Novel miniaturized semiconductor light source packaging structure
By employing an axisymmetric packaging structure and substrate recess design, the torsional stress and heat dissipation problems of semiconductor light source packaging structures are solved, achieving miniaturization and efficient integration, and improving the stability and heat dissipation performance of the device.
Patent Information
- Application Number
- CN202422950401.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-12-02
AI Technical Summary
Existing semiconductor light source packaging structures suffer from thermal stress and plastic deformation during long-term operation, leading to the accumulation of torsional stress, which affects device stability and lifespan. At the same time, they have low heat dissipation efficiency, making it difficult to achieve miniaturization and integration.
The packaging mechanism adopts an axisymmetric structure, combined with the groove design on the substrate and the tail tube connection, which reduces the substrate thickness and improves the heat conduction efficiency. By rationally arranging the mounting holes, additional connection points are avoided, thus achieving device fixation and heat dissipation.
It effectively overcomes torsional stress, improves heat dissipation efficiency, reduces device size, enhances space utilization, extends device life, and supports miniaturized integration.
Smart Images
Figure CN223540059U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical communication module manufacturing technology, specifically a novel miniaturized semiconductor light source packaging structure. Background Technology
[0002] Semiconductor light sources have broad application prospects in the field of optical communication. They have advantages such as small size, light weight, and good beam coherence, and are widely used in communication, sensing, medicine, military and other fields. With the emergence of the concept of photonic integration, the miniaturization of optoelectronic devices has become a research hotspot, but it has also brought about the problem of chip thermal management. At present, most semiconductor light sources on the market adopt double-sided butterfly packaging, which is large in size and not conducive to device miniaturization or integration. At the same time, the thick substrate of the tube shell has an adverse effect on the heat dissipation speed under extreme working conditions. A high level of thermal management is required during integration.
[0003] In existing technologies, to achieve structural stability, the bottom of the package structure is typically drilled and fixed to the base with screws. For semiconductor package structures with non-axisymmetric and centrosymmetric structures, during long-term operation, the release of various stresses such as thermal stress and plastic deformation of the package will result in the accumulation of torsional stress and shear stress near the fixed point of the package. Over time, this stress accumulation will accelerate the aging of the semiconductor light source package structure package and reduce the lifespan and stability of the device. Utility Model Content
[0004] The purpose of this invention is to provide a novel miniaturized semiconductor light source packaging structure. The packaging mechanism adopts an axisymmetric structure to effectively fix the semiconductor light source packaging structure, which can overcome torsional stress. A groove is provided on the substrate, which can partially reduce the thickness of the bottom of the substrate, which is beneficial to heat conduction and improves the heat dissipation efficiency of the laser. The tail tube design facilitates coupling while reducing the size of the device. The mounting holes are reasonably arranged on the substrate, eliminating the need for additional connection points, further improving the space utilization rate of the miniaturized semiconductor light source packaging structure during integration, thereby solving the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a novel miniaturized semiconductor light source packaging structure, comprising a substrate, wherein a groove is formed at the center of the surface of the substrate, and a packaging mechanism for providing packaging for the semiconductor light source is provided around the upper surface of the substrate. The packaging mechanism includes a first side plate, a second side plate, a third side plate, and a fourth side plate. The bottoms of the first side plate, the second side plate, the third side plate, and the fourth side plate are all fixed to the substrate. The first side plate, the second side plate, the third side plate, and the fourth side plate are all fixedly connected adjacent to each other. A tail tube is connected to the first side plate, and multiple pins are installed on the fourth side plate.
[0006] Preferably, the pins are provided with six pins, and the distance between any two adjacent pins is equal.
[0007] Preferably, mounting holes are provided at the axially symmetrical edges of the substrate, and the mounting holes are semi-circular in shape.
[0008] Preferably, the connection between the first side plate, the second side plate, the third side plate and the fourth side plate is chamfered, and the substrate is arranged in a symmetrical octagonal structure.
[0009] Preferably, the height at which the pin is mounted on the fourth side plate is equal to the height at which the tail tube is mounted on the first side plate.
[0010] Preferably, the lengths of the second and fourth side plates are greater than those of the first and third side plates.
[0011] Compared with the prior art, the beneficial effects of this utility model are:
[0012] This utility model provides a novel miniaturized semiconductor light source packaging structure. The packaging mechanism adopts an axisymmetric structure to effectively fix the semiconductor light source packaging structure, which can overcome torsional stress. A groove is provided on the substrate, which can partially reduce the thickness of the bottom of the substrate, which is beneficial to heat conduction and improves the heat dissipation efficiency of the laser. The tail tube design facilitates coupling while reducing the size of the device. The mounting holes are reasonably arranged on the substrate, eliminating the need for additional connection points and further improving the space utilization rate when integrating the miniaturized semiconductor light source packaging structure.
[0013] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained through the structures pointed out in the description and the accompanying drawings. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0015] Figure 2 This is a top view of the overall structure of this utility model;
[0016] Figure 3 This is a schematic diagram of the substrate structure of this utility model;
[0017] Figure 4 This is a top view of the substrate structure of this utility model.
