Feeding mechanism for semiconductor packaging and die bonding
By designing an appropriate feeding trough and limiting block in conjunction with a motor-driven reciprocating screw system, the problem of uncontrollable feeding rate in traditional feeding mechanisms was solved, achieving uniform feeding during the semiconductor packaging die bonding process and improving processing efficiency.
Patent Information
- Application Number
- CN202422877340.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-11-25
AI Technical Summary
Traditional feeding mechanisms cannot control the feeding rate during semiconductor packaging and die bonding, resulting in the need for multiple feedings and affecting the processing speed.
A feeding mechanism was designed, including a base plate, a guide block, a feeding plate, a limiting block, and a reciprocating screw system driven by a motor. Through the cooperation of the adapted feeding groove and the limiting block, the continuous pushing and uniform feeding of the raw material sheet can be realized.
This technology enables continuous and uniform feeding of raw material sheets, improving feeding efficiency and the practicality of the device.
Smart Images
Figure CN223539574U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor packaging die bonding technology, specifically a feeding mechanism for semiconductor packaging die bonding. Background Technology
[0002] With the rapid development of semiconductor technology, semiconductor packaging technology plays an increasingly important role in electronic product manufacturing. Die bonding, as a core step in semiconductor packaging, is the process of tightly bonding a silicon wafer (i.e., a chip) to a carrier using specific materials and technologies. This step directly affects the performance, stability, and lifespan of the circuit; therefore, the quality and efficiency of the die bonding process have a decisive impact on the overall performance of semiconductor products.
[0003] In the semiconductor packaging and die bonding process, the feeding mechanism is responsible for accurately and stably delivering materials such as chips to designated positions for use in subsequent packaging processes. While traditional feeding mechanisms can meet production needs to a certain extent, they have many shortcomings in terms of equidistant quantitative feeding. The most significant issue is that the feeding rate cannot be controlled during the feeding process, and the material cannot be fully utilized in subsequent processing. This forces users to repeatedly refill the reflow, increasing the overall workload and affecting the overall processing speed.
[0004] In view of this, a feeding mechanism for semiconductor packaging die bonding is provided to overcome the above-mentioned defects. Utility Model Content
[0005] The purpose of this invention is to provide a feeding mechanism for semiconductor packaging die bonding, so as to solve the problems mentioned in the background art.
[0006] To solve the above-mentioned technical problems, this utility model provides a feeding mechanism for semiconductor packaging die bonding, including a base plate and a raw material wafer. A guide block is fixedly installed on the top surface of the base plate, and a feeding hole is opened on the top surface of the guide block. A through groove is opened at the bottom of the feeding hole, and a movable feeding plate is arranged in the through groove. A feeding groove is opened on the top surface of the feeding plate, and a connecting block is fixedly installed on the top surface of the guide block. An L-shaped limiting block is hinged to the inner wall of the connecting block.
[0007] Furthermore, the size of the feeding trough is adapted to the raw material sheet.
[0008] Furthermore, the height of the raw material sheet is greater than the depth of the feeding trough.
[0009] Furthermore, when the raw material sheet is inside the feeding trough, the upper part of the raw material sheet is outside the feeding trough.
[0010] Furthermore, a limiting block is fixedly installed on the top surface of the feeding plate, and the limiting block is located on both sides of the feeding trough.
[0011] Furthermore, a motor is fixedly installed on the top surface of the base plate, a threaded sleeve is fixedly installed on the rear side of the top surface of the feed plate, a reciprocating screw is driven and connected to the side of the motor near the guide block, and the threaded sleeve is threadedly connected to the outer wall of the reciprocating screw.
[0012] Furthermore, the other end of the reciprocating lead screw is rotatably connected to the outer wall of the guide block.
[0013] Furthermore, the bottom end of the limiting block is initially positioned on one side of the through slot.
[0014] Compared with the prior art, the beneficial effects of this utility model are: it can continuously push the raw material sheet from the feeding trough to the designated position and complete the unloading work, and thus realize the control of the raw material sheet unloading rate, enabling the device to achieve uniform feeding and increasing the overall practicality of the device. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0016] Figure 2 This is a schematic diagram of the upper structure of this utility model;
[0017] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure at point AA;
[0018] Figure 4 This is a schematic diagram of the front structure of this utility model.
