Automatic cleaning device

Abstract

The utility model provides an automatic cleaning device which comprises a cleaning assembly, the cleaning assembly is connected with a sliding assembly, the sliding assembly drives the cleaning assembly to move in the first direction and then move in the second direction, and the first direction is opposite to the second direction. The cleaning assembly comprises a brush head, in the process that the sliding assembly drives the cleaning assembly to move, the brush head cleans a pressing part of the die pressing head of the die bonder back and forth, and the face, close to the brush head, of the pressing part is a plane or a convex face with tin materials. The cleaning assembly is driven by the sliding assembly to move towards the first direction, so that the front end of the brush head gradually gets close to the die pressing head of the die bonder until the front end of the brush head makes contact with the pressing part. When the brush head stops moving in the first direction, the sliding assembly starts to drive the cleaning assembly to move in the second direction, so that the rear end of the brush head gradually gets close to and makes contact with the pressing part. The cleaning assembly is driven by the sliding assembly to move alternately, automatic cleaning of the pressing part of the die-pressing head of the die bonder is achieved, and the cleaning efficiency and the cleaning quality of the die-pressing head of the die bonder are improved.

Description

Technical Field

[0001] This utility model relates to the field of cleaning device technology, and in particular to an automatic cleaning device. Background Technology

[0002] Current die bonders require multiple presses of the die head during the bonding process to ensure successful chip soldering. Because solder becomes fluid when heated, the die head may accumulate debris and impurities during prolonged operation. Excessive debris can lead to voids in the product, affecting product quality; therefore, regular cleaning of the die head is necessary.

[0003] However, the cleaning of the die-bonding die head in existing die-bonding machines generally relies on manual judgment of the cleaning time, followed by cleaning the die head with a brush. This method requires cleaning the die head before operation and cannot be judged during the die-bonding process. Dirt on the die head can cause excessively large voids in the product, leading to a decline in product quality.

[0004] Therefore, there is a need for an automatic cleaning device that can automatically clean the die bonding machine head at any time without requiring manual replacement of the die bonding machine head. Utility Model Content

[0005] To overcome the problems existing in the related technologies, the purpose of this utility model is to provide an automatic cleaning device that can automatically clean the die bonding machine's die head at any time without requiring manual replacement of the die bonding machine's die head.

[0006] An automatic cleaning device includes a cleaning assembly connected to a sliding assembly. The sliding assembly drives the cleaning assembly to move in a first direction and then in a second direction, the first and second directions being opposite. The cleaning assembly includes a brush head and a receiving plate. The brush head and the receiving plate are connected by a connector, and the brush head is located between the die bonder's die head and the receiving plate. The die bonder's die head includes a pressing part and a supporting part connected to each other. The side of the pressing part near the brush head is a flat or convex surface with solder. During the movement of the cleaning assembly driven by the sliding assembly, the brush head cleans the pressing part back and forth.

[0007] In a preferred embodiment of this invention, the brush head includes a bristle brush, and the extension direction of the bristle brush is perpendicular to the first direction.

[0008] In a preferred embodiment of this invention, the cleaning assembly further includes a receiving plate located below the brush head, which is used to receive debris falling from the die bonder's die head during the cleaning process.

[0009] In a preferred embodiment of this invention, the cleaning assembly further includes a push rod, the end face of which is connected to the receiving plate, and the side wall of which is connected to the brush head. The push rod drives the brush head and the receiving plate to move.

[0010] In a preferred embodiment of this invention, the sliding assembly includes a slider and a guide rail, with the slider sleeved on the guide rail.

[0011] In a preferred embodiment of this invention, the slider is connected to the push rod on the side of the receiving plate closer to the receiving plate, and the slider is used to drive the brush head and the receiving plate to move.

[0012] In a preferred embodiment of this invention, a first limiting block and a second limiting block are provided at both ends of the guide rail, and the first limiting block and the second limiting block are used to limit the movement position of the slider on the guide rail.

[0013] In a preferred embodiment of this invention, the bottom of the slider abuts against the belt, and the belt is used to drive the slider to move along the guide rail.

[0014] In a preferred embodiment of this invention, the brush head is detachably connected to the push rod, and the receiving plate is detachably connected to the push rod.

[0015] In a preferred embodiment of this invention, the automatic cleaning device further includes a sensing component, which includes a first sensor and a second sensor. The first sensor is disposed near the first limiting block, and the second sensor is disposed near the second limiting block.

[0016] In a preferred embodiment of this invention, the cleaning assembly further includes a connecting rod, the first end of which is connected to the brush head, and the second end of which is connected to the side wall of the push rod.

[0017] In a preferred embodiment of this utility model, a first receiving groove is provided in the connecting rod, and a second receiving groove is provided in the push rod, the first receiving groove and the second receiving groove are connected; the connecting member is disposed in the first receiving groove and the second receiving groove, the first end of the connecting member is connected to the brush head, and the second end of the connecting member is connected to the receiving plate.

