Cold plate assembly and server

Abstract

The cold plate assembly comprises a heat exchange layer, a soaking layer and a liquid injection part, the heat exchange layer is provided with a first side and a second side which are arranged oppositely, a heat exchange groove is formed in the first side, and the second side is used for being in heat transfer connection with a heating element; the heat equalizing layer is arranged on the first side and provided with a flow equalizing channel and at least two liquid inlets, the medium flowing direction of the flow equalizing channel is parallel to the plane where the heat exchange layer is located, and the at least two liquid inlets communicate with the flow equalizing channel and are arranged at intervals in the medium flowing direction of the flow equalizing channel. The flow equalizing channel can be communicated with the heat exchange groove through the liquid inlet; the liquid injection part is arranged on the soaking layer and communicates with the flow equalizing channel. Compared with the prior art, the cold plate assembly has the advantages that the flow distribution of the cooling medium can be optimized, the heat dissipation uniformity of the cold plate assembly is improved, and the overall heat dissipation capability of the cold plate assembly is further improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of servers, in particular to a cold plate assembly and a server. BACKGROUND

[0002] A server is internally integrated with a large number of high-power electronic components, such as a central processing unit (CPU), a graphics processing unit (GPU), a memory module, a hard disk and the like. As the power consumption of these electronic components is higher and higher, the server generates more and more heat when running. When the temperature inside the server exceeds the tolerance threshold of the electronic components, not only will the operation efficiency of the server be reduced, the running will be stalled and the like, but also serious problems such as data loss will occur.

[0003] In the conventional technology, a liquid cooling method is usually used to dissipate heat from the electronic components inside the server. However, for high-power electronic components such as CPUs, the heat dissipation effect of the conventional liquid cooling method cannot meet the heat dissipation needs, thereby affecting the normal operation of the server. SUMMARY

[0004] Therefore, it is necessary to provide a cold plate assembly and a server in order to solve the problem that the heat dissipation effect of the liquid cooling method in the conventional technology cannot meet the heat dissipation needs of the server, thereby affecting the normal operation of the server.

[0005] The technical scheme is as follows:

[0006] One embodiment provides a cold plate assembly, comprising:

[0007] a heat exchange layer, the heat exchange layer having a first side and a second side arranged opposite to each other, the first side being provided with a heat exchange groove, and the second side being used for heat transfer connection with a heat generating component;

[0008] a heat equalization layer, the heat equalization layer being arranged on the first side, the heat equalization layer being provided with a flow equalization channel and a liquid inlet, a medium flow direction of the flow equalization channel being parallel to a plane in which the heat exchange layer is arranged, the liquid inlet being provided with at least two, the at least two liquid inlets being in communication with the flow equalization channel and being arranged in a spaced manner along the medium flow direction of the flow equalization channel, so that the flow equalization channel can be in communication with the heat exchange groove through the liquid inlet; and

[0009] a liquid injection part, the liquid injection part being arranged on the heat equalization layer and being in communication with the flow equalization channel.

[0010] The cooling medium enters the flow equalization channel through the liquid injection part, and then enters the heat exchange groove of the heat exchange layer through the liquid inlet. The heat of the heat generating element is transferred from the second side to the first side of the heat exchange layer, so that heat exchange with the cooling medium in the heat exchange groove is generated to cool the heat generating element. During the process, the projection of the flow equalization channel towards the second side at least partially overlaps with the projection of the heat exchange groove towards the second side, so that the cooling medium can be distributed in different areas of the heat exchange groove. The liquid inlets are spaced along the medium flow direction of the flow equalization channel, so that the cooling medium entering the heat exchange groove through the liquid inlets can be distributed in at least two areas of the heat exchange groove to prevent local heat accumulation. Compared with the traditional technology, the cooling plate assembly can optimize the flow distribution of the cooling medium, improve the heat dissipation uniformity of the cooling plate assembly, and further improve the overall heat dissipation capacity of the cooling plate assembly.

[0011] In one of the embodiments, the cooling plate assembly further comprises a liquid discharge part, the heat equalization layer is further provided with a liquid discharge channel and a liquid outlet, the medium flow direction of the liquid discharge channel is parallel to the plane where the heat exchange layer is located, the liquid outlet is provided with at least two, and the at least two liquid outlets are in communication with the liquid discharge channel and are spaced along the medium flow direction of the liquid discharge channel, so that the heat exchange groove can be in communication with the liquid discharge channel through the liquid outlet, and the liquid discharge part is arranged on the heat equalization layer and is in communication with the liquid discharge channel.