[0018] The following are the labels in the diagram: 1. Substrate; 2. Groove; 3. Packaging mechanism; 31. First side plate; 32. Second side plate; 33. Third side plate; 34. Fourth side plate; 4. Tail tube; 5. Pin; 6. Mounting hole. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0020] This utility model provides, for example Figures 1-4 The present invention discloses a novel miniaturized semiconductor light source packaging structure, comprising a substrate 1, a groove 2 formed at the center of the surface of the substrate 1, and a packaging mechanism 3 for packaging the semiconductor light source arranged around the perimeter of the upper surface of the substrate 1. The packaging mechanism 3 includes a first side plate 31, a second side plate 32, a third side plate 33, and a fourth side plate 34. The bottoms of the first side plate 31, the second side plate 32, the third side plate 33, and the fourth side plate 34 are all fixed to the substrate 1. The first side plate 31, the second side plate 32, the third side plate 33, and the fourth side plate 34 are all adjacently and fixedly connected. A tail tube 4 is connected to the first side plate 31, and multiple pins 5 are installed on the fourth side plate 34. The packaging mechanism 3 adopts an axisymmetric structure to effectively fix the semiconductor light source packaging structure. The groove 2 on the substrate 1 can partially reduce the thickness of the bottom of the substrate 1, which is beneficial for heat conduction and improves the heat dissipation efficiency of the laser. While improving the heat dissipation efficiency of the device, it can also reduce the overall height of the packaging structure, further reducing the size of the device. The tail tube 4 design facilitates coupling while reducing the size of the device.
[0021] There are six pins 5, and the distance between any two adjacent pins 5 is equal. The pins 5 can provide an outward connection to the semiconductor light source.
[0022] Mounting holes 6 are provided at the axially symmetrical edges of the substrate 1. The mounting holes 6 are semi-circular. The mounting holes 6 are reasonably arranged on the substrate 1, eliminating the need for additional connection points and further improving the space utilization rate when integrating miniaturized semiconductor light source packaging structures.
[0023] The connection between the first side plate 31, the second side plate 32, the third side plate 33 and the fourth side plate 34 is chamfered. The substrate 1 is arranged in a symmetrical octagonal structure. The axially symmetrical structure effectively fixes the semiconductor packaging structure and overcomes torsional stress.
[0024] The height at which pin 5 is mounted on the fourth side plate 34 is equal to the height at which tail tube 4 is mounted on the first side plate 31, which facilitates the installation and fixation of the semiconductor light source.
[0025] The lengths of the second side plate 32 and the fourth side plate 34 are greater than those of the first side plate 31 and the third side plate 33, which can form a rectangular space to encapsulate the semiconductor light source.
[0026] In practical use, an axisymmetric structure is adopted to fix the first side plate 31, the second side plate 32, the third side plate 33, and the fourth side plate 34 of the packaging mechanism 3 onto the substrate 1, thereby forming a rectangular space. This facilitates the installation and fixation of the semiconductor light source and overcomes torsional stress. At the same time, the substrate 1 is cut into an octagon and a rectangular groove 2 is opened in its central area, which facilitates the installation and heat dissipation of the semiconductor light source. While improving the heat dissipation efficiency of the device, it can also reduce the overall height of the packaging structure, further reducing the size of the device. The tail tube 4 design facilitates coupling while reducing the size of the device. Then, mounting holes 6 are reasonably arranged on the substrate 1, eliminating the need for additional connection points and further improving the space utilization rate when integrating the miniaturized semiconductor light source packaging structure.
[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A novel miniaturized semiconductor light source packaging structure, comprising a substrate (1), characterized in that: A groove (2) is provided at the center of the surface of the substrate (1). A packaging mechanism (3) for providing packaging for semiconductor light source is provided around the upper surface of the substrate (1). The packaging mechanism (3) includes a first side plate (31), a second side plate (32), a third side plate (33), and a fourth side plate (34). The bottoms of the first side plate (31), the second side plate (32), the third side plate (33), and the fourth side plate (34) are all fixed on the substrate (1). The first side plate (31), the second side plate (32), the third side plate (33), and the fourth side plate (34) are all fixedly connected to each other. A tail tube (4) is connected to the first side plate (31), and multiple pins (5) are installed on the fourth side plate (34).
2. The novel miniaturized semiconductor light source packaging structure according to claim 1, characterized in that: The pins (5) are provided in six parts, and the distance between any two adjacent pins (5) is equal.
3. The novel miniaturized semiconductor light source packaging structure according to claim 2, characterized in that: The substrate (1) has mounting holes (6) at its axially symmetrical edges, and the mounting holes (6) are semi-circular.
4. The novel miniaturized semiconductor light source packaging structure according to claim 1, characterized in that: The connection between the first side plate (31), the second side plate (32), the third side plate (33) and the fourth side plate (34) is chamfered, and the substrate (1) is arranged in a symmetrical octagonal structure.
5. The novel miniaturized semiconductor light source packaging structure according to claim 2, characterized in that: The height at which the pin (5) is mounted on the fourth side plate (34) is equal to the height at which the tail tube (4) is mounted on the first side plate (31).
6. The novel miniaturized semiconductor light source packaging structure according to claim 1, characterized in that: The lengths of the second side plate (32) and the fourth side plate (34) are greater than those of the first side plate (31) and the third side plate (33).