Capacitor without shell

Abstract

The utility model provides a capacitor without a shell. The capacitor comprises a capacitor core, a first binding post, a second binding post and an epoxy resin packaging layer, the first binding post comprises a first covering section and a first exposed section; one end of the first covering section is connected with a first electrode layer of the capacitor core; the second binding post comprises a second covering section and a second exposed section; one end of the second covering section is connected with a second electrode layer of the capacitor core; the epoxy resin packaging layer covers the capacitor core, the first covering section and the second covering section; and metal powder particles are uniformly dispersed in the epoxy resin packaging layer. According to the utility model, the shell-free design of the epoxy resin packaging layer is adopted, and the metal powder particles are uniformly dispersed in the epoxy resin packaging layer, so that the steps of manufacturing and assembling a traditional shell in the manufacturing process of a traditional capacitor are omitted, the technological process is simplified, and the production cost is reduced; and the heat dissipation performance of the epoxy resin packaging layer is improved, and the reliability of the capacitor is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, and in particular to a capacitor without a casing. Background Technology

[0002] A capacitor is an electronic component capable of storing electrical charge, widely used in various electronic devices and circuits. Capacitor encapsulation provides necessary physical protection for the sensitive internal components, preventing damage to the capacitor core from the external environment and ensuring good electrical isolation between the capacitor and surrounding circuits, avoiding short circuits or leakage. Currently, most capacitor technologies rely on encapsulated forms with shells, including plastic, aluminum, and stainless steel shells. While these traditional encapsulation methods provide effective protection, manufacturing encapsulated capacitors requires more steps, increasing both production costs and manufacturing difficulty. Utility Model Content

[0003] The purpose of this invention is to provide a casing-less capacitor to solve one or more technical problems existing in the prior art, or at least to provide a beneficial option or create conditions.

[0004] The solution to the technical problem of this utility model is: to provide a casing-less capacitor, comprising: a capacitor core, a first terminal, a second terminal, and an epoxy resin encapsulation layer; the first terminal includes a first covered section and a first exposed section; one end of the first covered section is connected to the first electrode layer of the capacitor core; the second terminal includes a second covered section and a second exposed section; one end of the second covered section is connected to the second electrode layer of the capacitor core; the epoxy resin encapsulation layer covers the capacitor core, the first covered section, and the second covered section; metal powder particles are uniformly dispersed inside the epoxy resin encapsulation layer.

[0005] Furthermore, the length ratio between the first covered section and the first exposed section of the first terminal is between 0.5 and 1.0.

[0006] Furthermore, the length ratio between the second covered section and the second exposed section of the second terminal is between 0.5 and 1.0.

[0007] Furthermore, the capacitor core is a cylindrical structure formed by overlapping and winding two conductive films; the two conductive films include a first conductive film and a second conductive film.

[0008] Furthermore, the top of the cylindrical structure of the capacitor core is provided with the first electrode layer; the first electrode layer is connected to the first conductive film.

[0009] Furthermore, the bottom of the cylindrical structure of the capacitor core is provided with the second electrode layer; the second electrode layer is connected to the second conductive film.

[0010] Furthermore, one end of the first covering segment is welded to the first electrode layer of the capacitor core.

[0011] Furthermore, one end of the second covering segment is welded to the second electrode layer of the capacitor core.

[0012] Furthermore, the first conductive film includes a first conductive layer and a first plastic film layer; the second conductive film includes a second conductive layer and a second plastic film layer.

[0013] Furthermore, the first plastic film layer and the second plastic film layer are polypropylene component layers.

[0014] This invention has at least the following beneficial effects: By adopting a shell-less design with an epoxy resin encapsulation layer, this invention eliminates the steps of manufacturing and assembling a traditional shell in the traditional capacitor manufacturing process. This reduces the number of processes in the production process, lowers production complexity and costs, and improves overall production efficiency. Furthermore, by uniformly dispersing metal powder particles within the epoxy resin encapsulation layer, this invention enhances the heat dissipation performance and structural strength of the epoxy resin encapsulation layer, ensuring the reliability and stability of the capacitor. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly explained below. Obviously, the described drawings are only a part of the embodiments of this utility model, and not all of them. Those skilled in the art can obtain other design schemes and drawings based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the cross-sectional structure of an uncased capacitor;

[0017] Figure 2 This is an enlarged structural diagram of point A of an uncased capacitor;

[0018] Figure 3 This is a schematic diagram of the capacitor core structure of a capacitor without a casing.

