Self-heating quantitative epoxy potting equipment

Abstract

The utility model discloses self-heating quantitative epoxy filling and sealing equipment which comprises a base and a filling and sealing part arranged on the base, the filling and sealing part comprises a pressurizing mechanism and a sealing mechanism; the pressurizing mechanism is mounted on the base; the quantitative filling and sealing mechanism comprises a filling and sealing channel which is arranged on the base and is communicated with the pressurizing mechanism, and a quantitative mechanism which is arranged on the base and is connected with the filling and sealing channel; and the filling and sealing bin is communicated with the filling and sealing channel, and a plurality of groups of electric heating rods are arranged in the filling and sealing bin. According to the utility model, a plurality of groups of electric heating rods are designed in the filling and sealing bin, so that the temperature of epoxy resin is controlled through the electric heating rods during filling and sealing, the viscosity of the epoxy resin is reduced, the flowability of the epoxy resin is improved, and the quantitative filling and sealing of products can be realized during filling and sealing through the design of the quantitative mechanism.

Description

Technical Field

[0001] This utility model relates to the field of epoxy potting of rectifier diodes, specifically a self-heating quantitative epoxy potting device. Background Technology

[0002] Epoxy potting is a technology that uses epoxy resin materials to encapsulate electronic components. It plays an important role in many fields such as electronics, electrical appliances, automobiles, and aerospace.

[0003] Epoxy potting compounds are widely used in the electronics manufacturing, automotive, and aerospace industries. In electronics manufacturing, they are used to encapsulate components such as integrated circuits, transistors, and capacitors to improve the stability and reliability of electronic products.

[0004] During the potting process, epoxy resin is placed inside the chamber and potted through the outlet. No temperature control component is designed to control the temperature of the epoxy resin, which keeps the epoxy resin at room temperature. Epoxy resin at room temperature is generally more viscous and has poor flowability, which can easily affect the potting effect. Utility Model Content

[0005] Purpose of the utility model: To provide a self-heating quantitative epoxy potting device to solve the above-mentioned problems existing in the prior art.

[0006] Technical solution: A self-heating quantitative epoxy potting equipment, comprising:

[0007] A base, and a potting portion disposed on the base;

[0008] The potting section includes:

[0009] A pressurizing mechanism is mounted on the base;

[0010] A quantitative filling mechanism includes a filling channel mounted on the base and communicating with the pressurizing mechanism, and a quantitative mechanism mounted on the base and connected to the filling channel;

[0011] A filling chamber is connected to the filling channel, and the filling chamber is equipped with multiple sets of electric heating rods.

[0012] This invention designs multiple sets of electric heating rods inside the filling chamber. During filling, the temperature of the epoxy resin is controlled by the electric heating rods, which reduces the viscosity of the epoxy resin and increases its fluidity. Furthermore, the design of the metering mechanism allows for the metered filling of the product.

[0013] In a further embodiment, the pressurizing mechanism includes:

[0014] A pressurizing cylinder is mounted on the base, and a pressurizing piston is provided at the output end of the heating cylinder;

[0015] A pressure cylinder is mounted on the base, sleeved on the pressure piston and adapted to the pressure piston. The end of the pressure cylinder has a pressure port, and the inner wall of the pressure cylinder is hinged with a pressure hinge adapted to the pressure port.

[0016] In a further embodiment, the potting channel includes:

[0017] Filler head;

[0018] The metering chamber is connected at one end to the filling head, at the other end to the pressurizing cylinder, and at the top to the filling chamber.

[0019] In a further embodiment, the metering mechanism includes:

[0020] A metering cylinder is hinged to the base;

[0021] A metering swing arm, one end of which is hinged to the output end of the metering cylinder;

[0022] A quantitative mold head is connected to the other end of the quantitative swing arm.

[0023] In a further embodiment, the quantitative probe includes:

[0024] The metering head shell is connected to the metering swing arm at one end. The inside of the metering head shell has a cavity, and the surface has a metering through hole that penetrates the metering head shell.

[0025] The cavity inside the metering head shell has only the opening of the metering through hole, and the end away from the metering swing arm is sealed.

[0026] The metering hinge is hinged to the inner wall of the metering head housing and is adapted to the metering through hole on one side of the metering head housing.