[0019] In the diagram: 1. Base plate; 2. Guide block; 3. Feeding hole; 4. Raw material sheet; 5. Connecting block; 6. Limiting block; 7. Motor; 8. Threaded sleeve; 9. Reciprocating screw; 10. Feeding plate; 11. Feeding chute; 12. Limiting block. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0021] Example 1
[0022] See Figure 1-4A feeding mechanism for semiconductor packaging die bonding includes a base plate 1 and a raw material wafer 4. A guide block 2 is fixedly installed on the top surface of the base plate 1. A feeding hole 3 is opened on the top surface of the guide block 2. A through groove is opened at the bottom of the feeding hole 3. A movable unloading plate 10 is arranged in the through groove. A feeding groove 11 is opened on the top surface of the unloading plate 10. A connecting block 5 is fixedly installed on the top surface of the guide block 2. An L-shaped limiting block 6 is hinged to the inner wall of the connecting block 5.
[0023] Furthermore, the size of the feeding trough 11 is adapted to the raw material sheet 4, the height of the raw material sheet 4 is greater than the depth of the feeding trough 11, and when the raw material sheet 4 is inside the feeding trough 11, the upper part of the raw material sheet 4 is outside the feeding trough 11, and the bottom end of the limiting block 6 is on one side of the through groove in the initial state.
[0024] This setup allows the limiting block 6 to abut one side of the raw material sheet 4 after it is pushed to the other side of the guide block 2 by the feeding plate 10, preventing the raw material sheet 4 from resetting with the feeding plate 10 and forcing it to fall. This, combined with the conveyor belt, completes the feeding process.
[0025] Furthermore, a motor 7 is fixedly installed on the top surface of the base plate 1, and a threaded sleeve 8 is fixedly installed on the rear side of the top surface of the feed plate 10. A reciprocating screw 9 is connected to the side of the motor 7 near the guide block 2. The other end of the reciprocating screw 9 is rotatably connected to the outer wall of the guide block 2, and the threaded sleeve 8 is threadedly connected to the outer wall of the reciprocating screw 9.
[0026] In addition, a limiting block 12 is fixedly installed on the top surface of the feeding plate 10, and the limiting block 12 is located on both sides of the feeding groove 11.
[0027] In practice, initially, the raw material sheet 4 is placed in the feeding trough 11. Since the size of the feeding trough 11 is compatible with the raw material sheet 4, the raw material sheet 4 can be stably placed within it. Furthermore, the height of the raw material sheet 4 is greater than the depth of the feeding trough 11, so the upper part of the raw material sheet 4 protrudes outside the feeding trough 11. The bottom end of the limiting block 6 is positioned on one side of the through-slot, ready to abut against one side of the raw material sheet 4 that is about to be pushed. The motor 7 is not started, the reciprocating screw 9 remains stationary, and the unloading plate 10 remains in its original position.
[0028] The user then starts the motor 7, which drives the reciprocating screw 9 to rotate. Since the threaded sleeve 8 is fixedly installed on the rear side of the top surface of the feed plate 10 and is threadedly connected to the outer wall of the reciprocating screw 9, when the reciprocating screw 9 rotates, the threaded sleeve 8 and the feed plate 10 fixed thereto will move along the axial direction of the reciprocating screw 9. Driven by the reciprocating screw 9, the feed plate 10 moves forward along the top surface of the guide block 2. During this process, the raw material sheet 4 in the feeding groove 11 is also pushed to move the feed plate 10 together.
[0029] When the raw material sheet 4 directly contacts the limiting block 6, it will push the limiting block 6, which will rotate around the connecting block 5, allowing the raw material sheet 4 to pass through. When the feeding plate 10 is driven to reset by the reciprocating screw 9, the raw material sheet 4 encounters the resistance of the limiting block 6. Since the limiting block 6 is L-shaped and its bottom end is on one side of the through groove in the initial state, it can effectively prevent the raw material sheet 4 from continuing to move backward with the feeding plate 10. Once the raw material sheet 4 separates from the feeding plate 10 and is stuck by the limiting block 6, the raw material sheet 4 will fall from the opening of the feeding trough 11 under the action of gravity. The raw material sheet 4 can cooperate with the conveyor belt below for subsequent conveying and processing.
[0030] By repeating this process, the feeding mechanism can continuously push the raw material sheet 4 from the feeding trough 11 to the designated position and complete the unloading work. This also enables control over the unloading rate of the raw material sheet 4, allowing the device to achieve uniform feeding and increasing the overall practicality of the device.
