Electronic device

Abstract

The utility model relates to an electronic device. At least one package includes a die including a first surface, a second surface opposite the first surface, and one or more sidewalls transverse to the first surface and the second surface. One or more sidewalls extend from the first surface to the second surface. A plurality of separate and distinct heat spreaders are on the first surface of the die. Each respective separate and distinct heat sink of the plurality of separate and distinct heat sinks is separate and distinct from an adjacent separate and distinct heat sink of the plurality of separate and distinct heat sinks. The plurality of channels separate each respective one of the plurality of heat sinks from an adjacent one of the plurality of heat sinks. In some packages, a resilient thermally conductive material is present within and fills the plurality of channels.

Description

Technical Field

[0001] This disclosure relates to one or more embodiments of a heat sink, slug, or spreader, and one or more embodiments of a method of manufacturing the same. Background Technology

[0002] The semiconductor industry has shown considerable interest in technologies and structures that reduce or prevent the effects of thermo-mechanical stress. For example, when a heat sink, heat plate, or heat spreader is present on a die of a semiconductor package, and there is a temperature rise in the environment surrounding the package, the heat sink, heat plate, or heat spreader may expand as it dissipates the heat generated by the temperature rise within the semiconductor package. Alternatively, when a heat sink, heat plate, or heat spreader is present on a die of a semiconductor package, and there is a temperature drop in the environment surrounding the package, the heat sink, heat plate, or heat spreader may contract as it dissipates the heat generated by the temperature drop within the semiconductor package. When a heat sink, heat plate, or heat spreader expands and contracts due to these temperature changes, it may expand or contract by different amounts compared to other components of the semiconductor package due to differences in the coefficient of thermal expansion (CTE). These differences in expansion and contraction caused by temperature rise and fall generate mechanical stress between the various components of a semiconductor package (e.g., heat sink, heat block or heat sink and die), which can cause defects to propagate within the semiconductor package or increase their likelihood (e.g., cracking, delamination or some other similar or related type of defect). Utility Model Content

[0003] At least one embodiment of the apparatus disclosed herein (e.g., a semiconductor package, a semiconductor device, or some other similar or analog electronic device) relates to a die including a first surface, a second surface, and one or more sidewalls, the second surface being opposite to the first surface, and the one or more sidewalls being transverse to the first and second surfaces. The one or more sidewalls extend from the first surface to the second surface. Resin covers the one or more sidewalls of the die and extends around the die. A first non-conductive layer is on the second surface of the die. A plurality of conductive vias extend through the first non-conductive layer to the die. A plurality of conductive connection structures are coupled to the plurality of conductive vias and are on the first non-conductive layer. The plurality of conductive connection structures include a plurality of end surfaces spaced apart from the plurality of conductive vias. A second non-conductive layer is on the first non-conductive layer and extends around the plurality of conductive connection structures. The plurality of end surfaces of the plurality of conductive connection structures are exposed from the second non-conductive layer. A plurality of heat sinks are on the first surface of the die. Each respective heat sink of the plurality of heat sinks is separated from and distinct from adjacent heat sinks of the plurality of heat sinks. A plurality of channels separate each respective heat sink of the plurality of heat sinks from adjacent heat sinks of the plurality of heat sinks.

[0004] In some embodiments, the plurality of channels includes: a plurality of first channels extending in a first direction; and a plurality of second channels extending in a second direction, the second direction being transverse to the first direction.

[0005] In some embodiments, the plurality of first channels are perpendicular to the plurality of second channels; and each of the plurality of radiators has a rectangular prism shape.

[0006] In some embodiments, the plurality of first channels are perpendicular to the plurality of second channels; and each of the plurality of radiators has a cuboid shape.

[0007] In some embodiments, a respective heat sink among the plurality of heat sinks has at least one of the following: cylindrical shape, rectangular prism shape, and rhombic prism shape.

[0008] In some embodiments, each of the plurality of heat sinks includes: a heat sink end surface separated from a first surface of the fin; and a thickness extending from the first surface to the heat sink end surface, the thickness ranging from 20 to 200 micrometers (μm) or equal to the upper and lower ends of the range.

[0009] In some embodiments, each of the plurality of channels has a distance extending between the sidewalls of adjacent heat sinks in the plurality of heat sinks, and the distance ranges from 10 to 350 micrometers (μm) or the distance is equal to the upper and lower ends of the range.

[0010] In some embodiments, a respective heat sink of the plurality of heat sinks is on a third surface of the resin.

[0011] In some embodiments, the third surface of the resin is coplanar with the first surface of the bare sheet.

[0012] In some embodiments, the plurality of heat sinks are inwardly separated from one or more sidewalls of the resin.

[0013] At least one embodiment of the apparatus disclosed herein (e.g., a semiconductor package, a semiconductor device, or some other similar or analogous electronic device) relates to a die including a first surface, a second surface, and one or more sidewalls, the second surface being opposite to the first surface, and the one or more sidewalls being transverse to the first and second surfaces. The one or more sidewalls extend from the first surface to the second surface. Resin covers the one or more sidewalls of the die and extends the die. A first non-conductive layer is on the second surface of the die. A plurality of conductive vias extend through the first non-conductive layer to the die. A plurality of conductive connection structures are coupled to the plurality of conductive vias and are on the first non-conductive layer. The plurality of conductive connection structures include a plurality of end surfaces spaced apart from the plurality of conductive vias. A second non-conductive layer is on the first non-conductive layer and extends around the plurality of conductive connection structures. The plurality of end surfaces of the plurality of conductive connection structures are exposed from the second non-conductive layer. A plurality of heat sinks are on the first surface of the die. Each respective heat sink of the plurality of heat sinks is separated from and distinct from adjacent heat sinks of the plurality of heat sinks. A plurality of channels separate each respective heat sink of the plurality of heat sinks from adjacent heat sinks of the plurality of heat sinks. The thermally conductive material fills the multiple channels and is present on the surface of the bare die.

[0014] In some embodiments, the heat-conducting material is elastic.

[0015] In some embodiments, the thermally conductive material has an elastic modulus in the range of 0.1 to 5000 MPa, or equal to the upper and lower ends of that range.

[0016] In some embodiments, the heat-conducting material is configured to increase heat dissipation during operation.

[0017] In some embodiments, each of the plurality of heat sinks includes: a heat sink end surface separated from a first surface of the fin; and a thickness extending from the first surface to the heat sink end surface, the thickness ranging from 20 to 200 micrometers (μm) or equal to the upper and lower ends of the range.

[0018] In some embodiments, the thermally conductive material filling the plurality of channels has a thermally conductive surface that is coplanar with the heat sink end surfaces of the plurality of heat sinks.

[0019] In some embodiments, a resilient second thermally conductive material at least partially fills the plurality of channels. The second thermally conductive material is configured to increase heat dissipation during operation.

[0020] At least one embodiment of the manufacturing method relates to at least one embodiment of forming a semiconductor package as described above.

[0021] At least one embodiment of the manufacturing method includes: forming a temporary layer covering a first surface of a bare die; removing a portion of the temporary layer to form a plurality of openings in the temporary layer that expose a region of the first surface of the bare die; depositing a first thermally conductive material in the plurality of openings to form a plurality of separate and distinct heat sinks by at least partially filling the plurality of openings with the first thermally conductive material; and removing one or more remaining portions of the temporary layer to expose the sidewalls of the plurality of separate and distinct heat sinks and to expose a plurality of channels extending between adjacent heat sinks in the plurality of separate and distinct heat sinks.

[0022] In some embodiments, the method further includes forming a second thermally conductive material within the plurality of channels and on a first surface of the die, the second thermally conductive material having an elasticity ranging from 0.1 to 5000 MPa or equal to the upper and lower ends of that range.

[0023] In some embodiments, the method further includes: forming a first non-conductive layer on a second surface of the die opposite to the first surface; forming a plurality of conductive vias extending through the first non-conductive layer to the second surface of the die; forming a resin surrounding the die and covering the sidewalls of the die; forming a plurality of conductive connection structures on the first non-conductive layer and on the resin; and forming a second non-conductive layer extending around the plurality of conductive connection structures.

[0024] In some embodiments, a respective heat sink among the plurality of heat sinks has at least one of the following: cylindrical shape, rectangular prism shape, and rhombic prism shape.

