Ceramic resistor unit adopting heat conducting plate for heat dissipation and ceramic resistor

Abstract

The utility model relates to a resistor, in particular to a ceramic resistor unit adopting a heat conducting plate for heat dissipation and a ceramic resistor, and solves the problems that when the heat dissipation efficiency of the conventional ceramic resistor is improved, the overall structure is enlarged, the sealing performance is difficult to guarantee, and ceramic resistor discs are easy to be mutually extruded and damaged during thermal expansion and cold contraction. According to the utility model, the ceramic resistor disc is exposed in the air, the generated heat can be directly dissipated into the air, the heat dissipation efficiency is higher, and a sealing structure does not need to be used; the ceramic resistor discs are arranged between the two adjacent alloy heat-conducting plates, and heat is quickly conducted out by utilizing the alloy heat-conducting plates after heating, so that heat accumulation is prevented; the metal pressing device is arranged between the metal pressing plate and the alloy heat conduction plate at the outermost end and used for absorbing deformation of the ceramic resistor discs during thermal expansion and cold contraction and preventing damage caused by mutual extrusion between the ceramic resistor discs, the size of the ceramic resistor discs does not need to be increased to enhance the heat dissipation capacity, and therefore the overall size is small, and the miniaturization requirement is met.

Description

Technical Field

[0001] This utility model relates to resistors, specifically to a ceramic resistor unit and a ceramic resistor that uses a heat-conducting plate for heat dissipation. Background Technology

[0002] Resistors are widely used in various industries such as power transmission and distribution filtering, flexible DC start-up current limiting, electric drive load, AC / DC drive, pulse power supply, induction heating, pulse network, and laser. As these industries continue to develop, the requirements for the working stability of resistors are also gradually increasing.

[0003] Currently, ceramic resistors are widely used as the mainstream type of resistor. They mainly rely on multiple ceramic resistance elements connected in series to provide resistance. Existing structures typically use a sealed structure to enclose these series-connected ceramic resistance elements. However, temperature is one of the main factors affecting resistor operation; if the ceramic resistance elements in the sealed environment are not cooled, the resistor's efficiency will decrease significantly. The current main approach is to fill the sealed structure with a heat-equalizing medium (silicate minerals or insulating oil) to dissipate heat from the ceramic resistance elements.

[0004] To further improve heat dissipation efficiency, ceramic resistors currently primarily reduce temperature rise by increasing the number of ceramic resistance elements and adding a heat-spreading medium within the sealed structure. However, increasing the number of ceramic resistance elements increases the overall resistor size, compromising structural compactness. Adding a heat-spreading medium to the environment surrounding the ceramic resistance elements presents challenges. First, the ceramic resistance elements remain within the sealed structure, increasing the difficulty of fabricating the sealed structure and ensuring its sealing performance. Second, after prolonged heating, the heat dissipation efficiency of the heat-spreading medium decreases, and heat within the sealed structure is difficult to dissipate. As the number of ceramic resistance elements stacked increases, they become more susceptible to damage due to mutual compression during thermal expansion and contraction, leading to a decrease in the current-carrying capacity of the resistor circuit. In severe cases, the ceramic resistance elements may break off, destroying the entire resistor string structure and causing a short circuit. Furthermore, with the current trend towards intelligent and miniaturized power equipment, the increased size of ceramic resistors limits their application range and makes them less adaptable to industry development. Utility Model Content

[0005] The purpose of this invention is to solve the technical problems of current ceramic resistors, such as increased overall structure, difficulty in ensuring sealing performance, and easy mutual compression and damage of ceramic resistor sheets when improving heat dissipation efficiency. The invention provides a ceramic resistor unit and ceramic resistor that uses a heat-conducting plate for heat dissipation.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A ceramic resistor unit that uses a heat-conducting plate for heat dissipation is unique in that:

[0008] Includes insulating tie rods, metal pressure plates, metal clamping devices, alloy heat-conducting plates, and ceramic resistance sheets;

[0009] At least three insulating pull rods are provided and are evenly distributed in a circle. Metal pressure plates are provided at both ends of the insulating pull rods. Multiple alloy heat-conducting plates are provided at equal intervals between two metal pressure plates. The alloy heat-conducting plates are snapped between the insulating pull rods. There are multiple ceramic resistors, and each ceramic resistor is located between two adjacent alloy heat-conducting plates.

