Liquid cooling server

Abstract

The liquid cooling server comprises a circuit board, a first to-be-cooled module, a second to-be-cooled module and a cooling assembly, the first to-be-cooled module and the second to-be-cooled module are arranged on the circuit board in a spaced mode, and the power consumption of the first to-be-cooled module is larger than that of the second to-be-cooled module; the heat dissipation assembly comprises a liquid cooling heat dissipation plate, a heat conduction structure and a crimping structure, and the liquid cooling heat dissipation plate is arranged on the surface of the side, away from the circuit board, of the first module to be subjected to heat dissipation; the first end of the heat conduction structure is connected with the liquid cooling heat dissipation plate, the second end of the heat conduction structure is a free end, and the second end of the heat conduction structure is provided with a heat dissipation binding surface; the first end of the crimping structure is connected with the liquid cooling heat dissipation plate, and the second end of the crimping structure is crimped at the second end of the heat conduction structure, so that the heat dissipation binding surface is tightly attached to the second module to be subjected to heat dissipation. The problem that a small-power-consumption chip of a server in the prior art adopts an active fit heat dissipation mode is at least solved.

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and in particular to a liquid-cooled server. Background Technology

[0002] In the current field of high-performance computing and data centers, server cooling technology is crucial. Especially with the continuous increase in computing demands and power consumption, efficient heat dissipation components have become a key factor in ensuring the stable operation of servers. Liquid cooling technology, as a new type of heat dissipation solution, directly contacts the chip with liquid and removes heat. Compared with air cooling, it can maintain the chip temperature stable under higher heat loads, effectively improving the server's working efficiency and hardware lifespan.

[0003] However, the design and implementation of liquid cooling systems for large data center servers face many challenges, especially when dealing with the heat dissipation needs of chips with different power consumption levels. High-power chips are usually equipped with dedicated liquid cooling modules to dissipate heat efficiently through direct contact. For numerous low-power auxiliary chips, the heat dissipation design in related technologies relies on air cooling or active bonding heat dissipation, that is, using screw assemblies or pushpin assemblies to directly fix the heat sink to the chip surface to ensure good thermal contact and heat dissipation effect.

[0004] In the aforementioned active bonding heat dissipation design, low-power chips require additional installation space to accommodate locking devices (such as screw assemblies or pushpins), resulting in a reduction of the effective area on the PCB for wiring and component placement, leading to low PCB material utilization. Furthermore, installing locking devices not only occupies PCB space but also creates layout constraints, forming restricted areas that affect the rational arrangement of surrounding electronic components, reducing the overall design flexibility and component density of the PCBA. Secondly, due to the presence of thermal resistance, heat dissipation efficiency may be limited, especially in high-density layouts and multi-chip environments where thermal management efficiency is not as good as direct heat dissipation from liquid cooling modules. Finally, the addition of screw assemblies or pushpins makes the server assembly process more complex, increasing production and maintenance costs. Utility Model Content

[0005] This application provides a liquid-cooled server to at least solve the problem of using active bonding heat dissipation for low-power chips in servers in related technologies.

[0006] This application provides a liquid-cooled server, including a circuit board, a first module to be cooled, a second module to be cooled, and a heat dissipation assembly. The first and second modules to be cooled are spaced apart on the circuit board, and the power consumption of the first module to be cooled is greater than that of the second module to be cooled. The heat dissipation assembly includes a liquid-cooled heat sink, a thermally conductive structure, and a pressing structure. The liquid-cooled heat sink is disposed on the surface of the first module to be cooled away from the circuit board. A first end of the thermally conductive structure is connected to the liquid-cooled heat sink, and a second end of the thermally conductive structure is a free end with a heat dissipation contact surface. A first end of the pressing structure is connected to the liquid-cooled heat sink, and a second end of the pressing structure is pressed onto the second end of the thermally conductive structure to ensure that the heat dissipation contact surface is tightly fitted to the second module to be cooled.

[0007] In one exemplary embodiment, at least one first thermally conductive layer is provided between the liquid cooling heat sink and the first module to be cooled; and / or, at least one second thermally conductive layer is provided between the heat dissipation bonding surface and the second module to be cooled.

[0008] In an exemplary embodiment, the heat-conducting structure includes a heat transfer block and a heat-conducting pipe, wherein the heat transfer block has a heat dissipation contact surface; a first end of the heat-conducting pipe is connected to a liquid-cooled heat sink, and a second end of the heat-conducting pipe is connected to the heat transfer block.

