Wafer alignment film expanding device

Abstract

The utility model discloses a wafer aligning and film expanding device which comprises a bottom plate, a lifting mechanism, a rotating mechanism and a material guiding mechanism, the lifting mechanism comprises a first driving assembly, a lifting plate and a film expanding assembly, the first driving assembly is installed on the bottom plate and connected with the lifting plate, the film expanding assembly is in transmission connection with the lifting plate, and the rotating mechanism is installed on the lifting plate. The material guiding mechanism is arranged between the lifting plate and the film expanding assembly, the rotating mechanism comprises a second driving assembly and an inner ring assembly, the second driving assembly is installed on the bottom plate and connected with the inner ring assembly, and the inner ring assembly is in transmission connection with the bottom plate and is opposite to the film expanding assembly in position. According to the device, two independent driving assemblies are used for respectively driving two actions of wafer film expansion and wafer rotation, so that the simultaneous movement of film expansion and wafer rotation is realized, the efficiency of wafer emptying, film expansion and wafer rotation is improved, and a material guide mechanism is additionally arranged, so that skew product feeding during manual or automatic emptying can be avoided.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a wafer alignment and expansion device. Background Technology

[0002] Semiconductor packaging bonding technologies mainly include single- and dual-axis flip bonding, thermo-press bonding, fusion bonding, and temporary bonding. Wafer lifting and rotating platforms can be applied to various packaging and bonding equipment fields, and can realize functions such as wafer fixing, wafer carrying, and wafer film expansion in such equipment.

[0003] While some existing wafer platform designs can fulfill the two main functions of lifting and expanding film and rotating at an angle, some only use a single drive to achieve both expansion and rotation, making it impossible for the two actions to run simultaneously, which greatly reduces production efficiency. Even if some use dual drives to achieve simultaneous movement, their overall height is too high, causing unnecessary waste to the whole machine, and the lack of a feeding guide design makes it easy for the feeding to deviate. Utility Model Content

[0004] The purpose of this application is to provide a wafer alignment and expansion device, which drives wafer expansion and wafer rotation through two independent drive components, thereby realizing simultaneous expansion and rotation, avoiding switching back and forth between single drives to complete the action, improving the efficiency of wafer feeding, expansion and rotation, and also adding a material guiding mechanism to avoid product feeding skew during manual or automatic feeding.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] On one hand, a wafer alignment and expansion device is provided, comprising: a base plate, a lifting mechanism, a rotating mechanism, and a guiding mechanism. The lifting mechanism includes a first driving component, a lifting plate, and an expansion component. The first driving component is mounted on the base plate, and its driving end is connected to the lifting plate. The expansion component is drivenly connected to the lifting plate. The guiding mechanism is disposed between the lifting plate and the expansion component to move the wafer onto the expansion component along a preset direction. The rotating mechanism includes a second driving component and an inner ring component. The second driving component is mounted on the base plate, and its driving end is connected to the inner ring component. The inner ring component is drivenly connected to the base plate and is positioned opposite to the expansion component.

[0007] Furthermore, the film expansion assembly includes an alignment plate and a pressure ring. The alignment plate is connected to the lifting plate via a first bearing. The pressure ring is spaced apart on the alignment plate, and a receiving space for inserting the wafer is formed between the pressure ring and the alignment plate.

[0008] Furthermore, the lifting plate is provided with a support roller and a positioning component. The support roller is located on the front side of the accommodating space, the positioning component is located on the rear side of the accommodating space, and the material guiding mechanism is arranged between the support roller and the positioning component.

[0009] Furthermore, the material guiding mechanism includes two guide members disposed on the lifting plate, the opposite sides of the two guide members being parallel surfaces, and the distance between the two parallel surfaces being greater than the outer diameter of the wafer.

[0010] Furthermore, the material guiding mechanism also includes two limiting members disposed on the rear side of the guide member, one side of the limiting member being connected to the alignment plate and the other side being connected to the pressure ring.

[0011] Furthermore, the first drive assembly includes a lifting motor, a synchronous pulley, a first transmission belt, and a lead screw. The output shaft of the lifting motor is connected to the synchronous pulley, the synchronous pulley is connected to the lead screw via the first transmission belt, and the lead screw is connected to the lifting plate.

[0012] Furthermore, the second drive assembly includes a rotary motor, a drive wheel, a driven wheel, and a second transmission belt. The output shaft of the rotary motor is connected to the drive wheel, the drive wheel is connected to the driven wheel via the second transmission belt, and the inner ring assembly is disposed on the driven wheel.