[0010] There are two metal clamping devices, located between the metal pressure plate and the outermost alloy heat-conducting plate, used to absorb the deformation of the ceramic resistance element during thermal expansion and contraction.

[0011] Furthermore, it also includes an insulating positioning post; the insulating positioning post is located at the center of the metal pressure plate and penetrates from top to bottom through the two metal pressure plates and the alloy heat-conducting plate and ceramic resistor sheet located between the two metal pressure plates;

[0012] The metal clamping device includes a metal end, an elastic pin, and a clamping spring. The metal end is located at both ends of the insulating positioning post and is fixed to the insulating positioning post by the elastic pin. The clamping spring is sleeved on the insulating positioning post, with one end abutting against the inner end face of the metal end and the other end abutting against the outermost alloy heat-conducting plate.

[0013] Furthermore, the metal clamping device also includes a metal connecting block, which is located between the metal pressure plate and the outermost alloy heat-conducting plate and is sleeved on the insulating positioning post.

[0014] The metal connecting block has a mounting groove in the center, and the other end of the compression spring abuts against the bottom of the mounting groove.

[0015] Furthermore, the number of ceramic resistors is 20-50.

[0016] Furthermore, the diameter of the alloy heat-conducting plate is larger than the diameter of the ceramic resistor sheet.

[0017] Furthermore, four insulating tie rods are provided and are evenly distributed in a circle.

[0018] Meanwhile, this utility model also provides a ceramic resistor, which is special in that it includes multiple ceramic resistor units with heat dissipation by heat-conducting plates connected in sequence from top to bottom.

[0019] Furthermore, there are 3-5 ceramic resistor units that use heat-conducting plates for heat dissipation.

[0020] Furthermore, two adjacent ceramic resistor units that use heat-conducting plates for heat dissipation are connected by bolts.

[0021] Compared with the prior art, the beneficial effects of this utility model are:

[0022] (1) The ceramic resistor unit with heat dissipation using a heat-conducting plate provided by this utility model exposes the ceramic resistor sheet to the air, and the heat generated can be directly dissipated into the air. Compared with the previous method of sealing the ceramic resistor sheet with a sealed structure, the heat dissipation efficiency is higher, and there is no need to use a sealed structure, so there is no need to consider the sealing performance. In order to further enhance the heat dissipation effect, the ceramic resistor sheet is placed between two adjacent alloy heat-conducting plates. After the heat is generated, the alloy heat-conducting plate is used to quickly conduct the heat out, preventing the heat from accumulating and affecting the current flow of the resistor circuit. A metal clamping device is provided between the metal pressure plate and the outermost alloy heat-conducting plate, which is used to absorb the deformation of the ceramic resistor sheet when it expands and contracts with heat, and to prevent the ceramic resistor sheets from being squeezed together and damaged. There is no need to increase the size of the ceramic resistor sheet to enhance the heat dissipation capacity, so the overall volume is small and meets the miniaturization requirements.

[0023] (2) The metal clamping device in the ceramic resistor unit with heat dissipation by heat-conducting plate provided by this utility model includes a metal end, an elastic pin and a clamping spring. The metal end is fixed to both ends of the insulating positioning post by the elastic pin. The clamping spring is sleeved on the insulating positioning post. One end of the spring abuts against the inner end face of the metal end and the other end abuts against the outermost alloy heat-conducting plate. When the ceramic resistor sheet deforms due to thermal expansion and contraction, the elastic deformation of the clamping spring absorbs the deformation of the ceramic resistor sheet caused by thermal expansion and contraction.

[0024] (3) The metal clamping device in the ceramic resistor unit with heat dissipation by heat-conducting plate provided by this utility model also includes a metal connecting block. The metal connecting block increases the contact area between the clamping spring and the alloy heat-conducting plate, reduces the surface pressure of the alloy heat-conducting plate, and prevents pressure damage.

