Heat dissipation guide pipe with clamping structure for computer

Abstract

The utility model relates to the technical field of heat dissipation conduits for computers, in particular to a heat dissipation conduit with a clamping structure for a computer, which comprises a heat dissipation fin layer consisting of a plurality of uniformly arranged heat dissipation fins, a U-shaped heat dissipation conduit body and a bolt, an elastic heat insulation pad is fixedly connected to the outer side of the heat dissipation conduit body, and the elastic heat insulation pad is fixedly connected to the outer side of the heat dissipation conduit body. A positioning block is fixedly connected to the outer side of the elastic heat insulation pad, a sliding groove is formed in the inner side of the positioning block, a spring is arranged on the inner side of the sliding groove, and a clamping block with one side in an arc shape is slidably connected to the inner side of the sliding groove. The clamping blocks are clamped on the inner sides of the clamping grooves, and the bolts penetrate through the connecting blocks to be spirally connected with the threaded sleeves, so that detachable mounting of the cooling fin layer and the cooling guide pipe body is realized to a certain extent, and the problem that the cooling fin layer and the cooling guide pipe body are inconvenient to dismount for the cooling guide pipe for the computer is solved.

Description

Technical Field

[0001] This utility model relates to the field of heat pipe technology for computers, specifically a heat pipe for computers with a snap-fit ​​structure. Background Technology

[0002] The main function of heat pipes is to quickly conduct the heat generated inside the computer to the heat sink or cooling fan, and then dissipate the heat through air convection or liquid circulation, thereby ensuring the normal operation of computer hardware and extending its service life.

[0003] Some heat pipes are fixed inside the heat sink fin layer, making it inconvenient to disassemble the heat sink fin layer and the heat pipe body. The gap between the heat sink fin and the heat pipe may be difficult to clean, easily accumulating dust and debris, which affects the heat dissipation effect. Furthermore, when it is necessary to replace the heat pipe or heat sink fin, it may be necessary to disassemble more computer components, which increases the complexity and cost of maintenance. Therefore, a heat pipe for computers with a snap-fit ​​structure is proposed to address the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a heat pipe for computers with a snap-fit ​​structure, so as to solve the problem that it is inconvenient to disassemble the heat dissipation fin layer and the heat pipe body of a computer heat pipe.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A heat pipe for computers with a snap-fit ​​structure includes a heat dissipation fin layer composed of several uniformly arranged heat dissipation fins, a U-shaped heat pipe body, and bolts. A through hole is formed on the inner side of the heat dissipation fin layer. The heat pipe body is disposed inside the through hole. An elastic thermal insulation pad is fixedly connected to the outer side of the heat pipe body. A positioning block is fixedly connected to the outer side of the elastic thermal insulation pad. A sliding groove is formed on the inner side of the positioning block. A spring is disposed on the inner side of the sliding groove. A locking block with one side arc-shaped is slidably connected to the inner side of the sliding groove. A connecting block penetrating the sliding groove is fixedly connected to the outer side of the locking block. A fixing block is fixedly connected to the bottom of the heat dissipation fin layer. A locking groove is formed on one side of the fixing block. Threaded sleeves are fixedly connected to the inner side of the fixing block with uniformly arranged threaded sleeves.

[0007] Preferably, an elastic heat insulation sleeve is provided on the inner side of the positioning block, and the elastic heat insulation sleeve is in contact with the heat dissipation duct body.

[0008] Preferably, the slot is arc-shaped, and the card block engages with the inside of the slot.

[0009] Preferably, the bottom of the connecting block is fitted to the bottom of the fixing block, and the bolt passes through the connecting block and is spirally connected to the threaded sleeve.

