Sensor

Abstract

The utility model provides a sensor which comprises a sensing assembly, a sealing element and a supporting shell, the supporting shell is provided with a containing cavity and a protection cavity, one side of the protection cavity is communicated with the containing cavity, the other side of the protection cavity is a closed cavity, and the sensing assembly comprises a circuit board assembly, a pressure sensing assembly and a temperature sensing assembly. The circuit board assembly, the pressure sensing assembly and the sealing piece are located in the containing cavity, the supporting shell comprises an inner supporting part and a bottom, the inner supporting part and the bottom form at least part of wall parts corresponding to the containing cavity, the circuit board assembly and the inner supporting part are installed, the pressure sensing assembly is electrically connected with the circuit board assembly, and the sealing piece is located between the pressure sensing assembly and the bottom. The temperature sensing assembly comprises a temperature sensing element, part of the temperature sensing element is located in the protection cavity, the temperature sensing element is electrically connected with the circuit board assembly, and the protection cavity is located on the outer side of the sealing piece in the radial direction of the sensor. In this way, the structure of the sensor is simplified.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and more particularly to a sensor for a vehicle thermal management system. Background Technology

[0002] Sensors are components used to measure physical parameters, such as the temperature and / or pressure of refrigerant in a thermal management system.

[0003] The sensor includes a temperature sensing component, a pressure sensing component, and a circuit board assembly. Both the temperature sensing component and the pressure sensing component are electrically connected to the circuit board assembly. The temperature sensing component is used to sense the temperature of the refrigerant, and the pressure sensing component detects the pressure of the refrigerant by contacting it. Currently, in order to reduce refrigerant leakage into the sensor and into the circuit board assembly, the sensor usually has multiple seals or the cavity design for accommodating the temperature sensing component is relatively complex. Utility Model Content

[0004] Based on this, and in response to the above problems, the present application provides a sensor that helps reduce the number of sealing rings used or simplifies the cavity structure that houses the temperature sensing element, thereby simplifying the sensor structure.

[0005] To achieve the above objectives, one technical solution of this application is as follows:

[0006] A sensor includes a circuit board assembly, a pressure sensing assembly, a temperature sensing assembly, a seal, and a support housing. The support housing has a receiving cavity and a protective cavity. One side of the protective cavity communicates with the receiving cavity, and the other side of the protective cavity is a closed cavity. The circuit board assembly, the pressure sensing assembly, and the seal are located in the receiving cavity. The wall of the receiving cavity includes an inner support portion and a bottom. The circuit board assembly abuts against the inner support portion. The pressure sensing assembly is electrically connected to the circuit board assembly. The seal is located between the pressure sensing assembly and the bottom. The temperature sensing assembly includes a temperature sensing element, part of which is located in the protective cavity. The temperature sensing element is electrically connected to the circuit board assembly. Along the radial direction of the sensor, the protective cavity is located outside the seal.

[0007] This application provides a sensor with a temperature sensing element and a pressure sensing component. The pressure sensing component reduces leakage of the working medium into the sensor through a seal. The temperature sensing element is located in a protective cavity, and the other side of the protective cavity is a closed cavity. It can be understood that the protective cavity reduces leakage of the working medium into the sensor. The protective cavity is located radially outside the seal, which simplifies the cavity structure of the receiving cavity. Compared with the solutions mentioned in the background art, this technical solution reduces the use of internal seals in the sensor, which is beneficial to simplifying the structure of the sensor.

[0008] A sensor includes a sensing component, a seal, and a support housing. The support housing has a receiving cavity and a protective cavity. One side of the protective cavity communicates with the receiving cavity, and the other side of the protective cavity is a closed cavity. The sensing component includes a circuit board assembly, a pressure sensing component, and a temperature sensing component. The circuit board assembly, the pressure sensing component, and the seal are located in the receiving cavity. The support housing includes an inner support portion and a bottom portion, which form at least a portion of the wall corresponding to the receiving cavity. The circuit board assembly is mounted to the inner support portion. The pressure sensing component is electrically connected to the circuit board assembly. The seal is located between the pressure sensing component and the bottom portion. The temperature sensing component includes a temperature sensing element, a portion of which is located in the protective cavity. The temperature sensing element is electrically connected to the circuit board assembly. Along the radial direction of the sensor, the protective cavity is located outside the seal.

[0009] This application provides a sensor with a temperature sensing element and a pressure sensing component. The pressure sensing component reduces leakage of the working medium into the sensor through a seal. The temperature sensing element is located in a protective cavity, and the other side of the protective cavity is a closed cavity. It can be understood that the protective cavity reduces leakage of the working medium into the sensor. The protective cavity is located radially outside the seal, which simplifies the cavity structure of the receiving cavity. Compared with the solutions mentioned in the background art, this technical solution reduces the use of internal seals in the sensor, which is beneficial to simplifying the structure of the sensor. Attached Figure Description

[0010] Figure 1 This is a three-dimensional structural schematic diagram of one embodiment of the sensor of this application;

[0011] Figure 2 for Figure 1 A three-dimensional structural diagram of the sensor from another angle;

[0012] Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure of the sensor;

[0013] Figure 4 for Figure 1 A three-dimensional exploded view of the sensor.