[0009] In one exemplary embodiment, the first end of the heat pipe is welded to the liquid-cooled heat sink; and / or, the second end of the heat pipe is welded to the heat transfer block.

[0010] In an exemplary embodiment, the heat pipe includes a first heat-conducting section and a second heat-conducting section connected to each other, wherein the first heat-conducting section extends along a first direction, the second heat-conducting section extends along a second direction perpendicular to the first direction, and the connection between the first heat-conducting section and the second heat-conducting section is smoothly transitioned; wherein one end of the first heat-conducting section away from the second heat-conducting section is connected to a liquid cooling heat sink, and the second heat-conducting section is connected to a heat transfer block.

[0011] In one exemplary embodiment, there are two heat pipes, which are spaced apart and have two first heat-conducting sections that are parallel to each other, and two second heat-conducting sections that extend in opposite directions. A pressing structure is located between the two heat pipes.

[0012] In an exemplary embodiment, the heat transfer block has a guide hole on the side surface opposite to the second heat dissipation module; the pressing structure includes an elastic element and a pressure plate, wherein the elastic element is located inside the guide hole, and the first end of the elastic element is connected to the bottom surface of the guide hole; the first end of the pressure plate is connected to the liquid cooling heat sink, and the second end of the pressure plate is connected to the second end of the elastic element, so as to provide the heat transfer block with an elastic force that applies pressure toward the side of the second heat dissipation module through the elastic element.

[0013] In one exemplary embodiment, the thickness of the pressure plate does not exceed 3 mm.

[0014] In one exemplary embodiment, the first end of the pressure plate is detachably connected to the liquid-cooled heat sink.

[0015] In one exemplary embodiment, the projection of the liquid cooling heat sink in the thickness direction of the circuit board is adapted to the projection of the first module to be cooled in the thickness direction of the circuit board; and / or, the heat dissipation bonding surface is adapted to the surface of the second module to be cooled on the side opposite to the circuit board.

[0016] This application provides a liquid-cooled server, including a circuit board, a first module to be cooled, a second module to be cooled, and a heat dissipation assembly. The first and second modules to be cooled are spaced apart on the circuit board, and the power consumption of the first module to be cooled is greater than that of the second module to be cooled. The heat dissipation assembly includes a liquid-cooled heat sink, a thermally conductive structure, and a pressing structure. The liquid-cooled heat sink is disposed on the surface of the first module to be cooled away from the circuit board. A first end of the thermally conductive structure is connected to the liquid-cooled heat sink, and a second end of the thermally conductive structure is a free end with a heat dissipation contact surface. A first end of the pressing structure is connected to the liquid-cooled heat sink, and a second end of the pressing structure is pressed onto the second end of the thermally conductive structure to ensure that the heat dissipation contact surface is tightly fitted to the second module to be cooled.

[0017] By configuring a heat dissipation component, which includes a liquid-cooled heat sink, a thermally conductive structure, and a pressing structure, the liquid-cooled heat sink is positioned on the surface of the first module to be cooled, away from the circuit board. This effectively dissipates heat from the first module. Furthermore, by connecting the first end of the thermally conductive structure to the liquid-cooled heat sink, while setting the second end of the thermally conductive structure as a free end with a heat-dissipating contact surface, and then connecting the first end of the pressing structure to the liquid-cooled heat sink and pressing the second end of the pressing structure onto the second end of the thermally conductive structure, the heat-dissipating contact surface is tightly fitted to the second module to be cooled, effectively dissipating heat from the second module. This eliminates the need for additional fastening components to secure the active cooling plate of the second module, greatly simplifying the circuit board layout, significantly improving the space utilization of the circuit board, reducing the density of components on the circuit board, and greatly improving the overall assembly efficiency of the liquid-cooled server. Attached Figure Description

[0018] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1This is a partial structural diagram of a liquid-cooled server provided in an embodiment of this application;

[0020] Figure 2 for Figure 1 A top-down view of the structure of a liquid-cooled server.

[0021] The above figures include the following reference numerals:

[0022] 1. Circuit board; 2. First module to be cooled; 3. First thermally conductive layer; 4. Liquid-cooled heat sink; 5. Second module to be cooled; 6. Second thermally conductive layer; 7. Heat transfer block; 701. Guide hole; 8. Elastic element; 9. Heat pipe; 901. First thermally conductive section; 902. Second thermally conductive section;

[0023] 10. Pressure plate; 20. Thermally conductive structure; 30. Press-fit structure;

[0024] 11. First fastener; 12. Second fastener. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0026] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0027] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] The embodiments of this application provide a liquid-cooled server. The device is described in detail in conjunction with the structure and working principle of the liquid-cooled server (the technical terms involved must be explained).