[0012] In one of the embodiments, the medium flow direction of the flow equalization channel and the medium flow direction of the liquid discharge channel are both arranged along the first direction of the cooling plate assembly, the flow equalization channel is provided with at least two, the liquid discharge channel is provided with at least two, the flow equalization channel and the liquid discharge channel are alternately arranged along the second direction of the cooling plate assembly, and the second direction is at an angle with the first direction.

[0013] In one of the embodiments, the heat equalization layer is further provided with a first liquid collecting cavity and a second liquid collecting cavity, the first liquid collecting cavity is located on one side of the flow equalization channel along the first direction, the second liquid collecting cavity is located on the other side of the flow equalization channel along the first direction, the first liquid collecting cavity is in communication with the liquid injection part, the second liquid collecting cavity is in communication with the liquid discharge part, at least two flow equalization channels are in communication with the first liquid collecting cavity, and at least two liquid discharge channels are in communication with the second liquid collecting cavity.

[0014] In one of the embodiments, the cooling plate assembly further comprises a partitioning member, the partitioning member is arranged in the heat exchange groove to divide the heat exchange groove into at least two heat exchange spaces, the heat exchange space is in communication with at least one liquid inlet, and the heat exchange space is in communication with at least one liquid outlet.

[0015] In one of the embodiments, the liquid outlet is located at the joint of at least two adjacent heat exchange spaces, so that the liquid outlet can communicate with at least two adjacent heat exchange spaces.

[0016] In one of the embodiments, the cold plate assembly further comprises a heat dissipation fin connected with the bottom wall of the heat exchange groove.

[0017] In one of the embodiments, the heat dissipation fin comprises a fin needle, the fin needle is provided with at least two fin needles and is spaced apart in the heat exchange groove, one end of the fin needle is connected with the bottom wall of the heat exchange groove, and the other end of the fin needle is arranged towards the uniform heating layer.

[0018] In one of the embodiments, the uniform heating layer comprises a uniform heating plate and a cover plate, one side of the uniform heating plate is arranged at the first side, the other side of the uniform heating plate is provided with a uniform flow groove and a liquid discharge groove, at least two liquid inlets are arranged on the bottom wall of the uniform flow groove, at least two liquid outlets are arranged on the bottom wall of the heat exchange groove, the cover plate is arranged on the side of the uniform heating plate away from the first side, the cover plate and the uniform flow groove form the uniform flow channel, and the cover plate and the liquid discharge groove form the liquid discharge channel.

[0019] Another embodiment provides a server, the server comprises a cabinet, a heat generating element and a cold plate assembly as described above, the heat generating element and the cold plate assembly are arranged in the cabinet.

[0020] In the server, the cooling medium enters the uniform flow channel through the liquid injection part, the cooling medium in the uniform flow channel enters the heat exchange groove of the heat exchange layer through the liquid inlet, the heat of the heat generating element is transmitted from the second side to the first side of the heat exchange layer, so that heat exchange with the cooling medium in the heat exchange groove is generated to achieve cooling of the heat generating element. In this process, since the projection of the uniform flow channel towards the second side and the projection of the heat exchange groove towards the second side at least partially overlap, the cooling medium can be distributed in different areas of the heat exchange groove. Since the liquid inlets are spaced apart along the medium flow direction of the uniform flow channel, the cooling medium entering the heat exchange groove through the liquid inlets can be distributed in at least two areas of the heat exchange groove, preventing the phenomenon of local heat accumulation. Compared with the traditional technology, the server can optimize the flow distribution of the cooling medium, improve the heat dissipation uniformity of the cold plate assembly, and further improve the overall heat dissipation capacity of the server. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating any creative labor.

[0022] Figure 1 Structure diagram of a cold plate assembly in an embodiment of the present application.

[0023] Figure 2 Explosion diagram of a cold plate assembly in an embodiment of the present application.

[0024] Figure 3 Structure diagram of a heat exchange layer in an embodiment of the present application.

[0025] Figure 4 Structure diagram of a heat equalization layer in an embodiment of the present application.

[0026] Figure 5 Flow direction diagram of a cooling medium in a heat exchange layer in an embodiment of the present application.

[0027] Figure 6 Flow direction diagram of a cooling medium in a heat equalization layer in an embodiment of the present application.

