MOS tube radiator and circuit assembly

Abstract

The utility model relates to an MOS tube radiator and a circuit assembly, and belongs to the technical field of electronics. A metal oxide semiconductor (MOS) tube radiator is characterized in that the MOS tube radiator comprises a base assembly which is provided with a first mounting groove; the heat dissipation assembly is arranged on the base assembly, and the heat dissipation assembly is provided with a plurality of first heat dissipation through grooves, a plurality of second heat dissipation through grooves and a third heat dissipation through groove; and the contact pins are arranged on the base assembly and / or the heat dissipation assembly. The utility model discloses an MOS tube radiator, which is characterized in that a plurality of first heat dissipation through grooves, a plurality of second heat dissipation through grooves and a third heat dissipation through groove are formed in a heat dissipation assembly, so that heat can be transferred from a heating source to the radiator more quickly, and the overall heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic technology, and in particular to a MOS transistor heat sink and circuit assembly. Background Technology

[0002] In the existing technology, heat sinks without pins cannot be quickly and easily plugged into and unplugged from the circuit board. At the same time, heat sinks without pins lack this direct electrical connection method, requiring additional design and connecting wires. This not only increases the complexity of circuit design, but may also introduce new connection point failure risks. Utility Model Content

[0003] Therefore, it is necessary to provide a MOSFET heatsink and circuit assembly to address the issue of MOSFET heatsinks lacking pins.

[0004] A MOSFET heat sink includes: a base assembly having a first mounting slot; a heat dissipation assembly disposed on the base assembly having a plurality of first heat dissipation channels, a plurality of second heat dissipation channels, and a third heat dissipation channel; and a pin disposed on the base assembly and / or the heat dissipation assembly.

[0005] The above-disclosed MOSFET heat sink utilizes a heat dissipation component mounted on a base assembly. This heat dissipation component features multiple first, second, and third heat dissipation channels. The MOSFET is then mounted on the first mounting slot of the base assembly. By first mounting the heat dissipation component on the base assembly, a stable heat dissipation structure is constructed. The base assembly, typically serving as the foundation of the entire device, provides excellent support. The connection between the heat dissipation component and the base assembly ensures a tight integration between the heat dissipation system and the MOSFET, facilitating heat transfer from the heat source within the device to the heat dissipation component. This tight connection reduces thermal resistance, ensuring efficient heat transfer from the heat-generating component to the heat dissipation component. Furthermore, the multiple first, second, and third heat dissipation channels work together to enhance the heat dissipation performance of the heat sink from multiple angles. These channels cooperate to form a complete heat dissipation network, enhancing the comprehensiveness, uniformity, and stability of the heat dissipation. This ensures the heat sink can effectively handle the heat generated by the device, providing stable heat dissipation. Stable heat dissipation performance is crucial for equipment requiring long-term stable operation, effectively extending the lifespan of both the heat sink and the device. The pins are positioned on the base assembly and heatsink assembly. Their primary function is to securely fasten the MOSFET heatsink to the circuit board. This fixing method prevents the heatsink from loosening due to vibration, movement, or other external interference during equipment operation. The circuit board may be subjected to various mechanical stresses during operation, such as shaking during equipment handling and vibrations generated by internal fan operation. The pins ensure a tight connection between the heatsink and the circuit board, maintaining the heatsink's correct position on the circuit board. They also facilitate faster heat transfer from the heat source to the heatsink, thereby improving overall heat dissipation efficiency.

[0006] In one embodiment, the base assembly includes a base and multiple support blocks. These support blocks are disposed on the base and located on both sides of the base. The base has mounting holes and grooves. The multiple support blocks and the base together form a first mounting groove for mounting a MOSFET. The heat dissipation assembly is disposed on the base. By placing multiple support blocks on the base and distributing them on both sides, the stability of the entire device can be significantly improved. When the MOSFET heatsink is placed on the circuit board, the support blocks support the base, ensuring its stability. This is particularly beneficial for devices with a high center of gravity or those that may experience slight shaking or collisions during operation. Furthermore, these dual-sided support blocks effectively prevent the MOSFET heatsink from tipping to one side. The support blocks also distribute the weight of the base evenly across the circuit board, reducing localized pressure between the base and the circuit board. This helps prevent deformation of the base due to excessive localized pressure, and the support blocks extend the base's lifespan. Because the base has mounting holes and a first mounting groove, the MOSFET can be securely fixed to the base, providing a stable and secure mounting. This robust mounting method ensures a tight physical contact between the MOSFET and the base, allowing the heat dissipation components on the base to dissipate the heat generated by the MOSFET during operation, maintaining the MOSFET's operating temperature within a reasonable range and ensuring the normal operation of the entire circuit system.