[0029] like Figure 1 and Figure 2As shown, the liquid-cooled server includes a circuit board 1, a first heat-dissipating module 2, a second heat-dissipating module 5, and a heat dissipation assembly. The first heat-dissipating module 2 and the second heat-dissipating module 5 are spaced apart on the circuit board 1, and the power consumption of the first heat-dissipating module 2 is greater than that of the second heat-dissipating module 5. The heat dissipation assembly includes a liquid-cooled heat sink 4, a thermally conductive structure 20, and a pressing structure 30. The liquid-cooled heat sink 4 is disposed on the surface of the first heat-dissipating module 2 facing away from the circuit board 1. The first end of the thermally conductive structure 20 is connected to the liquid-cooled heat sink 4, and the second end of the thermally conductive structure 20 is a free end with a heat dissipation bonding surface. The first end of the pressing structure 30 is connected to the liquid-cooled heat sink 4, and the second end of the pressing structure 30 is pressed onto the second end of the thermally conductive structure 20 so that the heat dissipation bonding surface is tightly bonded to the second heat-dissipating module 5.

[0030] By setting up a heat dissipation component, which includes a liquid cooling heat sink 4, a heat-conducting structure 20, and a pressing structure 30, the liquid cooling heat sink 4 is positioned on the surface of the first module 2 to be cooled, away from the circuit board 1, thus effectively dissipating heat from the first module 2. Furthermore, by connecting the first end of the heat-conducting structure 20 to the liquid cooling heat sink 4, and setting the second end of the heat-conducting structure 20 as a free end with a heat-dissipating contact surface, and then connecting the first end of the pressing structure 30 to the liquid cooling heat sink 4, with the second end of the pressing structure 30 pressed against the second end of the heat-conducting structure 20, the heat-dissipating contact surface is tightly fitted to the second module 5 to be cooled, effectively dissipating heat from the second module 5. This eliminates the need for additional fastening components to fix the active cooling plate of the second module 5, greatly simplifying the layout of the circuit board 1, significantly improving the space utilization of the circuit board 1, reducing the density of components on the circuit board 1, and greatly improving the overall assembly efficiency of the liquid-cooled server.

[0031] It should be noted that in this application, the first heat dissipation module 2 is a high-power chip module, and the second heat dissipation module 5 is a low-power chip.

[0032] like Figure 1As shown, at least one first thermally conductive layer 3 is provided between the liquid cooling heat sink 4 and the first heat-dissipating module 2; and / or, at least one second thermally conductive layer 6 is provided between the heat dissipation bonding surface and the second heat-dissipating module 5. Thus, by providing the second thermally conductive layer 6 between the heat transfer block 7 and the second heat-dissipating module 5, the second thermally conductive layer 6 serves as the heat conduction medium between the heat transfer block 7 and the second heat-dissipating module 5. The selection of its material and thickness is crucial for improving heat dissipation efficiency. The second thermally conductive layer 6 can fill the tiny gaps between the heat transfer block 7 and the second heat-dissipating module 5, reducing thermal resistance and improving heat conduction efficiency. In this embodiment, the second thermally conductive layer 6 ensures that the heat from the second heat-dissipating module 5 can be quickly and evenly conducted to the heat transfer block 7, and then transferred to the liquid cooling heat sink 4 through the heat pipe 9, achieving efficient heat dissipation for low-power chips. In other embodiments, different types of thermally conductive materials, such as phase change materials or non-phase change materials, can be selected to adapt to low-power chips with different operating temperatures and heat dissipation requirements, solving the matching problem between heat dissipation materials and chip operating temperatures.

[0033] It should be noted that in this application, the second thermally conductive layer 6 is either a phase change material or a non-phase change material. When selecting a phase change material, the liquefaction temperature of 60°C is used as the standard. The size and thickness of the non-phase change material can be determined based on the structural design parameters. The choice of material for the second thermally conductive layer 6 is crucial for improving the heat dissipation efficiency and adaptability of the heat dissipation component. Phase change materials undergo a phase change at a specific temperature, thereby absorbing or releasing heat. Non-phase change materials reduce thermal resistance and improve heat transfer efficiency through their high thermal conductivity. In this embodiment, the choice of material for the second thermally conductive layer 6 ensures that heat can be quickly and uniformly transferred from the second heat-dissipating module 5 to the heat transfer block 7, achieving efficient heat dissipation for the low-power chip. In other embodiments, other types of thermally conductive materials, such as graphene or carbon nanotubes, can be selected to further improve the thermal conductivity of the second thermally conductive layer and solve the matching problem between heat dissipation material and heat dissipation efficiency.

