Wafer bonding device

Abstract

The utility model relates to a wafer bonding device which comprises a cleaning shed, a bearing assembly, a film cutting assembly, a film pasting assembly, a bonding lower cavity assembly and a bonding upper cavity assembly, the bearing assembly is used for bearing quartz glass to move below the film cutting assembly and the film pasting assembly, the film cutting assembly is used for cutting an adhesive film, and the film pasting assembly is used for pasting the adhesive film. The film pasting assembly is used for tightly pasting an adhesive film and quartz glass, the bonding lower cavity assembly is used for placing the quartz glass with the film pasted and driving the quartz glass with the film pasted to ascend during bonding, and the bonding upper cavity assembly is used for adsorbing a wafer and providing a vacuum environment and downward pressure so as to enable bonding to be tighter. According to the utility model, the bonding lower cavity assembly is raised, the bonding upper cavity assembly is pressed down, and a formed closed body is vacuumized, so that the bonding effect is effectively improved; according to the utility model, the quartz glass film pasting device and the wafer bonding device are integrated, so that the production efficiency is effectively improved; the whole device is protected by the clean shed, and the device is effectively prevented from being polluted.

Description

Technical Field

[0001] This utility model relates to the field of wafer fabrication technology, and more specifically, to a wafer bonding device. Background Technology

[0002] With the rapid development of technology, the semiconductor industry occupies an increasingly important position globally. In this industry, among semiconductor equipment, wafers are a basic material for manufacturing semiconductor chips. A 12-inch wafer with a thickness of 50 micrometers is as thin as paper, making it difficult to carry out subsequent photolithography and wet processing. In order to save costs, companies hope not to replace their existing equipment, which creates the demand for wafer bonding.

[0003] A bonding machine is used to bond two wafers or substrates with different properties face to face. By applying certain external conditions, such as pressure, temperature and voltage, they are bonded together. It can use two wafers for bonding or wafers and quartz glass for bonding. Wafer bonding technology is widely used in advanced packaging, MEMS, 3D interconnect, LED manufacturing and special substrate manufacturing, and is increasingly becoming an indispensable R&D and production tool in the semiconductor and MEMS fields. The existing traditional method is to stack wafers and quartz glass and then press them together to form a bond, which has problems such as poor bonding effect, low efficiency and easy contamination. Utility Model Content

[0004] The technical problem to be solved by this invention is poor bonding effect, low efficiency and easy contamination. In view of the above-mentioned defects of the prior art, a wafer bonding device is provided.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A wafer bonding apparatus is constructed, comprising a rack, a clean chamber, a carrier assembly, a film cutting assembly, a film attaching assembly, a lower bonding cavity assembly, and an upper bonding cavity assembly, wherein the carrier assembly, the film cutting assembly, the film attaching assembly, the lower bonding cavity assembly, and the upper bonding cavity assembly are all disposed within the clean chamber, and the clean chamber is disposed on the rack;

[0007] The supporting component is movably disposed below the film cutting component and the film applying component, and is used to support the quartz glass;

[0008] The film cutting assembly is located on the side of the film application assembly and is used to cut the adhesive film so that the adhesive film is the same size and shape as the quartz glass.

[0009] The film application assembly is located on one side of the frame and is used to apply a film to the quartz glass;

[0010] The bonding lower cavity assembly is located on the other side of the frame and is used to place the film-coated quartz glass;

[0011] The bonding upper cavity assembly is located above the bonding lower cavity assembly and is used to adsorb the wafer so that the wafer and the film-coated quartz glass can be bonded.

[0012] Furthermore, the bonding lower cavity assembly includes a protective cover and a lower cavity assembly, both of which are connected to the frame. The protective cover protects the lower cavity assembly. The lower cavity assembly includes a lower cavity shell, a bonding lifting assembly, a lifting assembly mounting plate, a lifting platform guide rail, and a lifting platform. The lifting assembly mounting plate is located inside the lower cavity shell and is fixedly connected to it. The lifting platform guide rail is located on the inner wall of the lower cavity shell, and the lifting platform is slidably connected to the lower cavity shell via the lifting platform guide rail. The bonding lifting assembly is located on the lifting assembly mounting plate, and its output end is fixedly connected to the lifting platform and is used to drive the lifting platform to perform lifting movements. The lifting platform is used to place the film-coated quartz glass.

[0013] Furthermore, the upper bonding cavity assembly is located above the lower bonding cavity assembly. The upper bonding cavity assembly includes an upper bonding cavity base frame, a lower bonding cylinder, and an upper cavity assembly. The upper bonding cavity base frame is fixedly connected to the frame. The lower bonding cylinder is mounted on the upper bonding cavity base frame. The output end of the lower bonding cylinder is connected to the upper cavity assembly and is used to drive the upper cavity assembly to press downward, so that the upper cavity and the lower cavity form a sealed space.