[0025] In view of the above discussion, embodiments of this disclosure relate to preventing, mitigating or reducing the possibility of mechanical defects propagating within a semiconductor package, including a heat sink, heatsink, or heat plate, which will readily become apparent from the discussion herein. Attached Figure Description

[0026] To better understand the embodiments, reference will now be made to the accompanying drawings by way of example. In the drawings, the same reference numerals identify the same or similar elements or actions unless the context otherwise indicates. The dimensions and relative proportions of the elements in the drawings are not necessarily drawn to scale. For example, some of these elements may be enlarged and positioned to improve the readability of the drawings.

[0027] Figure 1A It is the edge of the package Figure 1B A cross-sectional view taken from line 1A-1A in the diagram;

[0028] Figure 1B Is it like this? Figure 1A The top plan view of the package shown;

[0029] Figure 2A This is an embodiment of the packaging disclosed herein. Figure 2B A cross-sectional view taken from line 2A-2A in the diagram;

[0030] Figure 2B Is it like this? Figure 2A The top plan view of an embodiment of the package of this disclosure is shown;

[0031] Figure 3 This is a top plan view of an alternative embodiment of the packaging disclosed herein;

[0032] Figure 4 This is a top plan view of an alternative embodiment of the packaging disclosed herein;

[0033] Figure 5 This is a top plan view of an alternative embodiment of the packaging disclosed herein;

[0034] Figure 6 This is a top plan view of an alternative embodiment of the packaging disclosed herein;

[0035] Figure 7A This is an alternative embodiment of the packaging disclosed herein. Figure 7B The cross-sectional view taken by line 7A-7A shown in the figure;

[0036] Figure 7B Is it like this? Figure 7A The top plan view of an alternative embodiment of the package of this disclosure is shown;

[0037] Figure 8A This is an alternative embodiment of the packaging disclosed herein. Figure 8B The cross-sectional view taken by line 8A-8A shown in the figure;

[0038] Figure 8B Is it like this? Figure 8A The top plan view of an alternative embodiment of the package of this disclosure is shown;

[0039] Figure 9A It is a stress diagram of the interface of a package without a heat sink, heat block or heat plate;

[0040] Figure 9B Is it like this? Figure 1A and Figure 1B Stress diagram of the interface within the package shown;

[0041] Figure 9C As disclosed herein Figure 2A and Figure 2B Stress diagram of the interface within an embodiment of the encapsulation of this disclosure shown;

[0042] Figure 10 Is manufacturing like Figure 2A and Figure 2BA flowchart illustrating embodiments of methods for using multiple heat sinks, heat blocks, or heat plates in the present disclosure.

[0043] Figures 11A-11E Is it like this? Figure 10 The flowchart shown is a cross-sectional view of the corresponding steps of the manufacturing method embodiment to manufacture, as illustrated. Figure 2A and Figure 2B The embodiments of the package shown in this disclosure include multiple heat sinks, heat blocks, or heat plates;

[0044] Figure 12 Is manufacturing like Figure 7A and Figure 7B The flowchart illustrates alternative methods for various heat sinks, heat blocks, or heat plates in alternative embodiments of the packaging of this disclosure.

[0045] Figures 13A-13C Is it like this? Figure 12 The flowchart shown is a cross-sectional view of the corresponding steps of the manufacturing method embodiment to manufacture, as illustrated. Figure 2A and Figure 2B The embodiments of the package shown in this disclosure include multiple heat sinks, heat blocks, or heat plates;

[0046] Figure 14 Is manufacturing like Figure 2A and Figure 2B The flowcharts illustrating alternative methods for various heat sinks, heat blocks, or heat plates in alternative embodiments of the packaging of this disclosure are shown; and

[0047] Figures 15A-15E Is it like this? Figure 14 The flowchart shown is a cross-sectional view of the corresponding steps of the manufacturing method embodiment to manufacture, as illustrated. Figure 2A and Figure 2B The embodiments of the package shown in this disclosure include multiple heat sinks, heat blocks, or heat plates. Detailed Implementation

[0048] In the following description, certain details are set forth to provide a thorough understanding of various embodiments of the apparatus, methods, and articles of manufacture. However, those skilled in the art will understand that other embodiments may be practiced without these details. In other instances, well-known structures and methods associated with, for example, semiconductor manufacturing processes are not shown or described in detail in some figures to avoid unnecessarily obscuring the description of the embodiments.

[0049] Unless the context otherwise requires, the word “comprising” and its variations such as “including”, “containing”, etc., should be interpreted in an open-ended sense throughout the specification and the claims, i.e., “including but not limited to”.

[0050] Throughout this specification, references to "an embodiment" or "an embodiment" mean that a specific feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing in various places throughout this specification do not necessarily refer to the same embodiment or all embodiments. Furthermore, specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments to obtain further embodiments.

[0051] The headings are provided for convenience only and do not define the scope or meaning of this disclosure or the claims.

[0052] The dimensions and relative positions of the components in the accompanying drawings are not necessarily drawn to scale. For example, the shapes and angles of various components may not be drawn to scale, and some of these components may be enlarged and repositioned to improve the readability of the drawings.

[0053] The use of “transverse” means that a surface, sidewall, or similar structure or feature is at an angle relative to another corresponding surface, sidewall, or similar structure or feature. For example, if the first surface is transverse to the first sidewall, the first surface can be at an angle equal to 25 degrees, 35 degrees, 45 degrees, 75 degrees, 90 degrees, 120 degrees, etc.

[0054] Generally, in semiconductor packages, heat sinks, heat blocks, or heat plates are coupled to the surface of the package, the surface of the die within the package, or both. Heat sinks, heat blocks, or heat plates are typically fabricated as a continuous layer of a thermally conductive material (e.g., copper). Such a continuous heat sink, heat block, or heat plate can also be fabricated as a discrete component that is subsequently coupled to the surface of the package, the surface of the die, or both. Alternatively, such a continuous heat sink can be grown on the surface of the package, the surface of the die, or both. However, because such heat sinks, heat blocks, or heat plates are fabricated as a continuous layer of conductive material, the thermomechanical stress generated when the package is exposed to temperature rises or falls is high, leading to the propagation of defects within the package, or increasing the likelihood of defect propagation within the package. When defects propagate within the package, the package is generally damaged, causing it to operate outside of selected tolerances, resulting in a defective package that needs to be replaced. Because the likelihood of these defects occurring within the package increases, the overall package lifetime is reduced, as the increased likelihood of defect occurrence only increases with more exposure of the package to temperature rises and falls that generate these high thermomechanical stresses. To alleviate these high thermomechanical stresses, heat sinks, heat dissipation blocks, or heat dissipation plates are made of continuous layers of conductive material, and these are manufactured to be as thin as possible. However, there are manufacturing limitations that restrict the thinness of heat sinks, heat dissipation blocks, or heat dissipation plates made of continuous layers of conductive material, meaning that reducing the thickness of these heat sinks, heat dissipation blocks, or heat dissipation plates can only alleviate the high thermomechanical stresses to a certain extent.

[0055] In light of the foregoing discussion, this disclosure relates to providing one or more embodiments of a package comprising a plurality of separate and distinct heat sinks, heat blocks, or heat plates, which are separated from and distinct from each other to further mitigate thermomechanical stresses that occur when the package is exposed to temperature rises or falls. For example, a plurality of separate and distinct heat sinks, heat blocks, or heat plates further mitigate the thermomechanical stresses generated by temperature rises or falls within the package. By providing a plurality of separate and distinct heat sinks, heat blocks, or heat plates to further mitigate these thermomechanical stresses, the likelihood of defects propagating within the package is prevented or further reduced. By providing a plurality of separate and distinct heat sinks, heat blocks, or heat plates to prevent or further reduce the likelihood of defects, the usable lifetime of the package is further increased, allowing the package to operate for a longer time within selected tolerances compared to packages comprising heat sinks, heat blocks, or heat plates made of continuous layers of conductive material.

[0056] Figure 1A It is a 100-inch package with an edge-like shape. Figure 1B The cross-sectional view taken by line 1A-1A shown in the figure. Figure 1B Is it like this? Figure 1AThe top plan view of the package 100 shown.

[0057] Package 100 includes a die 102, which includes a first surface 104, a second surface 106 opposite to the first surface 104, and one or more sidewalls 108 transverse to the first surface 104 and the second surface 106. The one or more sidewalls 108 extend from the first surface 104 to the second surface 106.