[0014] Figure 5 for Figure 1 A three-dimensional exploded view of the sensor from another angle;

[0015] Figure 6 for Figure 1 A cross-sectional schematic diagram of the exploded three-dimensional structure of the sensor;

[0016] Figure 7 for Figure 1 A three-dimensional structural diagram of the connecting shell;

[0017] Figure 8 for Figure 1A cross-sectional structural diagram of the connecting shell;

[0018] Figure 9 for Figure 1 A three-dimensional structural diagram of the central base;

[0019] Figure 10 for Figure 1 A three-dimensional structural diagram of the central base from another angle;

[0020] Figure 11 for Figure 1 A top view of the central base;

[0021] Figure 12 for Figure 1 Cross-sectional structural diagram of the main body

[0022] Figure 13 for Figure 1 A three-dimensional structural diagram of the inner protective shell;

[0023] Figure 14 This is a three-dimensional structural schematic diagram of another embodiment of the sensor of this application;

[0024] Figure 15 for Figure 14 A cross-sectional schematic diagram of the sensor;

[0025] Figure 16 for Figure 14 A three-dimensional exploded view of the sensor. Attached image description:

[0027] 100. Sensor; 10. Sensing component;

[0028] 11. Connecting shell; 111. Top wall; 1111. First platform; 1112. Second platform; 1113. Transition section; 112. Surrounding wall; 1121. Guide section; 113. Inner cavity; 114. Guide post; 115. Through hole; 1151. First channel; 1152. Second channel;

[0029] 12. Conductive component; 121. First electrical connection part; 122. Elastic support part; 123. Second electrical connection part;

[0030] 13. Circuit board assembly; 131. Circuit board; 1311. First surface; 1312. Second surface; 1313. Wall; 132. Guide post groove; 133. Pin hole;

[0031] 14. Pressure sensing component; 141. Pressure sensing module; 142. Electrical connection part;

[0032] 15. Temperature sensing component; 151. Temperature sensing element; 152. Lead-out portion; 1521. First connecting portion; 1522. Second connecting portion; 1523. Transition portion;

[0033] 16. Seal; 161. Top; 162. Bottom end;

[0034] 17. Support shell;

[0035] 18. Base; 181. Main body; 1811. Support; 1811a. Sealing end; 1811b. Mounting end; 1812. Cylindrical part; 1812a. First cylindrical part; 1812b. Second cylindrical part; 1813. Bending part; 182. Receiving cavity; 1821. Sealing element limiting groove; 1821a. Groove bottom surface; 1822. Inner sealing surface; 1823. Inner support; 1823a. Wire groove; 183. Limiting hole; 1831. Inner top wall; 1832. Inner side wall; 184. Bottom; 185. Pressure tapping hole; 1851. Pressure tapping port; 1852. Contact port;

[0036] 19. Protective part; 191. Fixing part; 1911. First end face; 1912. Second end face; 1913. Side wall surface; 192. Extension part; 193. Top end part; 194. Protective cavity; 195. Thermally conductive adhesive. Detailed Implementation

[0037] The specific embodiments are described below with reference to the accompanying drawings:

[0038] The application of heat pump technology in new energy vehicles is becoming a trend. Therefore, real-time monitoring of the refrigerant pressure and temperature in the vehicle's thermal management system is necessary to accurately control the temperature of the battery and passenger compartment, further reducing energy consumption and increasing driving range. The sensors in the following technical solutions are mainly used to collect the pressure and / or temperature of the refrigerant in the internal cavities or pipes of the thermal management system.

[0039] like Figures 1 to 16 As shown, this application provides a sensor 100, which includes a connecting housing 11, a conductive element 12, a circuit board assembly 13, a pressure sensing component 14, a temperature sensing component 15, a sealing element 16, and a supporting housing 17. The supporting housing 17 is connected to the connecting housing 11 and includes a base 18 and a protective portion 19. The base 18 is connected to the protective portion 19. The circuit board assembly 13, the pressure sensing component 14, part of the temperature sensing component 15, and the sealing element 16 are located on the base 18, and part of the temperature sensing component is located on the protective portion 19. The conductive element 12, the pressure sensing component 14, and the temperature sensing component 15 are electrically connected to the circuit board assembly 13.

[0040] The inventors discovered that the sensor collects the temperature and / or pressure of the cold medium in the cavity or pipe of the thermal management system. Both the temperature sensing component and the pressure sensing component need to be in direct or indirect contact with the cold medium to achieve the measurement of temperature and / or pressure. In order to reduce the leakage of the cold medium into the sensor and into the circuit board components, the sensor is usually equipped with multiple seals or the cavity design to accommodate the temperature sensing component is complicated, which makes the structure of the sensor more complicated.