[0027] Beneficial effects: This utility model discloses a self-heating quantitative epoxy potting equipment. This utility model designs multiple sets of electric heating rods in the potting chamber. During potting, the temperature of the epoxy resin is controlled by the electric heating rods, which reduces the viscosity of the epoxy resin and increases its fluidity. Furthermore, through the design of the quantitative mechanism, the product can be quantitatively potted during the potting process. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of this utility model.

[0029] Figure 2 This is a schematic diagram of the potting section structure of this utility model.

[0030] Figure 3This is a schematic diagram of the quantitative filling mechanism of this utility model.

[0031] Figure 4 This is a schematic diagram of the pressurization mechanism of this utility model.

[0032] Figure 5 This is a schematic diagram of the internal structure of the quantitative mold head of this utility model.

[0033] The attached figures are labeled as follows:

[0034] 1. Base; 2. Encapsulation section;

[0035] 21. Filling chamber; 211. Heating rod;

[0036] 22. Metering filling mechanism; 221. Filling head; 222. Metering cavity; 223. Metering die; 2231. Metering head shell; 2232. Metering through hole; 2233. Metering hinge; 24. Metering swing arm; 225. Metering cylinder;

[0037] 23. Pressurizing mechanism; 231. Pressurizing cylinder; 232. Pressurizing piston; 233. Pressurizing cylinder; 234. Pressurizing air port; 235. Pressurizing hinge; Detailed Implementation

[0038] This application relates to a self-heating quantitative epoxy potting device, which will be explained in detail below through specific embodiments.

[0039] A self-heating, metered epoxy potting compound, comprising:

[0040] A base 1, and a potting portion 2 disposed on the base 1;

[0041] The filling section 2 includes:

[0042] Pressurization mechanism 23 is mounted on the base 1, and the pressurization mechanism 23 includes:

[0043] A pressurizing cylinder 231 is mounted on the base 1, and a pressurizing piston 232 is provided at the output end of the heating cylinder;

[0044] A pressure cylinder 233 is mounted on the base 1, sleeved on the pressure piston 232 and adapted to the pressure piston 232. The end of the pressure cylinder 233 has a pressure port 234, and the inner wall of the pressure cylinder 233 is hinged with a pressure hinge 235 adapted to the pressure port 234.

[0045] The design of the pressurizing mechanism 23 allows the epoxy resin stored in the metering die 223 to be filled onto the product through the filling head 221;

[0046] The quantitative filling mechanism 22 includes a filling channel mounted on the base 1 and communicating with the pressurizing mechanism 23, and a quantitative mechanism mounted on the base 1 and connected to the filling channel;

[0047] The filling channel includes:

[0048] 221 filler head;

[0049] The metering chamber 222 is connected at one end to the filling head 221 and at the other end to the pressure cylinder 233, and at the top to the filling chamber 21.

[0050] The quantitative mechanism includes:

[0051] A metering cylinder 225 is hinged to the base 1;

[0052] One end of the metering swing arm 24 is hinged to the output end of the metering cylinder 225;

[0053] The quantitative mold head 223 is connected to the other end of the quantitative swing arm 24.

[0054] The design of the metering mechanism allows for metered epoxy resin potting, avoiding excessive or insufficient amounts of epoxy resin during potting.

[0055] The quantitative mold head 223 includes:

[0056] The quantitative head shell 2231 is connected to the quantitative swing arm 24 at one end. The quantitative head shell 2231 has a cavity inside and a quantitative through hole 2232 that penetrates the quantitative head shell 2231 on its surface.

[0057] The cavity inside the metering head shell 2231 has only the opening of the metering through hole 2232, and the end away from the metering swing arm 24 is sealed.

[0058] The metering hinge 2233 is hinged to the inner wall of the metering head shell 2231 and is adapted to the metering through hole 2232 on one side of the metering head shell 2231.

[0059] The filling chamber 21 is connected to the filling channel, and the filling chamber 21 is equipped with multiple sets of electric heating rods 211.

[0060] By designing multiple sets of electric heating rods 211 inside the filling chamber 21, the temperature of the epoxy resin is controlled by the electric heating rods 211 during filling, which reduces the viscosity of the epoxy resin and increases its fluidity. Furthermore, through the design of the metering mechanism, the product can be quantitatively filled during filling.