[0013] Furthermore, the inner ring assembly includes a mounting plate and an inner ring component. The mounting plate is connected to the driven wheel, the inner ring component is disposed on the mounting plate, and the mounting plate is connected to the base plate via a second bearing.

[0014] Furthermore, a first sensing component is provided on the base plate, which is used to detect the lifting stroke of the lifting plate and the expanding film component.

[0015] Furthermore, a second sensing component is also provided on the base plate, which is used to detect the rotational position of the inner ring component.

[0016] The beneficial effects of this application are as follows: the wafer alignment and expansion device drives the wafer expansion and wafer rotation actions respectively through two independent drive components, realizing the simultaneous operation of expansion and rotation, which significantly improves the overall efficiency of wafer processing. The key feature is that it also has a material guiding mechanism, which is set between the lifting plate and the expansion component. This mechanism is designed to guide the wafer along a preset precise path to the expansion component, greatly reducing the possible deviation of the wafer during manual or automatic feeding, thereby improving the accuracy and stability of wafer alignment.

[0017] In addition, both components utilize belt drive, with the belts on the same side. This improves the smoothness of power transmission and conceals the wheel assembly and belts, ensuring the aesthetics and cleanliness of the wafer's main surface. Furthermore, the overall height of the device can be further reduced, significantly saving space and lowering the complexity of the equipment. Attached Figure Description

[0018] The present application will now be described in further detail with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is a three-dimensional representation of the wafer alignment and expansion apparatus described in the embodiments of this application. Figure 1 ;

[0020] Figure 2 This is a three-dimensional representation of the wafer alignment and expansion apparatus described in the embodiments of this application. Figure 2 ;

[0021] Figure 3 Examples of this application Figure 2 Enlarged view of point A in the middle;

[0022] Figure 4 This is a front view of the wafer alignment and expansion apparatus described in an embodiment of this application;

[0023] Figure 5 This is a cross-sectional view of the wafer alignment and expansion apparatus described in an embodiment of this application;

[0024] Figure 6 Examples of this application Figure 5 Enlarged diagram of point B in the middle.

[0025] In the diagram: 1. Base plate; 2. First drive assembly; 201. Lifting motor; 202. Synchronous pulley; 203. First transmission belt; 204. Lead screw; 3. Lifting plate; 4. Film expansion assembly; 401. Alignment plate; 402. Pressure ring; 5. Second drive assembly; 501. Rotary motor; 502. Drive wheel; 503. Driven wheel; 504. Second transmission belt; 6. Inner ring assembly; 601. Mounting plate; 602. Inner ring component; 7. First bearing; 8. Support roller; 9. Positioning component; 10. Guide component; 11. Limiting component; 12. Second bearing; 13. First sensing assembly; 1301. First sensing element; 1302. First sensor; 1303. Second sensing element; 1304. Second sensor; 14. Second sensing assembly; 1401. Third sensing element; 1402. Third sensor; 15. Third sensing assembly; 16. First inner pressure plate; 17. First outer pressure plate; 18. Second inner pressure plate; 19. Second outer pressure plate. Detailed Implementation

[0026] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] like Figures 1-6 As shown, this embodiment provides a wafer alignment and expansion device, which includes: a base plate 1, a lifting mechanism, a rotating mechanism, and a guiding mechanism. The lifting mechanism includes a first driving component 2, a lifting plate 3, and an expansion component 4. The first driving component 2 is mounted on the base plate 1, and its driving end is connected to the lifting plate 3. The expansion component 4 is drivenly connected to the lifting plate 3. The guiding mechanism is disposed between the lifting plate 3 and the expansion component 4 so that the wafer moves along a preset direction onto the expansion component 4. The rotating mechanism includes a second driving component 5 and an inner ring component 6. The second driving component 5 is mounted on the base plate 1, and its driving end is connected to the inner ring component 6. The inner ring component 6 is drivenly connected to the base plate 1 and is positioned opposite to the expansion component 4.

[0030] Based on the above scheme, during the manual or automatic wafer feeding stage, the first drive assembly 2 first drives the lifting plate 3 and the expansion assembly 4 to their highest working positions. At this time, the height of the expansion assembly 4 will exceed that of the inner ring assembly 6, thus creating a sufficient height difference between the two, facilitating the operator to accurately insert the wafer into the predetermined position using manual methods, grippers, robotic arms, or other specialized structures. If an automatic feeding method is used, the guiding mechanism will play a crucial role. It can effectively guide the wafer to move along the preset path, reduce deviation during the feeding process, and ensure that the wafer can be accurately placed on the expansion assembly 4, thereby improving feeding accuracy.