[0041] As one implementation method, such as Figures 1 to 16 As shown, a sensor 100 includes a sensing component 10, a sealing element 16, and a support housing 17. Specifically, the sensing component 10 includes a circuit board assembly 13, a pressure sensing component 14, and a temperature sensing component 15. The support housing 17 has a receiving cavity 182 and a protective cavity 194. One end of the protective cavity 194 communicates with the receiving cavity 182, and the other end of the protective cavity 194 is a closed end. The circuit board assembly 13, the pressure sensing component 14, and the sealing element are located within the receiving cavity 182. The support housing 17 includes an inner support portion 1823 and a bottom 184, which form at least a portion of the wall corresponding to the receiving cavity 182. The circuit board assembly 13 abuts against the inner support portion 1823. Specifically, in the axial direction of the sensor 100... The bottom surface of the circuit board assembly 13 abuts against the inner support portion 1823, and the circuit board assembly 13 is fixed on the inner support portion 1823 within the receiving cavity 182. It is understood that by providing the inner support portion 1823 on the support housing 17, the circuit board assembly 13 abuts against the inner support portion 1823, and the inner support portion 1823 limits the circuit board assembly 13 along the sensor axial direction. This eliminates the need for auxiliary structures to limit the circuit board assembly 13 along the sensor 100 axial direction, simplifying the structure of the sensor 100. The pressure sensing component 14 is electrically connected to the circuit board assembly 13. Specifically, the circuit board assembly 13 has a circuit board 131, and the pressure sensing component 14 is electrically connected to the circuit board 131. The pressure sensing component 14 is used to collect the pressure of the refrigerant in the thermal management system. The seal 16 is located between the pressure sensing assembly 14 and the bottom 184. The temperature sensing assembly 15 includes a temperature sensing element 151, a portion of which is located in the protective cavity 194. The temperature sensing element 151 is electrically connected to the circuit board assembly 13. Along the radial direction of the sensor 100, the protective cavity 194 is located outside the seal 16. It should be noted that the radial direction of the sensor 100, as described here and below, is the direction perpendicular to the axial direction of the sensor 100. The axial direction of the sensor 100 is the direction along its height. See [reference needed]. Figure 3As shown, the height direction of sensor 100 is the direction of arrow "H". Here, "outer side" refers to the direction perpendicular to the axial direction of the sensor and away from the axis of the sensor. It can be understood that the temperature sensing element 151 is used to sense the temperature of the refrigerant. The temperature sensing element 151 is located in the protective cavity 194. The other end of the protective cavity 194 is a closed cavity, so that the protective cavity 194 is located radially outside the seal 16. With this arrangement, the sealing effect of reducing the refrigerant entering the sensor can be achieved, avoiding the need to set multiple seals inside the sensor, which helps to simplify the structure of the sensor.

[0042] Furthermore, as one implementation method, such as Figures 3 to 16 As shown, the supporting housing 17 includes a base 18 and a protective portion 19. The base 18 includes a bottom 184, which is sealed to the protective portion 19. Specifically, in this embodiment, the protective portion 19 and the base 18 are separate structures. Furthermore, in another embodiment, as shown... Figures 14 to 16 As shown, the protective part 19 and the base 18 can also be an integral part. The wall portion corresponding to the protective cavity 194 is formed in the bottom 184 and the protective part 19. The protective cavity 194 extends in the axial direction of the sensor 100. It can be understood that the protective part 19 protects the temperature sensing component 15 from the risk of short circuit caused by direct contact between the temperature sensing component 15 and the refrigerant during operation in the thermal management system.

[0043] Furthermore, such as Figures 1 to 13 As shown, in one embodiment, the protective part 19 and the base 18 are separate structures. The protective part 19 includes a fixing part 191 and an extension part 192. The fixing part 191 is sealed to the base 18. Specifically, in one embodiment, the protective part 19 and the base 18 can be a transition fit or an interference fit. In a transition fit, sealant is applied to the gap at the connection position to achieve sealing. More specifically, in this embodiment, the base 18 is provided with a limiting hole 183 that is sealed and fixedly connected to the fixing part 191. The fixing part 191 includes a first end face 1911 that abuts against the inner top wall 1831 in the limiting hole 183, a side wall surface 1913 that abuts against the inner side wall 1832 in the limiting hole 183, and a second end face 1912 that abuts against the extension part. In addition, as Figures 12 to 14As shown, in another embodiment, the protective part 19 and the base 18 are an integral structural component. The protective part 19 includes an extension 192, which protrudes from the sealing end 1811a and away from the sealing end 1811a along the axial direction of the sensor. It is understood that the integral structure of the protective part 19 and the base 18 improves the sealing performance of the sensor 100. The temperature sensing assembly 15 includes a temperature sensing element 151, which is located in the protective cavity 194 corresponding to the extension 192. At least a portion of the protective part 19 is located inside the pipe through which the cold medium flows. It is understood that the protective part 19 covers the temperature sensing element 151 and enters the pipe through which the cold medium flows to measure the temperature, preventing the temperature sensing element 151 from directly contacting the cold medium. This arrangement avoids the risk of short circuit of the temperature sensing element 151 caused by metal impurities in the pipe and increases the stability of the sensor 100.