[0034] Furthermore, the first thermally conductive layer 3 between the liquid cooling heat sink 4 and the first heat-dissipating module 2 is thermally conductive silicone grease.

[0035] Furthermore, the second thermally conductive layer 6 between the heat-dissipating bonding surface and the second heat-dissipating module 5 is a thermally conductive PAD.

[0036] It should be noted that, in this application, if Figure 2As shown, the liquid-cooled heat sink 4 is connected to the first heat-dissipating module 2 via four second fasteners 12. In this way, the liquid-cooled heat sink 4 is fixed to the first heat-dissipating module 2 by the second fasteners 12. The use of the second fasteners 12 ensures a stable connection between the first heat-dissipating module 2 and the liquid-cooled heat sink 4, which is crucial for improving the overall heat dissipation performance of the heat dissipation component. The contact between the first heat-dissipating module 2 and the liquid-cooled heat sink 4, through the pressure of the second fasteners 12, ensures the uniform distribution of the first heat-conducting layer 3, reduces thermal resistance, and improves heat conduction efficiency. In this embodiment, the second fasteners 12 ensure a tight fit between the first heat-dissipating module 2 and the liquid-cooled heat sink 4, achieving efficient heat dissipation of the first heat-dissipating module 2. Simultaneously, the heat transfer through the heat pipes 9 of the heat-conducting structure 20 also improves the heat dissipation efficiency of the second heat-dissipating module 5. In other embodiments, the heat conduction efficiency between the first heat-dissipating module and the liquid-cooled heat sink can be improved by optimizing the size and material of the second fasteners 12, as well as adjusting the number and position of the second fasteners, thus solving the optimization problem between the heat dissipation structure and the heat dissipation effect.

[0037] like Figure 1 and Figure 2 As shown, the heat-conducting structure 20 includes a heat transfer block 7 and a heat-conducting pipe 9, wherein the heat transfer block 7 has a heat dissipation contact surface; the first end of the heat-conducting pipe 9 is connected to the liquid cooling heat sink 4, and the second end of the heat-conducting pipe 9 is connected to the heat transfer block 7.

[0038] It should be noted that in this application, the first end of the heat pipe 9 is welded to the liquid-cooled heat sink 4; and / or, the second end of the heat pipe 9 is welded to the heat transfer block 7. This welding connection between the heat pipe 9 and the heat transfer block 7 and liquid-cooled heat sink 4 ensures efficient heat transfer between the heat pipe 9, the heat transfer block 7, and the liquid-cooled heat sink 4. The welding connection reduces the thermal resistance between the heat pipe 9, the heat transfer block 7, and the liquid-cooled heat sink 4, thereby improving heat transfer efficiency. The welding connection technology of the heat pipe 9 in this embodiment ensures that heat can be quickly and efficiently transferred from the heat transfer block 7 to the liquid-cooled heat sink 4, achieving efficient heat dissipation of the second heat-dissipating module 5. In other embodiments, other connection methods, such as vacuum brazing or soldering, can also be used to improve the heat transfer efficiency between the heat pipe and the heat transfer block and the cold plate, solving the optimization problem between the heat dissipation structure and the heat dissipation effect.

[0039] Furthermore, the connection method between the heat pipe 9 and the heat transfer block 7 and the liquid cooling heat sink 4 can be vacuum brazing or soldering, which can be selected and confirmed according to design requirements.

[0040] Furthermore, the heat transfer block 7 is rectangular.

[0041] It should be noted that in this application, the heat pipe 9 is made of copper, copper alloy, aluminum, or aluminum alloy. As a key component for heat transfer, the choice of material for the heat pipe 9 directly affects its thermal conductivity and service life. Copper, copper alloy, aluminum, or aluminum alloy have high thermal conductivity, which can effectively reduce the thermal resistance of the heat pipe and improve its thermal efficiency. In this embodiment, the material of the heat pipe 9 ensures that heat can be transferred quickly and efficiently from the heat transfer block 7 to the liquid cooling heat sink 4, achieving efficient heat dissipation of the second heat dissipation module 5. In other embodiments, other materials with high thermal conductivity, such as silver alloy, can be selected to further improve the thermal efficiency of the heat pipe and solve the matching problem between heat dissipation material and heat dissipation efficiency.