[0018] The beneficial effects of this utility model are as follows:

[0019] This invention provides an automatic cleaning device, including a cleaning component connected to a sliding component. The sliding component drives the cleaning component to move in a first direction and then in a second direction, the first and second directions being opposite. The cleaning component includes a brush head and a receiving plate. The brush head and the receiving plate are connected by a connector, and the brush head is located between the die bonder's die head and the receiving plate. The die bonder's die head includes a pressing part and a supporting part connected to each other. The side of the pressing part near the brush head is a flat or convex surface with solder. During the movement of the cleaning component driven by the sliding component, the brush head cleans the pressing part back and forth. By driving the cleaning component in the first direction through the sliding component, the front end of the brush head gradually approaches the die bonder's die head until the front end of the brush head contacts the pressing part of the die bonder's die head. The brush head continues to move in the first direction, and the contact area between the brush head and the die bonder's die head gradually increases and then decreases until the rear end of the brush head moves away from the die bonder's die head. When the brush head stops moving in the first direction, the sliding component begins to drive the cleaning component to move in the second direction, so that the rear end of the brush head gradually approaches and contacts the pressing part of the die bonder's mold head. The brush head then continues to move in the second direction, and the contact area between the brush head and the die bonder's mold head gradually increases and then decreases until the front end of the brush head moves away from the die bonder's mold head. By having the sliding component drive the cleaning component to move alternately in the first and second directions, the pressing part of the die bonder's mold head is automatically cleaned through repeated friction between the brush head and the mold head. This solves the problems of manual cleaning not being able to automatically clean the die bonder's mold head at all times, and the time-consuming, labor-intensive, and incomplete cleaning associated with manually replacing the die bonder's mold head. This significantly improves the cleaning efficiency and quality of the die bonder's mold head. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the automatic cleaning device of this utility model;

[0021] Figure 2 This is a schematic diagram of the cleaning component of this utility model;

[0022] Figure 3 This is a schematic diagram of the connection between the slider and the push rod of this utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the first limiting block and the second limiting block of this utility model;

[0024] Figure 5 This is a schematic diagram of the structure of the first and second sensors of this utility model.

[0025] Reference numerals: 1. Cleaning component; 2. Sliding component; 3. Brush head; 4. Die bonder die head; 5. Brush; 6. Receiving plate; 7. Push rod; 8. Slider; 9. Guide rail; 10. First limit block; 11. Second limit block; 12. Belt conveyor; 13. Sensing component; 14. First sensor; 15. Second sensor; 16. Connector; 17. Pressing part; 18. Support part. Detailed Implementation

[0026] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0027] Example 1

[0028] like Figures 1-2 As shown, this embodiment provides an automatic cleaning device, including a cleaning component 1. The cleaning component 1 is connected to a sliding component 2. The sliding component 2 drives the cleaning component 1 to move along a first direction and then along a second direction, the first direction and the second direction being opposite. The cleaning component 1 includes a brush head 3 and a receiving plate 6. The brush head 3 and the receiving plate 6 are connected by a connector 16. The brush head 3 is located between the die bonder die head 4 and the receiving plate 6. The die bonder die head 4 includes a pressing part 17 and a supporting part 18 connected to each other. The side of the pressing part 17 near the brush head 3 is a flat or convex surface with solder. During the movement of the cleaning component 1 driven by the sliding component 2, the brush head 3 cleans the pressing part 17 back and forth.

[0029] This invention takes the die-bonding machine's pressure mold head 4 as an example. The first direction is the direction close to the die-bonding machine's pressure mold head 4, and the second direction is the direction away from the die-bonding machine's pressure mold head 4. The first direction and the second direction are on the same straight line and in opposite directions. During each cleaning of the die-bonding machine's pressure mold head 4, the distance the brush head 3 moves in the first direction is the same as the distance it moves in the second direction. As an example, the brush head 3 moves 1 meter along the first direction and then 1 meter along the second direction, thus completing one cleaning process. By alternating between moving in the first direction and moving in the second direction, the brush head 3 achieves the function of cleaning the pressing part 17 of the die-bonding machine's pressure mold head 4 back and forth.

[0030] During the cleaning process of the die bonder mold head 4, the sliding component 2 drives the cleaning component 1 to move in the first direction, thereby driving the brush head 3 to move in the first direction. As the brush head 3 moves a distance in the first direction, it gradually approaches and begins to contact the pressing part 17 of the pressing part 4 of the die bonder mold head 4 from a position far away. When the tip of the brush head 3 contacts the pressing part 17 of the die bonder mold head 4, the brush head 3 begins to clean the die bonder mold head 4. At this time, the brush head 3 continues to move in the first direction, and the contact surface between the brush head 3 and the die bonder mold head 4 gradually expands and completely contacts the pressing part 17 of the pressing part 4 of the die bonder mold head 4. Since the surface area of ​​the brush head 3 is smaller than the surface area of ​​the die bonder mold head 4, as the brush head 3 continues to move in the first direction, the entire surface of the brush head 3 can continuously contact the surface of the die bonder mold head 4 for a certain distance, allowing the brush head 3 to perform a more comprehensive cleaning of the die bonder mold head 4.