[0019] Reference numerals: 100, First terminal; 101, First covering section; 102, First exposed section; 200, Second terminal; 201, Second covering section; 202, Second exposed section; 300, Capacitor core; 301, First electrode layer; 302, Second electrode layer; 400, Epoxy resin encapsulation layer; 401, Metal powder particles; 500, Double-layer conductive film; 501, First conductive film; 502, Second conductive film; 511, First conductive layer; 512, First plastic film layer; 521, Second conductive layer; 522, Second plastic film layer. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0021] It should be noted that although functional modules are divided in the schematic diagram of the uncased capacitor, in some cases, the module division may differ from that shown in the schematic diagram of the uncased capacitor. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0022] refer to Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a schematic diagram of the cross-sectional structure of an uncased capacitor. Figure 2 This is an enlarged structural diagram of point A of an uncased capacitor. Figure 3 This is a schematic diagram of the capacitor core structure of a capacitor without a casing.

[0023] Most existing capacitors rely on encapsulated forms with shells, which result in complex manufacturing processes and high production costs. To address these issues, this application aims to achieve a lighter, more efficient, and lower-cost capacitor by employing a shell-less design with an epoxy resin encapsulation layer.

[0024] This utility model provides a casing-less capacitor, comprising: a capacitor core 300, a first terminal 100, a second terminal 200, and an epoxy resin encapsulation layer 400; the first terminal 100 includes a first covering section 101 and a first exposed section 102; one end of the first covering section 101 is connected to the first electrode layer 301 of the capacitor core 300; the second terminal 200 includes a second covering section 201 and a second exposed section 202; one end of the second covering section 201 is connected to the second electrode layer 302 of the capacitor core 300; the epoxy resin encapsulation layer 400 covers the capacitor core 300, the first covering section 101, and the second covering section 201; metal powder particles 401 are uniformly dispersed inside the epoxy resin encapsulation layer 400.

[0025] The capacitor core 300 is the core component of the capacitor, used to store charge. It plays a role in smoothly transmitting current and maintaining voltage stability.

[0026] The first terminal 100 and the second terminal 200 serve as a bridge connecting the external circuit to the inside of the capacitor. Because the design of the first terminal 100 and the second terminal 200 needs to consider both good electrical contact and mechanical strength, in some further embodiments, the first terminal 100 and the second terminal 200 are typically made of copper or other metals with good electrical conductivity.

[0027] The epoxy resin encapsulation layer 400 possesses excellent insulation properties, corrosion resistance, and plasticity, forming a robust and sealed outer shell after curing. Therefore, the epoxy resin encapsulation layer 400 not only protects the internal structure of the capacitor from external environmental factors such as moisture and dust, preventing damage or corrosion to internal components, but also provides excellent electrical isolation, ensuring the safe operation of the capacitor and thus improving its overall stability and safety.

[0028] The first covering segment 101 and the second covering segment 201 are covered by an epoxy resin encapsulation layer 400, which provides them with the necessary physical protection and insulation properties. One end of the first covering segment 101 is connected to the first electrode layer 301 of the capacitor core 300, and one end of the second covering segment 201 is connected to the second electrode layer 302 of the capacitor core 300.

[0029] Therefore, the first covering section 101 serves to establish a stable electrical connection between the first terminal 100 and the first electrode layer 301 of the capacitor core 300. The second covering section 201 serves to establish a stable electrical connection between the second terminal 200 and the second electrode layer 302 of the capacitor core 300.

[0030] The first exposed section 102 and the second exposed section 202 are exposed from the epoxy resin encapsulation layer 400, which facilitates the establishment of an electrical connection between the external circuit and the first terminal 100 and the second terminal 200, thereby establishing a complete electrical path between the inside and outside of the capacitor.

[0031] The design of this application, which uses a uniformly dispersed metal powder particles 401 within the epoxy resin encapsulation layer 400, is based on the following reasons: The plasticity of epoxy resin simplifies the encapsulation process, eliminating the need for complex machining equipment. Furthermore, the raw material price of epoxy resin is relatively low and readily available, reducing overall production costs. However, epoxy resin has poor thermal conductivity, which may affect the heat dissipation performance of the capacitor when used as an encapsulation layer, thereby impacting the capacitor's efficiency and lifespan.

[0032] Therefore, this application uniformly disperses metal powder particles 401 inside the epoxy resin encapsulation layer 400, which improves the heat dissipation capacity and structural strength of the epoxy resin encapsulation layer 400, thereby ensuring the heat dissipation performance and structural strength of the capacitor, and thus improving the reliability and service life of the capacitor.

[0033] In summary, by adopting a shell-less design with an epoxy resin encapsulation layer 400, this application not only ensures the reliability of the capacitor, but also effectively reduces production costs, simplifies the manufacturing process, and thus improves production efficiency.

[0034] In some further specific embodiments, the length ratio between the first covered section 101 and the first exposed section 102 of the first terminal 100 is between 0.5 and 1.0.