[0014] Furthermore, the upper cavity assembly includes an upper cavity connecting plate, an upper cavity shell, a bonding suction plate, and a bonding vacuum assembly. The upper cavity assembly is connected to the output end of the bonding pressure cylinder through the upper cavity connecting plate. The upper cavity shell is connected to the cavity connecting plate. The bonding suction plate is located inside the upper cavity shell and is used to adsorb wafers. The bonding vacuum assembly is used to perform vacuum treatment inside the upper cavity shell.

[0015] Furthermore, the diameter of the lower cavity shell is smaller than the diameter of the upper cavity shell, and the lifting platform is correspondingly arranged with the bonding suction plate.

[0016] Furthermore, the supporting component includes a horizontal module and a supporting platform. The supporting platform is provided with a heating element and an adsorption element for adsorbing and heating the quartz glass. The supporting platform is located above the horizontal module, and the horizontal module is used to drive the quartz glass to move below the film cutting component and the film applying component.

[0017] Furthermore, the horizontal module includes a first linear module and a second linear module, the second linear module being disposed above the first linear module, and the support platform being disposed above the second linear module. The first linear module and the second linear module cooperate to move the support platform along the direction of the first linear module and the direction of the second linear module.

[0018] Furthermore, the film cutting assembly includes a film cutting base frame, a film cutting mounting plate, a rotating module, and a cutting blade assembly. The film cutting base frame is fixedly connected to the film application assembly, and the film cutting mounting plate is fixedly connected to the film cutting base frame. The film cutting mounting plate has a through hole. The rotating module is located above the film cutting mounting plate, and the cutting blade assembly is located below the film cutting mounting plate. The rotating module passes through the through hole and is connected to the cutting blade assembly, and is used to drive the cutting blade assembly to rotate relative to the quartz glass.

[0019] Furthermore, the cutting assembly includes a film-cutting cylinder and a film-cutting blade. The output end of the film-cutting cylinder is connected to the film-cutting blade and is used to drive the film-cutting blade to move up and down relative to the quartz glass. The rotating module and the film-cutting cylinder work together to drive the film-cutting blade to rotate and move up and down. The film-cutting blade is used to cut the adhesive film so that the adhesive film is the same size and shape as the quartz glass.

[0020] Furthermore, the film application assembly includes a film application base frame, a film application lifting assembly, a pressing assembly, and an attachment assembly. The film application base frame is fixedly connected to the machine frame. One end of the film application lifting assembly is connected to the film application base frame, and the other end is connected to the pressing assembly. The output end of the pressing assembly is connected to the attachment assembly. The film application lifting assembly is used to drive the pressing assembly and the attachment assembly to perform lifting and lowering movements, and the pressing assembly is used to drive the attachment assembly to press downward.

[0021] Furthermore, the bonding assembly includes a bonding box, bonding rollers, and a bonding vacuum assembly. The bonding box is connected to the pressing assembly. The bonding rollers are disposed inside the bonding box and connected to the bonding box. The bonding rollers are used to apply film to the quartz glass. The bonding vacuum assembly is used to perform vacuum treatment on the bonding box.

[0022] The beneficial effects of this utility model are as follows:

[0023] 1. This utility model proposes that the lower cavity assembly containing the coated wafer moves upward during bonding, while the upper cavity assembly containing the wafer moves downward during bonding. This facilitates a tighter bonding between the quartz glass and the wafer, effectively improving the bonding effect.

[0024] 2. This utility model proposes to perform vacuum treatment on the sealed space formed by the lower bonding cavity assembly and the upper bonding cavity assembly, which helps to avoid the generation of air bubbles during bonding and further improves the bonding effect.

[0025] 3. This utility model proposes the integration of quartz glass film application and wafer bonding device, which is beneficial for subsequent wafer processing and effectively improves production efficiency;

[0026] 4. This utility model proposes to use the cleanroom protection device to protect each component, effectively avoiding contamination. Attached Figure Description

[0027] Figure 1 This is an overall structural diagram of a wafer bonding device according to one embodiment of the present invention;

[0028] Figure 2 This is a perspective view of a wafer bonding device concealing a cleanroom in one embodiment of the present invention;

[0029] Figure 3 This is a perspective view of the carrier component in one embodiment of the present invention;

[0030] Figure 4 This is a perspective view of the film cutting assembly in one embodiment of the present invention;

[0031] Figure 5 This is a perspective view of the film-applying assembly in one embodiment of the present invention;

[0032] Figure 6 This is a perspective view of the attached roller in one embodiment of the present invention;

[0033] Figure 7 This is a perspective view of the bonding lower cavity assembly in one embodiment of the present invention;

[0034] Figure 8 This is a bottom view of the bonding lower cavity assembly in one embodiment of the present invention;

[0035] Figure 9 This is a perspective view of the bonding upper cavity assembly in one embodiment of the present invention;

[0036] Figure 10 This is a bottom view of the bonding lower cavity assembly in one embodiment of the present invention.