[0025] (4) In the ceramic resistor unit with heat dissipation using a heat-conducting plate provided by this utility model, the diameter of the alloy heat-conducting plate is larger than the diameter of the ceramic resistor sheet, which increases the heat dissipation area and enhances the heat dissipation efficiency. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of an embodiment of a ceramic resistor unit using a heat-conducting plate for heat dissipation according to the present invention;

[0027] Figure 2 This is a three-dimensional structural diagram of an embodiment of a ceramic resistor according to the present invention;

[0028] Figure 3 This is a schematic diagram of the metal clamping device in an embodiment of a ceramic resistor unit that uses a heat-conducting plate for heat dissipation according to this utility model.

[0029] The annotations in the attached figures are explained as follows:

[0030] 01-Ceramic resistor unit with heat dissipation using heat-conducting plate; 1-Metal pressure plate; 2-Insulated pull rod; 3-Metal clamping device; 31-Metal end; 32-Elastic pin; 33-Compression spring; 34-Metal connecting block; 4-Alloy heat-conducting plate; 5-Ceramic resistor sheet; 6-Insulated positioning post. Detailed Implementation

[0031] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0032] Reference Figure 2 The ceramic resistor of this utility model includes a plurality of ceramic resistor units 01 connected from top to bottom and using heat-conducting plates for heat dissipation. In this embodiment, there are generally 3-5 ceramic resistor units 01 using heat-conducting plates for heat dissipation, and two adjacent ceramic resistor units 01 using heat-conducting plates for heat dissipation are connected by bolts.

[0033] like Figure 1 As shown, each ceramic resistor unit 01 using a heat-conducting plate for heat dissipation includes an insulating rod 2, a metal pressure plate 1, a metal clamping device 3, an alloy heat-conducting plate 4, and ceramic resistor sheets 5. For structural stability, at least three insulating rods 2 are provided, evenly distributed circumferentially. Considering manufacturing costs, four are provided in this embodiment. The four insulating rods 2 are evenly distributed circumferentially. There are two metal pressure plates 1, which are bolted to the two ends of the insulating rods 2. Multiple alloy heat-conducting plates 4 are evenly spaced between the two metal pressure plates 1, and the alloy heat-conducting plates 4 are engaged with the four insulating rods 2 via slots. Multiple ceramic resistor sheets 5 are also provided, each ceramic resistor sheet 5 located between two adjacent alloy heat-conducting plates 4. In this embodiment, the number of ceramic resistor sheets 5 in each ceramic resistor unit 01 is 20-50 to prevent excessive deformation due to thermal expansion and contraction of too many ceramic resistor sheets 5.

[0034] An insulating positioning post 6 is also provided at the center of the metal pressure plate 1. It runs from top to bottom through the two metal pressure plates 1 and the alloy heat-conducting plate 4 and ceramic resistor 5 located between the two metal pressure plates 1. The alloy heat-conducting plate 4 and the ceramic resistor 5 are both sleeved on the insulating positioning post 6, which is responsible for fixing and positioning the alloy heat-conducting plate 4 and the ceramic resistor 5. In order to enhance the heat dissipation effect, the diameter of the alloy heat-conducting plate 4 is larger than the diameter of the ceramic resistor 5. This increases the contact area with the air to carry away the heat generated by the ceramic resistor 5 during operation more quickly.

[0035] There are two metal clamping devices 3, located between the metal pressure plate 1 and the outermost alloy heat-conducting plate 4, used to absorb the deformation of the ceramic resistance element 5 during thermal expansion and contraction, and their structure is as follows. Figure 3As shown, the metal clamping device 3 includes a metal end 31, an elastic pin 32, and a clamping spring 33. The metal end 31 is disposed at both ends of the insulating positioning post 6 and is fixed to the insulating positioning post 6 by the elastic pin 32. The clamping spring 33 is sleeved on the insulating positioning post 6, with one end abutting against the inner end face of the metal end 31 and the other end abutting against the outermost alloy heat-conducting plate 4.

[0036] The small contact area between the compression spring 33 and the alloy heat-conducting plate 4 results in high surface pressure on the alloy heat-conducting plate 4, which can easily cause damage. Therefore, the metal clamping device 3 also includes a metal connecting block 34. The metal connecting block 34 is located between the metal pressure plate 1 and the outermost alloy heat-conducting plate 4 and is sleeved on the insulating positioning post 6. A mounting groove is provided in the center of the metal connecting block 34, and the other end of the compression spring 33 abuts against the bottom of the mounting groove, thereby increasing the force-bearing area through the metal connecting block 34. Figure 3 As shown, the metal clamping device 3 is in the extreme compression condition. At this time, the clamping spring 33 is fully compressed, and the outer end face of the metal connecting block 34 abuts against the metal pressure plate 1.