[0007] In one embodiment, the heat dissipation assembly includes a first heat sink, a second heat sink, and a third heat dissipation component. Multiple first heat sinks are disposed on both sides of the base assembly. Multiple second heat sinks are disposed on the base assembly. The first and second heat sinks are spaced apart to form a first heat dissipation channel. The third heat dissipation component is disposed on the base assembly, spaced apart from the second heat sinks to form a second heat dissipation channel, and includes the third heat dissipation channel. By distributing two first heat sinks on both sides of the base assembly, the heat dissipation area of ​​the entire heat dissipation system can be significantly increased. The larger the surface area of ​​the heat sink, the larger the area in contact with the surrounding air. According to the principle of heat exchange, the rate at which heat is transferred from a high-temperature object to a low-temperature object is proportional to the contact area. Therefore, this arrangement allows more heat to be transferred from the heat sink to the surrounding air, accelerating heat dissipation and thus more effectively reducing the temperature of the device. Two second heat sinks are then placed on the base assembly, forming a multi-layered heat dissipation structure. The spacing between the first and second heat sinks creates a first heat dissipation channel. This synergistic effect makes the heat dissipation process more efficient, as different layers of heat sinks can target heat accumulation at different locations and levels on the base assembly. The spacing between the first and second heat sinks also creates a first heat dissipation channel, providing a good passage for airflow. Hot air naturally rises from the warmer heat sink surface and is quickly expelled through these channels. A third heat dissipation component is then placed on the base assembly, and its spacing with the two second heat sinks creates a second heat dissipation channel. The addition of a third heat dissipation channel to the third heat dissipation component further increases the heat dissipation area, enhances the heat dissipation effect, and ensures the stable operation of the MOSFETs and other electronic components.

[0008] In one embodiment, the third heat dissipation component includes a third heat sink and a reinforcing block. Multiple third heat sinks are disposed on the base assembly, forming a third heat dissipation channel. The reinforcing block is sandwiched between the multiple third heat sinks. By disposing of multiple third heat sinks on the base assembly, with the spacing between them forming a third heat dissipation channel, the channel plays a crucial role in the heat dissipation process by guiding airflow. Hot air, due to its lower density, rises and exits through the channel, while surrounding cool air is drawn in, creating natural convection. This convection cycle continuously removes heat from the heat sink, maintaining the temperature gradient on its surface and ensuring uninterrupted heat dissipation. Furthermore, this convection allows heat to diffuse more quickly throughout the entire heat dissipation system, preventing localized heat accumulation and improving overall heat dissipation efficiency. Sandwiching the reinforcing block between the multiple third heat sinks significantly enhances the connection stability between them, providing additional support and allowing them to maintain their original shape and structure.

[0009] In one embodiment, a mounting sleeve is also included, disposed on the base assembly, for storing the locking screws that secure the MOSFET. By placing the mounting sleeve on the base assembly, it provides storage space for the locking screws securing the MOSFET, protecting them from external damage. In the operating environment, dust, moisture, or other substances that may cause the screws to rust or corrode may be present. The mounting sleeve isolates the screws from these adverse factors, preventing corrosion of the screw surface or damage to the threads. This ensures that the screws can perform their securing function normally during use, avoiding any impact on the MOSFET's securing effect due to screw damage. It also helps improve installation accuracy, preventing situations where the screws strip or cannot be tightened due to inaccurate positioning during installation.

[0010] A second aspect of this application discloses a circuit assembly, characterized in that the circuit assembly includes: the aforementioned MOS transistor heat sink; a grid-type heat sink, which is disposed opposite to the MOS transistor heat sink, and the grid-type heat sink is provided with a second mounting slot and a third mounting slot; a plurality of MOS transistors, one MOS transistor being disposed on the first mounting slot of the MOS transistor heat sink, and the plurality of MOS transistors being disposed on the second mounting slot and the third mounting slot of the grid-type heat sink; a circuit board, in which the pins of the MOS transistor heat sink pass through the circuit board, and the grid-type heat sink is disposed on the circuit board; and electronic components, which are disposed on the circuit board.

[0011] The second aspect disclosed above discloses a circuit assembly in which a MOSFET is mounted on a first mounting slot of a MOSFET heatsink, and multiple MOSFETs are mounted on second and third mounting slots of a grid-type heatsink, ensuring close contact between the MOSFET and the heatsink. This close contact reduces thermal resistance, allowing the heat generated by the MOSFET during operation to be conducted to the heatsink more efficiently. The heatsink has a large heat capacity and good heat dissipation performance, enabling it to quickly dissipate absorbed heat, thereby effectively reducing the temperature of the MOSFET and keeping it operating within a suitable temperature range. When the MOSFET temperature is too high, its electrical parameters such as on-resistance and threshold voltage will change, potentially leading to a decrease in circuit performance. Good heat dissipation conditions can maintain the stability of these parameters, ensuring the normal operation of the MOSFET in the circuit. By mounting the MOSFET heatsink pins and the grid-type heatsink on a circuit board, which also houses electronic components, the heatsink can absorb the heat generated by the electronic components, forming a comprehensive heat dissipation system. This ensures that the heat on the circuit board is dissipated in a timely manner, maintaining the electronic components within a suitable temperature range, thereby improving the performance and reliability of the entire circuit system.