[0044] Specifically, such as Figure 13 As shown, in one embodiment, the extension 192 includes a top portion 193, defined as the location of the temperature sensing element 151. Specifically, at least a portion of the top portion 193 is located at the central axial position of the pipe through which the refrigerant flows. This arrangement allows the top portion 193 to enclose the temperature sensing element 151 within the pipe through which the refrigerant flows. It is understood that the sensor 100 is mounted on a component of the thermal management system. When the refrigerant enters the pipe within the component, it conducts heat from both ends to the external component housing, causing temperature loss. Therefore, by contacting the top portion 193 with the refrigerant located at the central axial position of the pipe, the sensor 100 can more accurately measure the temperature of the refrigerant within the pipe. Figure 6 As shown, in one embodiment, the protective cavity 194 corresponding to the top part 193 is filled with thermally conductive adhesive 195, and the temperature sensing element 151 is located in the thermally conductive adhesive 195. This arrangement helps to improve the temperature conduction efficiency and reduce the temperature response time of the sensor 100.

[0045] like Figures 1 to 16As shown, in one implementation, the bottom 184 includes a pressure-sensing hole 185. Along the axial direction of the sensor 100, the pressure-sensing hole 185 penetrates the bottom 184. The pressure-sensing hole 185 includes a pressure-sensing port 1851 and a contact port 1852. Along the axial direction of the sensor 100, the contact port 1852 is closer to the pressure sensing component 14 than the pressure-sensing port 1851. It can be understood that the pressure-sensing hole 185 is connected to the channel through which the refrigerant flows. The refrigerant enters the pressure-sensing hole 185 through the pressure-sensing port 1851 and contacts the pressure sensing component 14 at the contact port 1852. The pressure sensing component 14 is used to collect the pressure in the pipe through which the refrigerant flows in the thermal management system. Along the radial direction of the sensor 100, the contact port 1852 is located radially inside the seal 16. With this arrangement, the pressure sensing component 14 contacts the refrigerant through the pressure-sensing port 1851 to measure the refrigerant pressure.

[0046] like Figures 1 to 6 As shown, in one embodiment, the pressure sensing assembly 14 includes a pressure sensing module 141 and an electrical connection portion 142. Both ends of the electrical connection portion 142 are electrically connected to the circuit board 131 and the pressure sensing module 141. The pressure sensing module 141 abuts against the circuit board 131. Along the axial direction of the sensor 100, the pressure sensing module 141 is positioned near the bottom 184 of the circuit board 131. The pressure sensing module 141 is a ceramic capacitor pressure sensing module. A sealing element 16 is provided between the pressure sensing module 141 and the corresponding wall portion of the receiving cavity 182. Specifically, the receiving cavity 182 has an inner sealing surface 182 that abuts against the pressure sensing module 141. 2. The receiving cavity 182 has a sealing element limiting groove 1821 recessed from the inner sealing surface 1822. The sealing element 16 is housed within the sealing element limiting groove 1821. The sealing element 16 fluidly seals between the pressure-sensing hole 185 and the receiving cavity 182. The sealing element 16 is pressed between the pressure-sensing module 141 and the bottom surface 1821a of the sealing element limiting groove 1821. More specifically, in this embodiment, the sealing element 16 is in the shape of an O-ring, and has a top 161 that abuts against the surface of the pressure-sensing module 141 and a bottom end 162 that abuts against the bottom surface 1821a of the sealing element limiting groove 1821. This arrangement prevents the pressure-sensing hole 185 from communicating with the receiving cavity 182, reducing the risk of refrigerant leakage caused by refrigerant flowing from the pressure-sensing hole 185 into the receiving cavity 182.

[0047] like Figures 9 to 12As shown, the base 18 includes a main body 181, which has a support portion 1811, a cylindrical portion 1812 extending upward from the support portion 1811, and a bent portion 1813 formed by bending the cylindrical portion 1812. The bent portion 1813 is formed by riveting and bending the cylindrical portion 1812. The bent portion 1813 abuts against the connecting housing 11, which abuts against the circuit board assembly 13 to fix the circuit board assembly 13 in the receiving cavity 182. The support portion 1811 has a sealing end 1811a, which is planar. Specifically, the cylindrical portion 1812 includes a first cylindrical portion 1812a connected to the support portion 1811 and a second cylindrical portion 1812b connected between the first cylindrical portion 1812a and the bending portion 1813. The wall thickness of the first cylindrical portion 1812a in the radial direction is greater than the wall thickness of the second cylindrical portion 1812b in the radial direction. The first cylindrical portion 1812a has an inner support portion 1823 that protrudes inward relative to the second cylindrical portion 1812b. The inner support portion 1823 serves to support the pressure sensing assembly 14 and the circuit board assembly 13. The inner support 1823 serves to position the connecting housing 11. Specifically, during the assembly of the sensor 100, the circuit board assembly 13 and the pressure sensing assembly 14 are welded and fixed before being installed in the inner support 1823. More specifically, in the axial direction of the sensor 100, the top wall of the inner support 1823 abuts against the circuit board assembly 13 and the connecting housing 11, and in the radial direction of the sensor 100, the circuit board assembly 13 abuts against the connecting housing 11, while the side wall of the inner support 1823 abuts against the pressure sensing assembly 14.