[0037] Labeling Explanation: 1. Frame; 2. Clean Booth; 3. Load-bearing Component; 4. Film Cutting Component; 5. Film Applying Component; 6. Lower Bonding Chamber Component; 7. Upper Bonding Chamber Component;

[0038] 11. Control box; 31. Horizontal module; 311. Load-bearing guide rail; 312. First linear module; 313. Second linear module; 32. Load-bearing platform; 321. Load-bearing housing; 322. Heating base plate; 323. Load-bearing suction plate;

[0039] 41. Film cutting base frame; 42. Film cutting mounting plate; 43. Rotating module; 431. Rotating drive component; 432. Rotating shaft; 44. Cutting blade assembly; 441. Rotating connecting plate; 442. Film cutting cylinder guide rail; 443. Film cutting cylinder connecting plate; 444. Film cutting cylinder; 445. Film cutting blade;

[0040] 51. Film application base frame; 52. Film application lifting assembly; 521. Film application lifting drive component; 522. Cylinder mounting plate; 523. Lifting guide shaft; 524. Film application lifting guide rail; 525. Guide rail connecting block; 53. Pressing assembly; 531. Film application pressing cylinder; 532. Cylinder guide shaft; 54. Application assembly; 541. Application box; 542. Application rollers;

[0041] 61. Protective cover; 62. Lower cavity assembly; 621. Lower cavity shell; 622. Bonding lifting assembly; 6221. Bonding lifting drive component; 6222. Synchronous pulley; 6223. Drive shaft; 623. Lifting assembly mounting plate; 624. Lifting platform guide rail; 625. Lifting platform; 626. Limiting plate;

[0042] 71. Upper cavity base frame; 72. Bonding and pressing cylinder; 73. Upper cavity assembly; 731. Upper cavity connecting plate; 732. Upper cavity lifting guide rail; 733. Upper cavity connecting block; 734. Upper cavity shell; 735. Bonding suction plate; 736. Vacuum control switch. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0044] Please refer to the attached document. Figures 1-10 This utility model proposes a wafer bonding device, including a clean booth 2, a carrier component 3, a film cutting component 4, a film attaching component 5, a lower bonding cavity component 6, and an upper bonding cavity component 7. The carrier component 3, the film cutting component 4, the film attaching component 5, the lower bonding cavity component 6, and the upper bonding cavity component 7 are all disposed inside the clean booth 2, which is mounted on a frame 1.

[0045] The carrier assembly 3 is movably located below the film cutting assembly 4 and the film attaching assembly 5, and is used to support the quartz glass; the film cutting assembly 4 is located to the side of the film attaching assembly 5, and is used to cut the film so that the film and the quartz glass are the same size and shape; the film attaching assembly 5 is located on one side of the frame 1, and is used to attach the film to the quartz glass; the bonding lower cavity assembly 6 is located on the other side of the frame 1, and is used to place the film-attached quartz glass; the bonding upper cavity assembly 7 is located above the bonding lower cavity assembly 6, and is used to adsorb the wafer so that the wafer and the film-attached quartz glass can be bonded.