[0031] As the brush head 3 moves in the first direction, the contact surface between the brush head 3 and the die bonder mold head 4 gradually increases until they are in complete contact, then decreases again until the rear end of the brush head 3 moves away from the second end of the die bonder mold head 4. At this point, the brush head 3 stops moving in the first direction and then begins moving in the second direction. During this movement, the rear end of the brush head 3 moves closer to the second end of the die bonder mold head 4. Once the rear end of the brush head 3 contacts the pressing part 17 of the die bonder mold head 4, the contact surface between the brush head 3 and the die bonder mold head 4 gradually increases. After the brush head 3 and the die bonder mold head 4 are in complete contact for a period of time, the contact surface decreases again until the entire brush head 3 moves away from the die bonder mold head 4 and returns to its initial position, thus completing one cleaning cycle of the die bonder mold head 4. As the sliding component 2 drives the cleaning component to move alternately in the first and second directions, the brush head 3 cleans the die bonder mold head 4 multiple times.

[0032] The die bonder die head 4 includes a pressing part 17 and a support part 18 connected to each other. The pressing part 17 is located close to the brush head 3, and the support part 18 is located away from the brush head 3, above the pressing part 17. The support part 18 supports the pressing part 17 and also contains a heating device, which can be a resistance wire or other electric heater. The heating device is used to heat the pressing part 17 when pressing the solder on the chip pins and before pressing the solder on the chip pins, so as to perform hot pressing on the solder.

[0033] The side of the pressing part 17 facing the brush head 3 is the pressing surface, which can be flat or convex. When the die bonder die head 4 is used to press the solder on the PCB board multiple times, the solder becomes fluid after being heated, resulting in solder-containing debris and impurities adhering to the pressing surface of the die bonder die head 4 after a long period of operation.

[0034] If the pressing surface is flat, the flatness of the pressing surface is relatively high. The brush head 3 moves back and forth along the first and second directions, which makes the contact area between the brush head 3 and the pressing surface larger, thereby improving the cleaning effect of the die bonder die head 4. Since the solder on the pressing surface has the same height, the cleaning consistency can also be improved.

[0035] If the pressing surface is convex, the brush head 3 will brush the convex surface during the alternating movement along the first and second directions, thereby specifically cleaning the part of the die bonder die head 4 where the solder adheres.

[0036] This embodiment provides an automatic cleaning device, including a cleaning component 1 connected to a sliding component 2. The sliding component 2 drives the cleaning component 1 to move in a first direction and then in a second direction, the first and second directions being opposite. The cleaning component 1 includes a brush head 3 and a receiving plate 6, which are connected by a connector 16. The brush head 3 is located between the die bonder die head 4 and the receiving plate 6. The die bonder die head 4 includes a pressing part 17 and a supporting part 18 connected to each other. The side of the pressing part 17 near the brush head 3 is a flat or convex surface with solder. During the movement of the cleaning component 1 driven by the sliding component 2, the brush head 3 cleans the pressing part 17 back and forth. By driving the cleaning component 1 in the first direction through the sliding component 2, the front end of the brush head 3 gradually approaches the die bonder die head 4 until the front end of the brush head 3 contacts the pressing part 17 of the die bonder die head 4. The brush head 3 continues to move in the first direction, and the contact area between the brush head 3 and the die bonder mold head 4 gradually increases and then decreases until the rear end of the brush head 3 moves away from the die bonder mold head 4. When the brush head 3 stops moving in the first direction, the sliding component 2 begins to drive the cleaning component 1 to move in the second direction, so that the rear end of the brush head 3 gradually approaches and contacts the pressing part 17 of the die bonder mold head 4. The brush head 3 then continues to move in the second direction, and the contact area between the brush head 3 and the die bonder mold head 4 gradually increases and then decreases until the front end of the brush head 3 moves away from the die bonder mold head 4. The sliding component 2 drives the cleaning component 1 to move alternately in the first and second directions. During the process of multiple frictions between the brush head 3 and the die bonder die head 4, the pressing part 17 of the die bonder die head 4 is automatically cleaned. This solves the problems that manual cleaning cannot automatically clean the die bonder die head 4 at any time, as well as the time-consuming, labor-intensive, and incomplete cleaning caused by manually replacing the die bonder die head 4. This greatly improves the cleaning efficiency and cleaning quality of the die bonder die head 4.