[0012] In one embodiment, the grille-type heat sink includes a mounting assembly and a heat exchange assembly. The heat exchange assembly is disposed on the mounting assembly, which is mounted on the circuit board. The mounting assembly has a second mounting slot and a third mounting slot, and a plurality of MOSFETs are disposed on the mounting assembly. By placing the plurality of MOSFETs on the second and third mounting slots, placing the heat exchange assembly on the mounting assembly, and then placing the mounting assembly on the circuit board, the MOSFETs can be made into close contact with the mounting assembly. Since the heat exchange assembly is disposed on the mounting assembly, the heat generated by the MOSFETs can be efficiently conducted to the heat exchange assembly through the mounting assembly. This tight heat conduction path design reduces heat loss during conduction, ensuring that heat can be quickly transferred from the MOSFETs to the heat exchange assembly, thereby effectively reducing the operating temperature of the MOSFETs, preventing local overheating of the MOSFETs, improving heat dissipation efficiency, ensuring that the MOSFETs operate within a suitable temperature range, and reducing the possibility of signal distortion and circuit failure.

[0013] In one embodiment, the mounting assembly includes a fixing plate and a mounting plate. Multiple mounting plates are spaced apart along the length of the fixing plate, which is mounted on the circuit board. This structure, by arranging multiple mounting plates spaced apart along the length of the fixing plate and mounting the fixing plate on the circuit board, makes the mounting plate more stable. The mounting plate is used to mount MOSFETs; its stable position ensures that the MOSFETs will not shift or experience poor contact due to movement of the mounting plate during device operation, thus guaranteeing the overall mechanical stability of the device. Simultaneously, the mounting plate can also be used as a heat dissipation element; the spacing facilitates airflow. Hot air can rise and dissipate within these gaps, while cool air can enter from below, forming natural convection channels and improving heat dissipation efficiency. Furthermore, this spacing prevents excessive heat accumulation in localized areas, allowing heat to be dissipated more evenly into the surrounding environment, optimizing the heat dissipation layout.

[0014] In one embodiment, the heat exchange assembly includes a first heat exchange component and third heat exchange plates. The first heat exchange component is disposed on one side of the mounting assembly and has multiple fourth and fifth heat dissipation channels. Multiple third heat exchange plates are spaced apart on the other side of the mounting assembly, forming a sixth heat dissipation channel. By placing the first heat exchange component on one side of the mounting assembly, and having multiple fourth and fifth heat dissipation channels, and then placing multiple third heat exchange plates on the other side of the mounting assembly, forming the sixth heat dissipation channel, this arrangement creates a multi-directional heat dissipation channel. Hot air can be discharged from the fourth and fifth heat dissipation channels of the first heat exchange component, and also from the sixth heat dissipation channel formed by the third heat exchange plates. Cold air is drawn into these channels from all directions, creating omnidirectional convection, allowing heat to be quickly dissipated from the mounting assembly to the surrounding environment, greatly improving heat dissipation efficiency. Meanwhile, the first heat exchange component and the third heat exchange plate are distributed on both sides of the mounting component, which can balance the heat distribution of the mounting component. Heat on one side of the mounting component can be dissipated through the first heat exchange component, and heat on the other side can be dissipated through the third heat exchange plate, avoiding excessive heat accumulation on one side of the mounting component. This helps to maintain the overall temperature uniformity of the mounting component and prevents local overheating from adversely affecting the MOSFETs mounted on it.

[0015] In one embodiment, the first heat exchange assembly includes a first heat exchange plate, a second heat exchange plate, and extension members. There are multiple first heat exchange plates, spaced apart along the length of the mounting assembly to form multiple fourth heat dissipation channels. There are also multiple second heat exchange plates, located at both ends of the mounting assembly, spaced apart to form multiple fifth heat dissipation channels. Multiple extension members are also present, each corresponding to one of the second heat exchange plates. By arranging multiple first heat exchange plates spaced apart along the length of the mounting assembly and simultaneously forming multiple fourth heat dissipation channels, and by placing multiple second heat exchange plates at both ends of the mounting assembly and simultaneously forming multiple fifth heat dissipation channels, the spaced arrangement of the first heat exchange plates along the length of the mounting assembly significantly increases the surface area for heat exchange. A larger area of ​​the heat exchange plate in contact with the air facilitates heat transfer from the heat exchange plate to the air. Once heat is conducted from the mounting assembly to the first heat exchange plate, the large surface area of ​​the heat exchange plate allows for rapid heat dissipation. Similarly, multiple second heat exchange fins are positioned at both ends of the mounting assembly, increasing the heat dissipation area at both ends. These heat exchange fins effectively absorb and dissipate heat from both ends of the mounting assembly, preventing heat accumulation. The presence of the fourth and fifth heat dissipation channels allows for ample airflow between the heat exchange fins. Cool air can directly contact the surfaces of the heat exchange fins, carrying away heat and creating efficient thermal convection, thereby improving heat dissipation efficiency. The placement of multiple extensions corresponding to the second heat exchange fins effectively expands the heat exchange space. These extensions extend the heat exchange area further away from the second heat exchange fins, allowing heat to dissipate over a wider area and increasing the contact area with surrounding cool air, further enhancing heat dissipation efficiency. Attached Figure Description

[0016] Figure 1 The first perspective view of the MOSFET heatsink;

[0017] Figure 2 This is a second perspective view of the MOSFET heatsink.