[0046] In this embodiment, the clean booth 2, the support assembly 3, the film-applying assembly 5, the lower bonding cavity assembly 6, and the upper bonding cavity assembly 7 are all mounted on the frame 1. The support assembly 3 includes a horizontal module 31 and a support platform 32. The support platform 32 is equipped with an adsorption element and a heating element for adsorbing and heating the quartz glass. The adsorption element helps prevent the quartz glass from slipping, and the heating element helps to ensure a tighter film application on the quartz glass. The support platform 32 is mounted on the horizontal module 31, which drives the quartz glass to move below the film-cutting assembly 4 and the film-applying assembly 5. The film-cutting assembly 4 is located to the side of the film-applying assembly 5 and includes a rotating module 43. The cutting assembly 44 is driven by a rotating assembly to rotate. The cutting assembly 44 cuts the adhesive film to make it the same size and shape as the quartz glass. In one specific embodiment, the carrying assembly 3 transports the quartz glass to below the film-cutting assembly 4. The adhesive film is in sheet form and can be manually applied to the quartz glass. The film-cutting assembly 4 cuts the sheet adhesive film to the same size and shape as the quartz glass. The film-applying assembly 5 includes a film-applying lifting assembly 52, a pressing assembly 53, an application assembly 54, and an application vacuum assembly. The film-applying lifting assembly 52 drives the pressing assembly 53. The attachment assembly 54 and the lifting assembly 53 drive the attachment assembly 54 to move downwards. The attachment assembly 54 is used to apply film to the quartz glass. The attachment vacuum assembly is used to perform vacuuming. In one specific embodiment, after the lifting assembly drives the lifting assembly 53 and the attachment assembly 54 to rise, the carrying assembly 3 transports the quartz glass to below the film application assembly 5. The lifting assembly 53 drives the attachment assembly 54 to press downwards, so that the attachment assembly 54 and the carrying assembly 3 form a sealed space. The attachment vacuum assembly performs vacuuming on this sealed space, which helps to avoid air bubbles during the application of film to the quartz glass. To improve the bonding effect of the quartz glass film, the bonding lower cavity assembly 6 is located on the other side of the frame 1. The bonding lower cavity assembly 6 includes a bonding lifting assembly 622 and a lower cavity assembly 62. The lower cavity assembly 62 includes a lifting platform 625. The bonding lifting assembly 622 is used to drive the lifting platform 625 to perform lifting movements. The lifting platform 625 is used to place the film-coated quartz glass. In a specific embodiment, the film-coated quartz glass is manually transported from the carrier assembly 3 to the lifting platform 625. When bonding is performed, the bonding lifting assembly 622 will drive the lifting platform 625 to perform upward movements, which is conducive to a tighter bonding between the quartz glass and the wafer.The upper bonding cavity assembly 7 is positioned above the lower bonding cavity assembly 6. The upper bonding cavity assembly 7 includes a bonding pressing cylinder 72, a lower cavity assembly 62, and a bonding vacuum assembly. The lower cavity assembly 62 includes a bonding suction plate 735. The bonding pressing cylinder 72 drives the bonding suction plate 735 to press down, and the bonding suction plate 735 is used to adsorb the wafer. The bonding vacuum assembly is used to perform vacuuming. In a specific embodiment, the upper bonding cavity assembly 7 drives the quartz glass to rise, and the lower bonding cavity assembly 6 drives the wafer to press down, which is beneficial for a tighter bonding between the wafer and the quartz glass. The upper cavity assembly 73 and the lower cavity assembly 62 form a sealed space, and the bonding vacuum assembly performs vacuuming on this sealed space, effectively avoiding the generation of bubbles during bonding and further improving the bonding effect.

[0047] This invention proposes that the lower cavity assembly 62, which holds the film-coated wafer, moves upward during bonding, while the upper cavity assembly 7, which holds the wafer, moves downward during bonding. This facilitates a tighter bond between the quartz glass and the wafer, effectively improving the bonding effect. This invention also proposes to perform vacuum treatment on the sealed space formed by the lower cavity assembly 6 and the upper cavity assembly 7, which helps to avoid air bubbles during bonding, further improving the bonding effect. Furthermore, this invention proposes to integrate the quartz glass film coating and wafer bonding device, which facilitates subsequent wafer processing and effectively improves production efficiency. Finally, this invention proposes to use a cleanroom 2 to protect the components within the device, effectively preventing contamination.

[0048] Please refer to Figure 2 and Figure 3 The supporting component 3 includes a horizontal module 31 and a supporting platform 32. The horizontal module 31 includes a first linear module 312 and a second linear module 313. The second linear module 313 is located above the first linear module 312, and the supporting platform 32 is located above the second linear module 313. The first linear module 312 and the second linear module 313 cooperate to move the supporting platform 32 along the direction of the first linear module 312 and the direction of the second linear module 313. The supporting platform 32 is provided with a heating element and an adsorption element for adsorbing and heating the quartz glass. The supporting platform 32 is located above the horizontal module 31, and the horizontal module 31 is used to drive the quartz glass to move below the film cutting component 4 and the film applying component 5.

[0049] In specific implementation: the horizontal module 31 includes a bearing guide rail 311, a first linear module 312, and a second linear module 313; the bearing platform 32 includes a bearing housing 321, a heating base plate 322, and a bearing suction plate 323; the bearing guide rail 311 is fixedly connected to the frame 1, and in one specific embodiment, the bearing guide rail 311 includes two; the first linear module 312 is located between the two bearing guide rails 311, and the first linear module 312 is parallel to the bearing guide rail 311; the second linear module 313 is slidably disposed on the first linear module 312, and the first linear module 312 drives the second linear module 313 to move along the direction of the first linear module 312; the bearing... The housing 321 is slidably mounted on the second linear module 313, which drives the housing 321 to move along the direction of the second linear module 313. The first linear module 312 and the second linear module 313 work together to drive the quartz glass to move below the film cutting assembly and the film application assembly 5. The heating base plate 322 is located on the housing 321 and is fixedly connected to it. A carrying suction plate 323 is provided above the heating base plate 322 and is used to heat the carrying suction plate 323. The carrying suction plate 323 is used to adsorb the quartz glass. Adsorbing the quartz glass effectively prevents it from slipping, and heating the quartz glass helps to make the film on the quartz glass adhere more tightly.