[0058] An insulating, non-conductive, or dielectric layer 110 is present on the second surface 106 of the die 102. The dielectric layer 110 may be ABF (Alternating Aspect Ratio). One or more conductive vias 112 extend through the dielectric layer 110. The one or more conductive vias 112 extend through the dielectric layer 110 to the second surface 106 of the die 102. The one or more conductive vias 112 are coupled along the second surface 106 of the die 102 to contact pads (not shown) of the die 102 at the second surface 106. The dielectric layer 110 includes one or more sidewalls 114 that are coplanar with one or more sidewalls 108 of the die 102 within the package 100.

[0059] Resin 116 extends around die 102 and dielectric layer 110. Resin 116 is a non-conductive material, such as a molding compound, epoxy compound, or some other similar or analogous type of non-conductive material. Resin 116 covers one or more sidewalls 108 of die 102 and one or more sidewalls 114 of dielectric layer 110. Resin 116 includes a third surface 118, a fourth surface 120 opposite to the third surface 118, and one or more sidewalls 122 transverse to the third surface 118 and the fourth surface 120. The one or more sidewalls 122 of resin 116 extend from the third surface 118 to the fourth surface 120. The third surface 118 of resin 116 is coplanar with the first surface 104 of die 102, and the fourth surface 120 is coplanar with the surface 124 of dielectric layer 110.

[0060] One or more insulating, non-conductive, or dielectric layers 126 are present on the fourth surface 120 of the resin 116 and on the surface 124 of the dielectric layer 110. Although the one or more insulating, non-conductive, or dielectric layers 126 are as follows... Figure 1A The layer shown is a single layer, but it can be multiple insulating, non-conductive, or dielectric layers stacked on top of each other. One or more dielectric layers 126 have a fifth surface 128 facing away from the bare die 102. One or more dielectric layers 126 include one or more sidewalls 129 that are coplanar with one or more sidewalls 122 of the resin 116.

[0061] One or more conductive connection structures 130 extend through one or more dielectric layers 126 to dielectric layer 110. Each of the one or more conductive connection structures 130 includes a conductive trace 130a and a conductive contact or junction 130b coupled to the corresponding conductive trace 130a. Each corresponding conductive trace in the one or more conductive traces 130a is coupled to a corresponding conductive via in one or more conductive vias 112. The one or more conductive connection structures 130, together with the one or more conductive vias 112, provide pathways for electrical signals to enter and exit the package 100 and to enter and exit the die 102 within the package 100. For example, the package 100 can be mounted to an external electrical component (e.g., a printed circuit board (PCB)) using one or more solder balls to interconnect one or more conductive contacts 130b of the one or more conductive connection structures 130 to the external electrical component.

[0062] A heat sink, heat sink block, or heat sink plate 131 is located on a first surface 104 of the bare slab 102 and on a third surface 118 of the resin 116. The heat sink, heat sink block, or heat sink plate 131 is made of a continuous layer of a thermally conductive material, which may be, for example, copper or some other suitable type of thermally conductive material. The heat sink 130 includes one or more sidewalls 132 that are inwardly separated from one or more sidewalls 122 of the resin 116. The heat sink 130 includes a sixth surface 134 facing away from the bare slab 102. The sixth surface 134 is transverse to the one or more sidewalls 132 of the heat sink 130, and the one or more sidewalls 132 of the heat sink 130 extend from the sixth surface 134 to the third surface 118 of the resin 116. It may be... Figure 1B The heat sink 130 is more easily seen in the middle, with one or more sidewalls 132 separated inward from one or more sidewalls 122 of the resin 116.

[0063] like Figure 1B As shown, when viewed in a top plan view, package 100 has a rectangular outline. Figure 1B As shown, when viewed in a top plan view, the radiator 130 has a rectangular outline.

[0064] Because the heat sink 130 is a continuous layer of a thermally conductive material (e.g., copper), the high thermomechanical stress generated when the package 100 is exposed to temperature rises or falls causes defects (e.g., delamination, cracks, or other similar types of defects) to propagate within the package 100 or increases the likelihood of defect propagation within the package 100. When defects propagate within the package 100, the package 100 is generally damaged, causing it to operate outside the selected tolerances, resulting in a defective package 100 that needs to be replaced, disposed of, or discarded. Because the likelihood of these defects occurring within the package 100 increases, the overall lifespan of the package 100 is reduced, since the increased likelihood of defects occurring only increases with more exposure of the package 100 to temperature rises and falls that generate these high thermomechanical stresses over its usable lifespan. To mitigate these high thermomechanical stresses, the heat sink 130, made of a continuous layer of thermally conductive material, is manufactured to be as thin as possible. However, there are manufacturing limitations on the minimum thickness of the heat sink 130 made of a continuous layer of conductive material, which means that reducing the thickness of the heat sink 130 made of a continuous layer of conductive material can only alleviate the high thermomechanical stress to a certain extent.

[0065] Due to differences in the coefficient of thermal expansion (CTE) between the various layers and materials used to form package 100, defects may propagate further within package 100. For example, the CTE of heat sink 130 may be substantially different from the CTE of die 102 and dielectric layer 110. This difference in CTE between heat sink 130 and die 102, and between dielectric layer 110, may cause the interface 136 where dielectric layer 110 and die 102 contact each other to begin cracking and delamination. Such cracking within dielectric layer 110 at this interface 136, or delamination between dielectric layer 110 and die 102, may damage conductive vias 112 present within dielectric layer 110. When conductive vias 112 are damaged, the corresponding electrical signals traveling in and out of die 102 of package 100 may be inaccurate or unreliable.

[0066] Based on the above reference Figure 1A and Figure 1B In light of the discussion, this disclosure relates to providing embodiments of packages that further mitigate these thermomechanical stresses, thereby further preventing or reducing the likelihood of defects propagating within embodiments of the packages disclosed herein, and thus increasing their usable lifetime.

[0067] Figure 2A This is an embodiment of the package 200 disclosed herein. Figure 2B The side view of the cross section taken by line 2A-2A in the figure. Figure 2B Is it like this? Figure 2AThe diagram shows a top plan view of an embodiment of package 200 of this disclosure. The same or similar features of package 200 as package 100 will be provided with the same or similar reference numerals. In view of... Figure 1A and Figure 1B The package 100 shown is as follows Figure 2A and 2B For the sake of simplicity and brevity, the discussion of these same or similar features between the embodiments of the package 200 shown in this disclosure is not reproduced here.

[0068] Unlike Figure 1A and Figure 1B The heat sink, heat block, or heat plate 131 of the package 100 shown is included in the package 200, which includes a heat sink, heat block, or heat plate structure 202 comprising a plurality of separate and distinct heat sinks, heat blocks, or heat plates 204. Each of the plurality of separate and distinct heat sinks 204 is separate and distinct from its adjacent separate and distinct heat sinks 204. The plurality of separate and distinct heat sinks 204 are separated from each other by a plurality of channels, grooves, or recesses 206 extending through the heat sink structure 202 to a first surface 104 of the bare die 102. The plurality of channels 206 includes a first set of channels 206a extending in a first direction and a second set of channels 206b extending in a second direction transverse to the first direction (which are described in this disclosure). Figure 2B (It can be seen more easily in the middle). The first set of channels 206a and the second set of channels 206b extend through each other and intersect each other.

[0069] like Figure 2B As shown, in this embodiment of package 100, the first set of channels 206a is transverse to the second set of channels 206b at an angle substantially equal to 90 degrees. In other words, in this embodiment of package 100, the first set of channels 206a is perpendicular to or orthogonal to the second set of channels 206b. Based on... Figure 2B The orientation of the package shown is such that the first set of channels 206a extends vertically while the second set of channels 206b extends horizontally.

[0070] In this embodiment of package 200, the plurality of channels 206 remain empty. In other words, air is present within the plurality of channels 206. However, in some alternative embodiments, the plurality of channels 206 may be filled with a thermally conductive material having a high elastic modulus (see this disclosure). Figure 7A and Figure 7B ).

[0071] like Figure 2BAs shown, each of the plurality of separate and different heat sinks 204 has a rectangular prism shape. In some embodiments, the plurality of separate and different heat sinks 204 have a cuboid shape.

[0072] like Figure 2A and Figure 2B As shown, the plurality of separate and different heat sinks 204 are substantially the same size and shape. In some embodiments, the size and shape of a particular heat sink among the plurality of separate and different heat sinks 204 may be different relative to the other heat sinks among the plurality of separate and different heat sinks 204 (see this disclosure). Figure 6 For example, providing multiple separate and different heat sinks 204 of different sizes and shapes along the first surface of the die 102 can more mitigate the propagation of defects in critical areas of the package 200 where the probability of defect propagation is generally relatively high, and can less mitigate the propagation of defects in non-critical areas of the package 200 where the probability of defect propagation is generally relatively low.