[0018] Figure 3 This is a third-dimensional view of the MOSFET heatsink;

[0019] Figure 4 This is the fourth perspective view of the MOSFET heatsink;

[0020] Figure 5 The first perspective view of the grille-type radiator;

[0021] Figure 6 This is a second perspective view of a grille-type radiator;

[0022] Figure 7 This is a 3D view of the circuit components.

[0023] The correspondence between the reference numerals and the component names is as follows:

[0024] 1. Base assembly, 11. Base, 12. Support block, 101. First mounting slot, 102. Groove, 103. Mounting hole;

[0025] 2 heat dissipation components, 21 first heat sink, 22 second heat sink, 23 third heat dissipation components, 231 third heat sink, 232 reinforcing block, 201 first heat dissipation channel, 202 second heat dissipation channel, 203 third heat dissipation channel;

[0026] 3 pins;

[0027] 4. Installation kit;

[0028] 100 grille radiator;

[0029] 5. Mounting components, 51. Fixing plate, 52. Mounting plate, 501. Second mounting slot, 502. Third mounting slot;

[0030] 6 heat exchange assembly, 61 first heat exchange assembly, 611 first heat exchange plate, 612 second heat exchange plate, 613 extension, 62 third heat exchange plate, 601 fourth heat dissipation channel, 602 fifth heat dissipation channel, 603 sixth heat dissipation channel.

[0031] 7MOS transistor;

[0032] 8 circuit boards;

[0033] 9. Electronic components. Detailed Implementation

[0034] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0035] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0036] The following describes some embodiments of the MOS transistor heat sink and circuit components of this utility model with reference to the accompanying drawings.

[0037] Example 1

[0038] like Figures 1 to 7As shown, this embodiment discloses a MOS transistor heat sink, including: a base assembly 1, the base assembly 1 having a first mounting groove 101; a heat sink 2, the heat sink 2 being disposed on the base assembly 1, the heat sink 2 having a plurality of first heat sink channels 201, a plurality of second heat sink channels 202 and a third heat sink channel 203; and a pin 3, the pin 3 being disposed on the base assembly 1 and / or the heat sink 2.

[0039] This application discloses a MOSFET heat sink. By mounting a heat sink component 2 on a base assembly 1, and providing multiple first heat dissipation channels 201, multiple second heat dissipation channels 202, and a third heat dissipation channel 203 on the heat sink component 2, and then mounting the MOSFET 7 on the first mounting slot 101 of the base assembly 1, a stable heat dissipation structure can be constructed by first mounting the heat sink component 2 on the base assembly 1. The base assembly 1 typically serves as the foundation of the entire device, providing good support. The heat sink component 2 is connected to it, allowing the heat dissipation system to be tightly integrated with the MOSFET 7. This facilitates heat transfer from the heat source inside the device to the heat sink component 2. This tight connection reduces thermal resistance and ensures efficient heat transfer from the heat-generating component to the heat dissipation component. Secondly, multiple first heat dissipation channels 201, second heat dissipation channels 202, and third heat dissipation channels 203 work together to improve the heat dissipation performance of the radiator from multiple aspects. These heat dissipation channels cooperate to form a complete heat dissipation network, enhancing the comprehensiveness, uniformity, and stability of the radiator's heat dissipation. This ensures that the radiator can effectively cope with the heat generated by the equipment, providing stable heat dissipation protection for the equipment. Stable heat dissipation performance is crucial for equipment that needs to operate stably for a long time, and can effectively extend the service life of the radiator and the equipment. Pins 3 are set on the base assembly 1 and the heat dissipation assembly 2. The main function of pins 3 is to firmly fix the MOSFET heatsink to the circuit board. This fixing method can prevent the heatsink from loosening due to vibration, movement, or other external interference during equipment operation. The circuit board may be subjected to various mechanical stresses during operation, such as shaking during equipment handling and vibration generated by the internal fan. Pins 3 can ensure a tight connection between the heatsink and the circuit board, maintaining the correct position of the heatsink on the circuit board. It also helps to transfer heat from the heat source to the heatsink more quickly, thereby improving the overall heat dissipation efficiency.