[0042] Furthermore, the heat pipe 9 can be a straight pipe, a U-shaped pipe, or an L-shaped pipe. The structural shape design of the heat pipe 9 is crucial for improving the heat dissipation efficiency and adaptability of the heat dissipation assembly. The structural shape design of the heat pipe 9 can affect the heat conduction path and thermal resistance of the heat pipe, thus affecting the overall heat dissipation efficiency of the heat dissipation assembly. In this embodiment, the structural shape design of the heat pipe 9 ensures that heat can be transferred quickly and efficiently from the heat transfer block 7 to the liquid cooling heat sink 4. Simultaneously, the U-shaped or L-shaped pipe design can adapt to different circuit board 1 layouts, improving the adaptability of the heat dissipation assembly. In other embodiments, heat pipes of other shapes, such as serpentine pipes, can be designed to further improve the heat dissipation efficiency of the heat pipe, while also adapting to more complex circuit board 1 layouts, solving the compatibility issues between the heat dissipation structure and heat dissipation efficiency, as well as the circuit board 1 layout.

[0043] like Figure 2 As shown, the heat pipe 9 includes a first heat-conducting section 901 and a second heat-conducting section 902 connected to each other. The first heat-conducting section 901 extends along a first direction, and the second heat-conducting section 902 extends along a second direction perpendicular to the first direction. The connection between the first heat-conducting section 901 and the second heat-conducting section 902 is smoothly transitioned. The end of the first heat-conducting section 901 facing away from the second heat-conducting section 902 is connected to the liquid cooling heat sink 4, and the second heat-conducting section 902 is connected to the heat transfer block 7.

[0044] like Figure 2 As shown, there are two heat pipes 9, which are spaced apart. The two first heat-conducting sections 901 are parallel to each other, and the two second heat-conducting sections 902 extend in opposite directions. The pressing structure 30 is located between the two heat pipes 9.

[0045] like Figure 1As shown, the heat transfer block 7 has a guide hole 701 on the side surface away from the second heat dissipation module 5; the pressing structure 30 includes an elastic element 8 and a pressure plate 10, wherein the elastic element 8 is located in the guide hole 701, and the first end of the elastic element 8 is connected to the bottom surface of the guide hole 701; the first end of the pressure plate 10 is connected to the liquid cooling heat dissipation plate 4, and the second end of the pressure plate 10 is connected to the second end of the elastic element 8, so as to provide the heat transfer block 7 with an elastic force that applies pressure toward the side of the second heat dissipation module 5 through the elastic element 8.

[0046] like Figure 1 As shown, the guide hole 701 is a blind hole, and the material of the heat transfer block 7 is copper / copper alloy or aluminum / aluminum alloy. It can be CNC machined or molded according to the design parameters and the required quantity.

[0047] It should be noted that in this application, the pressure plate 10 is made of 65Mn high-elasticity material. The choice of material for the pressure plate 10 is crucial for improving the heat dissipation efficiency and stability of the heat dissipation component. The 65Mn high-elasticity material provides stable elasticity, ensuring the pressure of the elastic element 8, thereby ensuring a tight fit between the heat transfer block 7 and the second heat dissipation module 5. The choice of material for the pressure plate 10 in this embodiment ensures the stability and heat dissipation efficiency of the heat dissipation component. In other embodiments, other types of high-elasticity materials, such as spring steel or elastic alloys, can be selected to further improve the elasticity and stability of the pressure plate, solving the matching problem between the heat dissipation material and the heat dissipation effect.

[0048] Furthermore, the pressure plate 10 has a preset thickness. The thickness design of the pressure plate 10 is crucial to ensuring its elasticity and stability. The thickness design of the pressure plate can affect its elasticity and compression, thereby affecting the pressure of the elastic element 8, ensuring a tight fit between the heat transfer block 7 and the second heat dissipation module 5. In this embodiment, the thickness design of the pressure plate 10 ensures the stability and heat dissipation efficiency of the heat dissipation component. In other embodiments, the elasticity and stability of the pressure plate can be further improved by optimizing the thickness design of the pressure plate, such as adjusting the material and processing technology of the pressure plate, thus solving the optimization problem between the heat dissipation structure and the heat dissipation effect.