[0048] like Figures 1 to 6As shown, the sensor also includes a connecting housing 11 and a conductive element 12. The connecting housing 11 is fixed to the base 18, and the connecting housing 11 insulates and isolates the conductive element 12 and the base 18. Specifically, the base 18 is a metal component. This design reduces electromagnetic interference from external sources to the internal electronic components of the sensor 100. The connecting housing 11 is an insulating component, which insulates and isolates the base 18 and the conductive element 12. The protective part 19 is a metal component that covers the temperature sensing element 151, thereby avoiding the risk of short circuits caused by metal impurities in the refrigerant system. Optionally, the base 18 and the protective part 19 can be made of aluminum or stainless steel. Aluminum is lighter, which is beneficial for the lightweight design of the sensor 100, thus facilitating the overall lightweight design of the vehicle when the sensor 100 is used in an automotive thermal management system. Although stainless steel is slightly heavier than aluminum, it has the advantage of being easy to weld. The connecting housing 11 is an insulating component made of plastic, which can be manufactured by injection molding. The insulating connecting housing 11 insulates the conductive component 12 from the base 18. The metal base 18 can be manufactured by processes such as die casting, extrusion molding, or metal injection molding (MIM).

[0049] like Figures 1 to 8 As shown, the connecting housing 11 has several through holes 115 extending along the axial direction, and the conductive element 12 can elastically deform along the axial direction of the sensor 100. Specifically, as... Figures 3 to 8 As shown, in one embodiment, the connecting housing 11 is generally inverted bowl-shaped. The connecting housing 11 includes a top wall 111, a peripheral wall 112 extending downward from the top wall, and an inner cavity 113 formed by the top wall 111 and the peripheral wall 112. The top wall 111 includes a first platform 1111 perpendicular to the peripheral wall 112, a second platform 1112 located above the first platform 1111, and a transition portion 1113 connecting the first platform 1111 and the second platform 1112. The peripheral wall 112 is provided with a guide portion 1121 for cooperating with the inner support portion 1823. By cooperating the guide portion 1121 of the connecting housing 11 with the inner support portion 1823 of the base 18, the installation direction of the base 18 and the connecting housing 11 is guided. The bent portion 1813 is riveted and pressed onto the first platform 1111. The top wall 111 is provided with an inwardly protruding guide post 114, which cooperates with the guide post groove 132 of the circuit board assembly 13 to guide the installation direction of the circuit board assembly 13 and the connecting housing 11. The connecting housing 11 is provided with a plurality of through holes 115 extending vertically through the second platform 1112, and the plurality of through holes 115 communicate with the inner cavity 113. The conductive element 12 passes through the through holes 115 of the second platform 1112.

[0050] Furthermore, such as Figures 4 to 6 As shown, in one embodiment, the conductive element 12 is in the shape of a helical spring. The conductive element 12 includes a first electrical connection portion 121, an elastic support portion 122, and a second electrical connection portion 123 connected in sequence. Specifically, the conductive element 12 includes a first electrical connection portion 121, a second electrical connection portion 123, and an elastic support portion 122 connected between the first electrical connection portion 121 and the second electrical connection portion 123. The first electrical connection portion 121 abuts against the first surface 1311 of the circuit board 131. The elastic support portion 122 is used to elastically support the second connection portion. The elastic support portion 122 is housed in the inner cavity 113 of the connecting housing 11. The second electrical connection portion 123 extends upward from the elastic support portion 122 beyond the connecting housing 11. More specifically, the first electrical connection portion 121 of the conductive element 12 is electrically connected to the circuit board 131, and the second electrical connection portion 123 of the conductive element 12 is used for electrical connection to components outside the sensor 100. The diameter of the first electrical connection portion 121 is smaller than the diameter of the elastic support portion 122. This arrangement reduces the electrical connection area between the first electrical connection portion 121 and the circuit board 131, which helps to reduce the soldering area of ​​the circuit board 131. The through hole 115 includes a first channel 1151 and a second channel 1152. The diameter of the first channel 1151 is smaller than that of the second channel 1152. The diameter of the channel 1152 is such that at least a portion of the second electrical connection portion 123 is located in the first channel 1151, and at least a portion of the elastic support portion 122 abuts against the second channel 1152. The diameter of the elastic support portion 122 is smaller than the diameter of the second channel 1152. The connecting housing 11 compresses and fixes the elastic support portion 122 within the inner cavity 113 to prevent the conductive element 12 from moving axially. The diameter of the second electrical connection portion 123 is smaller than the diameter of the first channel 1151, so that a portion of the second electrical connection portion 123 is housed within the first channel 1151 of the connecting housing 11. With this arrangement, the conductive element 12 of the coil spring structure is fixed inside the sensor 100 and abuts against the circuit board 131, which allows the sensing signal to be transmitted to other external components, facilitating further control of the sensor 100.

[0051] like Figures 1 to 16 As shown, the temperature sensing component 15 also includes at least one pair of leads 152. The circuit board 131 has pin holes 133 extending through the circuit board 131 along its thickness direction. The leads 152 extend from the temperature sensing element, pass through the pin holes 133, and connect to the circuit board 131. The leads 152 include a first connecting portion 1521, a second connecting portion 1522, and a transition portion 1523. Both the first connecting portion 1521 and the second connecting portion 1522 are connected to the transition portion 1523. The other end of the first connecting portion 1521 is connected to a wire on the circuit board 131, and the other end of the second connecting portion 1522 is connected to the temperature sensing element 151.