[0028] BRIEF DESCRIPTION OF DRAWINGS

[0029] 100, heat exchange layer; 110, first side; 120, second side; 130, heat exchange groove; 131, heat exchange space; 200, heat equalization layer; 210, flow equalization channel; 211, flow equalization groove; 220, liquid inlet; 230, liquid outlet channel; 231, liquid outlet groove; 240, liquid outlet; 250, first liquid collection cavity; 251, first liquid collection groove; 260, second liquid collection cavity; 261, second liquid collection groove; 271, heat equalization plate; 272, cover plate; 310, liquid injection portion; 320, liquid discharge portion; 400, heat generating element; 500, PCB; 600, partition; 700, heat dissipation fin; 710, fin needle. DETAILED DESCRIPTION

[0030] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described and it is therefore contemplated to cover all such modifications as fall within the scope of the application. It should be noted that the specific embodiments of the present application do not limit the scope of the present application.

[0031] In the description of the application, it should be understood that, if there are these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0032] In addition, if there are these terms "first", "second", these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0033] In this application, unless otherwise explicitly specified and limited, if there are terms such as "mounting", "connecting", "connecting", "fixing" and the like, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0034] In this application, unless otherwise explicitly specified and limited, if there are similar descriptions such as "first feature on" or "below" the second feature, the meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0035] It is to be noted that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In addition, it is to be understood that when a layer is referred to as being "connected", "coupled", or "adjacent" to another element, it can be directly connected, coupled, or adjacent to the other element, or intervening elements can also be present. As used herein, the term "vertical", "horizontal", "upper", "lower", "left", "right", and the like are merely used for the purpose of illustration and do not indicate an absolute orientation.

[0036] Referring to Figure 1 , Figure 2 and Figure 4 , one embodiment of the present application provides a cold plate assembly, comprising a heat exchange layer 100, a uniform heating layer 200, and a liquid injection part 310, the heat exchange layer 100 has a first side 110 and a second side 120 arranged oppositely, the first side 110 is provided with a heat exchange groove 130, and the second side 120 is used for heat transfer connection with a heating element 400; the uniform heating layer 200 is arranged on the first side 110, the uniform heating layer 200 is provided with a uniform flow channel 210 and a liquid inlet 220, the medium flow direction of the uniform flow channel 210 is parallel to the plane where the heat exchange layer 100 is located, and the liquid inlet 220 is provided with at least two, the at least two liquid inlets 220 are communicated with the uniform flow channel 210 and are arranged in a spaced manner along the medium flow direction of the uniform flow channel 210, so that the uniform flow channel 210 can be communicated with the heat exchange groove 130 through the liquid inlet 220; and the liquid injection part 310 is arranged on the uniform heating layer 200 and is communicated with the uniform flow channel 210.

[0037] The cooling medium enters the uniform flow channel 210 through the liquid injection part 310, and the cooling medium in the uniform flow channel 210 enters the heat exchange groove 130 of the heat exchange layer 100 through the liquid inlet 220, and the heat of the heating element 400 is transferred from the second side 120 to the first side 110 of the heat exchange layer 100, so as to exchange heat with the cooling medium in the heat exchange groove 130, so as to realize cooling of the heating element 400. In this process, since the medium flow direction of the uniform flow channel 210 is parallel to the plane where the heat exchange layer 100 is located, the cooling medium can be distributed in different areas of the heat exchange groove 130, and since the liquid inlets 220 are arranged in a spaced manner along the medium flow direction of the uniform flow channel 210, the cooling medium entering the heat exchange groove 130 through the liquid inlets 220 can be distributed in at least two areas in the heat exchange groove 130, so as to prevent the phenomenon of local heat accumulation; compared with the prior art, the cold plate assembly can optimize the flow distribution of the cooling medium, improve the heat dissipation uniformity of the cold plate assembly, and further improve the overall heat dissipation capacity of the cold plate assembly.

[0038] Optionally, the uniform flow channel 210 can be coiled on the uniform heating layer 200, can extend in a certain direction, and can be bent, as long as it can cover the heat exchange groove 130 to improve the uniformity of the cooling medium entering the heat exchange groove 130, and the specific limitation is not made here.

[0039] For example, the cooling medium can be selected from liquid media such as water and fluorinated liquid.

[0040] Referring to Figure 2 In some embodiments, the heat exchange layer 100 and the uniform heating layer 200 are in a plate shape, the uniform flow channel 210 is arranged in the uniform heating layer 200 in a plate shape, and the medium flow direction of the uniform flow channel 210 is parallel to the plane on which the heat exchange layer 100 in a plate shape is arranged.