[0050] Please refer to Figure 2 and Figure 4 The film cutting assembly 4 includes a film cutting base frame 41, a film cutting mounting plate 42, a rotating module 43, and a cutter assembly 44. The film cutting base frame 41 is fixedly connected to the frame 1, and the film cutting mounting plate 42 is fixedly connected to the film cutting base frame 41. The film cutting mounting plate 42 has a through hole. The rotating module 43 is located above the film cutting mounting plate 42, and the cutter assembly 44 is located below the film cutting mounting plate 42. The rotating module 43 passes through the through hole and is connected to the cutter assembly 44, and is used to drive the cutter assembly 44 to rotate relative to the quartz glass. The cutter assembly 44 includes a film cutting cylinder 444 and a film cutting blade 445. The output end of the film cutting cylinder 444 is connected to the film cutting blade 445, and is used to drive the film cutting blade 445 to move up and down relative to the quartz glass. The rotating module 43 and the film cutting cylinder 444 work together to drive the film cutting blade 445 to rotate and move up and down. The film cutting blade 445 is used to cut the film so that the film is the same size and shape as the quartz glass.

[0051] In specific implementation: the film cutting assembly 4 includes a film cutting base frame 41, a film cutting mounting plate 42, a rotating module 43, and a cutter assembly 44. The rotating module 43 includes a rotating drive component 431 and a rotating shaft 432. The cutter assembly 44 includes a rotating connecting plate 441, a film cutting cylinder guide rail 442, a film cutting cylinder connecting plate 443, a film cutting cylinder 444, and a film cutting blade 445. The film cutting base frame 41 is fixedly connected to the film application assembly 5, and the film cutting mounting plate 42 is fixedly connected to the film cutting base frame 41. The rotating drive component 431... 31 is located on the film-cutting mounting plate 42 and is used to drive the rotating shaft 432 to rotate. The film-cutting mounting plate 42 has a through hole. One end of the rotating shaft 432 is located above the film-cutting mounting plate 42, and the other end passes through the through hole and is connected to the cutter assembly 44, and is used to drive the cutter assembly 44 to rotate. The rotating connecting plate 441 is connected to the output end of the rotating shaft 432. The film-cutting cylinder guide rail 442 is provided below the rotating connecting plate 441. The film-cutting cylinder connecting plate 443 and the film-cutting cylinder guide rail 442 are slidably connected. Cylinder 444 is fixedly connected to the film-cutting cylinder connecting plate 443. The output end of the film-cutting cylinder 444 is connected to the film-cutting blade 445 and is used to drive the film-cutting blade 445 to move up and down. The rotating module 43 works in conjunction with the film-cutting cylinder 444 to drive the film-cutting blade 445 to rotate and move up and down. The film-cutting blade 445 is used to cut the film so that the film is the same size and shape as the quartz glass. In a specific embodiment, the rotating drive component 431 can be a servo motor. The bearing assembly 3 carries the quartz glass. The quartz glass is transported to the bottom of the film cutting assembly 4. The film is in sheet form when it is loaded, and the sheet film can be manually covered on the quartz glass. The film cutting assembly 4 cuts the sheet film to the same size and shape as the quartz glass. The film cutting cylinder connecting plate 443 and the film cutting cylinder guide rail 442 can be slidably connected to absorb rotational displacement errors and avoid jamming when the film cutting knife 445 rotates to cut the film, which is conducive to more accurate film cutting. Applying film to the quartz glass can prevent the quartz glass from being contaminated and facilitate subsequent wafer processing.

[0052] Please refer to Figure 2 , Figure 5 and Figure 6 The film application assembly 5 includes a film application base frame 51, a film application lifting assembly 52, a pressing assembly 53, and an application assembly 54. The film application base frame 51 is fixedly connected to the frame 1. One end of the film application lifting assembly 52 is connected to the film application base frame 51, and the other end is connected to the pressing assembly 53. The output end of the pressing assembly 53 is connected to the application assembly 54. The film application lifting assembly 52 is used to drive the pressing assembly 53 and the application assembly 54 to perform lifting and lowering movements. The pressing assembly 53 is used to drive the application assembly 54 to press downward. The application assembly 54 includes an application box 541, an application roller 542, and an application vacuum assembly. The application box 541 is connected to the pressing assembly 53. The application roller 542 is located inside the application box 541 and connected to the application box 541. The application roller 542 is used to apply film to quartz glass. The application vacuum assembly is used to perform vacuum treatment on the application box 541.