[0040] like Figure 1 and Figure 2As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the base assembly 1 includes a base 11 and support blocks 12, and there are multiple support blocks 12. These multiple support blocks 12 are disposed on the base 11 and distributed on both sides of the base 11. The base 11 has mounting holes 103 and grooves 102. The multiple support blocks 12 and the base 11 enclose to form a first mounting groove 101, which is used to mount the MOSFET 7. The heat dissipation assembly 2 is disposed on the base 11. By distributing multiple support blocks 12 on the base 11 and distributing them on both sides of the base 11, the stability of the entire device can be significantly improved. When the MOSFET heatsink is placed on the circuit board, the support blocks 12 support the base 11, allowing the base 11 to remain stable. This is especially beneficial for devices with a high center of gravity or those that may experience slight shaking or collisions during operation. Furthermore, the double-sided distribution of support blocks 12 effectively prevents the MOSFET heatsink from tipping to one side. Meanwhile, the support blocks 12 can share the weight of the base 11, distributing the weight of the device evenly across the circuit board and reducing localized pressure between the bottom of the base 11 and the circuit board. This helps prevent deformation of the base 11 due to excessive localized pressure, and the presence of the support blocks 12 extends the service life of the base 11. Because the base 11 has mounting holes 103 and a first mounting groove 101, the MOSFET can be securely fixed to the base 11, providing a stable fixation. This secure fixing method ensures tight physical contact between the MOSFET and the base 11, allowing the heat dissipation component 2 on the base 11 to dissipate the heat generated by the MOSFET during operation, maintaining the operating temperature of the MOSFET 7 within a reasonable range and ensuring the normal operation of the entire circuit system.

[0041] like Figure 1 and Figure 3As shown, in addition to the features of the above embodiments, this embodiment further defines: the heat dissipation assembly 2 includes a first heat sink 21, a second heat sink 22, and a third heat dissipation assembly 23. There are multiple first heat sinks 21, which are disposed on both sides of the base assembly 1. There are also multiple second heat sinks 22, which are disposed on the base assembly 1. The first heat sinks 21 and second heat sinks 22 are spaced apart to form a first heat dissipation channel 201. The third heat dissipation assembly 23 is disposed on the base assembly 1, and the third heat dissipation assembly 23 is spaced apart from the second heat sinks 22 to form a second heat dissipation channel 202. The third heat dissipation assembly 23 is provided with a third heat dissipation channel 203. By distributing the two first heat sinks 21 on both sides of the base assembly 1, the heat dissipation area of ​​the entire heat dissipation system can be significantly increased. The larger the surface area of ​​the heat sink, the larger the area in contact with the surrounding air. According to the principle of heat exchange, the rate at which heat is transferred from a high-temperature object to a low-temperature object is proportional to the contact area. Therefore, this arrangement allows more heat to be transferred from the heat sink to the surrounding air, accelerating the heat dissipation speed and thus more effectively reducing the temperature of the device. Two second heat sinks 22 are then placed on the base assembly 1, forming a multi-layered heat dissipation structure. The spacing between the first heat sink 21 and the second heat sink 22 forms a first heat dissipation channel 201. This synergistic effect makes the heat dissipation process more efficient because the different layers of heat sinks can target the heat accumulation at different locations and levels on the base assembly 1. The spacing between the first heat sink 21 and the second heat sink 22 also forms the first heat dissipation channel 201, providing a good channel for airflow. Hot air naturally rises from the surface of the heat sinks with higher temperatures and can be quickly exhausted through these channels. A third heat dissipation assembly 23 is then placed on the base assembly 1, and is spaced apart from the two second heat sinks 22 to form a second heat dissipation channel 202. The third heat dissipation assembly 23 also has a third heat dissipation channel 203, further increasing the heat dissipation area and enhancing the heat dissipation effect, ensuring the stable operation of the MOSFET 7 and other electronic components.

[0042] like Figure 3 and Figure 4As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the third heat dissipation component 23 includes a third heat dissipation fin 231 and a reinforcing block 232. There are multiple third heat dissipation fins 231, which are disposed on the base assembly 1, forming a third heat dissipation channel 203. The reinforcing block 232 is sandwiched between the multiple third heat dissipation fins 231. By disposing multiple third heat dissipation fins 231 on the base assembly 1, and with the spacing between the multiple third heat dissipation fins forming the third heat dissipation channel 203, the third heat dissipation channel 203 plays a crucial role in the heat dissipation process, guiding the direction of airflow. Hot air, due to its lower density, rises and is discharged from the third heat dissipation channel 203, while surrounding cool air is drawn into the channel, forming natural convection. This convection circulation continuously removes heat from the heat dissipation fins, maintaining the temperature gradient on the surface of the heat dissipation fins, thus ensuring uninterrupted heat dissipation. Moreover, this convection method allows heat to diffuse more quickly throughout the entire heat dissipation system, preventing heat accumulation in localized areas and improving the overall efficiency of heat dissipation. By clamping the reinforcing block 232 between multiple third heat sinks 231, the connection stability between the heat sinks can be significantly enhanced, providing additional support for the heat sinks so that they can maintain their original shape and structure.

