HDI circuit board with heat-conducting sealant layer

Abstract

The utility model discloses an HDI circuit board with a heat-conducting sealant layer, which comprises an HDI circuit board and an external connecting frame, the edge of the HDI circuit board is provided with a heat-conducting sealant edge sleeve, the external connecting frame is provided with a wiring terminal connecting part, and the wiring terminal connecting part is provided with a heat-conducting sealant edge sleeve. The upper surface and the lower surface of the external connection frame are respectively provided with a heat-conducting glue sealing panel used for sealing the interior of the external connection frame, the periphery of the HDI circuit board is wrapped with heat-conducting glue for sealing protection, and the conditions of oxidation, service life reduction and the like caused by water seepage in the use process of the HDI circuit board are prevented. The internal working temperature is reduced to a certain degree, and the wiring terminal connecting part can connect the internal wiring end of the HDI circuit board with the external wiring under the sealing condition, so that the normal use is not influenced.

Description

Technical Field

[0001] This utility model relates to HDI circuit boards, and more particularly to an HDI circuit board with a thermally conductive sealant layer. Background Technology

[0002] High-density interconnect (HDI) circuit boards represent one of the fastest-growing areas in the printed circuit board (PCB) industry. Simply put, they are integrated circuit boards widely used in communications, laptops, automotive electronics, automatic control equipment, and security systems. Currently, HDI circuit boards are typically installed directly inside the equipment. However, current HDI circuit boards have poor waterproofing, making them susceptible to corrosion from liquids and dust, thus affecting their lifespan. To address these issues, a HDI circuit board structure with improved sealing is needed.

[0003] Therefore, existing HDI circuit boards need further improvement. Utility Model Content

[0004] The purpose of this invention is to provide an HDI circuit board with a thermally conductive sealing layer, which can improve the waterproof sealing performance of the HDI circuit board while ensuring heat dissipation.

[0005] To achieve the above objectives, the present invention adopts the following solution:

[0006] An HDI circuit board with a thermally conductive sealant layer includes an HDI circuit board and an external connection frame. The edge of the HDI circuit board is provided with a thermally conductive sealant sleeve, and the external connection frame is provided with a terminal connection part. The upper and lower surfaces of the external connection frame are each provided with a thermally conductive sealant panel for sealing the interior of the external connection frame.

[0007] Furthermore, the external connection frame includes an outer frame, on which a plurality of screw connection holes for connection to the device are provided.

[0008] Furthermore, the terminal connection part includes a terminal fixing part disposed on the external connection frame. Multiple external terminals are disposed on the outside of the terminal fixing part, and multiple internal terminals are disposed on the inside of the terminal fixing part. The external terminals and a corresponding internal terminal are electrically connected.

[0009] Furthermore, the thermally conductive adhesive sealing panel described above is provided with multiple openings for the internal wiring terminals to pass through.

[0010] Furthermore, the inner terminal is located above the outer connection frame, and the other end is located inside the outer connection frame.

[0011] Furthermore, the upper surface of the thermally conductive adhesive sealing panel is provided with multiple heat dissipation grooves.

[0012] Furthermore, the thermally conductive adhesive sealing panel and the outer connecting frame are interference-fitted at their edges, and the outer connecting frame and the thermally conductive adhesive side sleeve are interference-fitted.

[0013] In summary, the advantages of this utility model over the prior art are:

[0014] This invention addresses the shortcomings of existing HDI circuit boards. Through its structural design, it offers the following advantages: The HDI circuit board is sealed and protected by thermally conductive adhesive, preventing water seepage that could lead to oxidation and reduced lifespan during use. Furthermore, the use of thermally conductive adhesive reduces the internal operating temperature to a certain extent. The terminal connections allow for sealed connection between the internal and external terminals of the HDI circuit board, without affecting normal operation. The design is also simple and easy to use. Attached Figure Description

[0015] Figure 1 This is a perspective view of the internal structure of this utility model;

[0016] Figure 2 This is a perspective view of the present utility model;

[0017] Figure 3 This is a cross-sectional view of the present invention;

[0018] Figure 4 for Figure 3 A magnified view of part A. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4 This utility model provides an HDI circuit board with a thermally conductive sealant layer, including an HDI circuit board 1 and an external connection frame 2. The edge of the HDI circuit board 1 is provided with a thermally conductive sealant sleeve 3, the external connection frame 2 is provided with a terminal connection part 4, and the upper and lower surfaces of the external connection frame 2 are each provided with a thermally conductive sealant panel 5 for sealing the inside of the external connection frame 2.