[0052] When the pressure sensing component 14 comes into contact with the cold medium, the pressure from the cold medium is converted into an electrical signal. Similarly, the temperature sensing component 15 is converted into an electrical signal based on the temperature of the cold medium. The circuit board 131 calculates the real-time pressure and temperature of the cold medium based on these electrical signals, thereby achieving real-time monitoring of the temperature and pressure of the cold medium. This facilitates precise control and intelligent design of the valve assembly. The temperature sensing element 151 can be an NTC (Negative Temperature Coefficient) temperature sensing element or a PTC (Positive Temperature Coefficient) temperature sensing element.

[0053] like Figures 1 to 13 As shown, in one embodiment, the base 18 includes a main body 181, which includes a support 1811. The support 1811 includes a sealing end 1811a and a mounting end 1811b. Along the axial direction of the sensor 100, the sealing end 1811a is closer to the protection part 19 than the mounting end 1811b. With this arrangement, the mounting end 1811b is used to withstand external clamping force. At least part of the protection part 19 protrudes along the sealing end 1811a. It can be understood that the protection part 19 and the mounting end 1811b are located on opposite sides of the sealing end 1811a. Only the external clamping force needs to be applied to the mounting end 1811b, which is beneficial for miniaturizing the sensor in the axial direction. At least a portion of the protection part 19 is provided to protrude along the sealing end 1811a. Specifically, along the radial direction of the sensor 100, the protection part 19 is provided on the side near the upstream of the pipe through which the cold medium is to be measured. It is understood that when the cold medium enters the pipe through which the cold medium flows into the component, it conducts heat from both the upper and lower ends to the external component housing. The loss of temperature of the cold medium in the pipe gradually increases from upstream to downstream. By providing the protection part 19 near the upstream of the pipe, the temperature of the cold medium in the pipe measured by the sensor 100 can be more accurate.

[0054] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications without departing from the concept of the present invention, and these modifications all fall within the protection scope of the present invention.

Claims

1. A sensor (100), characterized in that: The sensor (100) includes a circuit board assembly (13), a pressure sensing assembly (14), a temperature sensing assembly (15), a seal (16), and a support housing (17). The support housing has a receiving cavity (182) and a protective cavity (194). One side of the protective cavity (194) communicates with the receiving cavity (182), and the other side of the protective cavity (194) is a closed cavity. The circuit board assembly (13), the pressure sensing assembly (14), and the seal (16) are located in the receiving cavity (182). The wall of the receiving cavity (182) includes an inner support portion (1823) and a bottom portion (18). 4) The circuit board assembly (13) abuts against the inner support (1823), the pressure sensing assembly (14) is electrically connected to the circuit board assembly (13), the seal (16) is located between the pressure sensing assembly (14) and the bottom (184), the temperature sensing assembly (15) includes a temperature sensing element (151), a portion of the temperature sensing element (151) is located in the protective cavity (194), the temperature sensing element (151) is electrically connected to the circuit board assembly (13), and along the radial direction of the sensor (100), the protective cavity (194) is located outside the seal (16).

2. A sensor (100), characterized in that: The sensor (100) includes a sensing component (10), a seal (16), and a support housing (17). The support housing (17) has a receiving cavity (182) and a protective cavity (194). One side of the protective cavity (194) communicates with the receiving cavity (182), and the other side of the protective cavity (194) is a closed cavity. The sensing component (10) includes a circuit board assembly (13), a pressure sensing component (14), and a temperature sensing component (15). The circuit board assembly (13), the pressure sensing component (14), and the seal (16) are located in the receiving cavity (182). The support housing (17) includes an inner support portion (1823) and a bottom (184). The inner support portion (1823)... 3) and bottom (184) form at least a portion of the wall corresponding to the receiving cavity (182), the circuit board assembly (13) is mounted to the inner support (1823), the pressure sensing assembly (14) is electrically connected to the circuit board assembly (13), the seal (16) is located between the pressure sensing assembly (14) and the bottom (184), the temperature sensing assembly (15) includes a temperature sensing element (151), a portion of the temperature sensing element (151) is located in the protective cavity (194), the temperature sensing element (151) is electrically connected to the circuit board assembly (13), and along the radial direction of the sensor (100), the protective cavity (194) is located outside the seal (16).

3. The sensor (100) according to claim 1 or 2, characterized in that, The support housing (17) includes a base (18) and a protective part (19). The base (18) includes a bottom (184), which is sealed to the protective part (19). The wall of the protective cavity (194) is formed in the bottom (184) and the protective part (19). The protective cavity (194) extends in the axial direction of the sensor (100).

4. The sensor (100) according to claim 3, characterized in that, The protective part (19) and the base (18) are separate structures. The protective part (19) includes a fixing part (191) and an extension part (192). The fixing part (191) is riveted and sealed to the bottom (184). The temperature sensing component (15) includes a temperature sensing element (151). The temperature sensing element (151) is located in the protective cavity (194) corresponding to the extension part (192).