[0073] Each of the multiple channels 206 has a first dimension 208 (e.g., the width of the channel) extending between opposing sidewalls of the sidewalls 210 of adjacent heat sinks in a plurality of separate and distinct heat sinks 204. The first dimension 208 ranges from 10 to 350 micrometers (μm) and may be equal to the upper and lower ends of this range. The first dimension 208 is selected based on the conditions and environment in which the package 200 will be located to balance the reduction of thermomechanical stress while providing effective heat dissipation. The reduction of thermomechanical stress, along with the heat dissipation efficiency of the package 200, increases the usable lifetime of the package 200, depending on the environment in which the package 200 will be located, such that the lifetime of the package 200 in that environment is greater than the usable lifetime of the package 100 in the same environment. When the package 200 is installed or used in an electronic device (e.g., a computer, smartphone, tablet, or some other similar or suitable type of electronic device), the first dimension 208 may also be adjusted based on the amount of space available for the package 200.

[0074] Each of the multiple separate and distinct heat sinks 204 has a second dimension (e.g., thickness) 212 extending from a first surface 104 of the die 102 to an end surface 214 of the multiple separate and distinct heat sinks 204. Each of the multiple separate and distinct heat sinks 204 extends away from the first surface 104 of the die 102 and terminates at a corresponding end surface of the end surface 214 of the multiple separate and distinct heat sinks 204. The second dimension 212 ranges from 20 to 200 micrometers (μm) and may be equal to the upper and lower ends of this range. Similar to the first dimension 208, the second dimension 212 is selected based on the conditions and environment in which the package 200 will be located to balance the reduction of thermomechanical stress while providing effective heat dissipation. The reduction of thermomechanical stress, along with the heat dissipation efficiency of the package 200, increases the usable lifetime of the package 200 depending on the environment in which the package 200 will be located, such that the lifetime of the package 200 in that environment is greater than the usable lifetime of the package 100 in the same environment. When installed or used within an electronic device (such as a computer, smartphone, tablet, or some other similar or suitable type of electronic device), the second dimension 212 can also be adjusted based on the amount of space available for the package 200.

[0075] The respective heat sinks in the multiple separate and distinct heat sinks 204 have a third dimension (e.g., the width of the heat sink) 216 extending between the opposing sidewalls of the heat sinks. The third dimension 216 ranges from 20 to 4000 micrometers (μm) and may be equal to the upper and lower ends of this range. Similar to the first dimension 208 and the second dimension 212, the third dimension 216 is selected based on the conditions and environment in which the package 200 will be located to balance the reduction of thermomechanical stress while providing effective heat dissipation. The reduction of thermomechanical stress, which, depending on the environment in which the package 200 will be located, together with the heat dissipation efficiency of the package 200, increases the usable lifetime of the package 200, making the lifetime of the package 200 in that environment greater than that of the package 100 in the same environment. When installed or used within an electronic device (e.g., a computer, smartphone, tablet, or some other similar or suitable type of electronic device), the third dimension 216 may also be adjusted based on the amount of space available for the package 200.

[0076] Although the multiple separate and distinct heat sinks 204 of package 200 may be similar in thickness (e.g., second dimension 212) to the heat sink 130 of package 100, the first dimension 208 and the third dimension 216 can be adjusted and selected to prevent or further reduce the likelihood of defects propagating within package 200. For example, while the thickness of the heat sink 130 of package 100 may simply be made as thin as the multiple separate and distinct heat sinks 204, the multiple separate and distinct heat sinks 204 can be further adjusted in size and shape, thus providing more control and consistency in preventing or further reducing the likelihood of defects propagating within package 200 compared to package 100 when exposed to cyclical temperature rises and falls. In other words, the adjustability of the multiple separate and distinct heat sinks 204 of package 200 is greater than that of the heat sink 130 of package 100, resulting in a much lower likelihood of defects propagating within package 200 compared to package 100 when exposed to cyclical temperature rises and falls.

[0077] Multiple separate and distinct heat sinks are generally more efficient at dissipating heat from the package in a controlled manner because, relative to heat sink 130, multiple separate and distinct heat sinks 204 have a greater amount of exposed surface area (i.e., the end surfaces 214 and sidewalls 210 of the respective heat sinks in the multiple separate and distinct heat sinks 204). In other words, the total exposed surface area when using multiple separate and distinct heat sinks 204 is generally greater than the total exposed surface area of ​​heat sink 130. Although the total exposed surface area of ​​the multiple separate and distinct heat sinks 204 is larger, the total volume or area occupied by the multiple separate and distinct heat sinks 204 is generally equal to or less than the total volume or area occupied by heat sink 130.

[0078] Although the thicknesses of multiple separate and different heat sinks 204 and 130 may be similar, the adjustability of the size and shape of the multiple separate and different heat sinks 204 provides better control and better heat dissipation relative to package 100 in preventing or reducing the possibility of defects propagating within package 200 when exposed to cyclical temperature rises and falls.

[0079] By using multiple separate and distinct heat sinks 204 instead of a heat sink 130 made of a continuous layer of thermally conductive material, defects that would further propagate within the package 100 due to differences in the coefficient of thermal expansion (CTE) between the various layers and materials used to form the package 100 are mitigated. For example, while the multiple separate and distinct heat sinks 204 and 130 may have the same CTE, which differs from the CTE of the die 102 and dielectric layer 110, the multiple separate and distinct heat sinks 204, each smaller in size than the heat sink 130, more uniformly interfere with any differences in expansion and contraction between the multiple separate and distinct heat sinks 204, the die 102, and the dielectric layer 110 compared to when the heat sink 130 is used instead. This more uniform distribution of expansion and contraction caused by the individual separate and distinct heat sinks 204 prevents or reduces the likelihood of cracking or delamination at the interface 136. This prevention or reduction of the possibility of defect propagation at interface 136 increases the usable lifetime of package 200, making package 200 have a longer usable lifetime than package 100.

[0080] Figure 3 A top plan view relating to an alternative embodiment of the package 300 of this disclosure. In this embodiment, each of a plurality of separate and distinct heat sinks 302 has a cylindrical shape. Each respective heat sink of the plurality of separate and distinct heat sinks 302 is separated from other respective heat sinks of the plurality of separate and distinct heat sinks 302 by a channel 303. Each of the plurality of separate and distinct heat sinks 302 includes a sidewall 305, the outline of which is as shown in the figure. Figure 3 The image shown is a circle.

[0081] Figure 4 A top plan view relating to an alternative embodiment of the package 304 of this disclosure. In this embodiment, each of a plurality of separate and distinct heat sinks 306 has a rhomboid prism shape. Each corresponding heat sink in the plurality of separate and distinct heat sinks 306 is separated from other corresponding heat sinks in the plurality of separate and distinct heat sinks 302 by a plurality of channels 307. The plurality of channels 307 includes a first set of channels 307a and a second set of channels 307b, which are transverse to each other and intersect each other. Based on as Figure 4 As shown in the orientation, the first set of channels 307a and the second set of channels 307b extend in a diagonal direction. Each of the plurality of separate and distinct heat sinks 306 includes a plurality of sidewalls 309.

[0082] Figure 5A top plan view relating to an alternative embodiment of the package 308 of this disclosure. In this embodiment, each of the plurality of separate and distinct heat sinks 310 has a rhomboid prism shape and is coupled to as disclosed herein. Figure 4 The orientation is slightly different as shown. Each of the multiple separate and different radiators 310 is separated from the other multiple separate and different radiators 310 by channels 311.

[0083] Figure 6 A top plan view relating to an alternative embodiment of the package 312 of this disclosure. In this embodiment, a plurality of separate and distinct heat sinks 314 include a first set of heat sinks 314a and a second set of heat sinks 314b. The first set of heat sinks 314a has a cylindrical shape and the second set of heat sinks 314b has a rectangular prism shape. Each respective heat sink in the plurality of separate and distinct heat sinks 314 is separated from other respective heat sinks in the plurality of separate and distinct heat sinks 314 by a channel 315. Each heat sink in the first set of heat sinks 314a includes a sidewall 317, and each heat sink in the second set of heat sinks 314b includes a plurality of sidewalls 319.