[0043] like Figure 1 As shown, in addition to the features of the above embodiments, this embodiment further includes a mounting sleeve 4, which is disposed on the base assembly 1 and is used to store the locking screws for fixing the MOSFET 7. By placing the mounting sleeve 4 on the base assembly 1, the mounting sleeve 4 provides storage space for the locking screws for fixing the MOSFET 7, protecting the locking screws from damage by external factors. In the operating environment of the equipment, there may be dust, moisture, or other substances that may cause the screws to rust or corrode. The mounting sleeve 4 can isolate the screws from these adverse factors, preventing the screw surface from being corroded or the threads from being damaged. This ensures that the screws can perform their fixing function normally during use and avoids affecting the fixing effect of the MOSFET 7 due to screw damage. At the same time, it helps to improve the installation accuracy and avoid the situation where the screws are stripped or cannot be tightened due to inaccurate positioning during installation.

[0044] Example 2

[0045] like Figures 1 to 7As shown, this embodiment discloses a circuit assembly, including: the aforementioned MOSFET heat sink; a grid-type heat sink 100, which is disposed opposite to the MOSFET heat sink, and the grid-type heat sink 100 is provided with a second mounting slot 501 and a third mounting slot 502; multiple MOSFETs 7, one MOSFET 7 is disposed on the first mounting slot 101 of the MOSFET heat sink, and multiple MOSFETs 7 are disposed on the second mounting slot 501 and the third mounting slot 502 of the grid-type heat sink 100; a circuit board 8, with the pins 3 of the MOSFET heat sink passing through the circuit board 8, and the grid-type heat sink 100 disposed on the circuit board 8; and electronic components 9 disposed on the circuit board 8.

[0046] The second aspect of this application discloses a circuit assembly in which a MOSFET 7 is mounted on a first mounting slot 101 of a MOSFET heatsink, and multiple MOSFETs 7 are mounted on second mounting slots 501 and third mounting slots 502 of a grid-type heatsink 100, ensuring close contact between the MOSFETs 7 and the heatsink. This close contact reduces thermal resistance, allowing the heat generated by the MOSFET 7 during operation to be conducted to the heatsink more efficiently. The heatsink has a large heat capacity and good heat dissipation performance, enabling it to quickly dissipate absorbed heat, thereby effectively reducing the temperature of the MOSFET 7 and keeping it operating within a suitable temperature range. When the temperature of the MOSFET 7 is too high, its electrical parameters such as on-resistance and threshold voltage will change, potentially leading to a decrease in circuit performance. Good heat dissipation conditions can maintain the stability of these parameters, ensuring the normal operation of the MOSFET 7 in the circuit. The pins 3 of the MOSFET heat sink and the grid heat sink 100 are set on the circuit board 8. At the same time, the circuit board 8 is also equipped with electronic components 9. The heat sink can absorb the heat generated by the electronic components 9, forming a comprehensive heat dissipation system to ensure that the heat on the circuit board 8 can be dissipated in time, maintain the electronic components 9 in a suitable temperature range, thereby improving the performance and reliability of the entire circuit system.

[0047] like Figure 5 and Figure 7As shown, in addition to the features of the above embodiments, this embodiment further defines: the grille-type heat sink 100 includes a mounting assembly 5 and a heat exchange assembly 6. The heat exchange assembly 6 is disposed on the mounting assembly 5, which is disposed on the circuit board 8. The mounting assembly 5 has a second mounting slot 501 and a third mounting slot 502, and a plurality of MOSFETs 7 are disposed on the mounting assembly 5. By disposing of the plurality of MOSFETs 7 on the second mounting slot 501 and the third mounting slot 502, disposing of the heat exchange assembly 6 on the mounting assembly 5, and then disposing of the mounting assembly 5 on the circuit board 8, the MOSFETs 7 can be made to have close contact with the mounting assembly 5. Since the heat exchange assembly 6 is disposed on the mounting assembly 5, the heat generated by the MOSFETs 7 can be efficiently conducted to the heat exchange assembly 6 through the mounting assembly 5. This tight heat conduction path design can reduce heat loss during conduction, ensure that heat can be quickly transferred from the MOSFETs 7 to the heat exchange assembly 6, thereby effectively reducing the operating temperature of the MOSFETs 7, avoiding local overheating of the MOSFETs 7, improving heat dissipation efficiency, ensuring that the MOSFETs 7 operate within a suitable temperature range, and reducing the possibility of signal distortion and circuit failure.