[0049] Preferably, the thickness of the pressure plate 10 does not exceed 3 mm.

[0050] Furthermore, the elastic element 8 is a spring.

[0051] It should be noted that in this application, the elastic element 8 has a specific wire diameter, number of turns, and outer diameter. The parameter design of the elastic element 8 is crucial to ensuring a tight fit between the heat transfer block 7 and the second heat dissipation module 5. The design of the wire diameter, number of turns, and outer diameter of the elastic element 8 can affect the spring force and compression, thereby affecting the contact pressure between the low-power heat transfer block and the low-power chip, ensuring efficient heat conduction. In this embodiment, the parameter design of the elastic element 8 ensures a tight fit between the heat transfer block 7 and the second heat dissipation module 5, achieving efficient heat dissipation of the low-power chip. In other embodiments, the spring force and compression can be further improved by optimizing the spring parameter design, such as adjusting the spring material and structure, to solve the optimization problem between the heat dissipation structure and the heat dissipation effect.

[0052] It should be noted that, in this application, the first end of the pressure plate 10 is detachably connected to the liquid cooling heat sink 4.

[0053] It should be noted that, in this application, the projection of the liquid cooling heat sink 4 onto the thickness direction of the circuit board 1 is adapted to the projection of the first heat-dissipating module 2 onto the thickness direction of the circuit board 1; and / or, the heat dissipation bonding surface is adapted to the surface of the second heat-dissipating module 5 on the side away from the circuit board 1. This helps to ensure the reliability and effectiveness of heat dissipation of the first heat-dissipating module 2 by the liquid cooling heat sink 4, and to ensure that the heat transfer block 7 transfers the heat generated by the second heat-dissipating module 5 to the liquid cooling heat sink 4 through the heat pipe 9, thereby achieving effective heat dissipation of the second heat-dissipating module 5. The adaptation of the heat dissipation bonding surface of the heat transfer block 7 to the surface of the second heat-dissipating module 5 on the side away from the circuit board 1 ensures that the heat transfer block 7 can effectively transfer the heat generated by the second heat-dissipating module 5 to the liquid cooling heat sink 4 as evenly as possible.

[0054] This application optimizes the layout of circuit board 1 by eliminating the locking screw assembly or pushpin assembly of the active heat dissipation plate of the second heat dissipation module 5. Optimizing the layout of circuit board 1 is crucial for improving the heat dissipation efficiency of the heat dissipation components and the utilization rate of circuit board 1. Eliminating the locking screw assembly or pushpin assembly of the low-power cold plate simplifies the layout of circuit board 1, increases its utilization rate, and reduces the PCBA component density. The circuit board 1 layout optimization technology in this embodiment ensures efficient heat dissipation of the heat dissipation components while improving the utilization rate of circuit board 1 and the overall assembly efficiency. In other embodiments, the utilization rate of circuit board 1 can be further improved and the compatibility issue between the heat dissipation structure and the circuit board 1 layout can be resolved by optimizing the layout design of circuit board 1, such as using a more compact layout or using a multi-layer circuit board 1.

[0055] This application combines the second heat-dissipating module 5 with the heat transfer block 7, utilizing the pressure of the elastic element 8 to achieve close contact between the heat transfer block 7 and the second heat-dissipating module 5. This ensures that heat can be effectively conducted to the heat pipe 9, and then to the liquid cooling heat sink 4, achieving efficient heat dissipation. The heat transfer block 7 contacts the second heat-dissipating module 5 through a second thermally conductive layer 6 made of phase change material or non-phase change material. Utilizing the efficient thermal conductivity of the heat pipe 9, heat is conducted from the second heat-dissipating module 5 to the liquid cooling heat sink 4, achieving the heat dissipation effect. The close fit between the heat transfer block 7 and the second heat-dissipating module 5, along with the efficient thermal conduction of the heat pipe 9, significantly improves the heat dissipation efficiency of the second heat-dissipating module 5. Simultaneously, it eliminates the need for the locking screw assembly or pushpin assembly of the active heat sink of the second heat-dissipating module 5, simplifying the layout of the circuit board 1, improving the utilization rate of the circuit board 1, reducing the PCBA component layout density, and improving the overall assembly efficiency. In other embodiments, the size and material of the heat transfer block 7, as well as the parameters of the elastic element 8, can be adjusted to accommodate second heat dissipation modules 5 with different power levels, thus solving the technical problem of balancing heat dissipation efficiency and cost.