[0084] like Figure 2A , Figure 2B , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the respective heat sinks of a plurality of separate and distinct heat sinks 204, 302, 306, 310, 314 are arranged in an array along the first surface 104 of the bare die 102. In view of the various embodiments of packages 200, 300, 304, 308, 312 of this disclosure, the orientation and positioning of the respective heat sinks of the plurality of separate and distinct heat sinks 204, 302, 306, 310, 314 can be further adjusted or selected to further prevent or mitigate the propagation of defects within the various embodiments of packages 200, 300, 304, 308, 312 of this disclosure, while providing sufficient heat dissipation.

[0085] Figure 7A Alternative embodiments relating to package 400 are as follows Figure 7B The cross section taken from line 7A-7A in the diagram. Figure 7B Involving such as Figure 7A The top plan view of an alternative embodiment of the package 400 shown.

[0086] Package 400 includes a thermally conductive material 402 filling a plurality of channels 206. Compared to packages 100 and 200, respectively, the same or similar features of package 400 will be provided with the same or similar reference numerals. Specifically, considering as... Figure 1A, Figure 1B , Figure 2A and Figure 2B Packages 100 and 200 shown in the figures are as follows: Figure 7A and Figure 7B For the sake of simplicity and brevity, the discussion of these same or similar features between the embodiments of the package 400 shown in this disclosure is not reproduced here.

[0087] like Figure 7A As shown, a thermally conductive material 402 is present within and partially or completely fills the multiple channels 206. The thermally conductive material 402 can be a thermally conductive soft material (i.e., having a high elastic modulus) to further promote heat dissipation while having minimal or no effect on the generation of thermomechanical stresses present within the package 400 when exposed to periodic increases and decreases in temperature. The thermally conductive material 402 covers the sidewalls 210 of multiple separate and distinct heat sinks 204. In this embodiment of the package 400, the thermally conductive material 402 completely fills the multiple channels 206 such that the thermally conductive material has a surface 404 coplanar with the end surfaces 214 of the multiple separate and distinct heat sinks 204. In this embodiment of the package 400, the thermally conductive material 402 includes one or more end sidewalls 406 coplanar with the sidewalls 210 of the respective heat sinks in the peripheral region or edge of the heat sink structure 202 of the multiple separate and distinct heat sinks 204. In other words, in this embodiment of the package 400, as... Figure 7B As shown, the heat-conducting material 402 is not present on the third surface 118 of the resin 116. One or more end sidewalls 406 of the heat-conducting material 402 are inwardly separated from one or more sidewalls 122 of the resin 116.

[0088] Figure 8A This is an alternative embodiment of the package 500 disclosed herein. Figure 8B The cross-sectional view shown is taken from line 8A-8A. Figure 8B A top plan view relating to an alternative embodiment of package 500. Package 500 is generally the same as package 400, except that thermally conductive material 402 is present on a third surface of resin 116 and that thermally conductive material 402 covers the sidewalls 210 of the respective heat sinks in the peripheral region or edge of the heat sink structure 202 of a plurality of separate and different heat sinks 204. In this embodiment of package 500, thermally conductive material 402 includes one or more sidewalls 502 coplanar with the sidewalls 122 of resin 116.

[0089] The thermally conductive material 402 may have an elastic modulus in the range of 0.1 to 5000 MPa (e.g., megapascals), and may be equal to the upper and lower ends of this range. For example, the thermally conductive material 402 may be silicone, epoxy, paste, or some other similar or suitable type of material that is soft and elastic, making it easily deformable under compression or tension. Depending on the application or environment in which the final encapsulation may be used, these various materials may be more or less elastic.

[0090] Figure 9A This is a top plan view of stress diagram 600 at interface 136 of package 100 when package 100 does not include heat sink 130. As described earlier herein, interface 136 is the location where die 102 (e.g., silicon die) and dielectric layer (e.g., ABF layer or film) come into contact with each other. Stress diagram 600 represents the thermomechanical stress generated at the interface when cooled from a first temperature to a second temperature. The first temperature is greater than the second temperature such that, for example, the first temperature is the maximum temperature at which package 100 is used and the second temperature is room temperature (e.g., in some instances, room temperature may be in the range of 15 to 25 degrees Celsius or equal to the upper and lower ends of this range). As shown in stress diagram 600, there are high-stress regions 602 and low-stress regions 604. As shown in stress diagram 600, the low-stress region 604 is larger than the low-stress region 605, making the likelihood of defect propagation due to thermomechanical stress low. However, when package 100 does not include heat sink 130, package 100 cannot dissipate heat energy easily and quickly, which means that the components inside package 100 may deteriorate faster over time because package 100 without heat sink 130 cools from the first temperature to the second temperature slowly.

[0091] Figure 9BThis is a top plan view of stress diagram 606 at interface 136 of package 100 when package 100 includes heat sink 130. As described earlier herein, interface 136 is the location where die 102 (e.g., silicon die) and dielectric layer (e.g., ABF layer or film) come into contact with each other. Stress diagram 606 represents the thermomechanical stress generated at the interface as it cools from a first temperature to a second temperature. The first temperature is greater than the second temperature. For example, in some instances, the first temperature is the maximum temperature at which package 100 is used, and the second temperature is room temperature (e.g., in some instances, room temperature may be in the range of 15 to 25 degrees Celsius or equal to the upper and lower ends of this range). As shown in stress diagram 606, there are high-stress regions 608 and low-stress regions 610. High-stress region 602 in stress diagram 600 is much smaller than high-stress region 608 in stress diagram 606, and low-stress region 604 in stress diagram 600 is much larger than low-stress region 610 in stress diagram 606. Therefore, while the presence of a heat sink 130 that completely covers the first surface 104 of the die 102 provides good heat dissipation, the large high-stress region 608 (which runs along most of the interface 136) presents a high probability of defects (e.g., cracking, delamination, shearing, etc.) occurring at the interface 136. When the heat sink 130 is present on the first surface 130 of the die 102, the thermomechanical stress occurring at the interface 136 increases by 16% compared to when the package 100 does not include the heat sink 130. However, as stated above, the heat sink 130 allows the package to dissipate heat more quickly and efficiently than when the heat sink is absent.

[0092] Figure 9CThis is a top plan view of stress diagram 612 for a package 200 comprising multiple separate and distinct heat sinks 204. As described earlier herein, interface 136 is the location where the die 102 (e.g., a silicon die) and the dielectric layer (e.g., an ABF layer or film) come into contact with each other. Stress diagram 612 represents the thermomechanical stress generated at the interface when cooled from a first temperature to a second temperature. The first temperature is greater than the second temperature. For example, in some instances, the first temperature is the maximum temperature at which the package 100 is used, and the second temperature is room temperature (e.g., in some instances, room temperature may be in the range of 15 to 25 degrees Celsius or equal to the upper and lower ends of this range). As shown in stress diagram 612, there are high-stress regions 614 and low-stress regions 616, and both high-stress regions 614 and low-stress regions 616 are uniformly distributed across and along interface 136 within the package 200. The high-stress region 614 in stress diagram 612 is smaller than the high-stress region 608 in stress diagram 606 and larger than the high-stress region 602 in stress diagram 600, and the low-stress region 616 in stress diagram 612 is larger than the low-stress region 610 in stress diagram 606 and smaller than the low-stress region 604 in stress diagram 600. When multiple separate and different heat sinks 204 are present on the first surface 104 of die 102, the thermomechanical stress occurring at interface 136 decreases by 6.5% compared to when package 100 includes heat sink 130. Therefore, the multiple separate and different heat sinks 204 present on the first surface 104 of die 102 of package 200 maintain good heat dissipation, allowing the package to cool relatively quickly from a first temperature to a second temperature, while preventing or reducing the possibility of defects propagating along interface 136. The possibility of defects propagating along interface 136 is prevented or reduced because high-stress region 614 and low-stress region 616 are uniformly distributed across the interface, with high-stress region 614 being smaller than high-stress region 608 and low-stress region 616 being larger than low-stress region 610. In view of this, package 200 with multiple separate and distinct heat sinks 204 not only provides the same or similar good heat dissipation as package 100 with heat sink 130, but also prevents or reduces thermomechanical stress at interface 136 compared to package 100 with heat sink 130. This further prevention or reduction of thermomechanical stress at interface 136, along with good heat dissipation, results in a longer service life for package 200 with multiple separate and distinct heat sinks 204 than for package 100 with heat sink 130.

[0093] Figure 10 Is it manufactured as disclosed herein? Figure 2A and Figure 2BThe flowchart 700 shows a method for an embodiment of the encapsulation shown. The flowchart 700 of the manufacturing method includes a first step 702, a second step 704, a third step 706, and a fourth step 708. Figures 11A-11E This is a cross-sectional view of the corresponding step in flowchart 700, which will be discussed in detail in this paper along with the corresponding step in flowchart 700.