[0037] Example 2

[0038] like Figures 1-2As shown, this embodiment provides an automatic cleaning device, including a cleaning component 1. The cleaning component 1 is connected to a sliding component 2. The sliding component 2 drives the cleaning component 1 to move along a first direction and then along a second direction, the first direction and the second direction being opposite. The cleaning component 1 includes a brush head 3 and a receiving plate 6. The brush head 3 and the receiving plate 6 are connected by a connector 16. The brush head 3 is located between the die bonder die head 4 and the receiving plate 6. The die bonder die head 4 includes a pressing part 17 and a supporting part 18 connected to each other. The side of the pressing part 17 near the brush head 3 is a flat or convex surface with solder. During the movement of the cleaning component 1 driven by the sliding component 2, the brush head 3 cleans the pressing part 17 back and forth.

[0039] The brush head 3 includes a bristle brush 5, the extension direction of which is perpendicular to the first direction.

[0040] The cleaning assembly 1 also includes a receiving plate 6, which is located below the brush head 3 and is used to receive debris that falls off the die bonder die head 4 during the cleaning process.

[0041] As the brush head 3 moves in the first direction, the brush 5 gradually approaches the die bonder's pressing head 4 and contacts the pressing part 17 of the pressing part 4. During the contact between the brush 5 and the pressing part 17 of the die bonder's pressing head 4, friction is generated between the brush 5 and the pressing part 17 of the die bonder's pressing head 4 because the extension direction of the brush 5 is perpendicular to the first direction. Under the action of friction, the brush 5 bends and deforms, and the bending direction is opposite to the direction of movement of the brush 5, that is, the bending direction is towards the second direction, until the brush 5 no longer contacts the pressing part 17 of the die bonder's pressing head 4, and then the brush 5 returns to its natural extension state. During the movement of the brush head 3 in the second direction, the brush 5 is subjected to frictional force when it comes into contact with the pressing part 17 of the die bonder mold head 4. At this time, the direction of the brush 5 bending is towards the first direction. The direction of the brush 5 bending is always opposite to the direction of the brush 5 movement. After the brush 5 no longer comes into contact with the pressing part 17 of the die bonder mold head 4, the brush 5 returns to its natural extended state.

[0042] Preferably, the brush 5 is a glass fiber brush. Glass fiber not only has high tensile strength and low elongation, allowing the glass fiber brush to perform well under tension and not easily deformed, but also has a high elastic modulus and good rigidity, enabling the glass fiber brush to maintain a good shape and structure under tension. During the alternating movement of the brush head 3 in the first direction and the second direction, when the brush head 3 contacts the pressing part 17 of the die bonder's die head 4, although the brush head 3 is subjected to frictional forces opposite to the direction of movement, the use of glass fiber reduces the degree of bending deformation of the brush head 3, increasing the number of uses of the brush head 3. This avoids the need for frequent replacement of the brush head 3 due to easy deformation, not only increasing the number of uses of the brush head 3, but also, because glass fiber is relatively inexpensive, reducing the production cost of the brush head 3 to a certain extent.

[0043] The sliding component 2 drives the cleaning component 1 to move at a constant speed in both the first and second directions. During the movement of the cleaning component 1, the receiving plate 6 and the brush head 3 move at a constant speed simultaneously, ensuring that the relative positions of the receiving plate 6 and the brush head 3 remain unchanged. During the cleaning process of the die bonder die head 4 by the brush head 3, debris and dirt on the pressing part 17 of the die bonder die head 4 can be stably deposited onto the receiving plate 6, preventing debris and dirt from falling to other parts of the automatic cleaning device and affecting its normal operation. Preferably, the surface of the receiving plate 6 is coated with adhesive, making it sticky. This allows debris and dirt falling onto the receiving plate 6 after falling onto it, and the receiving plate 6 firmly adheres to the debris and dirt. Even if the receiving plate 6 vibrates, the debris and dirt will not splash out due to the vibration, significantly improving the effectiveness of the receiving plate 6.

[0044] The brush head 3 in this embodiment includes a bristle brush 5, the extension direction of which is perpendicular to the first direction. The cleaning assembly 1 also includes a receiving plate 6, which is located below the brush head 3 and is used to receive debris falling from the die bonder mold head 4 during the cleaning process. The cleaning assembly 1 is moved by the sliding assembly 2. During the uniform movement of the cleaning assembly 1, the relative positions of the brush head 3 and the receiving plate 6 do not change, and they remain aligned with the direction of movement of the cleaning assembly 1. This ensures that during the cleaning of the die bonder mold head 4 by the brush head 3, debris and dirt on the pressing part 17 of the die bonder mold head 4 can stably fall onto the receiving plate 6, preventing the debris and dirt from falling to other parts of the automatic cleaning device and affecting its service life. This significantly improves the subsequent use quality of the automatic cleaning device.

[0045] Example 3

[0046] like Figures 1-2As shown, this embodiment provides an automatic cleaning device, including a cleaning component 1. The cleaning component 1 is connected to a sliding component 2. The sliding component 2 drives the cleaning component 1 to move along a first direction and then along a second direction, the first direction and the second direction being opposite. The cleaning component 1 includes a brush head 3 and a receiving plate 6. The brush head 3 and the receiving plate 6 are connected by a connector 16. The brush head 3 is located between the die bonder die head 4 and the receiving plate 6. The die bonder die head 4 includes a pressing part 17 and a supporting part 18 connected to each other. The side of the pressing part 17 near the brush head 3 is a flat or convex surface with solder. During the movement of the cleaning component 1 driven by the sliding component 2, the brush head 3 cleans the pressing part 17 back and forth.