[0053] In specific implementation: the film application assembly 5 includes a film application base frame 51, a film application lifting assembly 52, a pressing assembly 53, and an attachment assembly 54. The film application lifting assembly 52 includes a film application lifting drive component 521, a cylinder mounting plate 522, a lifting guide shaft 523, a film application lifting guide rail 524, and a guide rail connecting block 525. The pressing assembly 53 includes a film application pressing cylinder 531 and a cylinder guide shaft 532. The attachment assembly 54 includes an attachment box 541, attachment rollers 542, and an attachment vacuum assembly. The film application base frame 51 is fixedly connected to the frame 1. The lifting drive unit is mounted on the film-applying base frame 51. The output end of the lifting drive unit is connected to the cylinder mounting plate 522. The inner side of the film-applying base frame 51 is provided with a film-applying lifting guide rail 524. The cylinder mounting plate 522 is connected to the film-applying lifting guide rail 524 through a guide rail connecting block 525 and is slidably connected to the film-applying base frame 51. The film-applying pressing cylinder 531 is mounted on the cylinder mounting plate 522. One end of the lifting guide shaft 523 is connected to the cylinder mounting plate 522, and the other end is connected to the applicator housing 541. The applicator roller 542 is located inside the applicator housing 541 and is connected to the film-applying roller. The attachment box 541 is fixedly connected, and the lifting drive is used to drive the cylinder mounting plate 522, the film-applying pressing cylinder 531, the attachment box 541, and the application rollers 542 to move up and down synchronously. The output end of the film-applying pressing cylinder 531 passes through the cylinder mounting plate 522 and is connected to the attachment box 541 through the lifting guide shaft 523. The film-applying pressing cylinder 531 is used to drive the attachment box 541 and the application rollers 542 to press down. In a specific embodiment, the film-applying lifting drive 521 can be a servo motor; the lifting assembly drives the pressing assembly. After the 53 and the attaching component 54 rise, the carrier component 3 transports the quartz glass with the adhesive film covering its surface to below the attaching component 5. The pressing component 53 drives the attaching component 54 to press downward. The attaching component 54 applies downward pressure to the surface of the quartz glass, and the attaching component 54 and the carrier component 3 form a sealed space. The attaching shaft vacuum component performs vacuum treatment on this sealed space, and the attaching roller 542 tightly attaches the film to the surface of the quartz glass, which helps to avoid the generation of air bubbles when attaching the film to the quartz glass and further improves the adhesion effect of the quartz glass film.

[0054] Please refer to Figure 2 , Figure 7 and Figure 8The bonding lower cavity assembly 6 includes a protective cover 61 and a lower cavity assembly 62. Both the protective cover 61 and the lower cavity assembly 62 are connected to the frame 1. The protective cover 61 is used to protect the lower cavity assembly 62. The lower cavity assembly 62 includes a lower cavity shell 621, a bonding lifting assembly 622, a lifting assembly mounting plate 623, and a lifting platform 625. The lifting assembly mounting plate 623 is located inside the lower cavity shell 621 and is fixedly connected to the lower cavity shell 621. The lifting platform 625 is slidably connected to the lower cavity shell 621. The bonding lifting assembly 622 is located on the lifting assembly mounting plate 623. The output end of the bonding lifting assembly 622 is fixedly connected to the lifting platform 625 and is used to drive the lifting platform 625 to perform lifting movements. The lifting platform 625 is used to place the film-coated quartz glass.

[0055] In specific implementation: the bonding lower cavity assembly 6 includes a protective cover 61 and a lower cavity assembly 62. The lower cavity assembly 62 includes a lower cavity shell 621, a bonding lifting assembly 622, a lifting assembly mounting plate 623, a lifting platform guide rail 624, and a lifting platform 625. The bonding lifting assembly 622 includes a bonding lifting drive 6221, a synchronous pulley 6222, and a drive shaft 6223. The protective cover 61 is located around the lower cavity assembly 62 and is used to protect the lower cavity assembly 62. The lifting assembly mounting plate 623 is located inside the lower cavity shell 621 and is fixedly connected to the lower cavity shell 621. The bonding lifting drive 6221 and the synchronous pulley 6222 are located on the lifting assembly mounting plate 623. The bonding lifting drive 6221 drives the synchronous pulley 6222 to rotate through a transmission belt. The output end of the synchronous pulley 6222 is connected to the drive shaft 6223 and is used to drive the drive shaft 6223 to move up and down. The lifting platform 625 is slidably connected to the lower cavity housing 621 via the lifting platform guide rail 624. The output end of the transmission shaft 6223 is connected to the lifting platform 625 and is used to drive the lifting platform 625 to perform lifting movements. In a specific embodiment, the bonding lifting drive component 6221 can be a servo motor. The lifting platform 625 is provided with a limiting piece 626, which is beneficial for positioning the film-coated quartz glass and controlling the bonding force to avoid damage to the quartz glass and the wafer. The film-coated quartz glass is manually transported from the carrier component 3 to the lifting platform 625, and the uncoated side of the quartz glass is bonded to the upper cavity component 7. When bonding is performed, the bonding lifting component 622 will drive the lifting platform 625 to move upward, which is beneficial for a tighter bonding between the quartz glass and the wafer and a better bonding effect.