[0035] The length ratio between the first covered section 101 and the first exposed section 102 of the first terminal 100 has a multifaceted impact on capacitor performance. In some applications, for first terminals 100 of the same length, a larger length ratio between the first covered section 101 and the first exposed section 102 allows for a longer first covered section 101. This results in a larger contact area between one end of the first covered section 101 and the first electrode layer 301 of the capacitor core 300, thereby improving the reliability of the conductive path, ensuring more stable current flow, and reducing contact resistance, which helps to reduce energy loss and improve capacitor efficiency.

[0036] Furthermore, the longer the first covering section 101 is, the larger the fixing area of ​​the first terminal 100 inside the epoxy resin encapsulation layer can be, which enhances the stability of the entire capacitor structure, making it more resistant to external forces such as vibration and impact, and improving the stability and reliability of the capacitor.

[0037] However, an excessively long first covering segment 101 may increase the thickness of the epoxy resin encapsulation layer 400, potentially affecting the capacitor's heat dissipation performance and consequently its reliability and lifespan. Furthermore, increasing the thickness of the epoxy resin encapsulation layer 400 not only increases the amount of epoxy resin material required for capacitor manufacturing, raising material costs, but also necessitates a more complex encapsulation process, such as a longer curing time, which is detrimental to improving capacitor production efficiency.

[0038] In summary, the optimal length ratio between the first covered section 101 and the first exposed section 102 of the first terminal 100 is crucial for balancing the electrical performance, structural stability, heat dissipation, and production cost of the capacitor. Therefore, in some applications, this application conducts detailed design and testing based on the specific application environment and technical specifications of the capacitor to ensure that the final capacitor product meets the required performance indicators. After numerous experiments and adjustments, this application sets the length ratio between the first covered section 101 and the first exposed section 102 of the first terminal 100 to be between 0.5 and 1.0.

[0039] In some further specific embodiments, the length ratio between the second covering section 201 and the second exposed section 202 of the second terminal 200 is between 0.5 and 1.0.

[0040] The design principle of the length ratio between the second covering section 201 and the second exposed section 202 of the second terminal 200 is the same as the design principle of the length ratio between the first covering section 101 and the first exposed section 102 of the first terminal 100. This is because the first terminal 100 and the second terminal 200 are symmetrical and similar in function and structure design in the capacitor. They both need to meet the requirements of electrical connection reliability, heat dissipation and production cost-effectiveness of the capacitor.

[0041] In some further specific embodiments, the capacitor core 300 is a cylindrical structure formed by overlapping and winding two conductive films 500; the two conductive films 500 include a first conductive film 501 and a second conductive film 502.

[0042] In some further specific embodiments, the first conductive film 501 includes a first conductive layer 511 and a first plastic film layer 512; the second conductive film 502 includes a second conductive layer 521 and a second plastic film layer 522.

[0043] The design of the capacitor core 300 directly determines the capacitor's energy storage capacity, voltage withstand performance, and overall size. In this application, a cylindrical structure of the capacitor core 300 is formed by overlapping and winding two layers of conductive film 500. This structure effectively increases the energy storage area of ​​the capacitor, optimizes space utilization, and maintains a high capacitance value.

[0044] The total thickness of each conductive layer in the double-layer conductive film 500 is generally very thin, possibly ranging from a few micrometers to tens of micrometers. The first conductive layer 511 of the first conductive film 501 and the second conductive layer 521 of the second conductive film 502 are even thinner, typically ranging from tens to hundreds of nanometers. This design helps to increase the capacitance density of the capacitor, reduce its size, and enhance its reliability.

[0045] In some further specific embodiments, the first conductive layer 511 of the first conductive film 501 and the second conductive layer 521 of the second conductive film 502 may be a metal material component layer or a graphene material component layer.

[0046] In some further specific embodiments, a first electrode layer 301 is provided on the top of the cylindrical structure of the capacitor core 300; the first electrode layer 301 is connected to the first conductive film 501.

[0047] A first electrode layer 301 is disposed on the top of the cylindrical structure of the capacitor core 300. The first electrode layer 301 is connected to the first conductive film 501, thus forming a continuous electrical path between the inside and outside of the capacitor core 300. This connection method can ensure that current can flow smoothly into or out of the capacitor core 300 while maintaining low resistance characteristics.

[0048] In some further specific embodiments, a second electrode layer 302 is provided at the bottom of the cylindrical structure of the capacitor core 300; the second electrode layer 302 is connected to the second conductive film 502.

[0049] The design principle of the second electrode layer 302 is the same as that of the first electrode layer 301. The second electrode layer 302 is connected to the second conductive film 502 to form a continuous electrical path between the inside and outside of the capacitor core 300.