[0047] The cleaning assembly 1 also includes a receiving plate 6, which is located below the brush head 3 and is used to receive debris that falls off the die bonder die head 4 during the cleaning process.

[0048] like Figure 2 As shown, the cleaning assembly 1 also includes a push rod 7, the end face of which is connected to the receiving plate 6, and the side wall of which is connected to the brush head 3. The push rod 7 drives the brush head 3 and the receiving plate 6 to move.

[0049] The brush head 3 is detachably connected to the push rod 7, and the receiving plate 6 is detachably connected to the push rod 7.

[0050] The push rod 7 and the brush head 3 are connected by an L-shaped structure. The first end of the L-shaped structure is connected to the side wall of the push rod 7, and the second end is connected to the brush head 3. The brush head 3 and the push rod 7 are detachably connected. In one connection method, the L-shaped structure is fixed to the side wall of the push rod 7, and the L-shaped structure and brush head 3 are detachably connected. A first through hole is provided on the L-shaped structure, allowing the brush head 3 to be inserted into the first through hole and connected to the L-shaped structure. When it is necessary to remove the brush head 3, it can be pulled out directly from the first through hole. In another connection method, the brush head 3 is fixed to the L-shaped structure, and the L-shaped structure and push rod 7 are detachable. An opening is provided on the side wall of the push rod 7. By installing the L-shaped structure on the opening, when it is necessary to remove the brush head 3, the L-shaped structure is removed from the opening on the side wall of the push rod 7, allowing the L-shaped structure and brush head 3 to separate from the push rod 7, thus achieving the disassembly of the brush head 3 from the push rod 7. The detachable connection between the brush head 3 and the push rod 7 allows the brush head 3 to be removed from the push rod 7 for cleaning at any time, thus enabling the brush head 3 to be reused.

[0051] The detachable connection between the receiving plate 6 and the push rod 7 can be achieved by having a second through hole on the end face of the push rod 7. A connecting rod is connected to the end of the receiving plate 6 near the end face of the push rod 7. The connecting rod is adapted to the second through hole, allowing it to be inserted into the second through hole, thus connecting the receiving plate 6 and the push rod 7. When it is necessary to remove the receiving plate 6, the connecting rod is pulled out from the second through hole, thereby removing the receiving plate 6 from the push rod 7. This detachable connection between the receiving plate 6 and the push rod 7 allows the receiving plate 6 to be removed and cleaned at any time, enabling its reuse.

[0052] The cleaning assembly 1 in this embodiment further includes a receiving plate 6, which is located below the brush head 3. The receiving plate 6 is used to receive debris falling from the die bonder's die head 4 during the cleaning process. The cleaning assembly 1 also includes a push rod 7, the end face of which is connected to the receiving plate 6, and the side wall of which is connected to the brush head 3. The push rod 7 drives the brush head 3 and the receiving plate 6 to move. The brush head 3 and the push rod 7 are detachably connected, and the receiving plate 6 is detachably connected to the push rod 7. The detachable connection between the brush head 3, the receiving plate 6, and the push rod 7 allows the brush head 3 and the receiving plate 6 to be disassembled and cleaned at any time during use, increasing the number of uses for the brush head 3 and the receiving plate 6. This not only enables the reuse of the brush head 3 and the receiving plate 6 but also extends their service life, significantly reducing the cost of using the brush head 3 and the receiving plate 6.

[0053] Example 4

[0054] like Figures 1-2 As shown, this embodiment provides an automatic cleaning device, including a cleaning component 1. The cleaning component 1 is connected to a sliding component 2. The sliding component 2 drives the cleaning component 1 to move along a first direction and then along a second direction, the first direction and the second direction being opposite. The cleaning component 1 includes a brush head 3 and a receiving plate 6. The brush head 3 and the receiving plate 6 are connected by a connector 16. The brush head 3 is located between the die bonder die head 4 and the receiving plate 6. The die bonder die head 4 includes a pressing part 17 and a supporting part 18 connected to each other. The side of the pressing part 17 near the brush head 3 is a flat or convex surface with solder. During the movement of the cleaning component 1 driven by the sliding component 2, the brush head 3 cleans the pressing part 17 back and forth.

[0055] The cleaning assembly 1 also includes a receiving plate 6, which is located below the brush head 3 and is used to receive debris that falls off the die bonder die head 4 during the cleaning process.

[0056] The cleaning assembly 1 also includes a push rod 7, the end face of which is connected to the receiving plate 6, and the side wall of which is connected to the brush head 3. The push rod 7 drives the brush head 3 and the receiving plate 6 to move.