[0056] It should be noted that in this application, the temperature difference between the first heat-dissipating module 2 and the second heat-dissipating module 5 does not exceed 30°C. Controlling the temperature difference between the first heat-dissipating module 2 and the second heat-dissipating module 5 is crucial for ensuring the heat dissipation efficiency of the heat dissipation component and the normal operation of the chip. By controlling the temperature difference between the first heat-dissipating module 2 and the second heat-dissipating module 5, the heat dissipation effect of the second heat-dissipating module 5 can be ensured, while avoiding the influence of the heat from the first heat-dissipating module 2 on the second heat-dissipating module 5, thus ensuring the normal operation of both the first heat-dissipating module 2 and the second heat-dissipating module 5. The temperature difference control technology in this embodiment ensures efficient heat dissipation of the heat dissipation component and the normal operation of both the first heat-dissipating module 2 and the second heat-dissipating module 5. In other embodiments, the temperature difference between the first heat-dissipating module 2 and the second heat-dissipating module 5 can be further reduced by optimizing the heat dissipation design of the heat dissipation component, such as using more efficient heat pipes or optimizing the structure of the cold plate, thereby solving the compatibility problem between the heat dissipation component and the operating temperatures of the first heat-dissipating module 2 and the second heat-dissipating module 5.

[0057] This application replaces the traditional active bonding heat dissipation of low-power chips with passive bonding heat dissipation, saving PCB wiring and PCBA device layout space, improving PCB material utilization, and eliminating the need for low-power cold plate locking screw assemblies or pushpin assemblies, simplifying DFM process design and improving overall assembly efficiency; a chip heat transfer design and method for liquid-cooled servers, wherein the low-power chip may have a second power consumption, operating temperature, heat generation, and combinations thereof different from those of the high-power chip; a chip heat transfer design and method for liquid-cooled servers, maintaining a thermal gradient across the thermal barrier between the high-power chip and the low-power chip, wherein the thermal gradient is located at a chip temperature difference of no more than 30°C between the high-power chip and the low-power chip, and this temperature difference value is not limited as long as the chip heat dissipation requirements are met.

[0058] It should be noted that the working process of the liquid-cooled server provided in this application is as follows:

[0059] During the operation of the liquid-cooled server, the second heat-dissipating module 5 and the first heat-dissipating module 2 generate heat. The heat from the second heat-dissipating module 5 is transferred to the heat transfer block 7 through the second heat-conducting layer 6, and the heat transfer block 7 transfers the heat to the liquid-cooled heat sink 4 through the heat-conducting pipe 9. The heat from the first heat-dissipating module 2 is transferred to the liquid-cooled heat sink 4 through the first heat-conducting layer 3. The liquid-cooled heat sink 4 uses refrigerant to carry the heat away from the server, achieving the purpose of heat dissipation. The pressure plate 10 is fixed to the liquid-cooled heat sink 4 by four first fasteners 11. One end of the pressure plate 10 cooperates with the elastic element 8. The pressure plate 10 keeps the elastic element 8 under pressure, thereby ensuring good contact between the heat transfer block 7 and the second heat-dissipating module 5, achieving efficient heat dissipation of the second heat-dissipating module 5. The entire heat dissipation assembly ensures the normal operation of the first heat-dissipating module 2 and the second heat-dissipating module 5 by controlling the temperature difference between them to not exceed 30°C, while improving the heat dissipation efficiency of the heat dissipation assembly and the operational stability of the liquid-cooled server.

[0060] It should be noted that this application also provides a chip heat transfer design method. Specifically, a first cooling fluid is provided to a liquid cooling heat sink 4, which is thermally connected to a first heat generation component (i.e., the first heat dissipation module 2). A heat transfer block 7 has a pre-designed cooling capacity and is thermally connected to a second heat generation component (i.e., the second heat dissipation module 5). A thermal gradient is maintained across the thermal barrier between the first heat dissipation module 2 and the second heat dissipation module 5. The thermal gradient is located at a 30°C chip temperature difference between the first heat dissipation module 2 and the second heat dissipation module 5. This temperature difference value is not limited as long as the chip heat dissipation requirements are met. Maintaining the thermal gradient allows the first heat dissipation module 2 and the second heat dissipation module 5 to have different cooling capacities.

[0061] Furthermore, the first heat dissipation module 2 has a first power consumption, operating temperature, heat generation, and combinations thereof.