5. The sensor (100) according to claim 3, characterized in that, The protective part (19) and the base (18) are an integral structure. The protective part (19) includes an extension (192) along the axial direction of the sensor (100). The extension (192) protrudes from the sealing end (1811a) in a direction away from the sealing end (1811a). The temperature sensing element (151) is located in the protective cavity (194) corresponding to the extension (192).

6. The sensor (100) according to claim 4 or 5, characterized in that, The extension (192) includes a top portion (193), and the position where the temperature sensing element (151) is located is defined as the top portion (193); the protective cavity (194) corresponding to the top portion (193) is filled with thermally conductive adhesive (195), and the temperature sensing element (151) is located in the thermally conductive adhesive (195).

7. The sensor (100) according to claim 3, characterized in that, The bottom (184) includes a pressure-sensing hole (185) extending through the bottom (184) along the axial direction of the sensor (100). The pressure-sensing hole (185) includes a pressure-sensing port (1851) and a contact port (1852). Along the axial direction of the sensor (100), the contact port (1852) is closer to the pressure sensing component (14) relative to the pressure-sensing port (1851). Along the radial direction of the sensor (100), the contact port (1852) is located radially inside the seal (16).

8. The sensor (100) according to claim 6, characterized in that, The bottom (184) includes a pressure-sensing hole (185) extending through the bottom (184) along the axial direction of the sensor (100). The pressure-sensing hole (185) includes a pressure-sensing port (1851) and a contact port (1852). Along the axial direction of the sensor (100), the contact port (1852) is closer to the pressure sensing component (14) relative to the pressure-sensing port (1851). Along the radial direction of the sensor (100), the contact port (1852) is located radially inside the seal (16).

9. The sensor (100) according to claim 4 or 5, characterized in that, The bottom (184) includes a pressure-sensing hole (185) extending through the bottom (184) along the axial direction of the sensor (100). The pressure-sensing hole (185) includes a pressure-sensing port (1851) and a contact port (1852). Along the axial direction of the sensor (100), the contact port (1852) is closer to the pressure sensing component (14) relative to the pressure-sensing port (1851). Along the radial direction of the sensor (100), the contact port (1852) is located radially inside the seal (16).

10. The sensor (100) according to claim 7 or 8, characterized in that, The pressure sensing component (14) includes a pressure sensing module (141) and an electrical connection part (142). The two ends of the electrical connection part (142) are electrically connected to the circuit board (131) and the pressure sensing module (141) respectively. The pressure sensing module (141) abuts against the circuit board (131). Along the axial direction of the sensor (100), the pressure sensing module (141) is close to the bottom (184) relative to the circuit board (131). The pressure sensing module (141) is a ceramic capacitor pressure sensing module. The sealing member (16) is disposed between the pressure sensing module (141) and the bottom (184) corresponding to the receiving cavity (182).

11. The sensor (100) according to claim 9, characterized in that, The pressure sensing component (14) includes a pressure sensing module (141) and an electrical connection part (142). The two ends of the electrical connection part (142) are electrically connected to the circuit board (131) and the pressure sensing module (141) respectively. The pressure sensing module (141) abuts against the circuit board (131). Along the axial direction of the sensor (100), the pressure sensing module (141) is close to the bottom (184) relative to the circuit board (131). The pressure sensing module (141) is a ceramic capacitor pressure sensing module. The sealing member (16) is disposed between the pressure sensing module (141) and the bottom (184) corresponding to the receiving cavity (182).

12. The sensor (100) according to claim 3, characterized in that, The sensor includes a connecting housing (11) and a conductive element (12). The connecting housing (11) is fixedly connected to the base (18). The connecting housing (11) insulates and isolates the conductive element (12) and the base (18). The connecting housing (11) has several through holes (115) arranged in the axial direction. The conductive element (12) passes through the through holes (115). The conductive element (12) can elastically deform along the axial direction of the sensor (100). One end of the conductive element (12) abuts against the circuit board (131), and the other end of the conductive element (12) is connected to other external components.

13. The sensor (100) according to claim 6, characterized in that, The sensor includes a connecting housing (11) and a conductive element (12). The connecting housing (11) is fixedly connected to the base (18). The connecting housing (11) insulates and isolates the conductive element (12) and the base (18). The connecting housing (11) has several through holes (115) arranged in the axial direction. The conductive element (12) passes through the through holes (115). The conductive element (12) can elastically deform along the axial direction of the sensor (100). One end of the conductive element (12) abuts against the circuit board (131), and the other end of the conductive element (12) is connected to other external components.

14. The sensor (100) according to claim 9, characterized in that, The sensor includes a connecting housing (11) and a conductive element (12). The connecting housing (11) is fixedly connected to the base (18). The connecting housing (11) insulates and isolates the conductive element (12) and the base (18). The connecting housing (11) has several through holes (115) arranged in the axial direction. The conductive element (12) passes through the through holes (115). The conductive element (12) can elastically deform along the axial direction of the sensor (100). One end of the conductive element (12) abuts against the circuit board (131), and the other end of the conductive element (12) is connected to other external components.