[0057] like Figure 3 and Figure 4 As shown, the sliding component 2 includes a slider 8 and a guide rail 9, with the slider 8 sleeved on the guide rail 9.

[0058] The slider 8 is connected to the push rod 7 on the side near the receiving plate 6, and the slider 8 is used to drive the brush head 3 and the receiving plate 6 to move.

[0059] like Figure 1 As shown, the bottom of the slider 8 abuts against the belt 12, and the belt 12 is used to drive the slider 8 to move along the guide rail 9.

[0060] The guide rail 9 includes two parallel guide rods of the same size and length. The extension direction of the guide rail 9 is the same as the first direction, and the position of the guide rods remains fixed. The slider 8 has a third through hole and a fourth through hole of the same size and length, which are adapted to the guide rods. After the slider 8 is fitted onto the guide rail 9, the two guide rods pass through the third through hole and the fourth through hole at the same time.

[0061] The belt conveyor 12 is connected to the motor, which provides power to the belt conveyor 12. When the motor starts, it drives the belt conveyor 12 to move. During the movement of the sliding assembly 2 and the cleaning assembly 1 in the first direction, the motor drives the belt conveyor 12 to move in the first direction, thereby causing the slider 8 to move along the guide rail 9. The direction in which the slider 8 moves along the guide rail 9 is the first direction. Since the push rod 7 is fixed to the slider 8, during the movement of the slider 8 in the first direction, the slider 8 drives the push rod 7 to move in the first direction, thereby causing the brush head 3 and the receiving plate 6 to move simultaneously in the first direction.

[0062] When the cleaning component 1 stops moving in the first direction, the sliding component 2 drives the cleaning component 1 to move in the second direction. During this movement, the motor drives the belt 12 to move in the second direction, thereby driving the slider 8 to move along the guide rail 9. At this time, the direction of the slider 8's movement along the guide rail 9 is the second direction. The slider 8 then drives the push rod 7 to move in the second direction, thereby driving the brush head 3 and the receiving plate 6 to move in the second direction simultaneously. One movement cycle is completed when the sliding component 2 drives the cleaning component 1 to move in the first direction and then in the second direction. After one movement cycle, one cleaning of the die bonder die head 4 is completed. By controlling the motor, the sliding component 2 can drive the cleaning component 1 to move alternately in the first and second directions, thereby realizing multiple cleanings of the die bonder die head 4 by the cleaning component 1.

[0063] The cleaning assembly 1 in this embodiment further includes a receiving plate 6, which is located below the brush head 3 and is used to receive debris falling from the die bonder's die head 4 during the cleaning process. The cleaning assembly 1 also includes a push rod 7, the end face of which is connected to the receiving plate 6, and the side wall of which is connected to the brush head 3. The push rod 7 drives the brush head 3 and the receiving plate 6 to move. The sliding assembly 2 includes a slider 8, which is sleeved on a guide rail 9. The side of the slider 8 closest to the receiving plate 6 is connected to the push rod 7, and the slider 8 drives the brush head 3 and the receiving plate 6 to move. The sliding assembly 2 also includes the guide rail 9, and the slider 8 moves along the guide rail 9. The bottom of the slider 8 abuts against a belt cable 12, which drives the slider 8 to move along the guide rail 9. The motor provides power to the conveyor belt 12, causing it to drive the slider 8 and push rod 7 in a first direction, which in turn drives the brush head 3 and receiving plate 6 to move simultaneously in the first direction. When the conveyor belt 12 stops moving in the first direction, the motor controls it to drive the slider 8 and push rod 7 in a second direction, which in turn drives the brush head 3 and receiving plate 6 to move simultaneously in the second direction. Within one cycle, the cleaning assembly 1 completes one cleaning of the die bonder mold head 4. By controlling the motor speed, the conveying speed of the conveyor belt 12 is controlled, thereby adjusting the cleaning speed of the cleaning assembly 1 on the die bonder mold head 4. The cleaning speed is controlled within a certain range to avoid incomplete cleaning of the die bonder mold head 4 due to excessive speed, and to prevent low cleaning efficiency due to excessively slow speed.

[0064] Example 5

[0065] like Figures 1-2 As shown, this embodiment provides an automatic cleaning device, including a cleaning component 1. The cleaning component 1 is connected to a sliding component 2. The sliding component 2 drives the cleaning component 1 to move along a first direction and then along a second direction, the first direction and the second direction being opposite. The cleaning component 1 includes a brush head 3 and a receiving plate 6. The brush head 3 and the receiving plate 6 are connected by a connector 16. The brush head 3 is located between the die bonder die head 4 and the receiving plate 6. The die bonder die head 4 includes a pressing part 17 and a supporting part 18 connected to each other. The side of the pressing part 17 near the brush head 3 is a flat or convex surface with solder. During the movement of the cleaning component 1 driven by the sliding component 2, the brush head 3 cleans the pressing part 17 back and forth.

[0066] The brush head 3 includes a bristle brush 5, the extension direction of which is perpendicular to the first direction.