[0021] In use, the thermally conductive adhesive sleeve 3 and the upper and lower thermally conductive adhesive sealing panels 5 completely seal the HDI circuit board 1, thereby improving the sealing performance of the HDI circuit board during use and preventing moisture from affecting the lifespan of the HDI circuit board.

[0022] Furthermore, the thermally conductive adhesive sleeve 3 and the thermally conductive adhesive sealing panel 5 are made of thermally conductive adhesive material, which greatly improves the heat dissipation effect.

[0023] Meanwhile, a terminal block connection part 4 is provided on the outside of the thermally conductive adhesive sealing panel 5. The terminal block connection part 4 can connect the internal and external terminals of the sealed HDI circuit board to ensure normal connection and use.

[0024] The external connection frame 2 of this utility model includes an outer frame 201, on which a plurality of screw connection holes 202 for connecting to the device are provided.

[0025] The terminal connection part 4 of this utility model includes a terminal fixing part 401 disposed on the external connection frame 2. A plurality of external terminals 402 are disposed on the outside of the terminal fixing part 401, and a plurality of internal terminals 403 are disposed on the inside of the terminal fixing part 401. The external terminals 402 and a corresponding internal terminal 403 are electrically connected.

[0026] The thermally conductive adhesive sealing panel 5 described above is provided with multiple openings 100 for the internal wiring terminals 403 to pass through.

[0027] The internal wiring terminal 403 of this utility model is disposed above the external connection frame 2, and the other end is disposed inside the external connection frame 2.

[0028] The thermally conductive adhesive sealing panel 5 of this invention has multiple heat dissipation grooves 200 on its upper surface.

[0029] The thermally conductive adhesive sealing panel 5 and the external connecting frame 2 of this utility model are interference-fitted at their edges, and the external connecting frame 2 and the thermally conductive adhesive side sleeve 3 are interference-fitted.

[0030] The foregoing has shown and described the basic principles and main features of this utility model, as well as its advantages. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An HDI circuit board with a thermally conductive sealant layer, comprising an HDI circuit board (1), characterized in that: It also includes an external connection frame (2), the edge of the HDI circuit board (1) is provided with a thermally conductive adhesive sleeve (3), the external connection frame (2) is provided with a terminal connection part (4), and the upper and lower surfaces of the external connection frame (2) are each provided with a thermally conductive adhesive sealing panel (5) for sealing the inside of the external connection frame (2).

2. The HDI circuit board with a thermally conductive sealant layer according to claim 1, characterized in that: The external connection frame (2) includes an outer frame (201), which has a plurality of screw connection holes (202) for connecting to the device.

3. An HDI circuit board with a thermally conductive sealant layer according to claim 2, characterized in that: The terminal connection part (4) includes a terminal fixing part (401) disposed on the external connection frame (2). A plurality of external terminals (402) are disposed on the outside of the terminal fixing part (401), and a plurality of internal terminals (403) are disposed on the inside of the terminal fixing part (401). The external terminals (402) and a corresponding internal terminal (403) are electrically connected.

4. An HDI circuit board with a thermally conductive sealant layer according to claim 3, characterized in that: The thermally conductive adhesive sealing panel (5) above is provided with multiple openings (100) for the internal wiring terminals (403) to pass through.

5. An HDI circuit board with a thermally conductive sealant layer according to claim 4, characterized in that: The inner terminal (403) is located above the outer connection frame (2), and the other end is located inside the outer connection frame (2).

6. An HDI circuit board with a thermally conductive sealant layer according to claim 5, characterized in that: The upper surface of the thermally conductive adhesive sealing panel (5) is provided with multiple heat dissipation grooves (200).

7. An HDI circuit board with a thermally conductive sealant layer according to claim 6, characterized in that: The thermally conductive adhesive sealing panel (5) and the external connecting frame (2) are interference-fitted at their edges, and the external connecting frame (2) and the thermally conductive adhesive side sleeve (3) are interference-fitted.

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