Package structure

Abstract

The utility model discloses a packaging structure, and the structure comprises a bottom plate; the chip is mounted on the bottom plate; the packaging layer is located on the bottom plate and wraps the chip; the pin component is exposed out of the packaging layer and is connected with the side part of the bottom plate; and the heat dissipation cover is fixed on the pin component, and the packaging layer is arranged in a cavity defined by the heat dissipation cover and the bottom plate. The pin component is in direct contact with the air environment, so that heat generated by the chip in a working state can be quickly dissipated through the pin component, and meanwhile, the heat dissipation cover is fixed on the pin component, so that the heat in the pin component can enter the heat dissipation cover, the heat dissipation cover can also play a role in heat dissipation, and the service life of the chip is prolonged. Therefore, the heat dissipation performance of the packaging structure is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging, and more particularly to a packaging structure. Background Technology

[0002] Leadframe packages such as DIP (Dual In-line Package), SOT (Small Outline Transistor), QFP (Quad Flat Package), SOP (Small Outline Package), and SON (Small Outline No-leads Package) are still widely used in consumer electronics, automotive, and medical fields due to their low cost, small size, and high reliability.

[0003] However, as chip functionality increases and power consumption rises, the heat generated during chip operation also increases.

[0004] Currently, the packaging structure can no longer meet the requirements for high heat dissipation. Utility Model Content

[0005] The problem solved by this embodiment of the invention is to provide a packaging structure that improves the heat dissipation performance of the packaging structure.

[0006] To address the aforementioned problems, this utility model provides a packaging structure, comprising: a base plate; a chip mounted on the base plate; a packaging layer located on the base plate and covering the chip; pin components exposed on the packaging layer and connected to the side of the base plate; and a heat sink fixed to the pin components, with the packaging layer placed within the cavity formed by the heat sink and the base plate.

[0007] Optionally, the packaging structure further includes: thermally conductive adhesive, located between the pin component and the heat sink, the thermally conductive adhesive being used to fix the heat sink; or, the packaging structure further includes: a fixing groove, located in the pin component, the bottom of the heat sink being embedded in the fixing groove, and the fixing groove being used to fix the heat sink.

[0008] Optionally, the thermally conductive adhesive is also filled between the heat sink and the encapsulation layer.

[0009] Optionally, the material of the thermally conductive adhesive includes one or more of thermally conductive silicone grease, thermally conductive gel, thermosetting polymer, thermally conductive pad, and thermally conductive phase change material.

[0010] Optionally, the pin component includes a connecting portion and an extension portion connected to the side of the connecting portion, the connecting portion being connected to the side of the base plate; the heat sink is fixed to the connecting portion.

[0011] Optionally, the width of the connecting portion is smaller than the width of the extension portion.

[0012] Optionally, the number of connecting portions between the extension portion and the base plate is one; or, the number of connecting portions between the extension portion and the base plate is multiple.

[0013] Optionally, when there are multiple connecting portions between the extension portion and the base plate, the distance between adjacent connecting portions is equal.

[0014] Optionally, the heat sink includes a heat sink top cover and a heat sink side cover connected to the edge of the heat sink top cover, the heat sink side cover being fixed to the pin component.

[0015] Optionally, the heat dissipation cover may be made of one or more of the following materials: copper, aluminum, gold, nickel, steel, stainless steel, graphite, graphene, and carbon nanotubes.

[0016] Optionally, the pin components are connected to both sides of the base plate in a first direction; the package structure further includes: functional pins, which are disposed on both sides of the base plate in a second direction, the functional pins being spaced apart from the base plate, and the first direction and the second direction being perpendicular to each other.

[0017] Optionally, the packaging structure further includes: a lead wire disposed above the base plate, one end of the lead wire being electrically connected to the chip, and the other end of the lead wire being electrically connected to the functional pin; the packaging layer also covers the lead wire and the electrical connection between the lead wire and the functional pin.

[0018] Optionally, the lead wire may be made of one or more of copper, gold, and aluminum.