[0067] The cleaning assembly 1 also includes a receiving plate 6, which is located below the brush head 3 and is used to receive debris that falls off the die bonder die head 4 during the cleaning process.

[0068] like Figure 2 As shown, the cleaning assembly 1 also includes a push rod 7, the end face of which is connected to the receiving plate 6, and the side wall of which is connected to the brush head 3. The push rod 7 drives the brush head 3 and the receiving plate 6 to move.

[0069] like Figures 3-4 As shown, the sliding component 2 includes a slider 8 and a guide rail 9, with the slider 8 sleeved on the guide rail 9.

[0070] The slider 8 is connected to the push rod 7 on the side near the receiving plate 6, and the slider 8 is used to drive the brush head 3 and the receiving plate 6 to move.

[0071] The guide rail 9 is provided with a first limiting block 10 and a second limiting block 11 at both ends. The first limiting block 10 and the second limiting block 11 are used to limit the movement position of the slider 8 on the guide rail 9.

[0072] like Figure 5 As shown, the automatic cleaning device also includes a sensing component 13, which includes a first sensor 14 and a second sensor 15. The first sensor 14 is disposed near the first limiting block 10, and the second sensor 15 is disposed near the second limiting block 11.

[0073] The first limiting block 10 and the second limiting block 11 are arranged facing each other, and the two ends of the guide rail 9 are respectively connected to the first limiting block 10 and the second limiting block 11. The slider 8 is sleeved on the guide rail 9. Pushing the slider 8 in the first direction causes the slider 8 to move in the first direction; pushing the slider 8 in the second direction causes the slider 8 to move in the second direction.

[0074] When the slider 8 abuts against the first limiting block 10, the brush head 3 is furthest from the die bonder's pressing head 4; when the slider 8 abuts against the second limiting block 11, the brush head 3 is closest to the die bonder's pressing head 4. A space is formed between the first limiting block 10 and the second limiting block 11 for the slider 8 to slide. The slider 8 slides back and forth between the first limiting block 10 and the second limiting block 11, that is, the slider 8 slides alternately along the first direction and the second direction, so that the brush 5 of the brush head 3 cleans the pressing part 17 of the die bonder's pressing head 4 back and forth.

[0075] The first limiting block 10 is used to determine the farthest backward distance of the slider 8, and the second limiting block 11 is used to determine the farthest forward distance of the slider 8. Slider 8 moving forward means moving along a first direction, and slider 8 moving backward means moving along a second direction. The first direction is the direction closer to the die bonder's die head 4, and the second direction is the direction farther away from the die bonder's die head 4.

[0076] When the first sensor 14 detects the slider 8, it means that the slider 8 is in contact with the first limiting block 10. At this time, the distance between the slider 8 and the die bonding machine die head 4 is the farthest, and the belt cable 12 drives the slider 8 to move in the first direction. When the second sensor 15 detects the slider 8, it means that the slider 8 is in contact with the second limiting block 11. At this time, the distance between the slider 8 and the die bonding machine die head 4 is the closest, and the belt cable 12 drives the slider 8 to move in the second direction.

[0077] In this embodiment, the guide rail 9 is provided with a first limiting block 10 and a second limiting block 11 at both ends. The first limiting block 10 and the second limiting block 11 are used to limit the movement position of the slider 8 on the guide rail 9. The automatic cleaning device also includes a sensing component 13, which includes a first sensor 14 and a second sensor 15. The first sensor 14 is disposed near the first limiting block 10, and the second sensor 15 is disposed near the second limiting block 11. The first limiting block 10 is used to determine the farthest backward distance of the slider 8, and the second limiting block 11 is used to determine the farthest forward distance of the slider 8. When the first sensor 14 detects the slider 8, it means that the slider 8 is in contact with the first limiting block 10. At this time, the distance between the slider 8 and the die bonder die head 4 is the farthest, and the belt conveyor 12 drives the slider 8 to move in the first direction. When the second sensor 15 detects the slider 8, it means that the slider 8 is in contact with the second limiting block 11. At this time, the distance between the slider 8 and the die bonder die head 4 is the closest, and the belt conveyor 12 drives the slider 8 to move in the second direction.

[0078] Example 6

[0079] like Figures 1-2 As shown, this embodiment provides an automatic cleaning device, including a cleaning component 1. The cleaning component 1 is connected to a sliding component 2. The sliding component 2 drives the cleaning component 1 to move along a first direction and then along a second direction, the first direction and the second direction being opposite. The cleaning component 1 includes a brush head 3 and a receiving plate 6. The brush head 3 and the receiving plate 6 are connected by a connector 16. The brush head 3 is located between the die bonder die head 4 and the receiving plate 6. The die bonder die head 4 includes a pressing part 17 and a supporting part 18 connected to each other. The side of the pressing part 17 near the brush head 3 is a flat or convex surface with solder. During the movement of the cleaning component 1 driven by the sliding component 2, the brush head 3 cleans the pressing part 17 back and forth.