[0041] In some embodiments, the liquid inlet 220 is provided with a plurality of liquid inlets and is arranged towards the heat exchange groove 130, so that the cooling medium can directly enter the heat exchange groove 130 through the liquid inlet 220, reducing the energy loss of the cooling medium in the flow process.

[0042] Referring to Figure 1 , Figure 2 and Figures 4 to 6 In one embodiment, the cold plate assembly further comprises a liquid discharge portion 320, the uniform heating layer 200 is further provided with a liquid discharge channel 230 and a liquid outlet 240, the medium flow direction of the liquid discharge channel 230 is parallel to the plane on which the heat exchange layer 100 is arranged, the liquid outlet 240 is provided with at least two liquid outlets, the at least two liquid outlets 240 are in communication with the liquid discharge channel 230 and are arranged in the medium flow direction of the liquid discharge channel 230, so that the heat exchange groove 130 can be in communication with the liquid discharge channel 230 through the liquid outlet 240, and the liquid discharge portion 320 is arranged in the uniform heating layer 200 and is in communication with the liquid discharge channel 230.

[0043] The cooling medium enters the uniform flow channel 210 through the liquid injection portion 310, and then enters the heat exchange groove 130 through the liquid inlet 220, so as to absorb the heat generated by the heat generating element 400 and be heated. The heated cooling medium enters the liquid discharge channel 230 through the liquid outlet 240, and then is discharged from the cold plate assembly through the liquid discharge portion 320, so as to realize the circulating cooling of the heat generating element 400; the medium flow direction of the liquid discharge channel 230 is parallel to the plane on which the heat exchange layer 100 is arranged, and the liquid outlet 240 is arranged in the medium flow direction of the liquid discharge channel 230, so that the heat-exchanged cooling medium can be discharged more uniformly from the liquid outlet 240 which is closer, preventing the heat-exchanged cooling medium from being accumulated locally in the heat exchange groove 130, thereby improving the heat dissipation uniformity of the cold plate assembly and improving the overall heat dissipation efficiency of the cold plate assembly.

[0044] Optionally, the liquid discharge channel 230 can be coiled, extended in a certain direction, or bent, as long as it covers the heat exchange groove 130 to improve the uniformity of the cooling medium flowing out of the heat exchange groove 130, which is not limited here.

[0045] Further, the projection of the liquid discharge channel 230 toward the heat exchange layer 100 does not coincide with the projection of the flow uniformization channel 210 toward the heat exchange layer 100, so as to avoid unnecessary heat transfer between the cooling medium in the flow uniformization channel 210, the cooling medium in the liquid discharge channel 230, and the cooling medium in the heat exchange groove 130.

[0046] In some embodiments, the liquid outlet 240 is provided with multiple liquid outlets and is arranged toward the heat exchange groove 130, so that the cooling medium in the heat exchange groove 130 can directly enter the liquid discharge channel 230 through the liquid outlet 240, thereby improving the discharge efficiency of the cooling medium.

[0047] Please refer to Figure 2 and Figure 4 In one embodiment, the medium flow direction of the flow uniformization channel 210 and the medium flow direction of the liquid discharge channel 230 both extend along a first direction of the cold plate assembly, the flow uniformization channel 210 is provided with at least two, the liquid discharge channel 230 is provided with at least two, and the flow uniformization channel 210 and the liquid discharge channel 230 are alternately arranged along a second direction of the cold plate assembly, the second direction being at an angle to the first direction.

[0048] The medium flow direction of the at least two flow uniformization channels 210 and the medium flow direction of the at least two liquid discharge channels 230 both extend along a first direction of the cold plate assembly, and the flow uniformization channel 210 and the liquid discharge channel 230 are alternately arranged along a second direction of the cold plate assembly, so as to not only improve the uniformity of the cooling medium in the process of entering and exiting the heat exchange groove 130, but also improve the space utilization of the heat uniformization layer 200, so as to further optimize the flow distribution of the cooling medium and improve the overall heat dissipation capacity of the cold plate assembly.

[0049] Further, the flow uniformization channel 210 and the liquid discharge channel 230 both extend along a straight line.

[0050] As an explanation, the first direction in the above embodiments is the length direction of the cold plate assembly (i.e., the A direction in Figure 2 and Figure 4 The second direction in the above embodiments is the width direction of the cold plate assembly (i.e., the B direction in Figure 2 and Figure 4 which will not be described here.