[0010] Preferably, the elastic thermal insulation pads are symmetrically arranged at the bottom of the heat dissipation fin layer, and the elastic thermal insulation pads are attached to the bottom of the heat dissipation fin layer.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] In this invention, a structure consisting of a positioning block, a locking block, a connecting block, a fixing block, a slot, a screw sleeve, and bolts is used. The heat pipe body is inserted into a through hole on the inner side of the heat dissipation fin layer. The locking block is engaged with the inner side of the slot, and the bolts are threaded through the connecting block and the screw sleeve, thereby enabling the detachable installation of the positioning block and the fixing block. The positioning block is fixedly connected to the heat pipe body through an elastic heat insulation sleeve, and the fixing block is fixedly connected to the heat dissipation fin layer. This, to a certain extent, enables the detachable installation of the heat dissipation fin layer and the heat pipe body, solving the problem of inconvenient disassembly of the heat dissipation fin layer and the heat pipe body in computer heat pipes. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This utility model Figure 1 A schematic diagram of the structure at point A;

[0015] Figure 3 This is a schematic diagram of the assembly structure of the heat dissipation pipe body of this utility model;

[0016] Figure 4 This utility model Figure 3 A schematic diagram of the structure at point B;

[0017] Figure 5 This is a three-dimensional structural diagram of the heat dissipation fin layer of this utility model;

[0018] Figure 6 This is a schematic diagram of the positioning block of this utility model;

[0019] Figure 7 This is a schematic diagram of the structure of the card block of this utility model.

[0020] In the diagram: 1. Heat dissipation fin layer; 2. Through hole; 3. Heat pipe body; 4. Elastic thermal insulation pad; 5. Positioning block; 6. Elastic thermal insulation sleeve; 7. Slide groove; 8. Spring; 9. Locking block; 10. Connecting block; 11. Fixing block; 12. Slot; 13. Screw sleeve; 14. Bolt. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0023] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0024] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0025] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0026] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0027] Please see Figure 1-7 This utility model provides a technical solution:

[0028] A computer heat pipe with a snap-fit ​​structure includes a heat dissipation fin layer 1 composed of several uniformly arranged heat dissipation fins, a U-shaped heat pipe body 3, and bolts 14. A through hole 2 is formed on the inner side of the heat dissipation fin layer 1. The heat pipe body 3 is disposed inside the through hole 2. An elastic thermal insulation pad 4 is fixedly connected to the outer side of the heat pipe body 3. A positioning block 5 is fixedly connected to the outer side of the elastic thermal insulation pad 4. A sliding groove 7 is formed on the inner side of the positioning block 5. A spring 8 is provided on the inner side of the sliding groove 7. A locking block 9 with one side arc-shaped is slidably connected to the inner side of the sliding groove 7. A connecting block 10 penetrating the sliding groove 7 is fixedly connected to the outer side of the locking block 9. A fixing block 11 is fixedly connected to the bottom of the heat dissipation fin layer 1. A slot 12 with uniformly arranged slots is formed on one side of the fixing block 11. A screw sleeve 13 with uniformly arranged slots is fixedly connected to the inner side of the fixing block 11. This design solves the problem of inconvenience in disassembling the heat dissipation fin layer 1 and the heat pipe body 3 in computer heat pipes.

[0029] An elastic heat insulation sleeve 6 is provided on the inner side of the positioning block 5. The elastic heat insulation sleeve 6 is in contact with the heat dissipation pipe body 3. This setting allows the elastic heat insulation sleeve 6 to prevent the heat accumulated in the heat dissipation pipe body 3 from being transferred to the positioning block 5, thereby extending the service life of the positioning block 5. The slot 12 is arc-shaped, and the slot 9 is engaged with the inner side of the slot 12. This setting allows the slot 9 to be used in conjunction with the slot 12. The connecting block 10 is in contact with the bottom of the fixing block 11. The bolt 14 passes through the connecting block 10 and is screwed to the threaded sleeve 13. This setting allows the positioning block 5 and the fixing block 11 to be detachably installed. The elastic heat insulation pad 4 is symmetrically arranged at the bottom of the heat dissipation fin layer 1. The elastic heat insulation pad 4 is in contact with the bottom of the heat dissipation fin layer 1. This setting allows the elastic heat insulation pad 4 to protect the positioning block 5, preventing heat from accumulating on the inner side of the positioning block 5 and extending the service life of the positioning block 5.