[0080] The cleaning assembly 1 also includes a receiving plate 6, which is located below the brush head 3 and is used to receive debris that falls off the die bonder die head 4 during the cleaning process.

[0081] The cleaning assembly 1 also includes a push rod 7, the end face of which is connected to the receiving plate 6, and the side wall of which is connected to the brush head 3. The push rod 7 drives the brush head 3 and the receiving plate 6 to move.

[0082] The cleaning assembly 1 also includes a connecting rod, the first end of which is connected to the brush head 3, and the second end of which is connected to the side wall of the push rod 7.

[0083] The connecting rod has a first receiving groove, and the push rod 7 has a second receiving groove. The first receiving groove and the second receiving groove are connected. The connecting member 16 is disposed in the first receiving groove and the second receiving groove. The first end of the connecting member 16 is connected to the brush head 3, and the second end of the connecting member 16 is connected to the receiving plate 6.

[0084] The connecting rod has a first receiving groove inside, which is L-shaped. The push rod 7 has a second receiving groove inside, which is straight. The first and second receiving grooves together form a U-shaped groove. The connector 16 has a U-shaped structure and extends from the first receiving groove to connect to the brush head 3. The connector 16 extends from the second receiving groove to connect to the receiving plate 6.

[0085] In this embodiment, a first receiving groove is formed inside the connecting rod, and a second receiving groove is formed inside the push rod 7. The first and second receiving grooves are connected. The connector 16 is placed into the first and second receiving grooves, and the connector 16 is used to connect the brush head 3 and the receiving plate 6. This ensures that during the alternating movement of the cleaning assembly 1 along the first and second directions, the forward and backward amplitudes of the brush head 3 and the receiving plate 6 remain consistent. This guarantees that all the solder brushed off the brush head 3 from the pressing part 17 of the die bonder die head 4 falls onto the receiving plate 6, preventing the solder from falling to other positions.

[0086] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application. Any specific values ​​in all examples shown and discussed herein should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0087] It should be understood that spatial relative terms are intended to encompass different orientations of a device in use or operation, in addition to the orientation described in the figures. For example, if a device in the figures is inverted, a device described as "above" or "on top of" other devices or structures will subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0088] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0089] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An automatic cleaning device, characterized in that, The device includes a cleaning assembly connected to a sliding assembly. The sliding assembly drives the cleaning assembly to move in a first direction and then in a second direction, the first and second directions being opposite. The cleaning assembly includes a brush head and a receiving plate. The brush head and the receiving plate are connected by a connector, and the brush head is located between the die bonder's die head and the receiving plate. The die bonder's die head includes a pressing part and a supporting part connected to each other. The side of the pressing part near the brush head is a flat or convex surface with solder. During the movement of the cleaning assembly driven by the sliding assembly, the brush head cleans the pressing part back and forth.

2. The automatic cleaning device according to claim 1, characterized in that, The brush head includes a bristle brush, the bristle brush extending in a direction perpendicular to the first direction.

3. The automatic cleaning device according to claim 1, characterized in that, The cleaning assembly also includes a receiving plate located below the brush head, which is used to receive debris that falls off the die bonding machine's die head during the cleaning process.

4. The automatic cleaning device according to claim 3, characterized in that, The cleaning assembly also includes a push rod, the end face of which is connected to the receiving plate, and the side wall of which is connected to the brush head. The push rod drives the brush head and the receiving plate to move.

5. The automatic cleaning device according to claim 4, characterized in that, The sliding assembly includes a slider and a guide rail, with the slider fitted onto the guide rail.

6. The automatic cleaning device according to claim 5, characterized in that, The slider is connected to the push rod on the side near the receiving plate, and the slider is used to drive the brush head and the receiving plate to move.

7. The automatic cleaning device according to claim 5, characterized in that, The guide rail is provided with a first limiting block and a second limiting block at both ends. The first limiting block and the second limiting block are used to limit the movement position of the slider on the guide rail.

8. The automatic cleaning device according to claim 5, characterized in that, The bottom of the slider abuts against the belt cable, which is used to drive the slider to move along the guide rail.

9. The automatic cleaning device according to claim 4, characterized in that, The brush head is detachably connected to the push rod, and the receiving plate is detachably connected to the push rod.

10. The automatic cleaning device according to claim 7, characterized in that, It also includes a sensing component, which includes a first sensor and a second sensor, wherein the first sensor is disposed near the first limiting block and the second sensor is disposed near the second limiting block.

11. The automatic cleaning device according to claim 4, characterized in that, The cleaning assembly also includes a connecting rod, the first end of which is connected to the brush head, and the second end of which is connected to the side wall of the push rod.

12. The automatic cleaning device according to claim 11, characterized in that, The connecting rod has a first receiving groove, and the push rod has a second receiving groove, which are connected. The connecting member is disposed in the first receiving groove and the second receiving groove, with the first end of the connecting member connected to the brush head and the second end of the connecting member connected to the receiving plate.

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