[0061] Working principle description: During potting, epoxy resin is discharged into the potting chamber 21, and the electric heating rod 211 is turned on to maintain the temperature of the epoxy resin and ensure its fluidity. Then, the epoxy resin is discharged in a metering mechanism.

[0062] When the metering mechanism is working, the metering cylinder 225 drives the metering swing arm 24 to swing, which in turn drives the metering die head 223 to rotate. Before rotation, epoxy resin enters the cavity inside the metering head shell 2231 through the metering cavity 222 and the metering through hole 2232 on the side without the metering hinge 2233. At this time, the epoxy resin squeezes the metering hinge 2233 to make it fit against the metering through hole 2232 on the other side. After rotation, the metering through hole 2232 on the side with the metering hinge 2233 corresponds to the filling head 221. At this time, the part of the metering head shell 2231 without the through hole abuts against the connection between the metering cavity 222 and the filling chamber 21 to prevent the epoxy resin from continuing to flow down. The pressurizing mechanism 23 discharges the epoxy resin in the cavity to the filling head 221 and fills it onto the product.

[0063] When the pressurizing mechanism 23 is working, the pressurizing cylinder 231 drives the pressurizing piston 232 to move forward in the pressurizing cylinder 233, compressing the air. At this time, the air opens the metering hinge 2233 and enters the cavity through the metering through hole 2232, and squeezes the epoxy resin in the cavity through the metering through hole 2232 on the other side into the filling head 221 and is discharged onto the product.

[0064] When the pressurizing cylinder 231 drives the pressurizing piston 232 to retract, a negative pressure is formed in the pressurizing cylinder 233. At this time, the pressurizing hinge 235 stops blocking the pressurizing port 234, and air enters the pressurizing cylinder 233 through the pressurizing port 234.

[0065] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various equivalent transformations can be made to the technical solutions of the present invention, and all such equivalent transformations fall within the protection scope of the present invention.

Claims

1. A self-heating, metered epoxy potting compound, comprising: A base (1) and a potting portion (2) disposed on the base (1); The potting section (2) is characterized in that it comprises: A pressurizing mechanism (23) is mounted on the base (1); The quantitative filling mechanism (22) includes a filling channel mounted on the base (1) and communicating with the pressurizing mechanism (23), and a quantitative mechanism mounted on the base (1) and connected to the filling channel; The filling chamber (21) is connected to the filling channel, and the filling chamber (21) is equipped with multiple sets of electric heating rods (211).

2. The self-heating quantitative epoxy potting equipment according to claim 1, characterized in that: The pressurization mechanism (23) includes: A pressurizing cylinder (231) is mounted on the base (1), and a pressurizing piston (232) is provided at the output end of the pressurizing cylinder (231). A pressure cylinder (233) is installed on the base (1), sleeved on the pressure piston (232) and adapted to the pressure piston (232). The end of the pressure cylinder (233) has a pressure port (234), and the inner wall of the pressure cylinder (233) is hinged with a pressure hinge (235) adapted to the pressure port (234).

3. The self-heating quantitative epoxy potting equipment according to claim 1, characterized in that: The filling channel includes: Filler head (221); The metering chamber (222) is connected at one end to the filling head (221), at the other end to the pressure cylinder (233), and at the top to the filling chamber (21).

4. The self-heating quantitative epoxy potting equipment according to claim 1, characterized in that: The quantitative mechanism includes: A metering cylinder (225) is hinged to the base (1); A metering swing arm (24) is hinged at one end to the output end of the metering cylinder (225); The quantitative mold head (223) is connected to the other end of the quantitative swing arm (24).

5. The self-heating quantitative epoxy potting equipment according to claim 4, characterized in that: The quantitative mold (223) includes: The quantitative head shell (2231) is connected to the quantitative swing arm (24) at one end. The quantitative head shell (2231) has a cavity inside and a quantitative through hole (2232) through the quantitative head shell (2231) on its surface. The metering hinge (2233) is hinged to the inner wall of the metering head shell (2231) and is adapted to the metering through hole (2232) on one side of the metering head shell (2231).

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