15. The sensor (100) according to claim 10, characterized in that, The sensor includes a connecting housing (11) and a conductive element (12). The connecting housing (11) is fixedly connected to the base (18). The connecting housing (11) insulates and isolates the conductive element (12) and the base (18). The connecting housing (11) has several through holes (115) arranged in the axial direction. The conductive element (12) passes through the through holes (115). The conductive element (12) can elastically deform along the axial direction of the sensor (100). One end of the conductive element (12) abuts against the circuit board (131), and the other end of the conductive element (12) is connected to other external components.

16. The sensor (100) according to any one of claims 4, 5, 7, 8 or 11, characterized in that, The sensor includes a connecting housing (11) and a conductive element (12). The connecting housing (11) is fixedly connected to the base (18). The connecting housing (11) insulates and isolates the conductive element (12) and the base (18). The connecting housing (11) has several through holes (115) arranged in the axial direction. The conductive element (12) passes through the through holes (115). The conductive element (12) can elastically deform along the axial direction of the sensor (100). One end of the conductive element (12) abuts against the circuit board (131), and the other end of the conductive element (12) is connected to other external components.

17. The sensor (100) according to any one of claims 12-15, characterized in that, The conductive component (12) includes a first electrical connection portion (121), an elastic support portion (122), and a second electrical connection portion (123) connected in sequence. The through hole (115) includes a first channel (1151) and a second channel (1152). The diameter of the first channel (1151) is smaller than the diameter of the second channel (1152). At least a portion of the second electrical connection portion (123) is located in the first channel (1151). At least a portion of the elastic support portion (122) abuts against the second channel (1152). The second electrical connection portion (123) extends out of the first channel (1151) from the sensor (100) and is electrically connected to other external components. The first electrical connection portion (121) is electrically connected to the circuit board (131).

18. The sensor (100) according to claim 16, characterized in that, The conductive component (12) includes a first electrical connection portion (121), an elastic support portion (122), and a second electrical connection portion (123) connected in sequence. The through hole (115) includes a first channel (1151) and a second channel (1152). The diameter of the first channel (1151) is smaller than the diameter of the second channel (1152). At least a portion of the second electrical connection portion (123) is located in the first channel (1151). At least a portion of the elastic support portion (122) abuts against the second channel (1152). The second electrical connection portion (123) extends out of the first channel (1151) from the sensor (100) and is electrically connected to other external components. The first electrical connection portion (121) is electrically connected to the circuit board (131).

19. The sensor (100) according to claim 3, characterized in that, The base (18) includes a support portion (1811), which includes a sealing end (1811a) and a mounting end (1811b). Along the axial direction of the sensor (100), the sealing end (1811a) is close to the protection portion (19) relative to the mounting end (1811b), and at least a portion of the protection portion (19) is provided to protrude along the sealing end (1811a).

20. The sensor (100) according to claim 6, characterized in that, The base (18) includes a support portion (1811), which includes a sealing end (1811a) and a mounting end (1811b). Along the axial direction of the sensor (100), the sealing end (1811a) is close to the protection portion (19) relative to the mounting end (1811b), and at least a portion of the protection portion (19) is provided to protrude along the sealing end (1811a).

21. The sensor (100) according to claim 9, characterized in that, The base (18) includes a support portion (1811), which includes a sealing end (1811a) and a mounting end (1811b). Along the axial direction of the sensor (100), the sealing end (1811a) is close to the protection portion (19) relative to the mounting end (1811b), and at least a portion of the protection portion (19) is provided to protrude along the sealing end (1811a).

22. The sensor (100) according to claim 10, characterized in that, The base (18) includes a support portion (1811), which includes a sealing end (1811a) and a mounting end (1811b). Along the axial direction of the sensor (100), the sealing end (1811a) is close to the protection portion (19) relative to the mounting end (1811b), and at least a portion of the protection portion (19) is provided to protrude along the sealing end (1811a).

23. The sensor (100) according to claim 16, characterized in that, The base (18) includes a support portion (1811), which includes a sealing end (1811a) and a mounting end (1811b). Along the axial direction of the sensor (100), the sealing end (1811a) is close to the protection portion (19) relative to the mounting end (1811b), and at least a portion of the protection portion (19) is provided to protrude along the sealing end (1811a).

24. The sensor (100) according to claim 17, characterized in that, The base (18) includes a support portion (1811), which includes a sealing end (1811a) and a mounting end (1811b). Along the axial direction of the sensor (100), the sealing end (1811a) is close to the protection portion (19) relative to the mounting end (1811b), and at least a portion of the protection portion (19) is provided to protrude along the sealing end (1811a).

25. The sensor (100) according to any one of claims 4, 5, 7, 8, 11-15 or 18, characterized in that, The base (18) includes a support portion (1811), which includes a sealing end (1811a) and a mounting end (1811b). Along the axial direction of the sensor (100), the sealing end (1811a) is close to the protection portion (19) relative to the mounting end (1811b), and at least a portion of the protection portion (19) is provided to protrude along the sealing end (1811a).

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