[0031] Once the wafer is successfully placed, the first drive assembly 2 will restart, driving the lifting plate 3 and the film expansion assembly 4 to descend to the appropriate position. During descent, the bottom of the wafer will gradually contact the inner ring assembly 6. As descent continues, the film expansion assembly 4 will come into play, as its height is now lower than the inner ring assembly 6. The wafer film will adhere to the inner ring assembly 6, while the outer iron ring of the wafer will remain on the film expansion assembly 4, thus achieving the film expansion effect. This step is crucial for the subsequent processing of the wafer, ensuring that the wafer is in optimal condition before rotation or other actions.

[0032] After the wafer loading and expansion processes are completed, the second drive assembly 5 will begin operation, driving the inner ring assembly 6 to rotate. Since the lifting plate 3 and the expansion assembly 4 are connected by a transmission mechanism, the expansion assembly 4 will rotate together with the inner ring assembly 6, while the lifting plate 3 itself remains stationary. Simultaneously, the inner ring assembly 6 is also connected to the base plate 1 via a transmission device, ensuring that the base plate 1 remains stable while the inner ring assembly 6 rotates. This design not only achieves the rotational movement of the wafer but also ensures the stability and reliability of the entire device during rotation.

[0033] In summary, the wafer alignment and expansion apparatus described in this application drives both wafer expansion and wafer rotation through two independent drive components, enabling simultaneous expansion and rotation, thus significantly improving the overall efficiency of wafer processing. Furthermore, its compact structure and precise material feeding mechanism make this apparatus highly valuable for applications in semiconductor packaging and bonding.

[0034] Furthermore, the expansion assembly 4 includes an alignment plate 401 and pressure rings 402. The alignment plate 401 is connected to the lifting plate 3 via a first bearing 7. The pressure rings 402 are spaced apart on the alignment plate 401, forming a receiving space between the pressure rings 402 and the alignment plate 401 for inserting the wafer. The alignment plate 401 and the lifting plate 3 of the expansion assembly 4 are connected via the first bearing 7. This connection not only ensures that the alignment plate 401 can move smoothly with the lifting plate 3, but also ensures that the alignment plate 401 can maintain a certain degree of flexibility relative to the lifting plate 3 during rotation, thereby meeting the accuracy requirements of wafer alignment and expansion. The pressure rings 402 are spaced apart on the alignment plate 401, forming a receiving space for inserting the wafer together with the alignment plate 401. This receiving space must not only be able to accommodate the wafer, but also ensure that the wafer is subjected to uniform pressure during the expansion process, thereby achieving a good expansion effect. The material and shape of the pressure ring 402 have been carefully selected and designed to ensure that it can provide sufficient support without damaging the wafer.

[0035] Furthermore, the lifting plate 3 is equipped with a support roller 8 and a positioning element 9. The support roller 8 is located on the front side of the receiving space, and the positioning element 9 is located on the rear side of the receiving space. The guiding mechanism is arranged between the support roller 8 and the positioning element 9. The support roller 8 on the lifting plate 3 is positioned on the front side of the receiving space. This design aims to provide a smooth transition area, allowing the wafer to smoothly transition from a suspended state to a supported state during transport. The rotational characteristics of the support roller 8 ensure that the wafer is not subjected to additional resistance or damage during transport, while also helping to reduce deviations caused by its own weight and preventing interference between the wafer and the lifting plate 3. The positioning element 9, located on the rear side of the receiving space, serves a positioning function. When the wafer is transported forward along the guiding mechanism, once it contacts the positioning element 9, it means that it has reached the preset installation position. This design not only improves the accuracy of wafer installation but also makes the entire unloading process smoother and more efficient. The guiding mechanism is arranged between the support roller 8 and the positioning component 9, forming a complete wafer transport channel. The design of the guiding mechanism takes into account the size, shape, and material properties of the wafers to ensure that the wafers maintain a stable and accurate posture during transport. Guided by the guiding mechanism, the wafers can smoothly enter the receiving space and be accurately positioned between the alignment plate 401 and the pressure ring 402.