[0019] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:

[0020] In the packaging structure provided by this embodiment, the chip is mounted on the substrate, the packaging layer is located on the substrate and covers the chip, the pins are exposed on the packaging layer and connected to the side of the substrate, the heat sink is fixed on the pins, and the packaging layer is placed in the cavity formed by the heat sink and the substrate. By providing pins exposed on the packaging layer and connected to the side of the substrate, the pins are in direct contact with the air environment, allowing the heat generated by the chip during operation to dissipate quickly through the pins. Simultaneously, the heat sink is fixed to the pins, allowing heat from the pins to enter the heat sink, which also serves a heat dissipation function, thereby improving the heat dissipation performance of the packaging structure. Attached Figure Description

[0021] Figures 1 to 3 This is a schematic diagram of the corresponding structure in the first embodiment of the packaging structure of this utility model. Detailed Implementation

[0022] As can be seen from the background technology, current packaging structures can no longer meet the requirements for high heat dissipation.

[0023] To address the aforementioned technical problems, this utility model provides a packaging structure, comprising: a base plate; a chip mounted on the base plate; a packaging layer located on the base plate and covering the chip; pin components exposed on the packaging layer and connected to the side of the base plate; and a heat sink fixed to the pin components, with the packaging layer placed within the cavity formed by the heat sink and the base plate.

[0024] In the packaging structure provided by this embodiment, the chip is mounted on the substrate, the packaging layer is located on the substrate and covers the chip, the pins are exposed on the packaging layer and connected to the side of the substrate, the heat sink is fixed on the pins, and the packaging layer is placed in the cavity formed by the heat sink and the substrate. By providing pins exposed on the packaging layer and connected to the side of the substrate, the pins are in direct contact with the air environment, allowing the heat generated by the chip during operation to dissipate quickly through the pins. Simultaneously, the heat sink is fixed to the pins, allowing heat from the pins to enter the heat sink, which also serves a heat dissipation function, thereby improving the heat dissipation performance of the packaging structure.

[0025] To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0026] Figures 1 to 3 This is a schematic diagram of the corresponding structure in the first embodiment of the packaging structure of this utility model. Wherein, Figure 1 This is a top view of the base plate, lead components, and functional pins in the package structure. Figure 2 yes Figure 1 A sectional view along the A1A2 direction. Figure 3 yes Figure 1 A sectional view along the B1B2 direction.

[0027] The packaging structure includes: a base plate 100; a chip 110 mounted on the base plate 100; an encapsulation layer 108 located on the base plate 100 and covering the chip 110; a lead component 104 exposed on the encapsulation layer 108 and connected to the side of the base plate 100; and a heat sink 190 fixed on the lead component 104, with the encapsulation layer 108 placed within the cavity formed by the heat sink 190 and the base plate 100.

[0028] It should be noted that, in this embodiment of the present invention, by setting a pin component 104 exposed on the packaging layer 108 and connected to the side of the base plate 100, the pin component 104 can be in direct contact with the air environment, so that the heat generated by the chip 110 in the working state can be quickly dissipated through the pin component 104. At the same time, a heat sink 190 is fixed on the pin component 104, so that the heat in the pin component 104 can enter the heat sink 190, so that the heat sink 190 can also play a role in heat dissipation, thereby improving the heat dissipation performance of the packaging structure.

[0029] Specifically, the base plate 100 provides a support platform for the chip 110.

[0030] As an example, the base plate 100 is a metal base plate 100. In this embodiment, the material of the base plate 100 includes copper or an iron-nickel alloy.

[0031] Specifically, copper or iron-nickel alloys have good electrical and thermal conductivity, a low coefficient of thermal expansion, and good corrosion and oxidation resistance.

[0032] It should be noted that chip 110 is a chip with a specific function.

[0033] Specifically, the type of chip 110 depends on the actual functional requirements or application scenarios. For example, chip 110 includes one or more of the following: system-on-a-chip (SoC), memory chip, ASIC (Application-Specific Integrated Circuit) chip, CPU (Central Processing Unit) chip, GPU (Graphics Processing Unit) chip, and FPGA (Field-Programmable Gate Array) chip.

[0034] Specifically, the encapsulation layer 108 protects the chip 110 and the substrate, prevents the chips 110 from interconnecting, and reduces the probability of damage to the chip 110 and pollution from the air environment. At the same time, the chip 110 and the substrate encapsulated by the encapsulation layer 108 are also conducive to installation and transportation.