[0062] Furthermore, the second heat-dissipating module 5 has a second power consumption, operating temperature, heat generation, and combinations thereof that are different from those of the first heat-dissipating module 2.

[0063] Preferably, the provision of the first cooling fluid includes a fluid source that has never been cooled providing the first cooling fluid.

[0064] Furthermore, maintaining the thermal gradient includes maintaining a thermal gradient of less than 30°C, and this temperature difference is not limited as long as the chip's heat dissipation requirements are met.

[0065] The liquid-cooled server provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A liquid-cooled server, characterized in that, include: Circuit board (1); The first heat dissipation module (2) and the second heat dissipation module (5) are disposed on the circuit board (1) at intervals, and the power consumption of the first heat dissipation module (2) is greater than that of the second heat dissipation module (5). Heat dissipation assembly, the heat dissipation assembly comprising: Liquid cooling heat sink (4), the liquid cooling heat sink (4) is disposed on the surface of the first heat dissipation module (2) on the side away from the circuit board (1); A heat-conducting structure (20) is provided, the first end of which is connected to the liquid cooling heat sink (4), the second end of which is a free end, and the second end of which has a heat dissipation contact surface. A pressing structure (30) is provided, the first end of which is connected to the liquid cooling heat sink (4), and the second end of which is pressed against the second end of the heat-conducting structure (20) so that the heat dissipation bonding surface is tightly bonded to the second heat dissipation module (5).

2. The liquid-cooled server according to claim 1, characterized in that, The liquid-cooled heat sink (4) has at least one first thermally conductive layer (3) between it and the first heat-dissipating module (2); and / or, The heat dissipation bonding surface and the second heat dissipation module (5) have at least one second heat-conducting layer (6).

3. The liquid-cooled server according to claim 1, characterized in that, The thermally conductive structure (20) includes: Heat transfer block (7), the heat transfer block (7) having the heat dissipation bonding surface; A heat pipe (9) is provided, with its first end connected to the liquid cooling heat sink (4) and its second end connected to the heat transfer block (7).

4. The liquid-cooled server according to claim 3, characterized in that, The first end of the heat pipe (9) is welded to the liquid-cooled heat sink (4); and / or, The second end of the heat pipe (9) is welded to the heat transfer block (7).

5. The liquid-cooled server according to claim 3, characterized in that, The heat pipe (9) includes a first heat-conducting section (901) and a second heat-conducting section (902) connected to each other. The first heat-conducting section (901) extends along a first direction, and the second heat-conducting section (902) extends along a second direction perpendicular to the first direction. The connection between the first heat-conducting section (901) and the second heat-conducting section (902) is smoothly transitioned. The first heat-conducting section (901) is connected to the liquid-cooled heat sink (4) at one end away from the second heat-conducting section (902), and the second heat-conducting section (902) is connected to the heat transfer block (7).

6. The liquid-cooled server according to claim 5, characterized in that, There are two heat pipes (9), which are spaced apart. The two first heat-conducting sections (901) are parallel to each other, and the two second heat-conducting sections (902) extend in opposite directions. The pressing structure (30) is located between the two heat pipes (9).

7. The liquid-cooled server according to claim 3, characterized in that, The heat transfer block (7) has a guide hole (701) on the side surface away from the second heat dissipation module (5). The press-fit structure (30) includes: An elastic element (8) is located inside the guide hole (701), and the first end of the elastic element (8) is connected to the bottom surface of the guide hole (701). A pressure plate (10) is provided, with its first end connected to the liquid cooling heat sink (4) and its second end connected to the second end of the elastic member (8), so that the elastic member (8) provides the heat transfer block (7) with an elastic force that applies pressure toward the side of the second heat dissipation module (5).

8. The liquid-cooled server according to claim 7, characterized in that, The thickness of the pressure plate (10) does not exceed 3 mm.

9. The liquid-cooled server according to claim 7, characterized in that, The first end of the pressure plate (10) is detachably connected to the liquid cooling heat sink (4).

10. The liquid-cooled server according to any one of claims 1 to 9, characterized in that, The projection of the liquid cooling heat sink (4) onto the thickness direction of the circuit board (1) is adapted to the projection of the first heat dissipation module (2) onto the thickness direction of the circuit board (1); and / or, The heat dissipation bonding surface is adapted to the surface of the second heat dissipation module (5) on the side opposite to the circuit board (1).

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