[0036] Specifically, the guiding mechanism mainly consists of two guide members 10 mounted on the lifting plate 3 and two limiting members 11 located behind the guide members 10. The opposing sides of the two guide members 10 are designed as parallel surfaces, and the distance between the two parallel surfaces is precisely set to 382mm. This dimensional design fully considers the vertical distance (380mm) of the outer ring of the 12-inch wafer, ensuring that the wafer can smoothly enter the space between the guide members 10 during the initial transport phase and receive effective guidance. Within an 84mm range along the edge of the guide member 10, the guide member 10 provides excellent guidance. This design not only improves the stability of wafer transport but also ensures that the wafer maintains an accurate posture when entering the vicinity of the device center, providing strong support for subsequent alignment and expansion operations.

[0037] Furthermore, two limiting members 11 are cleverly positioned on the rear side of the guide member 10, with one side connected to the alignment plate 401 and the other side connected to the pressure ring 402. The design of the limiting members 11 also takes into account the dimensional characteristics of the wafer, with the distance between their parallel surfaces set at 382mm, consistent with the distance between the guide members 10. This design allows the limiting members 11 to continue their guiding function when the wafer enters near the center of the device, preventing the wafer from skewing during transport.

[0038] It is worth noting that the alignment plate 401 and the pressure ring 402 are fixed together and can be regarded as a single structure. They are connected by the limiting members 11 on both sides, forming a stable and reliable film expansion assembly 4. This design not only improves the rigidity and stability of the film expansion assembly 4, but also enables the wafer to be subjected to uniform pressure distribution during the film expansion process, thereby achieving a good film expansion effect.

[0039] In some embodiments, the first drive assembly 2 includes a lifting motor 201, a synchronous pulley 202, a first transmission belt 203, and a lead screw 204. The output shaft of the lifting motor 201 is connected to the synchronous pulley 202, the synchronous pulley 202 is connected to the lead screw 204 via the first transmission belt 203, and the lead screw 204 is connected to the lifting plate 3. The lifting motor 201 serves as a power source, and its output shaft is tightly connected to the synchronous pulley 202, ensuring effective power transmission. The synchronous pulley 202 is connected to the lead screw 204 via the first transmission belt 203; this design not only enables long-distance power transmission but also ensures stability and accuracy during transmission. The first transmission belt 203, acting as a bridge connecting the synchronous pulley 202 and the lead screw 204, has been carefully selected and designed in terms of material and structure to ensure it can withstand sufficient tension and friction while maintaining good transmission efficiency. The connection between the lead screw 204 and the lifting plate 3 can be achieved through threaded engagement or other reliable connection methods to ensure that the lifting plate 3 can smoothly rise and fall with the rotation of the lead screw 204. During the lifting process, the pitch and rotation speed of the lead screw 204 are precisely controlled to achieve precise positioning and smooth movement of the lifting plate 3 and the film expansion assembly 4.

[0040] Meanwhile, the second drive assembly 5 includes a rotary motor 501, a driving wheel 502, a driven wheel 503, and a second transmission belt 504. The output shaft of the rotary motor 501 is connected to the driving wheel 502, and the driving wheel 502 is connected to the driven wheel 503 via the second transmission belt 504. The inner ring assembly 6 is disposed on the driven wheel 503. The rotary motor 501 serves as a power source, and its output shaft is tightly connected to the driving wheel 502, ensuring effective power transmission. This connection method is not only simple and direct but also reduces energy loss and improves transmission efficiency. The driving wheel 502 is connected to the driven wheel 503 via the second transmission belt 504, realizing remote power transmission. The inner ring assembly 6 is disposed on the driven wheel 503. During the wafer alignment and expansion process, the second drive assembly 5 drives the driving wheel 502 to rotate via the rotary motor 501, which in turn drives the driven wheel 503 and the inner ring assembly 6 to rotate via the second transmission belt 504. The rotation of the inner ring component 6 will drive the wafer to perform alignment and film expansion operations, thereby achieving precise wafer processing.