[0035] In this embodiment, the encapsulation layer 108 is made of molding compound. Specifically, the molding compound is made of epoxy resin, which has advantages such as low shrinkage, good adhesion, good corrosion resistance, excellent electrical properties, and low cost.

[0036] It should be noted that the molding compound may also include one or more of the following: hardener, catalyst, and filler.

[0037] It should also be noted that the encapsulation layer 108 needs to be cured and baked to allow the molecular chains in the encapsulation layer 108 to cross-react more fully, so as to give it more stable physical and chemical properties and release the internal stress in the encapsulation layer 108.

[0038] Specifically, by setting a pin component 104 exposed on the packaging layer 108 and connected to the side of the base plate 100, the pin component 104 is in direct contact with the air environment, which allows the heat generated by the chip in the working state to be quickly dissipated through the pin component 104, thereby improving the heat dissipation performance of the packaging structure.

[0039] In this embodiment, the pin component 104 includes a connecting portion 103 and an extension portion 102 connected to the side of the connecting portion 103. The connecting portion 103 is connected to the side of the base plate 100.

[0040] Specifically, the connecting portion 103 is connected to the side of the base plate 100, and the extension portion 102 is connected to the side of the connecting portion 103. When the chip 110 is in the working state, the heat generated on the base plate 100 is dissipated to the extension portion 102 through the connecting portion 103. Since the extension portion 102 is exposed to the air environment, the generated heat can be quickly dissipated through the extension portion 102, thereby improving the heat dissipation performance of the packaging structure.

[0041] It should be noted that when the chip 110 is in operation, the heat generated is dissipated to the extension portion 102 through the connection portion 103. Since the connection portion 103 is close to the base plate 100, the heat of the connection portion 103 is higher than that of the extension portion 102. Accordingly, by fixing the heat sink 190 on the connection portion 103, the heat on the connection portion 103 can be diffused to the extension portion 102 and the heat sink 190, so that the extension portion 102 and the heat sink 190 can dissipate the heat generated by the chip 110 at the same time, thereby further improving the heat dissipation performance of the packaging structure.

[0042] As an example, the pin component 104 is in a first direction (e.g. Figure 1 (As shown in the X direction) It is connected to both sides of the base plate 100.

[0043] Specifically, the pin components 104 are connected to both sides of the base plate 100 in the first direction, so that the heat generated when the chip 110 is in working state can be dissipated evenly through the pin components 104 on both sides of the base plate 100, thereby making the heat of each area of ​​the base plate 100 uniform and reducing the probability of local high heat and local low heat in the base plate 100.

[0044] In this embodiment, the width of the connecting portion 103 is smaller than the width of the extension portion 102.

[0045] Specifically, the width of the connecting portion 103 is smaller than the width of the extension portion 102, which facilitates the separation of the connecting portion 103 from the extension portion 102, thereby fixing the heat dissipation cover 190 on the connecting portion 103.

[0046] As an example, the number of connecting portions 103 between the extension portion 102 and the base plate 100 is one.

[0047] In other embodiments, such as Figure 1 As shown, there are multiple connecting portions 103 between the extension portion 102 and the base plate 100.

[0048] Specifically, there are multiple connecting portions 103 between the extension portion 102 and the base plate 100, which means that there are multiple heat dissipation channels between the extension portion 102 and the base plate 100, so that the heat of the base plate 100 can be quickly dissipated through multiple heat dissipation channels, thereby further improving the heat dissipation performance of the packaging structure.

[0049] As an example, when there are multiple connecting portions 103 between the extension portion 102 and the base plate 100, the distance between adjacent connecting portions 103 is equal.

[0050] It should be noted that the distance between adjacent connecting parts 103 is equal, which can improve the heat conduction uniformity of multiple heat dissipation channels, thereby making the heat uniform in all areas of the base plate 100 and reducing the probability of local high heat and local low heat in the base plate 100.

[0051] In this embodiment, the packaging structure further includes a fixing groove 199 located in the pin component 104, the bottom of the heat sink 190 is embedded in the fixing groove 199, and the fixing groove 199 is used to fix the heat sink 190.

[0052] Specifically, the fixing groove 199 provides a fixed support for the heat sink 190, reducing the risk of the heat sink 190 falling off from the pin component 104.

[0053] It should be noted that the bottom of the heat sink 190 has a protrusion that is embedded in the fixing groove 199.