[0094] like Figure 11E As shown, an assembly 710 has been fabricated, comprising one or more dielectric layers 126, one or more conductive interconnect structures 130, a dielectric layer 110, conductive vias 112, and resin 116. In other words, the assembly 710 is a partially fabricated version of the package 200, which has undergone processing and techniques within the semiconductor industry to form the assembly 710.

[0095] In such Figure 11B In the first step shown, a temporary layer 712 is formed on the first surface 104 of the die 102 and the third surface 118 of the resin 116. In some embodiments, the temporary layer 712 may be a single layer, such that the temporary layer 712 is a mask layer or photoresist layer that can be patterned or etched. In some alternative embodiments, the temporary layer 712 may be one or more stacked layers, such that the temporary layer is one or more mask layers or photoresist layers that can be patterned or etched.

[0096] Following the first step 702 of forming a temporary layer 712 on the first surface 104 of the die 102 and the third surface 118 of the resin 116, in the second step 704, the temporary layer 712 is etched (e.g., chemically etched) or patterned (e.g., exposed to light, drilled, cut, etc.) to form one or more openings 714 within the temporary layer 712 that expose the area or area of ​​the first surface 104 of the die 102. The one or more openings 714 may be formed as rectangular, circular, diamond-shaped, or some other size or shape to form a heat sink having that corresponding size and shape.

[0097] Following the second step 704, in which one or more openings 714 are formed in the temporary layer 712, in the third step 706, a thermally conductive material is formed by deposition into the one or more openings 714. The thermally conductive material may be copper or some other suitable thermally conductive material. After the thermally conductive material is formed by deposition into the one or more openings 714, the thermally conductive material is allowed to cure, thereby forming multiple separate and distinct heat sinks 204.

[0098] Following the third step 706, after multiple separate and distinct heat sinks 204 are formed on the first surface 104 of the die 102, in the fourth step 708, any remaining portion of the temporary layer 712 is removed. For example, the temporary layer 712 may be made of a material that degrades and dissolves when exposed to a fluid such as water, or it may be made of a material that degrades and dissolves when exposed to light. Once the remaining portion of the temporary layer 712 is removed, region 716 of the first surface 104 of the die 102 is exposed and the third surface 118 of the resin 116 is exposed. Removing these remaining portions of the temporary layer 712 defines multiple channels 206 between the multiple separate and distinct heat sinks 204. In other words, the package 200 has been manufactured after the fourth step 708.

[0099] Figure 12 This is a flowchart 718 of a method for manufacturing multiple heat sinks, heat blocks, or heat plates 204, along with forming a thermally conductive material 402 having a high elastic modulus, as an alternative embodiment of package 400. Flowchart 718 includes first step 702, second step 704, third step 706, and fourth step 708. Since first step 702, second step 704, third step 706, and fourth step 708 have been referenced above... Figure 10 and Figures 11A-11E Detailed descriptions are required, so the discussions of steps 702, 704, 706, and 708 are not reproduced here. Flowchart 718 also includes steps 720, 722, and 724.

[0100] In the fifth step 720, another temporary layer 726 is formed on the third surface 118 of the resin 116. In some embodiments, depending on whether a respective heat sink in the peripheral region of the heat sink structure 202 is inwardly separated from one or more sidewalls 108 of the bare plate 102, this other temporary layer 726 may be partially formed on the first surface 104 of the bare plate 102. Figure 13AAs shown, another temporary layer 726 covers the third surface 118 of the resin 116. In some embodiments, although not shown, one or more additional temporary layers (not shown) may be formed on and along the multiple separate and different heat sinks 204 and in the multiple channels 206 to avoid forming the other temporary layer 726 on and along the multiple separate and different heat sinks 204 and in the multiple channels 206. After being formed, the one or more additional temporary layers (not shown) may be patterned with openings to expose the area where the other temporary layer 726 is to be formed. Once the one or more additional temporary layers (not shown) are patterned, the other temporary layer 726 is formed at the exposed areas exposed by the openings in the one or more additional temporary layers. Once the other temporary layer 726 is formed at the exposed areas, the one or more additional temporary layers (not shown) are removed, thereby exposing the multiple separate and different heat sinks 204 and the multiple channels 206, such that the formation of the other temporary layer 726 is achieved. Figure 13A The remaining structure is shown. One or more additional temporary layers may be soluble materials that deteriorate or dissolve when exposed to liquids or gases, or that can deteriorate and dissolve when exposed to a light source.

[0101] In the formation of such Figure 13A Following the fifth step 720 of the other temporary layer 726 shown, in the sixth step 722, the plurality of channels 206 are filled with a thermally conductive material 402 having a high elastic modulus. The thermally conductive material 402 having a high elastic modulus is soft and elastically deformable. In some embodiments, although not shown, one or more additional temporary layers (not shown) are formed on the plurality of separate and different heat sinks, on the other temporary layer 726, and in the plurality of channels 206. Once the one or more additional temporary layers (not shown) are formed, the one or more additional temporary layers (not shown) are patterned with openings to expose the region 716 of the plurality of channels 206 and the first surface of the bare die 102. After the one or more additional temporary layers (not shown) are patterned, the thermally conductive material 402 is formed in the region 716 and the plurality of channels 206 exposed by the openings in the one or more additional temporary layers (not shown). Once the thermally conductive material 402 is formed in the plurality of channels 206 and on the region 716, the one or more additional temporary layers (not shown) are removed, thereby obtaining as shown. Figure 13B The remaining structure is shown. The one or more additional temporary layers may be soluble materials that deteriorate or dissolve when exposed to liquids or gases, or that can deteriorate and dissolve when exposed to a light source. Once the thermally conductive material 402 is formed in the plurality of channels 206 and regions 716, one or more sidewalls 210 of the plurality of separate and distinct heat sinks 204 are covered with the thermally conductive material 402.

[0102] Following the sixth step 722, in which the thermally conductive material 402 is formed within the multiple channels 206 and in the region 716, in the seventh step 724, another temporary layer 726 is removed. This other temporary layer 726 may be a material that is soluble when exposed to a liquid or gas, or that deteriorates and dissolves when exposed to a light source. Once the other temporary layer 726 is removed, a material as described above is produced. Figure 13C The remaining structure is shown. In other words, package 400 has already been manufactured after step 724.

[0103] Encapsulation 500 can be formed by not forming another temporary layer 726 in step 720, and instead simply by proceeding to step 724. By not performing step 722, the third surface 118 of resin 116 remains exposed, thereby forming a thermally conductive material 402 on the third surface 118 of resin 116 to manufacture encapsulation 500.

[0104] Figure 14 Is it manufactured as disclosed herein? Figure 2A and Figure 2B The flowchart 800 shows an alternative method for manufacturing an embodiment of the package 200 of this disclosure. The flowchart 800 of the alternative method for manufacturing an embodiment of the package 200 includes a first step 802, a second step 804, a third step 806, a fourth step 808, a fifth step 810, a sixth step 812, a seventh step 814, an eighth step 816, a ninth step 818, and a tenth step 820. Figures 15A-15E This is a cross-sectional view of the corresponding step in flowchart 800, which will be discussed in detail in this paper along with the corresponding step in flowchart 800.

[0105] In the first step 802, a temporary layer 822 is formed on the first surface 104 of the die 102. Following the formation of the temporary layer 822 on the first surface of the die 102 in the first step 802, in the second step 804, the temporary layer 822 is patterned with one or more openings 824. The openings 824 can be formed within the temporary layer 822 by drilling, etching (chemical etching, water etching, photoresist etching, etc.), or some other suitable type of technique for forming one or more openings 824 in the temporary layer 822. After the formation of one or more openings 824 in the temporary layer 822, in the third step 806, a thermally conductive material is deposited into the one or more openings 824. The thermally conductive material is then allowed to cure and harden, thereby forming multiple separate and distinct heat sinks 204 within the one or more openings 824 patterned within the temporary layer 822. This can be easily achieved by... Figure 15A The cross-sectional view of the structure shown reveals the results of the first step 802, the second step 804, and the third step 806.