[0041] Generally, the inner ring assembly 6 includes a mounting plate 601 and an inner ring component 602. The mounting plate 601 is connected to the driven wheel 503, and the inner ring component 602 is disposed on the mounting plate 601. The mounting plate 601 is connected to the base plate 1 via a second bearing 12. The mounting plate 601, as the base of the inner ring assembly 6, not only supports the inner ring component 602 but also connects to the driven wheel 503 to ensure effective power transmission. This connection can be achieved through bolts, pins, or other reliable connectors to ensure the stability and reliability of the connection. The inner ring component 602, disposed on the mounting plate 601, is a key component in the wafer alignment and expansion process. The design of the inner ring component 602 needs to fully consider the size, shape, and material properties of the wafer to ensure a tight fit and sufficient support. Simultaneously, the surface quality and precision of the inner ring component 602 also need to be strictly controlled to avoid damage to the wafer or affecting its processing quality. A transmission connection is achieved between the mounting plate 601 and the base plate 1 via a second bearing 12. This connection method not only allows the mounting plate 601 to rotate relative to the base plate 1, but also ensures stability and accuracy during the rotation process.

[0042] Preferably, the base plate 1 is provided with a first sensing component 13 and a second sensing component 14. The first sensing component 13 is used to detect the lifting stroke of the lifting plate 3 and the expansion component 4, and the second sensing component 14 is used to detect the rotational position of the inner ring component 6. The main function of the first sensing component 13 is to monitor the lifting stroke of the lifting plate 3 and the expansion component 4 in real time, which is crucial for ensuring the precise alignment of the wafer during processing. By accurately measuring the moving distance of the lifting plate 3, the limit safety position monitoring of the entire expansion stroke is achieved, thereby realizing precise alignment and expansion operations. At the same time, it can effectively prevent the lifting plate 3 from moving excessively, thereby avoiding unnecessary damage to the wafer or other parts of the device.

[0043] The second sensing component 14 is also mounted on the base plate 1, but it detects the rotational position of the inner ring component 6. The rotation of the inner ring component 6 is equally crucial for the wafer alignment and expansion process. By monitoring the rotation angle and position of the inner ring component 6 in real time, the second sensing component 14 ensures that the wafer maintains the correct orientation throughout the process, thereby further improving processing accuracy and reliability. Furthermore, it can provide feedback signals when necessary to adjust the rotational speed and position of the inner ring component 6 in a timely manner, ensuring the smooth operation of the entire process. The introduction of these two sensing components not only improves the automation level of the wafer alignment and expansion device but also makes the entire process more controllable and reliable. Through real-time monitoring and feedback adjustments, they ensure that the wafer maintains the correct position and orientation throughout the process, thereby significantly improving processing accuracy and efficiency.

[0044] The first sensing assembly 13 includes a first sensing element 1301 mounted on the synchronous pulley 202, a first sensor 1302 mounted on the base plate 1, a second sensing element 1303 mounted on the lifting plate 3, and a second sensor 1304 mounted on the base plate 1. During operation, the first sensing element 1301 has twelve small protrusions that work in conjunction with the first sensor 1302. Each time the first sensor 1302 senses a small protrusion, the lead screw 204 of the film expansion assembly 4 and the lifting plate 3 rises or falls by 1 / 12, thus refining the stroke of the film expansion and preventing excessive descent speed from affecting the product. The second sensing element 1303 and the second sensor 1304 are used for detecting the limit safety position throughout the film expansion stroke. The second sensing assembly 14 includes a third sensing element 1401 mounted on the mounting plate 601 and a third sensor 1402 mounted on the base plate 1. The third sensing element 1401 and the third sensor 1402 work together to facilitate the detection of the wafer's rotational position.

[0045] In addition, a third sensing component 15 is provided to detect whether a wafer is placed on the film expansion component 4. Only when a wafer is detected will the descent, film expansion, and rotation actions be performed. The third sensing component 15 is specifically a positioning detection optical fiber.

[0046] It is worth mentioning that the inner ring of the first bearing 7 is provided with a first inner pressure plate 16, and the outer ring is provided with a first outer pressure plate 17. The inner ring of the second bearing 12 is provided with a second inner pressure plate 18, and the outer ring is provided with a second outer pressure plate 19. The first inner pressure plate 16 and the first outer pressure plate 17 simultaneously press the inner and outer rings of the first bearing 7 on one side. The first bearing 7 can separate the lifting plate 3 from the alignment plate 401, so that the lifting plate 3 does not rotate. The second bearing 12 uses the second inner pressure plate 18 and the second outer pressure plate 19 to press the inner and outer rings of the second bearing 12 on both sides respectively, separating the base plate 1 from the mounting plate 601, so that the base plate 1 is fixed and the mounting plate 601 can rotate.