[0048] like Figure 5 and Figure 6 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the mounting assembly 5 includes a fixing plate 51 and a mounting plate 52, and there are multiple mounting plates 52, which are spaced apart along the length direction of the fixing plate 51. The fixing plate 51 is mounted on the circuit board 8. By arranging multiple mounting plates 52 spaced apart along the length direction of the fixing plate 51 and mounting the fixing plate 51 on the circuit board 8, this structure makes the position of the mounting plate 52 more stable. The mounting plate 52 is used to mount the MOSFET 7. The stable position ensures that the MOSFET 7 will not shift or have poor contact due to the shaking of the mounting plate 52 during device operation, thereby ensuring the overall mechanical stability of the device. At the same time, the mounting plate 52 can also be used as a heat dissipation element, and the space between them is conducive to air circulation. Hot air can rise and dissipate in these spaces, and cold air can also enter from below, forming a natural convection channel, which helps to improve heat dissipation efficiency. Moreover, this spaced arrangement can avoid excessive heat accumulation in local areas, so that heat can be dissipated more evenly to the surrounding environment, optimizing the heat dissipation layout.

[0049] like Figure 5 and Figure 6As shown, in addition to the features of the above embodiments, this embodiment further defines: the heat exchange component 6 includes a first heat exchange component 61 and a third heat exchange plate 62. The first heat exchange component 61 is disposed on one side of the mounting component 5. The first heat exchange component 61 is provided with a plurality of fourth heat dissipation channels 601 and a plurality of fifth heat dissipation channels 602. The number of third heat exchange plates 62 is plurality of, and the plurality of third heat exchange plates 62 are spaced apart and disposed on the other side of the mounting component 5 to form a sixth heat dissipation channel 603. By disposing of the first heat exchange component 61 on one side of the mounting component 5, and the first heat exchange component 61 being provided with a plurality of fourth heat dissipation channels 601 and a plurality of fifth heat dissipation channels 602, and then disposing of a plurality of third heat exchange plates 62 on the other side of the mounting component 5, and the plurality of third heat exchange plates 62 forming the sixth heat dissipation channel 603, the arrangement of the first heat exchange component 61 on one side of the mounting component 5 and the plurality of third heat exchange plates 62 on the other side creates a multi-directional heat dissipation channel. Hot air can be discharged from the fourth heat dissipation channel 601 and the fifth heat dissipation channel 602 of the first heat exchange component 61, and also from the sixth heat dissipation channel 603 formed by the third heat exchange plate 62. Cold air is drawn into these channels from all directions, forming omnidirectional convection, which allows heat to be quickly dissipated from the mounting component 5 to the surrounding environment, greatly improving heat dissipation efficiency. At the same time, the first heat exchange component 61 and the third heat exchange plate 62 are distributed on both sides of the mounting component 5, which can balance the heat distribution of the mounting component 5. Heat on one side of the mounting component 5 can be dissipated through the first heat exchange component 61, and heat on the other side can be dissipated through the third heat exchange plate 62, avoiding excessive heat accumulation on one side of the mounting component 5. This helps to maintain the overall temperature uniformity of the mounting component 5 and prevents local overheating from adversely affecting the MOS transistor 7 mounted on it.

[0050] like Figure 5 and Figure 6As shown, in addition to the features of the above embodiments, this embodiment further defines: the first heat exchange component 61 includes a first heat exchange plate 611, a second heat exchange plate 612, and an extension member 613. The number of first heat exchange plates 611 is multiple, and the multiple first heat exchange plates 611 are spaced apart along the length direction of the mounting component 5 to form multiple fourth heat dissipation channels 601. The number of second heat exchange plates 612 is multiple, and the multiple second heat exchange plates 612 are respectively disposed at both ends of the mounting component 5. The multiple second heat exchange plates 612 are spaced apart to form multiple fifth heat dissipation channels 602. The number of extension members 613 is multiple, and the multiple extension members 613 are correspondingly disposed on the multiple second heat exchange plates 612. By arranging multiple first heat exchange plates 611 at intervals along the length of the mounting assembly 5 and simultaneously forming multiple fourth heat dissipation channels 601, and distributing multiple second heat exchange plates 612 at both ends of the mounting assembly 5 and simultaneously forming multiple fifth heat dissipation channels 602, the multiple first heat exchange plates 611 spaced apart along the length of the mounting assembly 5 significantly increase the surface area for heat exchange. A larger area of ​​contact between the heat exchange plates and the air facilitates heat transfer from the heat exchange plates to the air. When heat is conducted from the mounting assembly 5 to the first heat exchange plates 611, the large area of ​​the heat exchange plates allows for rapid heat dissipation. Similarly, the multiple second heat exchange plates 612 distributed at both ends of the mounting assembly 5 also increase the heat dissipation area at both ends. These heat exchange plates can effectively absorb and dissipate heat at both ends of the mounting assembly 5, preventing heat accumulation at the ends. The presence of the fourth heat dissipation channels 601 and the fifth heat dissipation channels 602 allows for sufficient airflow between the heat exchange plates. Cold air can directly contact the surfaces of the heat exchange plates, carrying away heat and forming efficient thermal convection, thereby improving heat dissipation efficiency. By correspondingly installing multiple extensions 613 on the second heat exchange plate 612, the heat exchange space can be effectively expanded. The extensions 613 can extend the heat exchange area further away from the second heat exchange plate 612, allowing heat to dissipate over a wider area and increasing the contact area with surrounding cold air, thus further improving heat dissipation efficiency.