[0106] After the third step 806, in the fourth step 808, multiple separate and different heat sinks 204 are formed in one or more openings 824 patterned within a temporary layer 822, and then flipped as follows: Figure 15A The structure shown allows the temporary layer 822 and the end surfaces 214 of the multiple separate and distinct heat sinks 204 to be temporarily coupled to the support 826. For example, the support 826 can be tape, a dummy wafer, or some other suitable type of support 826 to which the end surfaces 214 of the multiple separate and distinct heat sinks 204 and the temporary layer 822 can be temporarily coupled by an adhesive. Figure 15B The cross-sectional view of the structure shown reveals the result of step 808.

[0107] After the fourth step 808, in which the end surfaces 214 of multiple separate and distinct heat sinks 204 and the temporary layer 822 are temporarily coupled to the support 826, in the fifth step 810, a dielectric layer 110, which may be an ABF layer or a film, is formed on the second surface 106 of the die 102. After the fifth step 810, in the sixth step 812, one or more openings 824 are patterned within the dielectric layer 110. After the dielectric layer 110 is patterned with one or more openings, a conductive material is formed within the one or more openings 824 and allowed to cure, thereby forming conductive vias 112 within the dielectric layer 110. This can be easily achieved in... Figure 15C The cross-sectional view of the structure shown reveals the results of steps 810 and 812 in steps 5 and 6.

[0108] After the sixth step 812, in which a dielectric layer 110 is formed on the second surface 106 of the die 102 and a conductive via 112 is formed extending through the dielectric layer 110 to the second surface 106 of the die 102, in the seventh step 814, resin 116 is formed on one or more sidewalls 108 of the die 102 and on one or more sidewalls 114 of the dielectric layer 110. In this embodiment of the method of manufacturing package 200 having flowchart 800, prior to the formation of resin 116, an additional temporary layer 828 is formed on the surface 830 of the support 826 and on one or more sidewalls 832 of the temporary layer (see...). Figure 15D The formation of this additional temporary layer 828 prevents the resin 116 from extending beyond the first surface 104 of the bare die 102. In some alternative embodiments of the method of manufacturing the package 200, this additional temporary layer 828 may not be formed, such that, similar to that disclosed herein, Figure 2A and Figure 2B In an alternative embodiment of the manufacturing version of the package of the embodiment of the package 200 shown, the resin 116 extends beyond the first surface 104 of the bare die 102.

[0109] Following step 814, after forming resin 116 on one or more sidewalls 108 of the bare die 102 and one or more sidewalls 114 of the dielectric layer 110, in step 8, one or more dielectric layers 126 are formed on the third surface 118 of the resin 116 and the surface 124 of the dielectric layer 110. Along with forming the one or more dielectric layers 126, one or more conductive connection structures 130 are formed along the one or more dielectric layers 126. For example, a first dielectric layer of the one or more dielectric layers 126 is formed on the surface 124 of the dielectric layer 110 and the third surface 118 of the resin 116. The first dielectric layer is then patterned with first openings, and then a conductive material is deposited to fill those first openings. The conductive material is then allowed to cure, forming traces 130a of the conductive connection structure 130. After the first dielectric layer in one or more dielectric layers 126 and the trace 130a of the conductive structure 130 have been formed, a second dielectric layer in one or more dielectric layers 126 is formed on the first dielectric layer in one or more dielectric layers 126 and on the trace 130a of the conductive connection structure 130. The second dielectric layer is then patterned with second openings exposing regions of the trace 130a of the conductive connection structure 130. A conductive material is then deposited and filled within the second openings. The conductive material within the second openings of the second dielectric layer in one or more dielectric layers 126 is then allowed to solidify to form a contact 130b of the conductive connection structure 130. Once the contact 130b is formed, the conductive connection element is formed. It can be easily achieved in, for example... Figure 15D The cross-sectional view of the structure shown reveals the results of steps 7 (814) and 8 (816).

[0110] After the eighth step 816, in the ninth step 818, the dielectric layer 126 and conductive connection structure 130 are formed from the support 826. Figure 15D The structure shown is as depicted. After being removed from support 826, as shown... Figure 15D Following the ninth step 818 of the structure shown, in the tenth step 820, any remaining amount of the additional temporary layer 828 and temporary layer 822 is removed from the third surface 118 of the resin 116 and the first surface 104 of the bare die 102, thereby exposing a plurality of channels 206 extending between the plurality of separate and distinct heat sinks 204. The temporary layer 822 and the additional temporary layer 828 may be soluble materials that deteriorate or dissolve when exposed to liquids or gases, or that can deteriorate and dissolve when exposed to a light source. In other words, after the tenth step 820, the package 200 has been as disclosed herein. Figure 15E The one shown is manufactured.

[0111] As discussed herein, one or more embodiments of packages 200, 300, 304, 308, 312, 400, 500, comprising multiple separate and distinct heat sinks, heat blocks, or heat plates 204, further mitigate the thermomechanical stresses that occur when packages 200, 300, 304, 308, 312, 400, 500 are exposed to rising or falling temperatures, compared to package 100 having a heat sink, heat block, or heat plate 131. For example, multiple separate and distinct heat sinks, heat blocks, or heat plates 204 further mitigate the thermomechanical stresses generated by rising or falling temperatures in packages 200, 300, 304, 308, 312, 400, 500 by having multiple separate and distinct heat sinks, heat blocks, or heat plates 204. This is because, due to the more uniform distribution of these thermomechanical stresses across interface 136, these separate and distinct heat sinks, heat blocks, or heat plates 204 prevent or further reduce the likelihood of defects propagating within packages 200, 300, 304, 308, 312, 400, and 500. By providing multiple separate and distinct heat sinks, heat blocks, or heat plates 204 to prevent or further reduce defects, the usable lifespan of packages 200, 300, 304, 308, 312, 400, and 500 is further increased, allowing packages 200, 300, 304, 308, 312, 400, and 500 to operate for longer periods within selected tolerances compared to package 100, which includes a heat sink, heat block, or heat plate 131 made of a continuous layer of conductive material. Multiple separate and different heat sinks 204 also provide similar heat dissipation efficiency as heat sinks, heat blocks or heat plates 131, and the heat dissipation efficiency can be further improved by providing a heat-conducting material 402 with a high elastic modulus in multiple channels 206.

[0112] Various embodiments of multiple separate and different heat sinks, heat plates or heat blocks 204, 302, 306, 310, 314 can be used in various types of semiconductor packages, wherein heat dissipation improves functionality and increases the usable life of the corresponding semiconductor package.

[0113] At least one embodiment of the apparatus disclosed herein can be summarized as including: a die including a first surface, a second surface, and one or more sidewalls, the second surface opposite to the first surface, the one or more sidewalls being transverse to the first and second surfaces and extending from the first surface to the second surface; a resin covering the one or more sidewalls of the die and extending around the die; a first non-conductive layer on the second surface of the die; a plurality of conductive vias extending through the first non-conductive layer to the die; and a plurality of conductive connection structures coupled to the plurality of conductive vias and On a first non-conductive layer, the plurality of conductive connection structures include a plurality of end surfaces separated from the plurality of conductive vias; a second non-conductive layer extending on the first non-conductive layer and around the plurality of conductive connection structures, wherein the plurality of end surfaces of the plurality of conductive connection structures are exposed from the second non-conductive layer; a plurality of heat sinks on a first surface of a bare die, each respective heat sink being separate from and distinct from adjacent heat sinks; and a plurality of channels separating each respective heat sink from adjacent heat sinks.

[0114] The plurality of channels may include: a plurality of first channels extending in a first direction; and a plurality of second channels extending in a second direction transverse to the first direction.

[0115] The plurality of first channels may be perpendicular to the plurality of second channels; and each of the plurality of radiators may have a rectangular prism shape.

[0116] The plurality of first channels may be perpendicular to the plurality of second channels; and each of the plurality of radiators may have a cuboid shape.

[0117] The respective heat sinks among the plurality of heat sinks may have at least one of the following: cylindrical shape, rectangular prism shape, and rhomboid prism shape.

[0118] Each of the plurality of heat sinks may include: a heat sink end surface separated from a first surface of the fin; and a thickness extending from the first surface to the heat sink end surface, the thickness ranging from 20 to 200 micrometers (μm) or equal to the upper and lower ends of this range.

[0119] Each of the plurality of channels may have a distance extending between the sidewalls of adjacent radiators in the plurality of radiators, and the distance may range from 10 to 350 micrometers (μm) or the distance may be equal to the upper and lower ends of this range.

[0120] The respective heat sink in the plurality of heat sinks can be on the third surface of the resin.

[0121] The third surface of the resin can be coplanar with the first surface of the bare die.

[0122] The multiple heat sinks can be separated inward from one or more sidewalls of the resin.