[0056] Please refer to Figure 2 , Figure 9 and Figure 10The upper bonding cavity assembly 7 is located above the lower bonding cavity assembly 6. The upper bonding cavity assembly 7 includes an upper bonding cavity base frame 71, a bonding pressing cylinder 72, and an upper cavity assembly 73. The upper bonding cavity base frame 71 is fixedly connected to the frame 1. The bonding pressing cylinder 72 is mounted on the upper bonding cavity base frame 71. The output end of the bonding pressing cylinder 72 is connected to the upper cavity assembly 73 and is used to drive the upper cavity assembly 73 downward to form a sealed space between the upper cavity and the lower cavity. The upper cavity assembly 73 includes an upper cavity connecting plate 731. The upper cavity housing 734, bonding suction plate 735, and bonding vacuum assembly are included. The upper cavity assembly 73 is connected to the output end of the bonding pressure cylinder 72 via the upper cavity connecting plate 731. The upper cavity housing 734 is connected to the cavity connecting plate. The bonding suction plate 735 is located inside the upper cavity housing 734 and is used to adsorb wafers. The bonding vacuum assembly is used to perform vacuum treatment inside the upper cavity housing 734. The diameter of the lower cavity housing 621 is smaller than that of the upper cavity housing 734. The lifting platform 625 is correspondingly set with the bonding suction plate 735.

[0057] In specific implementation: the bonding upper cavity assembly 7 includes a bonding upper cavity base frame 71, a bonding lower pressure cylinder 72, and an upper cavity assembly 73. The upper cavity assembly 73 includes an upper cavity connecting plate 731, an upper cavity lifting guide rail 732, an upper cavity connecting block 733, an upper cavity outer shell 734, a bonding suction plate 735, a bonding vacuum assembly, and a vacuum control switch 736. The bonding upper cavity base frame 71 is fixedly connected to the frame 1. The frame 1 is equipped with a control box 11, which is used to control the bonding switch and the bonding lower pressure cylinder. Cylinder 72 is mounted on the bonding upper cavity base frame 71 and fixedly connected to it. The output end of the bonding pressing cylinder 72 is connected to the upper cavity assembly 73 and is used to drive the upper cavity assembly 73 to press down. The upper cavity connecting plate 731 is fixedly connected to the output end of the bonding pressing cylinder 72. An upper cavity lifting guide rail 732 is provided on the inner side of the upper cavity base frame 71. The upper cavity connecting plate 731 is connected to the upper cavity lifting guide rail 732 through the upper cavity connecting block 733 and forms a slidable connection with the upper cavity base frame 71. The cavity housing 734 is connected to the cavity connecting plate. The bonding suction plate 735 is located inside the upper cavity housing 734 and is used to adsorb the wafer. The diameter of the lower cavity housing 621 is smaller than that of the upper cavity housing 734. The lifting platform 625 is correspondingly set with the bonding suction plate 735, which is beneficial to the alignment of the quartz glass and the wafer, making the bonding more accurate. The bonding pressing cylinder 72 drives the upper cavity assembly 73 to press down, and the bonding lifting assembly 622 drives the lifting platform 625 to rise. The upper cavity assembly 73 and the lower cavity form a closed cavity space for bonding. The vacuum assembly evacuates the sealed space of the cavity, effectively preventing air bubbles from forming during bonding. The vacuum control switch 736 is located on one side of the bonding upper cavity base 71 and is used to control whether to evacuate the sealed space of the cavity. In a specific embodiment, the bonding suction plate 735 is provided with a limiting ring, which allows the wafer to be manually adsorbed onto the bonding suction plate 735, and the limiting ring ensures accurate placement. Turning on the vacuum control switch 736 and the control box 11 enables vacuum bonding, effectively improving the bonding effect.

[0058] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, apparatus, article, or method that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, apparatus, article, or method. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, apparatus, article, or method that includes that element.

[0059] The above description is only a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A wafer bonding apparatus, comprising a rack, characterized in that, It includes a cleanroom, a support assembly, a film cutting assembly, a film applying assembly, a lower bonding cavity assembly, and an upper bonding cavity assembly. The support assembly, the film cutting assembly, the film applying assembly, the lower bonding cavity assembly, and the upper bonding cavity assembly are all disposed inside the cleanroom, which is mounted on the frame. The supporting component is movably disposed below the film cutting component and the film applying component, and is used to support the quartz glass; The film cutting assembly is located on the side of the film application assembly and is used to cut the adhesive film so that the adhesive film is the same size and shape as the quartz glass; The film application assembly is located on one side of the frame and is used to apply a film to the quartz glass; The bonding lower cavity assembly is located on the other side of the frame and is used to place the coated quartz glass. The bonding upper cavity assembly is located above the bonding lower cavity assembly and is used to adsorb the wafer so that the wafer and the film-coated quartz glass can be bonded.