[0030] Workflow: When connecting the heat sink fin layer 1 to the heat pipe body 3, insert the heat pipe body 3 into the through hole 2 on the inner side of the heat sink fin layer 1. The locking block 9 will first be pressed by the outer wall of the fixing block 11, thereby causing the locking block 9 to drive the connecting block 10 to slide inside the slide groove 7. The locking block 9 will act on the spring 8, compressing the spring 8. When the positioning block 5 is aligned with the fixing block 11, the elastic thermal insulation pad 4 will adhere to the bottom of the heat sink fin layer 1. The elastic thermal insulation pad 4 can protect the positioning block 5, so that heat will not accumulate inside the positioning block 5. At the same time, the locking block 9 will engage inside the slot 12. Under the reaction force of the spring 8, The inner wall of the card block 9 and the card slot 12 are tightly fitted together. Then, the bolt 14 is threaded through the connecting block 10 and the screw sleeve 13 to achieve the detachable installation of the positioning block 5 and the fixing block 11. The positioning block 5 is fixedly connected to the heat pipe body 3 through the elastic heat insulation sleeve 6, and the fixing block 11 is fixedly connected to the heat dissipation fin layer 1. This achieves the detachable installation of the heat dissipation fin layer 1 and the heat pipe body 3 to a certain extent, solving the problem that it is inconvenient to disassemble the heat dissipation fin layer 1 and the heat pipe body 3 of computer heat pipes. The elastic heat insulation sleeve 6 can prevent the heat accumulated in the heat pipe body 3 from being transferred to the positioning block 5, thereby extending the service life of the positioning block 5.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat pipe for a computer with a snap-fit ​​structure, comprising a heat dissipation fin layer (1) composed of a plurality of uniformly arranged heat dissipation fins, a heat pipe body (3) arranged in a U-shape, and a bolt (14), characterized in that: The heat dissipation fin layer (1) has a through hole (2) on its inner side. The heat dissipation pipe body (3) is located inside the through hole (2). An elastic heat insulation pad (4) is fixedly connected to the outer side of the heat dissipation pipe body (3). A positioning block (5) is fixedly connected to the outer side of the elastic heat insulation pad (4). A sliding groove (7) is opened on the inner side of the positioning block (5). A spring (8) is provided on the inner side of the sliding groove (7). A locking block (9) with one side arc-shaped is slidably connected to the inner side of the sliding groove (7). A connecting block (10) that penetrates the sliding groove (7) is fixedly connected to the outer side of the locking block (9). A fixing block (11) is fixedly connected to the bottom of the heat dissipation fin layer (1). A slot (12) with uniform arrangement is opened on one side of the fixing block (11). A screw sleeve (13) with uniform arrangement is fixedly connected to the inner side of the fixing block (11).

2. A heat pipe for a computer with a snap-fit ​​structure according to claim 1, characterized in that: An elastic heat insulation sleeve (6) is provided on the inner side of the positioning block (5), and the elastic heat insulation sleeve (6) is in contact with the heat dissipation duct body (3).

3. A heat pipe for a computer with a snap-fit ​​structure according to claim 1, characterized in that: The slot (12) is arc-shaped, and the card block (9) engages with the inside of the slot (12).

4. A heat pipe for a computer with a snap-fit ​​structure according to claim 1, characterized in that: The bottom of the connecting block (10) is attached to the fixing block (11), and the bolt (14) is threaded through the connecting block (10) and connected to the threaded sleeve (13).

5. A heat pipe for a computer with a snap-fit ​​structure according to claim 1, characterized in that: The elastic thermal insulation pad (4) is symmetrically arranged at the bottom of the heat dissipation fin layer (1), and the elastic thermal insulation pad (4) is attached to the bottom of the heat dissipation fin layer (1).

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