Radiator structure for electronic product

Abstract

The utility model belongs to the technical field of heat dissipation of electronic products, and particularly discloses a radiator structure for electronic products, which comprises a product body, a heat source part is arranged in the product body, a fan is fixedly mounted in the product body, a built-in cold plate is attached to the outer surface of the heat source part, and the built-in cold plate is fixedly mounted in the product body. A heat conducting piece is arranged on the outer surface of the built-in cold plate, air holes are formed in the position, close to the fan, of the outer surface of the product body, and an inner heat dissipation mechanism is arranged in the product body. According to the radiator structure for the electronic product, the vortex tube technology is utilized, cold airflow and hot airflow are directly generated through the rotating separation effect of airflow in the vortex tube, the cold airflow generated through the physical effect directly acts on a cold plate near a heat source and an external cold box, heat can be taken away more quickly and more effectively, the radiating efficiency is improved, and the heat dissipation efficiency is improved. Compared with a complex water cooling system, the vortex tube heat dissipation system is simpler in structure, and potential safety hazards such as liquid leakage are reduced.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic products, specifically a heat sink structure for electronic products. Background Technology

[0002] Industrial electronic devices need to meet both performance and environmental adaptability requirements. In particular, the performance of electronic devices will drop sharply or even become unusable at high temperatures, so good heat dissipation design is required.

[0003] Existing heat dissipation methods for electronic products are mainly divided into two types: air cooling and water cooling. However, the effectiveness of active air cooling and water cooling is greatly reduced at high temperatures. Furthermore, due to their complex structure, water cooling systems are prone to leakage during the heat dissipation process, posing certain safety hazards. Utility Model Content

[0004] In view of this, the purpose of this utility model is to overcome the shortcomings of the prior art and propose a heat sink structure for electronic products to solve the problems existing in the prior art.

[0005] To achieve the above objectives, this utility model provides a heat sink structure for electronic products, including a product body. A heat source is disposed within the product body, and a fan is fixedly installed inside the product body. An internal cold plate is attached to the outer surface of the heat source, and a heat-conducting fin is disposed on the outer surface of the internal cold plate. Air vents are disposed on the outer surface of the product body near the fan. An internal heat dissipation mechanism is disposed inside the product body, and an external heat dissipation mechanism is disposed on the outer surface of the product body. The end of the heat-conducting fin away from the internal cold plate faces the airflow outlet of the fan, and the air vents are designed to better allow the fan to draw in airflow.

[0006] Preferably, the internal heat dissipation mechanism includes a first vortex tube disposed inside the product body. The output end of the first vortex tube is fixedly connected to a first cold pipe. The heat source is generally a high-energy-consuming component such as a power supply, which generates a large amount of heat. The internal heat dissipation mechanism can dissipate heat from the part of the product inside that is close to the heat source.

[0007] Preferably, the external heat dissipation mechanism includes an external cold box fixedly installed on the back of the product body, and the interior of the external cold box is provided with a second vortex tube, which can dissipate heat from the back of the product through the external heat dissipation mechanism.

[0008] Preferably, the output end of the second vortex tube is fixedly connected to a second cold pipe, and fins are provided inside both the first and second cold pipes, with the fins arranged throughout the entire first and second cold pipes.

[0009] Preferably, the first vortex tube and the second vortex tube are fixedly connected to an air inlet pipe, the first vortex tube and the second vortex tube are provided with a cold air outlet, and the end of the first vortex tube and the second vortex tube away from the cold air outlet is provided with a hot air outlet.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] 1. This heat sink structure for electronic products utilizes vortex tube technology. Through the rotational separation effect of airflow within the vortex tube, it directly generates cold and hot airflows. The cold airflow generated by this physical effect directly acts on the cold plate near the heat source and the external cold box, which can remove heat more quickly and effectively, improving heat dissipation efficiency. Compared with complex water cooling systems, the vortex tube heat dissipation system has a simpler structure and reduces safety hazards such as leakage.

[0012] 2. This heat sink structure for electronic products effectively increases the heat dissipation area by incorporating fins inside the cold pipes. This allows the cool airflow to make more thorough contact with the cold pipes and carry away heat, further enhancing the heat dissipation effect. This design enables the system to achieve higher heat dissipation capacity within a limited space. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this application;

[0014] Figure 2 This is a schematic diagram of the internal structure of the external cold box in this application;

[0015] Figure 3 This is a schematic diagram of the internal structure of the product body in this application;

[0016] Figure 4 This is a schematic diagram of the internal structure of the first and second cold pipes in this application;

[0017] Figure 5 This is a schematic diagram of the cross-sectional structure of the vortex tube in this application.

[0018] The components are: 1. Product body; 2. Heat source; 3. Fan; 4. Heat-conducting plate; 5. Built-in cold plate; 6. Air vent; 7. First vortex tube; 8. First cold pipe; 9. External cold box; 10. Second vortex tube; 11. Second cold pipe; 12. Fins; 13. Air inlet pipe; 14. Cold air outlet; 15. Hot air outlet. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] Please see Figure 1-5 A heat sink structure for electronic products includes a product body 1, a heat source part 2 inside the product body 1, a fan 3 fixedly installed inside the product body 1, an internal cold plate 5 attached to the outer surface of the heat source part 2, a heat-conducting sheet 4 on the outer surface of the internal cold plate 5, a vent 6 on the outer surface of the product body 1 near the fan 3, an internal heat dissipation mechanism inside the product body 1, and an external heat dissipation mechanism on the outer surface of the product body 1.

