Car machine mainboard degumming and heating device with clamping mechanism

Abstract

The utility model relates to the technical field of glue removing devices, and discloses a glue removing and heating device with a clamping mechanism for a vehicle machine mainboard, which comprises a mounting seat, the mounting seat is provided with a placing seat, a mounting frame is mounted on the mounting seat, a first lifting driving device is arranged on the mounting frame, and a second lifting driving device is arranged on the first lifting driving device. A mounting plate is mounted at the driving end of the first lifting driving device, a horizontal moving device is arranged below the mounting plate, a mounting block is arranged at the driving end of the horizontal moving device, and two second lifting driving devices are arranged below the mounting block. According to the mainboard glue removing device, glue can be automatically removed from a mainboard, the heating temperature can be monitored through the temperature detection assembly, the mainboard is prevented from being damaged due to the too high temperature, and the problems that in the prior art, the temperature is difficult to accurately control through manual operation, and electronic elements or circuits on the mainboard can be damaged due to the too high temperature are solved.

Description

Technical Field

[0001] This utility model relates to the field of adhesive removal device technology, and in particular to an adhesive removal heating device for a vehicle mainboard with a clamping mechanism. Background Technology

[0002] The vehicle infotainment system motherboard typically refers to the core circuit board of the multimedia navigation system or in-vehicle infotainment system (IVI) installed inside a car. It is the heart of the vehicle infotainment system (in-vehicle multimedia device), responsible for core functions such as data processing, software operation, display control, and receiving input signals. The design of the vehicle infotainment system motherboard needs to take into account the vehicle's operating environment, so it usually has certain characteristics such as shock resistance, electromagnetic interference resistance, and high and low temperature resistance.

[0003] In existing technologies, the method of removing adhesive from motherboards is generally to soften the adhesive by manually using a hot air gun. However, manual operation makes it difficult to precisely control the temperature, and excessively high temperatures may damage electronic components or circuits on the motherboard. Utility Model Content

[0004] The purpose of this utility model is to solve the problems existing in the prior art by proposing a de-adhesive heating device for a vehicle mainboard with a clamping mechanism.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A heating device for removing adhesive from a vehicle infotainment motherboard with a clamping mechanism includes a mounting base, a placement seat on the mounting base, a mounting frame on the mounting base, a first lifting drive device on the mounting frame, a mounting plate mounted on the drive end of the first lifting drive device, a horizontal moving device below the mounting plate, a mounting block mounted on the drive end of the horizontal moving device, two second lifting drive devices below the mounting block, a scraper and a hot air assembly respectively mounted on the drive ends of the two second lifting drive devices, a scraper cleaning assembly on one side of the placement seat, and clamping assemblies on both sides of the mounting plate.

[0007] Preferably, the placement seat is provided with a placement groove, and a protective pad is provided in the placement groove.

[0008] Preferably, the clamping assembly includes two limiting plates and four elastic telescopic rods. The two limiting plates are respectively disposed on both sides of the mounting plate, and the four elastic telescopic rods are respectively disposed on the corresponding limiting plates in pairs, and the telescopic ends of the four elastic telescopic rods are provided with protective parts.

[0009] Preferably, the scraper includes a connecting plate and bristles, the connecting plate being disposed at the drive end of one of the second lifting drive devices, and the bristles being disposed below the connecting plate.

[0010] Preferably, the scraper cleaning assembly includes a cleaning box, a horizontal moving assembly, two clamping plates, and two cleaning components. The cleaning box is mounted on a mounting base, the horizontal moving assembly is disposed inside the cleaning box, the two clamping plates are disposed at the drive end of the horizontal moving assembly, and the two cleaning components are disposed on one side of the corresponding clamping plates.

[0011] Preferably, the horizontal moving assembly includes a chute, a rotary motor, two sliders, and a bidirectional threaded rod. The chute is disposed on one side of the cleaning box, the rotary motor is disposed within the chute, the bidirectional threaded rod is disposed at the drive end of the rotary motor, the two sliders are respectively threaded to both sides of the bidirectional threaded rod, and both sliders are slidably connected to the chute. The two clamping plates are fixedly connected to the corresponding sliders.

[0012] Preferably, a temperature detection component, which is an infrared sensor, is installed on one side of the mounting block.

[0013] Preferably, the bristles are in several clusters, and the cleaning component is provided with several grooves, which are adapted to the bristles.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention utilizes a placement base to place the motherboard on it. A first lifting drive device moves the mounting plate downwards, and a horizontal moving device moves the mounting block, moving the hot air assembly to the appropriate position. A second lifting drive device then moves the hot air assembly to the desired position to heat the motherboard. A temperature detection component monitors the heating temperature to prevent damage from excessive heat. After heating, a scraper removes the softened adhesive. Compared to existing technologies, this device, with its scraper and hot air assembly, can automatically remove adhesive from the motherboard. Furthermore, the temperature detection component monitors the heating temperature to prevent damage from excessive heat. This solves the problem in existing technologies where manual operation makes precise temperature control difficult, and excessive heat can damage electronic components or circuits on the motherboard. Attached Figure Description

[0016] Figure 1 This is an overall schematic diagram of a de-adhesive heating device for a vehicle infotainment motherboard with a clamping mechanism proposed in this utility model.