[0054] In other embodiments, the packaging structure further includes a thermally conductive adhesive located between the pin component and the heat sink, the thermally conductive adhesive being used to fix the heat sink.

[0055] Specifically, the thermally conductive adhesive serves both to dissipate heat and to fix the heat sink to the pin components, reducing the risk of the heat sink detaching from the pin components. At the same time, it allows the heat on the pin components to be dissipated to the heat sink through the thermally conductive adhesive, thus enabling the heat sink to dissipate heat.

[0056] In other embodiments, thermally conductive adhesive is also filled between the heat sink and the encapsulation layer, which can further fix the heat sink and dissipate the heat on the encapsulation layer to the heat sink through the thermally conductive adhesive, thereby further improving the heat dissipation effect of the encapsulation structure.

[0057] As an example, the materials of thermally conductive adhesives include one or more of thermally conductive silicone grease, thermally conductive gel, thermosetting polymers, thermally conductive pads, and thermally conductive phase change materials.

[0058] In this embodiment, the package structure further includes: a functional pin 101, in a second direction (e.g., Figure 1The functional pins 101 are disposed on both sides of the base plate 100 (as shown in the Y direction), and are spaced apart from the base plate 100, with the first direction and the second direction being perpendicular to each other.

[0059] It should be noted that the function pin 101 is used to electrically connect to the external circuit board and the chip 110, so that the chip 110 can transmit electrical signals with other electronic components on the external circuit board through the function pin 101.

[0060] It should also be noted that the functional pins 101 are arranged on both sides of the base plate 100 in the second direction, so that the functional pins 101 on one side of the base plate 100 can be used as signal input terminals and the functional pins 101 on the other side of the base plate 100 can be used as signal output terminals. At the same time, the arrangement direction of the functional pins 101 and the pin components 104 is not the same, which is conducive to the electrical connection between the chip 110 and the functional pins 101 through the leads 126, reducing the risk of mutual interference between the functional pins 101 and the pin components 104 and improving the reliability of the packaging structure.

[0061] Specifically, a heat sink 190 is fixed on the pin component 104 so that the heat in the pin component 104 can enter the heat sink 190, and the heat sink 190 can also play a role in heat dissipation, thereby improving the heat dissipation performance of the package structure.

[0062] It should be noted that the encapsulation layer 108 is placed in the cavity formed by the heat dissipation cover 190 and the base plate 100, so that the heat dissipation cover 190 can protect the encapsulation layer 108 and the chip 110 in the cavity.

[0063] As an example, the heat sink 190 includes a heat sink top cover 1902 and a heat sink side cover 1901 connected to the edge of the heat sink top cover 1902, the heat sink side cover 1901 being fixed to the pin component 104.

[0064] Specifically, by providing a heat dissipation top cover 1902 and a heat dissipation side cover 1901, the heat dissipation cover 190 has a groove facing the base plate 100, and the heat dissipation side cover 1901 is fixed on the pin component 104, so that the chip 110 and the encapsulation layer 108 can be disposed in the cavity formed by the heat dissipation cover 190 and the base plate 100.

[0065] In this embodiment, the heat sink 190 is fixed to the connecting part 103. Since the connecting part 103 is closer to the base plate 100, the heat of the connecting part 103 is higher than that of the extension part 102. Fixing the heat sink 190 to the connecting part 103 allows the heat on the connecting part 103 to diffuse to the extension part 102 and the heat sink 190, so that the extension part 102 and the heat sink 190 can dissipate the heat generated by the chip 110 at the same time, thereby further improving the heat dissipation performance of the packaging structure.

[0066] In this embodiment, the heat sink is made of one or more of the following materials: copper, aluminum, gold, nickel, steel, stainless steel, graphite, graphene, and carbon nanotubes.

[0067] Copper, aluminum, gold, nickel, steel, stainless steel, graphite, graphene, and carbon nanotube materials have high thermal conductivity, which can improve the heat dissipation performance of the encapsulation structure.

[0068] In this embodiment, the packaging structure further includes a lead 126 disposed above the base plate 100, one end of the lead 126 being electrically connected to the chip, and the other end of the lead 126 being electrically connected to the functional pin 101.