[0021] Through the above technical solution, after the airflow enters the vortex tube through the air inlet pipe 13, part of it forms a cold airflow that is input into the cold pipe from the cold air outlet 14, and the other part forms a hot airflow that is discharged from the hot air outlet 15. The cold pipe is in large-area contact with the built-in cold plate 5 and the external cold box 9, so it can simultaneously dissipate heat inside and outside the product.

[0022] Specifically, the internal heat dissipation mechanism includes a first vortex tube 7 disposed inside the product body 1, and the output end of the first vortex tube 7 is fixedly connected to a first cold pipe 8.

[0023] Through the above technical solution, the cold airflow discharged from the first vortex tube 7 is input into the first cold pipe 8. The first cold pipe 8 is laid over a large area and connected to the built-in cold plate 5, so the heat can be carried away and dissipated.

[0024] Specifically, the external heat dissipation mechanism includes an external cold box 9 fixedly installed on the back of the product body 1, and a second vortex tube 10 is provided inside the external cold box 9.

[0025] Through the above technical solution, the external cold box 9 is set on the back of the product body 1. It has excellent thermal conductivity and can conduct a large amount of heat generated by the product body 1 to the surface of the external cold box 9.

[0026] Specifically, the output end of the second vortex tube 10 is fixedly connected to the second cold tube 11, and fins 12 are provided inside both the first cold tube 8 and the second cold tube 11.

[0027] Through the above technical solution, the interior of the first cold pipe 8 and the second cold pipe 11 is provided with rows of longitudinal fins 12. These fins 12 can significantly increase the surface area of ​​the pipe wall, so that the cold airflow can come into more full contact with the pipe wall when it flows through the pipe, thereby improving the heat exchange efficiency.

[0028] Specifically, the first vortex tube 7 and the second vortex tube 10 are fixedly connected to the air inlet end by an air inlet pipe 13, the first vortex tube 7 and the second vortex tube 10 are provided with a cold air outlet end 14, and the end of the first vortex tube 7 and the second vortex tube 10 away from the cold air outlet end 14 is provided with a hot air outlet end 15.

[0029] Through the above technical solution, the cold air outlet 14 of the first vortex tube 7 is connected to the first cold pipe 8, which allows the cold air discharged from the first vortex tube 7 to be smoothly input into the first cold pipe 8, and the cold air outlet 14 of the second vortex tube 10 is connected to the second cold pipe 11, which allows the cold air discharged from the second vortex tube 10 to be smoothly input into the second cold pipe 11.

[0030] Working principle: During use, the heat source 2 of the electronic product body 1 generates a large amount of heat (due to the operation of high-energy-consuming components). This heat is transferred to the built-in cold plate 4, and then partially transferred to the heat-conducting plate 5. The fan 3, when turned on, dissipates the heat on the heat-conducting plate 5 through the air vents 6. Simultaneously, high-pressure airflow is injected into the first vortex tube 7 and the second vortex tube 10. After compressed air enters the two sets of vortex tubes tangentially from the intake pipe 13, the airflow begins to rotate at high speed, forming a vortex. During the vortex process, gas molecules separate due to centrifugal force. The two airflows, an inner ring and an outer ring, are formed. The inner ring airflow loses energy and its temperature decreases during rotation, forming a cold airflow, while the outer ring airflow gains energy and its temperature increases, forming a hot airflow. The hot airflow generated by both sets of vortex tubes is discharged from the hot air outlet 15, while the cold airflow generated by the first vortex tube 7 is input into the first cold pipe 8 through the cold air outlet 14, and the cold airflow generated by the second vortex tube 10 is input into the second cold pipe 11 through the cold air outlet 14. With the fins 12 set inside the first cold pipe 8 and the second cold pipe 11, the heat dissipation area can be effectively increased, thereby carrying away and dissipating the heat that comes into contact with and is absorbed by the cold pipe, achieving an effective heat dissipation effect.

[0031] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat sink structure for electronic products, comprising a product body (1), characterized in that: The product body (1) is provided with a heat source part (2), a fan (3) is fixedly installed inside the product body (1), an internal cold plate (5) is attached to the outer surface of the heat source part (2), a heat-conducting plate (4) is provided on the outer surface of the internal cold plate (5), a vent (6) is provided on the outer surface of the product body (1) near the fan (3), an internal heat dissipation mechanism is provided inside the product body (1), and an external heat dissipation mechanism is provided on the outer surface of the product body (1).

2. The heat sink structure for electronic products according to claim 1, characterized in that: The internal heat dissipation mechanism includes a first vortex tube (7) disposed inside the product body (1), and the output end of the first vortex tube (7) is fixedly connected to a first cold pipe (8).

3. A heat sink structure for electronic products according to claim 2, characterized in that: The external heat dissipation mechanism includes an external cold box (9) fixedly installed on the back of the product body (1), and a second vortex tube (10) is provided inside the external cold box (9).

4. A heat sink structure for electronic products according to claim 3, characterized in that: The output end of the second vortex tube (10) is fixedly connected to the second cold tube (11), and fins (12) are provided inside both the first cold tube (8) and the second cold tube (11).

5. A heat sink structure for electronic products according to claim 3, characterized in that: The first vortex tube (7) and the second vortex tube (10) are fixedly connected to the air inlet pipe (13). The first vortex tube (7) and the second vortex tube (10) are provided with a cold air outlet (14). The end of the first vortex tube (7) and the second vortex tube (10) away from the cold air outlet (14) is provided with a hot air outlet (15).

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