[0051] Further, the first direction and the second direction are perpendicular, and both the first direction and the second direction are parallel to the plane in which the heat exchange layer 100 is located.

[0052] Referring to Figure 2 and Figure 4 In one embodiment, the heat uniformization layer 200 is further provided with a first liquid collecting cavity 250 and a second liquid collecting cavity 260, the first liquid collecting cavity 250 is located at one side of the flow uniformization channel 210 along the first direction, the second liquid collecting cavity 260 is located at the other side of the flow uniformization channel 210 along the first direction, the first liquid collecting cavity 250 is in communication with the liquid injection part 310, the second liquid collecting cavity 260 is in communication with the liquid discharge part 320, at least two flow uniformization channels 210 are in communication with the first liquid collecting cavity 250, and at least two liquid discharge channels 230 are in communication with the second liquid collecting cavity 260.

[0053] In this way, the cooling medium can first enter the first liquid collecting cavity 250 through the liquid injection part 310, and then enter each flow uniformization channel 210 through the first liquid collecting cavity 250, so as to avoid the phenomenon that the flow of the cooling medium in some flow uniformization channels 210 is too large and the flow of the cooling medium in some flow uniformization channels 210 is too small due to the flow direction and pressure difference of the cooling medium, and to improve the flow uniformity of the cooling medium. In addition, the first liquid collecting cavity 250 and the second liquid collecting cavity 260 can also play a role of "pressure stabilization and buffering" for the flowing cooling medium. After the cooling medium enters the first liquid collecting cavity 250 and the second liquid collecting cavity 260, it will first release pulse energy in the first liquid collecting cavity 250 and the second liquid collecting cavity 260, and then enter the flow uniformization channel 210 and the liquid discharge part 320 with stable pressure, respectively, so as to reduce the resistance of the cooling medium in the flow and improve the operating efficiency of the cold plate assembly.

[0054] In addition, the first liquid collecting cavity 250 is arranged at one side of the flow uniformization channel 210 along the first direction, and the second liquid collecting cavity 260 is arranged at the other side of the flow uniformization channel 210 along the first direction, so as to make the first liquid collecting cavity 250 and the second liquid collecting cavity 260 as far away from each other as possible, to prevent the unheated cooling medium and the heated cooling medium from transferring heat to each other and affecting the cooling effect on the heat generating element 400, to improve the space utilization rate of the heat uniformization layer 200, and to further optimize the spatial layout of the heat uniformization layer 200.

[0055] Referring to Figure 3 In one embodiment, the cold plate assembly further comprises a partition member 600 arranged in the heat exchange groove 130 to divide the heat exchange groove 130 into at least two heat exchange spaces 131, the heat exchange space 131 is in communication with at least one liquid inlet 220, and the heat exchange space 131 is in communication with at least one liquid outlet 240.

[0056] The heat exchange tank 130 is divided to form at least two heat exchange spaces 131 with smaller areas, so as to avoid the situation that the cooling medium forms a region with lower flow rate due to too long flow path or uneven resistance in the heat exchange tank 130, thereby affecting the heat dissipation capacity of the region, avoiding heat accumulation, and improving the heat dissipation uniformity and efficiency of the cold plate assembly on the heat generating element 400.

[0057] In some embodiments, the partition member 600 is in the form of a plate and is vertically arranged in the heat exchange tank 130 to divide the heat exchange tank 130 into at least two heat exchange spaces 131.

[0058] In Figure 3 In the illustrated embodiment, the partition member 600 is in the form of a cross to divide the heat exchange tank 130 into nine heat exchange spaces 131; in other embodiments, the partition member 600 can also be in the form of a straight line, a cross, etc., and multiple partition members 600 can be provided, which can be flexibly arranged according to actual needs to form heat exchange spaces 131 with different shapes and numbers, which are not specifically limited here.

[0059] Please refer to Figures 2 to 4 and Figures 5 to 6 In one embodiment, the liquid inlet 220 is arranged one-to-one with the heat exchange spaces 131, and the liquid inlet 220 is located at the middle part of the heat exchange space 131. In this way, when the cooling medium enters the heat exchange space 131 through the liquid inlet 220, the cooling medium can flow from the middle part of the heat exchange space 131 to the periphery, improving the consistency of flow resistance in each heat exchange space 131, so that the temperature rise of the cooling medium is more uniform, the overall temperature difference of the cold plate assembly is smaller, and the heat dissipation effect is enhanced.