[0031] Working principle: In the initial state, the raw material sheet 4 is placed in the feeding trough 11. Since the size of the feeding trough 11 is adapted to the raw material sheet 4, the raw material sheet 4 can be stably placed in the feeding trough 11. Moreover, the height of the raw material sheet 4 is greater than the depth of the feeding trough 11, so the upper part of the raw material sheet 4 will protrude outside the feeding trough 11. The bottom end of the limiting block 6 is on one side of the through groove, ready to abut against one side of the raw material sheet 4 that is about to be pushed. The motor 7 is in the off state, the reciprocating screw 9 is stationary, and the feeding plate 10 also remains in its original position.
[0032] The user then starts the motor 7, which drives the reciprocating screw 9 to rotate. Since the threaded sleeve 8 is fixedly installed on the rear side of the top surface of the feed plate 10 and is threadedly connected to the outer wall of the reciprocating screw 9, when the reciprocating screw 9 rotates, the threaded sleeve 8 and the feed plate 10 fixed thereto will move along the axial direction of the reciprocating screw 9. Driven by the reciprocating screw 9, the feed plate 10 moves forward along the top surface of the guide block 2. During this process, the raw material sheet 4 in the feeding groove 11 is also pushed to move the feed plate 10 together.
[0033] When the raw material sheet 4 directly contacts the limiting block 6, it will push the limiting block 6, which will rotate around the connecting block 5, allowing the raw material sheet 4 to pass through. When the feeding plate 10 is driven to reset by the reciprocating screw 9, the raw material sheet 4 encounters the resistance of the limiting block 6. Since the limiting block 6 is L-shaped and its bottom end is on one side of the through groove in the initial state, it can effectively prevent the raw material sheet 4 from continuing to move backward with the feeding plate 10. Once the raw material sheet 4 separates from the feeding plate 10 and is stuck by the limiting block 6, the raw material sheet 4 will fall from the opening of the feeding trough 11 under the action of gravity. The raw material sheet 4 can cooperate with the conveyor belt below for subsequent conveying and processing.
[0034] By repeating this process, the feeding mechanism can continuously push the raw material sheet 4 from the feeding trough 11 to the designated position and complete the unloading work. This also enables control over the unloading rate of the raw material sheet 4, allowing the device to achieve uniform feeding and increasing the overall practicality of the device.
Claims
1. A feeding mechanism for semiconductor packaging die bonding, comprising a base plate (1) and a raw material wafer (4), characterized in that, A guide block (2) is fixedly installed on the top surface of the base plate (1). A feeding hole (3) is opened on the top surface of the guide block (2). A through groove is opened at the bottom of the feeding hole (3). A movable feeding plate (10) is provided in the through groove. A feeding groove (11) is opened on the top surface of the feeding plate (10). A connecting block (5) is fixedly installed on the top surface of the guide block (2). A limiting block (6) in the shape of an "L" is hinged on the inner wall of the connecting block (5).
2. The feeding mechanism for semiconductor packaging die bonding as described in claim 1, characterized in that: The size of the feeding trough (11) is adapted to the raw material sheet (4).
3. The feeding mechanism for semiconductor packaging die bonding as described in claim 2, characterized in that: The height of the raw material sheet (4) is greater than the depth of the feeding trough (11).
4. The feeding mechanism for semiconductor packaging die bonding as described in claim 3, characterized in that: When the raw material sheet (4) is inside the feeding trough (11), the upper part of the raw material sheet (4) is outside the feeding trough (11).
5. The feeding mechanism for semiconductor packaging die bonding as described in claim 4, characterized in that: Limiting blocks (12) are fixedly installed on the top surface of the feeding plate (10), and the limiting blocks (12) are located on both sides of the feeding groove (11).
6. The feeding mechanism for semiconductor packaging die bonding as described in claim 5, characterized in that: A motor (7) is fixedly installed on the top surface of the base plate (1), and a threaded sleeve (8) is fixedly installed on the rear side of the top surface of the feed plate (10). A reciprocating screw (9) is connected to the side of the motor (7) near the guide block (2), and the threaded sleeve (8) is threadedly connected to the outer wall of the reciprocating screw (9).
7. The feeding mechanism for semiconductor packaging die bonding as described in claim 6, characterized in that: The other end of the reciprocating lead screw (9) is rotatably connected to the outer wall of the guide block (2).
8. The feeding mechanism for semiconductor packaging die bonding as described in claim 7, characterized in that: The bottom end of the limiting block (6) is initially located on one side of the through slot.