[0017] Figure 2This is a bottom view of a de-adhesive heating device for a vehicle infotainment motherboard with a clamping mechanism, as proposed in this utility model.

[0018] Figure 3 This is a top view of a de-adhesive heating device for a vehicle infotainment motherboard with a clamping mechanism, as proposed in this utility model.

[0019] Figure 4 This is a schematic diagram of a cleaning box for a vehicle infotainment motherboard with a clamping mechanism and a heating device for removing adhesive.

[0020] In the diagram: 1. Mounting base; 2. Placement base; 3. Mounting frame; 4. First lifting drive device; 5. Mounting plate; 6. Horizontal moving device; 7. Mounting block; 8. Second lifting drive device; 9. Scraper; 10. Hot air assembly; 11. Temperature detection assembly; 12. Placement slot; 13. Protective pad; 14. Limiting plate; 15. Elastic telescopic rod; 16. Connecting plate; 17. Brush bristles; 18. Cleaning box; 19. Clamping plate; 20. Cleaning component; 21. Slide groove; 22. Rotary motor; 23. Slider; 24. Bidirectional threaded rod. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figures 1 to 4 A heating device for removing adhesive from a vehicle infotainment motherboard with a clamping mechanism includes a mounting base 1, a placement seat 2 on the mounting base 1, a mounting frame 3 on the mounting base 1, a first lifting drive device 4 on the mounting frame 3, a mounting plate 5 mounted on the drive end of the first lifting drive device 4, a horizontal moving device 6 below the mounting plate 5, a mounting block 7 at the drive end of the horizontal moving device 6, two second lifting drive devices 8 below the mounting block 7, a scraper 9 and a hot air assembly 10 respectively mounted on the drive ends of the two second lifting drive devices 8, a scraper cleaning assembly on one side of the placement seat 2, and clamping assemblies on both sides of the mounting plate 5.

[0023] In use, this device places the motherboard on the placement base 2, then the first lifting drive device 4 moves the mounting plate 5 downward, and the horizontal moving device 6 moves the mounting block 7 to the corresponding position, thus moving the hot air assembly 10 to the appropriate position. The second lifting drive device 8 then moves the hot air assembly 10 to the appropriate position to heat the motherboard. The temperature detection component 11 monitors the heating temperature of the motherboard to prevent damage from excessive heating. After heating, the softened adhesive is removed by the scraper 9. Compared with existing technologies, this device, through the scraper 9 and hot air assembly 10, can automatically remove adhesive from the motherboard, and the temperature detection component 11 monitors the heating temperature to prevent damage from excessive heat. This solves the problem in existing technologies where manual operation makes precise temperature control difficult, and excessive heat may damage electronic components or circuits on the motherboard.

[0024] Furthermore, the placement base 2 is provided with a placement groove 12, and a protective pad 13 is provided inside the placement groove 12. The motherboard can be placed inside the placement groove 12, and the protective pad 13 can protect the bottom of the motherboard when removing the adhesive.

[0025] Furthermore, the clamping assembly includes two limiting plates 14 and four elastic telescopic rods 15. Each elastic telescopic rod 15 includes an inner rod, an outer tube sleeved on the outside of the inner rod, and a spring connecting the inner end of the inner rod and the inner wall of the outer tube. The two limiting plates 14 are respectively disposed on both sides of the mounting plate 5, and the four elastic telescopic rods 15 are respectively disposed on the corresponding limiting plates 14 in pairs. The telescopic ends of the four elastic telescopic rods 15 are provided with protective parts. By setting the elastic telescopic rods 15, when the mounting plate 5 moves down, the elastic telescopic rods 15 are moved down at the same time, which can clamp the motherboard and fix the motherboard in the placement groove 12.

[0026] Furthermore, the scraper 9 includes a connecting plate 16 and bristles 17. The connecting plate 16 is disposed at the driving end of one of the second lifting drive devices 8, and the bristles 17 are disposed below the connecting plate 16. After the hot air assembly 10 softens the colloid, the bristles 17 can be moved by the horizontal moving device 6 to remove the softened colloid.

[0027] Furthermore, the scraper cleaning assembly includes a cleaning box 18, a horizontal moving assembly, two clamping plates 19, and two cleaning components 20. The cleaning box 18 is mounted on the mounting base 1, the horizontal moving assembly is located inside the cleaning box 18, the two clamping plates 19 are located at the drive end of the horizontal moving device 6, and the two cleaning components 20 are located on one side of the corresponding clamping plates 19. After the brush bristles 17 have cleaned the colloid, the connecting plate 16 is moved down by the second lifting drive device 8 to move the brush bristles 17 into the cleaning box 18. Then, the horizontal moving assembly moves the two clamping plates 19 and the two cleaning components 20 inward to clamp the brush bristles 17. Finally, the second lifting drive device 8 moves the brush bristles 17 upward so that the cleaning components 20 clean the colloid on the brush bristles 17.