[0050] In some further specific embodiments, the first electrode layer 301 and the second electrode layer 302 may be metal layers formed by gold sputtering or other methods, the purpose of which is to provide a large contact surface for connection to external circuits.

[0051] In some further specific embodiments, one end of the first covering segment 101 is welded to the first electrode layer 301 of the capacitor core 300.

[0052] In some further specific embodiments, one end of the second covering segment 201 is welded to the second electrode layer 302 of the capacitor core 300.

[0053] Welding is a high-temperature processing technique in which the metal surfaces melt and resolidify to form a strong bond. This connection method provides very low contact resistance, thus ensuring efficient current transmission. Welding creates a direct bond between the metals, thus providing an extremely stable and low-impedance electrical path, which is crucial for maintaining good charge and discharge characteristics of capacitors.

[0054] Therefore, by welding one end of the first covering section 101 of the first terminal 100 to the first electrode layer 301 of the capacitor core 300 and one end of the second covering section 201 to the second electrode layer 302 of the capacitor core 300, reliable electrical contact between the inside and outside of the capacitor core 300 is provided, and the mechanical stability of the capacitor is also enhanced.

[0055] In some further specific embodiments, the first plastic film layer 512 and the second plastic film layer 522 are polypropylene component layers.

[0056] Polypropylene possesses high dielectric strength and low dielectric loss, making it ideal for use as an insulating medium in capacitors. Therefore, the polypropylene component layer exhibits excellent insulating properties, effectively isolating the first conductive layer 511 and the second conductive layer 521 to prevent short circuits and ensure safe capacitor operation. Furthermore, the polypropylene component layer possesses good mechanical strength and toughness, capable of withstanding tensile stress without cracking, which contributes to improving the overall durability and reliability of the capacitor. Consequently, the polypropylene component layer is less prone to tearing during winding, contributing to the formation of a compact and uniform capacitor core. Moreover, compared to some other high-performance insulating materials, polypropylene is relatively inexpensive and readily available, helping to reduce production costs.

[0057] In summary, by employing the first plastic film layer 512 and the second plastic film layer 522 as polypropylene component layers, the capacitor not only achieves excellent electrical insulation performance and mechanical strength but also maintains economic efficiency. This design facilitates the manufacture of high-efficiency, reliable, and cost-effective capacitor products.

[0058] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A casingless capacitor, characterized in that, include: The capacitor core (300), the first terminal (100), the second terminal (200), and the epoxy resin encapsulation layer (400) are provided. The first terminal (100) includes a first covering section (101) and a first exposed section (102). One end of the first covering section (101) is connected to the first electrode layer (301) of the capacitor core (300). The second terminal (200) includes a second covering section (201) and a second exposed section (202). One end of the second covering section (201) is connected to the second electrode layer (302) of the capacitor core (300). The epoxy resin encapsulation layer (400) covers the capacitor core (300), the first covering section (101), and the second covering section (201). Metal powder particles (401) are uniformly dispersed inside the epoxy resin encapsulation layer (400).

2. The casingless capacitor according to claim 1, characterized in that, The length ratio between the first covered section (101) and the first exposed section (102) of the first terminal (100) is between 0.5 and 1.

0.

3. The casingless capacitor according to claim 1, characterized in that, The length ratio between the second covering section (201) and the second exposed section (202) of the second terminal (200) is between 0.5 and 1.

0.

4. The casingless capacitor according to claim 1, characterized in that, The capacitor core (300) is a cylindrical structure formed by overlapping and winding two layers of conductive films (500); the two layers of conductive films (500) include a first conductive film (501) and a second conductive film (502).

5. The casingless capacitor according to claim 4, characterized in that, The top of the cylindrical structure of the capacitor core (300) is provided with the first electrode layer (301); the first electrode layer (301) is connected to the first conductive film (501).

6. The casingless capacitor according to claim 4, characterized in that, The bottom of the cylindrical structure of the capacitor core (300) is provided with the second electrode layer (302); the second electrode layer (302) is connected to the second conductive film (502).

7. The casingless capacitor according to claim 1, characterized in that, One end of the first covering segment (101) is welded to the first electrode layer (301) of the capacitor core (300).

8. The casingless capacitor according to claim 1, characterized in that, One end of the second covering section (201) is welded to the second electrode layer (302) of the capacitor core (300).

9. The casingless capacitor according to claim 4, characterized in that: The first conductive film (501) includes a first conductive layer (511) and a first plastic film layer (512); the second conductive film (502) includes a second conductive layer (521) and a second plastic film layer (522).

10. The casingless capacitor according to claim 9, characterized in that: The first plastic film layer (512) and the second plastic film layer (522) are polypropylene component layers.

Images