[0047] In summary, this application primarily adds a drive module, using two independent drive components to drive the wafer expansion and wafer rotation actions respectively, thereby achieving simultaneous expansion and rotation. This avoids switching back and forth between single drives, improving the efficiency of wafer feeding, expansion, and rotation. Furthermore, a guiding mechanism is added to prevent product skew during manual or automatic feeding. Both drives utilize belt drives, with the belts located on one side. This improves the smoothness of power transmission and conceals the synchronous pulleys and belts, ensuring a clean and aesthetically pleasing wafer surface while reducing the overall height of the wafer platform mechanism to 90mm.

[0048] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other orientations or positional relationships are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no special meaning.

[0049] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0050] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0051] The technical principles of this application have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this application without inventive effort, and these embodiments will all fall within the scope of protection of this application.

Claims

1. A wafer alignment and expansion apparatus, characterized in that, include: The base plate (1), lifting mechanism, rotating mechanism and material guiding mechanism, the lifting mechanism includes a first driving component (2), a lifting plate (3) and a film expanding component (4), the first driving component (2) is installed on the base plate (1), the driving end of the first driving component (2) is connected to the lifting plate (3), the film expanding component (4) is connected to the lifting plate (3) in a transmission manner, the material guiding mechanism is set between the lifting plate (3) and the film expanding component (4) so ​​that the wafer moves along a preset direction to the film expanding component (4), the rotating mechanism includes a second driving component (5) and an inner ring component (6), the second driving component (5) is installed on the base plate (1), the driving end of the second driving component (5) is connected to the inner ring component (6), the inner ring component (6) is connected to the base plate (1) in a transmission manner and is positioned opposite to the film expanding component (4).

2. The wafer alignment and expansion apparatus according to claim 1, characterized in that, The film expansion assembly (4) includes an alignment plate (401) and a pressure ring (402). The alignment plate (401) is connected to the lifting plate (3) via a first bearing (7). The pressure ring (402) is spaced on the alignment plate (401). A receiving space for inserting the wafer is formed between the pressure ring (402) and the alignment plate (401).

3. The wafer alignment and expansion apparatus according to claim 2, characterized in that, The lifting plate (3) is provided with a support roller (8) and a positioning element (9). The support roller (8) is located on the front side of the accommodating space, and the positioning element (9) is located on the rear side of the accommodating space. The material guiding mechanism is arranged between the support roller (8) and the positioning element (9).

4. The wafer alignment and expansion apparatus according to claim 3, characterized in that, The material guiding mechanism includes two guide members (10) disposed on the lifting plate (3). The opposite sides of the two guide members (10) are parallel surfaces, and the distance between the two parallel surfaces is greater than the outer diameter of the wafer.

5. The wafer alignment and expansion apparatus according to claim 4, characterized in that, The material guiding mechanism also includes two limiting members (11) disposed on the rear side of the guide member (10). One side of the limiting member (11) is connected to the alignment plate (401), and the other side is connected to the pressure ring (402).

6. The wafer alignment and expansion apparatus according to any one of claims 1-5, characterized in that, The first drive assembly (2) includes a lifting motor (201), a synchronous pulley (202), a first transmission belt (203), and a lead screw (204). The output shaft of the lifting motor (201) is connected to the synchronous pulley (202), the synchronous pulley (202) is connected to the lead screw (204) through the first transmission belt (203), and the lead screw (204) is connected to the lifting plate (3).

7. The wafer alignment and expansion apparatus according to any one of claims 1-5, characterized in that, The second drive assembly (5) includes a rotary motor (501), a drive wheel (502), a driven wheel (503), and a second transmission belt (504). The output shaft of the rotary motor (501) is connected to the drive wheel (502), and the drive wheel (502) is connected to the driven wheel (503) through the second transmission belt (504). The inner ring assembly (6) is disposed on the driven wheel (503).

8. The wafer alignment and expansion apparatus according to claim 7, characterized in that, The inner ring assembly (6) includes a mounting plate (601) and an inner ring component (602). The mounting plate (601) is connected to the driven wheel (503). The inner ring component (602) is disposed on the mounting plate (601). The mounting plate (601) is connected to the base plate (1) via a second bearing (12).

9. The wafer alignment and expansion apparatus according to any one of claims 1-5, characterized in that, The base plate (1) is provided with a first sensing component (13), which is used to detect the lifting stroke of the lifting plate (3) and the expanding film component (4).

10. The wafer alignment and expansion apparatus according to any one of claims 1-5, characterized in that, The base plate (1) is also provided with a second sensing component (14), which is used to detect the rotational position of the inner ring component (6).

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