[0060] As an explanation, Figure 5 and Figure 6 The direction of the arrow in the figure is the flow direction of the cooling medium, wherein the solid arrow represents the flow direction of the cooling medium without heat exchange, and the dashed arrow represents the flow direction of the cooling medium after heat exchange, which will not be described here.

[0061] Please refer to Figures 2 to 4 In one embodiment, the liquid outlet 240 is located at the junction of at least two adjacently arranged heat exchange spaces 131, so that the liquid outlet 240 can communicate with at least two adjacently arranged heat exchange spaces 131.

[0062] The cooling medium in the adjacent heat exchange spaces 131 can be discharged from the same liquid outlet 240 after heat absorption, so as to simplify the structure of the heat equalizing layer 200 and reduce the possibility of assembly error.

[0063] Please refer to Figure 3 and Figure 4In one embodiment, the partition 600 is in the shape of a cross to divide the heat exchange groove 130 into nine heat exchange spaces 131, and four adjacent heat exchange spaces 131 are combined into a cross shape. The liquid outlet 240 is located at the junction of the four adjacent heat exchange spaces 131, i.e., the C region in Figure 3 and Figure 5 , i.e., the middle junction of the four adjacent heat exchange spaces 131, so that the part of each heat exchange space 131 close to the corner can communicate with the liquid outlet 240. Similarly, the liquid outlet 240 can also be located at the junction of two adjacent heat exchange spaces 131, i.e., the D region in Figure 4 and Figure 6 , which will not be described here.

[0064] Please refer to Figure 2 and Figure 3 In one embodiment, the cold plate assembly further comprises a heat dissipation fin 700 connected with the bottom wall of the heat exchange groove 130.

[0065] The heat of the heat generating element 400 is transferred to the heat exchange layer 100 and to the heat dissipation fin 700. The heat dissipation fin 700 can increase the contact area with the cooling medium to improve the heat exchange efficiency, thereby improving the cooling effect of the heat generating element 400.

[0066] Optionally, the heat dissipation fin 700 can be in the shape of a flat, corrugated, jagged or needle-shaped fin, etc., as long as it can increase the heat dissipation area, which will not be specifically limited here.

[0067] Please refer to Figure 2 and Figure 3 In one embodiment, the heat dissipation fin 700 comprises a fin needle 710, which is provided with at least two and is spaced apart in the heat exchange groove 130. One end of the fin needle 710 is connected with the bottom wall of the heat exchange groove 130, and the other end of the fin needle 710 is arranged towards the heat equalization layer 200.

[0068] The fin needle 710 can not only increase the contact area with the cooling medium to improve the heat exchange efficiency, but also can weaken the thickness of the boundary layer of the cooling medium and increase the overall flow rate of the cooling medium when the cooling medium enters the heat exchange groove 130 from the liquid inlet 220 of the heat equalization layer 200, so that the cooling medium can impact on the fin needle 710 at a faster flow rate and then flow and diffuse in all directions. The fin needle 710 can weaken the thickness of the boundary layer of the cooling medium and increase the overall flow rate of the cooling medium to achieve impingement jet of the cooling medium and improve the heat exchange disturbance strength of the cold plate assembly, thereby further improving the heat exchange efficiency of the cold plate assembly.

[0069] Further, the cooling medium first impacts on the fin needle 710 and weakens its boundary layer to increase the flow rate, and then impacts on the bottom wall of the heat exchange groove 130 and changes its flow direction, thereby further destroying the boundary layer of the cooling medium to achieve the purpose of increasing the heat exchange capacity.

[0070] Referring to Figure 3 In one embodiment, a plurality of 710 fins are arranged in an array within each heat exchange space 131 to improve the heat exchange efficiency of the cold plate assembly.

[0071] Further, referring to Figures 5 to 6 The cooling medium enters the heat exchange space 131 through the liquid inlet 220 located in the middle of the heat exchange space 131, first hits the fin 710 and weakens its boundary layer to increase the flow rate, then hits the bottom wall of the heat exchange groove 130 and flows towards the boundary of the heat exchange space 131. The fin 710 can weaken the thickness of the boundary layer of the cooling medium and increase the overall flow rate of the cooling medium, thereby further improving the heat exchange efficiency of the cold plate assembly, and finally flows to the liquid outlet 240 located at the boundary of the heat exchange space 131 and flows out to take away the heat of the heat generating element 400.