[0051] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A MOSFET heat sink, characterized in that, The aforementioned MOSFET heat sink includes: A base assembly (1) is provided with a first mounting groove (101); Heat dissipation assembly (2), which is disposed on the base assembly (1), and the heat dissipation assembly (2) is provided with a plurality of first heat dissipation channels (201), a plurality of second heat dissipation channels (202) and a third heat dissipation channel (203); Pins (3) are disposed on the base assembly (1) and / or the heat dissipation assembly (2).

2. The MOS transistor heat sink according to claim 1, characterized in that, The base assembly (1) includes a base (11) and support blocks (12). There are multiple support blocks (12), which are disposed on the base (11) and located on both sides of the base (11). The base (11) is provided with mounting holes (103) and grooves (102). The multiple support blocks (12) and the base (11) enclose each other to form the first mounting groove (101). The first mounting groove (101) is used to install MOS transistors (7). The heat dissipation assembly (2) is disposed on the base (11).

3. The MOS transistor heat sink according to claim 1, characterized in that, The heat dissipation assembly (2) includes a first heat sink (21), a second heat sink (22), and a third heat dissipation assembly (23). There are multiple first heat sinks (21), which are disposed on both sides of the base assembly (1). There are multiple second heat sinks (22), which are disposed on the base assembly (1). The first heat sinks (21) and the second heat sinks (22) are spaced apart to form a first heat dissipation channel (201). The third heat dissipation assembly (23) is disposed on the base assembly (1). The third heat dissipation assembly (23) and the second heat sinks (22) are spaced apart to form a second heat dissipation channel (202). The third heat dissipation assembly (23) is provided with the third heat dissipation channel (203).

4. The MOS transistor heat sink according to claim 3, characterized in that, The third heat dissipation component (23) includes a third heat sink (231) and a reinforcing block (232). There are multiple third heat sinks (231), which are disposed on the base assembly (1) and form the third heat dissipation channel (203). The reinforcing block (232) is sandwiched between the multiple third heat sinks (231).

5. The MOS transistor heat sink according to claim 1, characterized in that, It also includes a mounting sleeve (4), which is disposed on the base assembly (1) and is used to store the locking screws for fixing the MOS tube (7).

6. A circuit component, characterized in that, The circuit components include: The MOS transistor heat sink according to any one of claims 1 to 5; A grille-type heat sink (100) is provided opposite to the MOS tube heat sink, and the grille-type heat sink (100) is provided with a second mounting slot (501) and a third mounting slot (502). MOS transistor (7), the number of MOS transistors (7) is multiple, one MOS transistor (7) is disposed on the first mounting slot (101) of the MOS transistor heat sink, and multiple MOS transistors (7) are disposed on the second mounting slot (501) and the third mounting slot (502) of the grille heat sink (100); Circuit board (8), the pin (3) of the MOS tube heat sink is inserted through the circuit board (8), and the grid heat sink (100) is disposed on the circuit board (8); Electronic component (9) is disposed on the circuit board (8).

7. The circuit assembly according to claim 6, characterized in that, The grille-type heat sink (100) includes a mounting assembly (5) and a heat exchange assembly (6). The heat exchange assembly (6) is disposed on the mounting assembly (5). The mounting assembly (5) is disposed on the circuit board (8). The mounting assembly (5) is provided with a second mounting slot (501) and a third mounting slot (502). A plurality of MOS transistors (7) are disposed on the mounting assembly (5).

8. The circuit assembly according to claim 7, characterized in that, The mounting assembly (5) includes a fixing plate (51) and a mounting plate (52). There are multiple mounting plates (52), which are spaced apart along the length of the fixing plate (51). The fixing plate (51) is mounted on the circuit board (8).

9. The circuit assembly according to claim 7, characterized in that, The heat exchange assembly (6) includes a first heat exchange assembly (61) and a third heat exchange plate (62). The first heat exchange assembly (61) is disposed on one side of the mounting assembly (5). The first heat exchange assembly (61) is provided with a plurality of fourth heat dissipation channels (601) and a plurality of fifth heat dissipation channels (602). The number of the third heat exchange plates (62) is plurality of, and the plurality of third heat exchange plates (62) are spaced apart on the other side of the mounting assembly (5) to form a sixth heat dissipation channel (603).

10. The circuit assembly according to claim 9, characterized in that, The first heat exchange assembly (61) includes a first heat exchange plate (611), a second heat exchange plate (612), and an extension member (613). There are multiple first heat exchange plates (611), which are spaced apart along the length of the mounting assembly (5) to form multiple fourth heat dissipation channels (601). There are multiple second heat exchange plates (612), which are disposed at both ends of the mounting assembly (5) and are spaced apart to form multiple fifth heat dissipation channels (602). There are multiple extension members (613), which are disposed one-to-one on the multiple second heat exchange plates (612).

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