[0037] In use, 3-5 ceramic resistor units 01 with heat dissipation plates are connected from top to bottom with bolts according to actual needs. When the ceramic resistor 5 heats up, the heat is carried away by the alloy heat-conducting plate 4 and dissipated into the air. When multiple ceramic resistors 5 expand and contract with heat, the compression spring 33 is compressed. The elastic deformation absorbs the deformation of this thermal expansion and contraction, preventing the ceramic resistors 5 from being squeezed and broken.

[0038] The embodiments described above are merely descriptions of specific implementations of this utility model and are not intended to limit the scope of this utility model. Various modifications and improvements made to the technical solutions of this utility model by those skilled in the art without departing from the spirit of this utility model should fall within the protection scope defined by the claims of this utility model.

Claims

1. A ceramic resistor unit employing a heat-conducting plate for heat dissipation, characterized in that: It includes an insulating pull rod (2), a metal pressure plate (1), a metal clamping device (3), an alloy heat-conducting plate (4), and a ceramic resistance sheet (5); At least three insulating pull rods (2) are provided and are evenly distributed in a circle. Metal pressure plates (1) are provided at both ends of the insulating pull rods (2). Multiple alloy heat-conducting plates (4) are provided at equal intervals between two metal pressure plates (1). The alloy heat-conducting plates (4) are snapped between the insulating pull rods (2). There are multiple ceramic resistors (5), and each ceramic resistor (5) is located between two adjacent alloy heat-conducting plates (4). There are two metal clamping devices (3), located between the metal pressure plate (1) and the outermost alloy heat-conducting plate (4), which are used to absorb the deformation of the ceramic resistor (5) during thermal expansion and contraction.

2. The ceramic resistor unit with heat dissipation using a heat-conducting plate according to claim 1, characterized in that: It also includes an insulating positioning post (6); the insulating positioning post (6) is located at the center of the metal pressure plate (1) and passes through the two metal pressure plates (1) from top to bottom, as well as the alloy heat-conducting plate (4) and ceramic resistance sheet (5) located between the two metal pressure plates (1); The metal clamping device (3) includes a metal end (31), an elastic pin (32), and a clamping spring (33). The metal end (31) is disposed at both ends of the insulating positioning post (6) and fixed on the insulating positioning post (6) by the elastic pin (32). The clamping spring (33) is sleeved on the insulating positioning post (6), with one end abutting against the inner end face of the metal end (31) and the other end abutting against the outermost alloy heat-conducting plate (4).

3. The ceramic resistor unit with heat dissipation using a heat-conducting plate according to claim 2, characterized in that: The metal clamping device (3) also includes a metal connecting block (34), which is located between the metal pressure plate (1) and the outermost alloy heat-conducting plate (4) and is sleeved on the insulating positioning post (6). The metal connecting block (34) has a mounting groove in the center, and the other end of the compression spring (33) abuts against the bottom of the mounting groove.

4. The ceramic resistor unit with heat dissipation using a heat-conducting plate according to claim 3, characterized in that: The number of ceramic resistors (5) is 20-50.

5. The ceramic resistor unit with heat dissipation using a heat-conducting plate according to claim 4, characterized in that: The diameter of the alloy heat-conducting plate (4) is larger than the diameter of the ceramic resistor (5).

6. The ceramic resistor unit with heat dissipation using a heat-conducting plate according to claim 5, characterized in that: The insulating tie rods (2) are provided in four parts and are evenly distributed in a circle.

7. A ceramic resistor, characterized in that: It includes multiple ceramic resistor units (01) with heat dissipation using a heat-conducting plate as described in any one of claims 1-6, connected sequentially from top to bottom.

8. The ceramic resistor according to claim 7, characterized in that: There are 3-5 ceramic resistor units (01) that use heat-conducting plates for heat dissipation.

9. The ceramic resistor according to claim 8, characterized in that: Two adjacent ceramic resistor units (01) that use heat-conducting plates for heat dissipation are connected by bolts.

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