[0072] Referring to Figure 1 and Figure 2 In one embodiment, the heat equalization layer 200 includes a heat equalization plate 271 and a cover plate 272. One side of the heat equalization plate 271 is provided on the first side 110. The other side of the heat equalization plate 271 is provided with a flow equalization groove 211 and a liquid discharge groove 231. At least two liquid inlets 220 are provided on the bottom wall of the flow equalization groove 211. At least two liquid outlets 240 are provided on the bottom wall of the heat exchange groove 130. The cover plate 272 is provided on the side of the heat equalization plate 271 away from the first side 110. The cover plate 272 and the flow equalization groove 211 form a flow equalization channel 210. The cover plate 272 and the liquid discharge groove 231 form a liquid discharge channel 230.

[0073] The cover plate 272 can be provided on the heat equalization plate 271 to form the flow equalization channel 210 and the liquid discharge channel 230 around the flow equalization groove 211 and the liquid discharge groove 231, respectively, for the flow of the cooling medium. At least two liquid inlets 220 are provided on the bottom wall of the flow equalization groove 211. At least two liquid outlets 240 are provided on the bottom wall of the heat exchange groove 130 to realize the communication of the liquid inlets 220 and the liquid outlets 240 with the heat exchange groove 130.

[0074] Further, the cover plate 272 is provided with a liquid injection port and a liquid discharge port. The liquid injection portion 310 is provided at the liquid injection port. The liquid discharge portion 320 is provided at the liquid discharge port to realize the flow of the cooling medium in the cold plate assembly.

[0075] Referring to Figure 2 and Figure 4 In one embodiment, the heat equalization plate 271 is provided with a first liquid collection groove 251 on one side along the first direction. The heat equalization plate 271 is provided with a second liquid collection groove 261 on the other side along the first direction. The first liquid collection groove 251 and the cover plate 272 form a first liquid collection chamber 250. The second liquid collection groove 261 and the cover plate 272 form a second liquid collection chamber 260.

[0076] Further, one side wall of the first liquid collecting groove 251 is communicated with the flow equalizing groove 211 to realize the communication between the first liquid collecting cavity 250 and the flow equalizing channel 210, and one side wall of the second liquid collecting groove 261 is communicated with the liquid discharging groove 231 to realize the communication between the second liquid collecting cavity 260 and the liquid discharging channel 230.

[0077] In one embodiment, the cover plate 272 is detachably connected with the vapor chamber 271, so as to facilitate the opening of the cover plate 272 for cleaning the flow equalizing groove 211 and the liquid discharging groove 231.

[0078] Optionally, the cover plate 272 and the vapor chamber 271 can be connected by screwing, pin connection or the like, so as to realize the detachable connection therebetween.

[0079] In one embodiment, the liquid injection part 310 comprises a liquid injection pipe, and the liquid discharging part 320 comprises a liquid discharging pipe. The cooled cooling medium is discharged through the liquid discharging pipe and is cooled by an external heat dissipation device. The cooled cooling medium enters the heat dissipation groove through the liquid injection pipe to cool the heat generating element 400. Such a cycle is repeated to cool the heat generating element 400.

[0080] Another embodiment provides a server, which comprises a case, a heat generating element 400 and a cold plate assembly as described above. The heat generating element 400 and the cold plate assembly are arranged in the case.

[0081] In the above-mentioned server, the cooling medium enters the flow equalizing channel 210 through the liquid injection part 310. The cooling medium in the flow equalizing channel 210 enters the heat exchange groove 130 of the heat exchange layer 100 through the liquid inlet 220. The heat of the heat generating element 400 is transferred from the second side 120 to the first side 110 of the heat exchange layer 100, so as to exchange heat with the cooling medium in the heat exchange groove 130 to cool the heat generating element 400. In this process, since the projection of the flow equalizing channel 210 towards the second side 120 at least partially overlaps with the projection of the heat exchange groove 130 towards the second side 120, the cooling medium can be distributed in different areas of the heat exchange groove 130. Since the liquid inlets 220 are arranged along the medium flow direction of the flow equalizing channel 210, the cooling medium entering the heat exchange groove 130 through the liquid inlets 220 can be distributed in at least two areas of the heat exchange groove 130, so as to prevent the local heat accumulation. Compared with the conventional technology, the above-mentioned server can optimize the flow distribution of the cooling medium, improve the heat dissipation uniformity of the cold plate assembly, and further improve the overall heat dissipation capacity of the server.