[0069] It should be noted that one end of the lead 126 is electrically connected to the chip, and the other end of the lead 126 is electrically connected to the functional pin 101. The lead 126 is used to realize the electrical connection between the chip 110 and the functional pin 101, so that the chip 110 can be electrically connected to other external electronic components through the functional pin 101.

[0070] In this embodiment, the material of the lead 126 includes one or more of copper, gold, and aluminum.

[0071] Copper, gold, and aluminum are all conductive materials and are commonly used for lead 126 in the package structure. In addition, copper, gold, and aluminum have low resistivity, which can improve the conductivity of lead 126.

[0072] Specifically, the encapsulation layer 108 protects the chip 110 and the substrate, prevents the chips 110 from interconnecting, and reduces the probability of damage to the chip 110 and pollution from the air environment. At the same time, the chip 110 and the substrate encapsulated by the encapsulation layer 108 are also conducive to installation and transportation.

[0073] In this embodiment, the encapsulation layer 108 also covers the lead 126 and the electrical connection between the lead 126 and the functional pin 101.

[0074] It should be noted that the encapsulation layer 108 covers the lead 126 and the electrical connection between the lead 126 and the functional pin 101, which can reduce the probability of the lead 126 and the electrical connection between the lead 126 and the functional pin 101 being contaminated by the air environment, reduce the probability of electrical failure at the electrical connection between the lead 126 and the functional pin 101, and thus improve the reliability of the encapsulation structure.

[0075] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A packaging structure, characterized in that, include: Base plate; The chip is mounted on the substrate; An encapsulation layer is located on the substrate and covers the chip; The pin components are exposed outside the packaging layer and connected to the side of the base plate; A heat sink is fixed to the pin component, and the encapsulation layer is placed in the cavity formed by the heat sink and the base plate.

2. The packaging structure as described in claim 1, characterized in that, The encapsulation structure further includes: thermally conductive adhesive, located between the pin component and the heat sink, the thermally conductive adhesive being used to fix the heat sink; or, The packaging structure further includes a fixing groove located in the pin component, the bottom of the heat sink being embedded in the fixing groove, and the fixing groove being used to fix the heat sink.

3. The packaging structure as described in claim 2, characterized in that, The thermally conductive adhesive is also filled between the heat sink and the encapsulation layer.

4. The packaging structure as described in claim 2 or 3, characterized in that, The thermally conductive adhesive is made of one or more of the following materials: thermally conductive silicone grease, thermally conductive gel, thermosetting polymer, thermally conductive pad, and thermally conductive phase change material.

5. The packaging structure as described in claim 1, characterized in that, The pin component includes a connecting portion and an extension portion connected to a side portion of the connecting portion, the connecting portion being connected to a side portion of the base plate; The heat dissipation cover is fixed to the connecting part.

6. The packaging structure as described in claim 5, characterized in that, The width of the connecting part is smaller than the width of the extension part.

7. The packaging structure as described in claim 5, characterized in that, The number of connection portions between the extension portion and the base plate is one; or, The number of connection parts between the extension portion and the base plate is multiple.

8. The packaging structure as described in claim 7, characterized in that, When there are multiple connecting parts between the extension portion and the base plate, the distance between adjacent connecting parts is equal.

9. The packaging structure as described in claim 1, characterized in that, The heat sink includes a heat sink top cover and a heat sink side cover connected to the edge of the heat sink top cover, and the heat sink side cover is fixed to the pin component.

10. The packaging structure as described in claim 1, characterized in that, The heat sink is made of one or more of the following materials: copper, aluminum, gold, nickel, steel, stainless steel, graphite, graphene, or carbon nanotubes.

11. The packaging structure as described in claim 1, characterized in that, The pin components are connected to both sides of the base plate in a first direction; The packaging structure further includes: functional pins, which are disposed on both sides of the base plate in a second direction, the functional pins being spaced apart from the base plate, and the first direction being perpendicular to the second direction.

12. The packaging structure as described in claim 11, characterized in that, The packaging structure further includes: a lead wire disposed above the base plate, one end of the lead wire being electrically connected to the chip, and the other end of the lead wire being electrically connected to the functional pin; The encapsulation layer also covers the leads and the electrical connections between the leads and the functional pins.

13. The packaging structure as described in claim 12, characterized in that, The lead wire is made of one or more of copper, gold, and aluminum.

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