[0123] At least one embodiment of this disclosure can be summarized as including: a die including a first surface, a second surface, and one or more sidewalls, the second surface opposite to the first surface, the one or more sidewalls being transverse to the first and second surfaces, the one or more sidewalls extending from the first surface to the second surface; a resin covering the one or more sidewalls of the die and extending the die; a first non-conductive layer on the second surface of the die; a plurality of conductive vias extending through the first non-conductive layer to the die; and a plurality of conductive connection structures coupled to the plurality of conductive vias and on the first non-conductive layer, the plurality of conductive connection structures encompassing... The device includes multiple end surfaces separated from multiple conductive vias; a second non-conductive layer extending on and around the multiple conductive connection structures on the first non-conductive layer, wherein the multiple end surfaces of the multiple conductive connection structures are exposed from the second non-conductive layer; multiple heat sinks on a first surface of the die, each of the multiple heat sinks being separate from and distinct from its adjacent counterparts; multiple channels separating each of the multiple heat sinks from its adjacent counterparts; and a thermally conductive material filling the multiple channels and on the surface of the die.

[0124] Thermally conductive materials can be elastic.

[0125] The thermally conductive material can have an elastic modulus in the range of 0.1 to 5000 MPa, or equal to the upper and lower ends of this range.

[0126] Thermally conductive materials can be configured to increase heat dissipation during operation.

[0127] Each of the plurality of heat sinks may include: a heat sink end surface separated from a first surface of the fin; and a thickness extending from the first surface to the heat sink end surface, the thickness ranging from 20 to 200 micrometers (μm) or equal to the upper and lower ends of this range.

[0128] The heat-conducting material filling the plurality of channels may have a heat-conducting surface that is coplanar with the heat sink end surfaces of the plurality of heat sinks.

[0129] At least one embodiment of the method disclosed herein can be summarized as including: forming a temporary layer covering a first surface of a bare die; removing a portion of the temporary layer to form a plurality of openings in the temporary layer that expose the first surface of the bare die; depositing a first thermally conductive material in the plurality of openings to form a plurality of separate and distinct heat sinks by at least partially filling the plurality of openings with the first thermally conductive material; and removing one or more remaining portions of the temporary layer to expose the sidewalls of the plurality of separate and distinct heat sinks and to expose a plurality of channels extending between adjacent heat sinks in the plurality of separate and distinct heat sinks.

[0130] The method also includes forming a second thermally conductive material within the plurality of channels and on a first surface of the die, the second thermally conductive material having an elasticity ranging from 0.1 to 5000 MPa or equal to the upper and lower ends of this range.

[0131] The method may further include: forming a first non-conductive layer on a second surface of the die opposite to the first surface; forming a plurality of conductive vias extending through the first non-conductive layer to the second surface of the die; forming a resin surrounding the die and covering the sidewalls of the die; forming a plurality of conductive connection structures on the first non-conductive layer and on the resin; and forming a second non-conductive layer extending around the plurality of conductive connection structures.

[0132] The respective heat sinks among the plurality of heat sinks may have at least one of the following: cylindrical shape, rectangular prism shape, and rhomboid prism shape.

[0133] The various embodiments described above can be combined to provide further embodiments. Various aspects of the embodiments can be modified, and concepts from various patents, applications, and publications can be employed where necessary to provide further embodiments.

[0134] These and other changes can be made to the embodiments based on the above detailed description. Generally,

[0135] In the following claims, the terminology used should not be construed as limiting the claims to [specific terms].

[0136] The specific embodiments disclosed in the specification and claims should be interpreted as encompassing all possible embodiments.

[0137] The embodiments that can be implemented, together with the full scope of the equivalents claimed by such claims. Therefore, the rights...

[0138] The claims are not limited by this disclosure.

Claims

1. An electronic device, characterized in that, include: A bare die, the bare die including a first surface, a second surface and one or more sidewalls, the second surface being opposite to the first surface, the one or more sidewalls being transverse to the first surface and the second surface, the one or more sidewalls extending from the first surface to the second surface; Resin, the resin covering one or more sidewalls of the bare sheet and extending around the bare sheet; A first non-conductive layer is provided on the second surface of the bare die; Multiple conductive vias extend through the first non-conductive layer to the bare die; Multiple conductive connection structures are coupled to multiple conductive vias and are located on a first non-conductive layer. The multiple conductive connection structures include multiple end surfaces that are separated from the multiple conductive vias. A second non-conductive layer extends over the first non-conductive layer and around the plurality of conductive connection structures, wherein the plurality of end surfaces of the plurality of conductive connection structures are exposed from the second non-conductive layer; Multiple heat sinks are located on the first surface of the bare fin, and each of the multiple heat sinks is separate from and different from its adjacent heat sinks. as well as Multiple channels separate each of the plurality of radiators from its adjacent radiator.

2. The electronic device according to claim 1, characterized in that, The plurality of channels includes: A plurality of first channels, the plurality of first channels extending in a first direction; and A plurality of second channels extend in a second direction, which is transverse to the first direction.

3. The electronic device according to claim 2, characterized in that: The plurality of first channels are perpendicular to the plurality of second channels; and Each of the plurality of radiators has a rectangular prism shape.

4. The electronic device according to claim 2, characterized in that: The plurality of first channels are perpendicular to the plurality of second channels; and Each of the plurality of radiators has a cuboid shape.

5. The electronic device according to claim 1, characterized in that, The respective heat sinks among the plurality of heat sinks have at least one of the following: cylindrical shape, rectangular prism shape, and rhomboid prism shape.

6. The electronic device according to claim 1, characterized in that, Each of the plurality of radiators includes: The heat sink end surface, which is separated from the first surface of the bare fin; and The thickness extending from the first surface to the end surface of the heat sink, the thickness ranging from 20 to 200 micrometers (μm) or the thickness being equal to the upper and lower ends of that range.

7. The electronic device according to claim 1, characterized in that, Each of the plurality of channels has a distance extending between the sidewalls of adjacent radiators in the plurality of radiators, and the distance ranges from 10 to 350 micrometers (μm) or the distance is equal to the upper and lower ends of that range.

8. The electronic device according to claim 1, characterized in that, The corresponding heat sink of the plurality of heat sinks is on the third surface of the resin.

9. The electronic device according to claim 8, characterized in that, The third surface of the resin is coplanar with the first surface of the bare die.

10. The electronic device according to claim 1, characterized in that, The plurality of heat sinks are inwardly separated from one or more sidewalls of the resin.

11. An electronic device, characterized in that, include: A bare die, the bare die including a first surface, a second surface and one or more sidewalls, the second surface being opposite to the first surface, the one or more sidewalls being transverse to the first surface and the second surface, the one or more sidewalls extending from the first surface to the second surface; Resin, the resin covering and extending the one or more sidewalls of the bare die; A first non-conductive layer is provided on the second surface of the bare die; Multiple conductive vias extend through the first non-conductive layer to the bare die; Multiple conductive connection structures are coupled to multiple conductive vias and are located on a first non-conductive layer. The multiple conductive connection structures include multiple end surfaces that are separated from the multiple conductive vias. A second non-conductive layer extends over the first non-conductive layer and around the plurality of conductive connection structures, wherein the plurality of end surfaces of the plurality of conductive connection structures are exposed from the second non-conductive layer; Multiple heat sinks are located on the first surface of the bare fin, and each of the multiple heat sinks is separate from and different from its adjacent heat sinks. Multiple channels, the multiple channels separating each respective heat sink from its adjacent heat sink; as well as A thermally conductive material that fills the plurality of channels and is present on the surface of the bare die.

12. The electronic device according to claim 11, characterized in that, The heat-conducting material is elastic.

13. The electronic device according to claim 12, characterized in that, The heat-conducting material has an elastic modulus in the range of 0.1 to 5000 MPa, or equal to the upper and lower ends of that range.

14. The electronic device according to claim 11, characterized in that, The heat-conducting material is configured to increase heat dissipation during operation.

15. The electronic device according to claim 11, characterized in that: Each of the plurality of radiators includes: The heat sink end surface, which is separated from the first surface of the bare fin; and The thickness extending from the first surface to the end surface of the heat sink, the thickness ranging from 20 to 200 micrometers (μm) or the thickness being equal to the upper and lower ends of that range.

16. The electronic device according to claim 15, characterized in that, The heat-conducting material filling the plurality of channels has a heat-conducting surface that is coplanar with the heat sink end surfaces of the plurality of heat sinks.

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