[0082] Please refer to Figure 1 and Figure 2In one embodiment, the server further comprises a circuit board, the heat generating element 400 is a central processing unit (CPU), the central processing unit is arranged on the circuit board, and the second side 120 of the cold plate assembly is arranged on a side of the central processing unit away from the circuit board.

[0083] It can be understood that, in other embodiments, the heat generating element 400 can also be a GPU, a hard disk, etc., which will not be described here.

[0084] The technical features of the above embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present disclosure.

[0085] The above embodiments only express several implementation manners of the present application, and the description is specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that, for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A cold plate assembly, characterized by, The cold plate assembly comprises: a heat exchange layer having a first side and a second side arranged oppositely, the first side being provided with a heat exchange groove, and the second side being used for heat transfer connection with a heating element; a heat equalization layer arranged on the first side, the heat equalization layer being provided with a flow channel and liquid inlet ports, a medium flow direction of the flow channel being parallel to a plane in which the heat exchange layer is arranged, the liquid inlet ports being at least two, the liquid inlet ports being in communication with the flow channel and being arranged at intervals along the medium flow direction of the flow channel, so that the flow channel can be in communication with the heat exchange groove through the liquid inlet ports; and a liquid injection part arranged on the heat equalization layer and in communication with the flow channel.

2. The cold plate assembly of claim 1, wherein, The cold plate assembly further comprises a liquid discharge part, the heat equalization layer is further provided with a flow channel and liquid outlet ports, a medium flow direction of the flow channel being parallel to the plane in which the heat exchange layer is arranged, the liquid outlet ports being at least two, the liquid outlet ports being in communication with the flow channel and being arranged at intervals along the medium flow direction of the flow channel, so that the heat exchange groove can be in communication with the flow channel through the liquid outlet ports, and the liquid discharge part is arranged on the heat equalization layer and in communication with the flow channel.

3. The cold plate assembly of claim 2, wherein, The medium flow directions of the flow channel and the flow channel are both arranged along a first direction of the cold plate assembly, the flow channel is provided with at least two, the flow channel is provided with at least two, and the flow channel and the flow channel are alternately arranged along a second direction of the cold plate assembly, the second direction being at an angle with the first direction.

4. The cold plate assembly of claim 3, wherein, The heat equalization layer is further provided with a first liquid collecting cavity and a second liquid collecting cavity, the first liquid collecting cavity being located on one side of the flow channel along the first direction, the second liquid collecting cavity being located on the other side of the flow channel along the first direction, the first liquid collecting cavity being in communication with the liquid injection part, the second liquid collecting cavity being in communication with the liquid discharge part, at least two flow channels being in communication with the first liquid collecting cavity, and at least two flow channels being in communication with the second liquid collecting cavity.

5. The cold plate assembly of claim 2, wherein, The cold plate assembly further comprises a partitioning part arranged in the heat exchange groove to divide the heat exchange groove into at least two heat exchange spaces, the heat exchange spaces being in communication with at least one liquid inlet port, and the heat exchange spaces being in communication with at least one liquid outlet port.

6. The cold plate assembly of claim 5, wherein, The liquid outlet ports are located at the connection of at least two adjacently arranged heat exchange spaces, so that the liquid outlet ports can be in communication with at least two adjacently arranged heat exchange spaces.

7. The cold plate assembly of claim 1, wherein, The cold plate assembly further comprises a heat dissipation fin connected with a bottom wall of the heat exchange groove.

8. The cold plate assembly of claim 7, wherein, The heat dissipation fin comprises fin needles, the fin needles being at least two and being arranged at intervals in the heat exchange groove, one end of the fin needles being connected with the bottom wall of the heat exchange groove, and the other end of the fin needles being arranged towards the heat equalization layer.

9. The cold plate assembly of claim 2, wherein, The uniform heating layer comprises a uniform heating plate and a cover plate, one side of the uniform heating plate is arranged on the first side, the other side of the uniform heating plate is provided with a uniform flow groove and a liquid discharge groove, at least two liquid inlet openings are arranged on the bottom wall of the uniform flow groove, at least two liquid outlet openings are arranged on the bottom wall of the heat exchange groove, the cover plate is arranged on the side of the uniform heating plate away from the first side, the cover plate and the uniform flow groove form the uniform flow channel, and the cover plate and the liquid discharge groove form the liquid discharge channel.

10. A server, characterized by The server comprises a case, a heat generating element and the cold plate assembly according to any one of claims 1-9, and the heat generating element and the cold plate assembly are arranged in the case.

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