[0028] Furthermore, the horizontal moving assembly includes a slide groove 21, a rotary motor 22, two sliders 23, and a bidirectional threaded rod 24. The slide groove 21 is located on one side of the cleaning box 18, the rotary motor 22 is located inside the slide groove 21, and the bidirectional threaded rod 24 is located at the drive end of the rotary motor 22. The two sliders 23 are respectively threaded to both sides of the bidirectional threaded rod 24, and both sliders 23 are slidably connected to the slide groove 21. The two clamping plates 19 are fixedly connected to the corresponding sliders 23. The rotary motor 22 can drive the bidirectional threaded rod 24 to rotate, which can drive the two sliders 23 to move within the slide groove 21 and drive the two clamping plates 19 to move. This allows the cleaning component 20 to clamp the bristles 17, at which point the bristles 17 can be cleaned.

[0029] Furthermore, a temperature detection component 11 is installed on one side of the mounting block 7. The temperature detection component 11 is an infrared sensor. By setting the infrared sensor, the temperature of the motherboard heated by the hot air component 10 can be detected to prevent the temperature from getting too high.

[0030] Furthermore, the bristles 17 are in the form of several clusters, and the cleaning component 20 is provided with several grooves, which are adapted to the bristles 17. By providing several grooves, it can be adapted to the clustered bristles 17, allowing the cleaning component 20 to better clean the colloid on the bristles 17.

[0031] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A heating device for removing adhesive from a vehicle infotainment motherboard with a clamping mechanism, comprising a mounting base (1), characterized in that: The mounting base (1) is provided with a placement seat (2), the mounting base (1) is provided with a mounting frame (3), the mounting frame (3) is provided with a first lifting drive device (4), the drive end of the first lifting drive device (4) is provided with a mounting plate (5), the mounting plate (5) is provided with a horizontal moving device (6) below the mounting plate (5), the drive end of the horizontal moving device (6) is provided with a mounting block (7), the mounting block (7) is provided with two second lifting drive devices (8) below the mounting block (7), the drive ends of the two second lifting drive devices (8) are respectively provided with a scraper (9) and a hot air assembly (10), a scraper cleaning assembly is provided on one side of the placement seat (2), and clamping assemblies are provided on both sides of the mounting plate (5).

2. The adhesive removal heating device for a vehicle infotainment motherboard with a clamping mechanism according to claim 1, characterized in that: The placement seat (2) is provided with a placement groove (12), and a protective pad (13) is provided in the placement groove (12).

3. The adhesive removal heating device for a vehicle infotainment motherboard with a clamping mechanism according to claim 1, characterized in that: The clamping assembly includes two limiting plates (14) and four elastic telescopic rods (15). The two limiting plates (14) are respectively disposed on both sides of the mounting plate (5), and the four elastic telescopic rods (15) are respectively disposed on the corresponding limiting plates (14) in pairs, and the telescopic ends of the four elastic telescopic rods (15) are provided with protective parts.

4. The adhesive removal heating device for a vehicle infotainment motherboard with a clamping mechanism according to claim 1, characterized in that: The scraper (9) includes a connecting plate (16) and bristles (17). The connecting plate (16) is disposed at the driving end of one of the second lifting drive devices (8), and the bristles (17) are disposed below the connecting plate (16).

5. The adhesive removal heating device for a vehicle infotainment motherboard with a clamping mechanism according to claim 1, characterized in that: The scraper cleaning assembly includes a cleaning box (18), a horizontal moving assembly, two clamping plates (19), and two cleaning components (20). The cleaning box (18) is mounted on the mounting base (1), the horizontal moving assembly is located inside the cleaning box (18), the two clamping plates (19) are located at the drive end of the horizontal moving device (6), and the two cleaning components (20) are located on one side of the corresponding clamping plate (19).

6. The adhesive removal heating device for a vehicle infotainment motherboard with a clamping mechanism according to claim 5, characterized in that: The horizontal moving assembly includes a slide groove (21), a rotary motor (22), two sliders (23), and a bidirectional threaded rod (24). The slide groove (21) is located on one side of the cleaning box (18). The rotary motor (22) is located inside the slide groove (21). The bidirectional threaded rod (24) is located at the drive end of the rotary motor (22). The two sliders (23) are threaded to both sides of the bidirectional threaded rod (24), and both sliders (23) are slidably connected to the slide groove (21). The two clamping plates (19) are fixedly connected to the corresponding sliders (23).

7. The adhesive removal heating device for a vehicle infotainment motherboard with a clamping mechanism according to claim 1, characterized in that: A temperature detection component (11) is installed on one side of the mounting block (7), and the temperature detection component (11) is an infrared sensor.

8. The adhesive removal heating device for a vehicle infotainment motherboard with a clamping mechanism according to claim 5, characterized in that: The bristles (17) are in several clusters, and the cleaning component (20) is provided with several grooves, which are adapted to the bristles (17).

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