2. The wafer bonding apparatus according to claim 1, characterized in that, The bonding lower cavity assembly includes a protective cover and a lower cavity assembly, both of which are connected to the frame. The protective cover protects the lower cavity assembly. The lower cavity assembly includes a lower cavity shell, a bonding lifting assembly, a lifting assembly mounting plate, a lifting platform guide rail, and a lifting platform. The lifting assembly mounting plate is located inside the lower cavity shell and is fixedly connected to it. The lifting platform guide rail is located on the inner wall of the lower cavity shell, and the lifting platform is slidably connected to the lower cavity shell via the lifting platform guide rail. The bonding lifting assembly is located on the lifting assembly mounting plate, and its output end is fixedly connected to the lifting platform and is used to drive the lifting platform to perform lifting movements. The lifting platform is used to place the film-coated quartz glass.

3. The wafer bonding apparatus according to claim 2, characterized in that, The upper bonding cavity assembly is located above the lower bonding cavity assembly. The upper bonding cavity assembly includes an upper bonding cavity base frame, a lower bonding cylinder, and an upper cavity assembly. The upper bonding cavity base frame is fixedly connected to the frame. The lower bonding cylinder is mounted on the upper bonding cavity base frame. The output end of the lower bonding cylinder is connected to the upper cavity assembly and is used to drive the upper cavity assembly to press downward so that the upper cavity and the lower cavity form a sealed space.

4. The wafer bonding apparatus according to claim 3, characterized in that, The upper cavity assembly includes an upper cavity connecting plate, an upper cavity shell, a bonding suction plate, and a bonding vacuum assembly. The upper cavity assembly is connected to the output end of the bonding pressure cylinder through the upper cavity connecting plate. The upper cavity shell is connected to the cavity connecting plate. The bonding suction plate is located inside the upper cavity shell and is used to adsorb wafers. The bonding vacuum assembly is used to perform vacuum treatment inside the upper cavity shell.

5. The wafer bonding apparatus according to claim 4, characterized in that, The diameter of the lower cavity shell is smaller than the diameter of the upper cavity shell, and the lifting platform is correspondingly arranged with the bonding suction plate.

6. The wafer bonding apparatus according to claim 1, characterized in that, The support assembly includes a horizontal module and a support platform. The support platform is equipped with a heating element and an adsorption element for adsorbing and heating the quartz glass. The support platform is located above the horizontal module, and the horizontal module is used to drive the quartz glass to move below the film cutting assembly and the film applying assembly.

7. The wafer bonding apparatus according to claim 6, characterized in that, The horizontal module includes a first linear module and a second linear module. The second linear module is located above the first linear module, and the support platform is located above the second linear module. The first linear module and the second linear module work together to move the support platform along the direction of the first linear module and the direction of the second linear module.

8. The wafer bonding apparatus according to claim 1, characterized in that, The film cutting assembly includes a film cutting base frame, a film cutting mounting plate, a rotating module, and a cutting blade assembly. The film cutting base frame is fixedly connected to the film application assembly, and the film cutting mounting plate is fixedly connected to the film cutting base frame. The film cutting mounting plate has a through hole. The rotating module is located above the film cutting mounting plate, and the cutting blade assembly is located below the film cutting mounting plate. The rotating module passes through the through hole and is connected to the cutting blade assembly, and is used to drive the cutting blade assembly to rotate relative to the quartz glass.

9. The wafer bonding apparatus according to claim 8, characterized in that, The cutting assembly includes a film-cutting cylinder and a film-cutting blade. The output end of the film-cutting cylinder is connected to the film-cutting blade and is used to drive the film-cutting blade to move up and down relative to the quartz glass. The rotating module and the film-cutting cylinder work together to drive the film-cutting blade to rotate and move up and down. The film-cutting blade is used to cut the adhesive film so that the adhesive film is the same size and shape as the quartz glass.

10. The wafer bonding apparatus according to claim 1, characterized in that, The film application assembly includes a film application base frame, a film application lifting assembly, a pressing assembly, and an attachment assembly. The film application base frame is fixedly connected to the machine frame. One end of the film application lifting assembly is connected to the film application base frame, and the other end is connected to the pressing assembly. The output end of the pressing assembly is connected to the attachment assembly. The film application lifting assembly is used to drive the pressing assembly and the attachment assembly to move up and down. The pressing assembly is used to drive the attachment assembly to press down.

11. The wafer bonding apparatus according to claim 10, characterized in that, The bonding assembly includes a bonding box, bonding rollers, and a bonding vacuum assembly. The bonding box is connected to a pressing assembly. The bonding rollers are located inside the bonding box and connected to the bonding box. The bonding rollers are used to apply film to quartz glass. The bonding vacuum assembly is used to perform vacuum treatment on the bonding box.

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