Small-spacing printing steel mesh for LED packaging

By designing a first and second stencil for overlapping use and using positioning holes to insert positioning components for precise positioning, problems such as solder paste spikes, solder bridging, and hole blockage in Mini-LED printing were solved, improving printing precision and circuit board positioning accuracy.

CN223545976UActive Publication Date: 2025-11-14XINYANG GUMAI OPTRONICS CO LTD
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Patent Information

Application Number
CN202423051714.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-11-14
Estimated Expiration
2034-12-11

AI Technical Summary

Technical Problem

Existing Mini-LED stencils are prone to printing abnormalities such as solder paste spikes, solder bridging, and hole blockage when the pitch is small, and are difficult to position accurately, affecting printing accuracy.

Method used

The first and second stencils are used in a stacked manner. Positioning is achieved by inserting positioning elements into the first and second positioning holes. Combined with the inconsistent printing area spacing design, abnormal solder paste transfer is avoided, ensuring the stability of the circuit board during the processing.

Benefits of technology

It achieves precise transfer of solder paste, avoids solder bridging and hole clogging, and improves printing accuracy and circuit board positioning accuracy.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model is applicable to the technical field of printing steel meshes, and provides a small-spacing printing steel mesh for LED packaging, which comprises a first steel mesh and a second steel mesh which are overlapped for use, the first steel mesh is provided with a plurality of first printing areas, the second steel mesh is provided with a plurality of second printing areas, and the spacing between the first printing areas is larger than that between the second printing areas. The device solves the problems of tin connection caused by too much solder paste of electronic components and steel mesh opening blockage caused by relatively large solder paste particles when solder paste particles are relatively small during small-spacing printing, achieves the purposes of accurately transferring the solder paste to avoid the conditions of tin connection, opening blockage and the like, also can accurately position the printing steel mesh, and improves the printing efficiency. And the phenomenon that the printing precision is affected due to displacement of the circuit board in the machining process is avoided.
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Description

Technical Field

[0001] This utility model relates to the field of printed stencil technology, and more specifically, to a printed stencil for small-pitch LED packaging. Background Technology

[0002] Compared to traditional SMT printing processes, Mini-LED printing is more precise, demanding extremely high levels of precision. Statistics show that over 60% of Mini-LED soldering defects are caused by the printing process. The spacing of the stencil in Mini-LED printing is smaller than in traditional printing, which makes it easier for problems such as solder paste spikes to occur during demolding after the solder paste is printed on the small-pitch LED.

[0003] Existing Mini-LED printed stencils primarily improve the positioning of the stencil and circuit board during processing, preventing circuit board displacement and thus improving printing accuracy. However, they do not address issues such as solder bridging caused by excessive solder paste on electronic components when solder paste particles are small, or stencil aperture blockage caused by larger solder paste particles. Utility Model Content

[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide a printing stencil for small-pitch LED packaging that can accurately transfer solder paste to avoid solder bridging and hole blockage, while also accurately positioning the printing stencil to prevent circuit board displacement during processing and thus avoid affecting printing accuracy.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A printed stencil for small-pitch LED packaging includes a first stencil and a second stencil stacked together. The first stencil has a plurality of first printing areas, and the second stencil has a plurality of second printing areas. The spacing between the first printing areas is greater than the spacing between the second printing areas.

[0007] The present invention is further configured such that: a first frame is provided on the edge of the first steel mesh, and a plurality of first steel plates are installed on the first frame.

[0008] The present invention is further configured such that: a first partition is provided between the plurality of first steel sheets for separation, and a first printing area is provided on each of the first steel sheets.

[0009] The present invention is further configured such that: two first printing areas are symmetrically arranged about the first steel sheet, and a first positioning hole is provided at the center of the two first printing areas.

[0010] The present invention is further configured such that both the first printing area and the first positioning hole penetrate the first steel sheet.

[0011] The present invention is further configured such that: a second frame is provided on the edge of the second steel mesh, and a plurality of second steel plates are installed on the second frame.

[0012] The present invention is further configured such that: a second partition is provided between the plurality of second steel sheets for separation, and a second printing area is provided on each of the second steel sheets.

[0013] The present invention is further configured such that: two second printing areas are symmetrically arranged about the second steel sheet, and a second positioning hole is provided at the center of the two second printing areas.

[0014] By adopting the above technical solution, the shape and position of the second positioning hole and the first positioning hole correspond one-to-one. When the first steel mesh and the second steel mesh are superimposed for printing, the first steel mesh and the second steel mesh can be accurately positioned by inserting positioning parts inside the first positioning hole and the second positioning hole, so as to avoid the circuit board from shifting during the processing and affecting the printing accuracy.

[0015] The present invention is further configured such that the second printing area and the second positioning hole both penetrate the second steel sheet.

[0016] The beneficial effects of this utility model are:

[0017] When the first and second stencils are overlaid together for printing, a printing channel with inconsistent spacing is formed between the first and second printing areas. This transfers the solder paste from the first stencil to the pads of the Mini-LED and the solder paste from the second stencil to the pads of electronic components (capacitors, resistors, ICs, and connectors, etc.), thus avoiding solder bridging, hole blockage, and other issues. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is a schematic diagram of the structure of the printed stencil for small-pitch LED packaging according to this utility model.

[0020] Figure 2 for Figure 1 The diagram shows the structure of the first steel mesh.

[0021] Figure 3 for Figure 1 The diagram shows the structure of the second steel mesh.

[0022] Explanation of reference numerals in the attached drawings: 1. First steel mesh; 11. First frame; 12. First steel sheet; 13. First printing area; 14. First partition; 15. First positioning hole;

[0023] 2. Second steel mesh; 21. Second frame; 22. Second steel sheet; 23. Second printing area; 24. Second partition; 25. Second positioning hole. Detailed Implementation

[0024] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will now be described in detail with reference to the accompanying drawings. This drawing is a simplified schematic diagram, illustrating only the basic aspects of the present utility model, and therefore only shows the components relevant to the present utility model. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0025] Please refer to Figure 1-3 A printing stencil for small-pitch LED packaging includes a first stencil 1 and a second stencil 2 stacked together. The first stencil 1 and the second stencil 2 have the same shape and specifications. During printing, solder paste in the first stencil 1 is transferred to the pads of the Mini-LED, and solder paste in the second stencil 2 is transferred to the pads of electronic components (capacitors, resistors, ICs, and connectors, etc.). This method is suitable for different requirements of Mini-LEDs and electronic components regarding solder paste application.

[0026] Please refer to Figure 1 and Figure 2 The first stencil 1 has a first frame 11 along its edge, and multiple first steel sheets 12 are mounted on the first frame 11. The first frame 11 is made of hollow aluminum, and the first steel sheets 12 are made of stainless steel. A first partition 14, also made of hollow aluminum, separates the multiple first steel sheets 12. In this embodiment, the first frame 11 is divided into four different regions by the first partition 14, which is positioned along the length and width of the first frame 11. One first steel sheet 12 is mounted in each region, allowing the printing stencil for small-pitch LED packaging to be printed simultaneously using multiple workstations. In other embodiments, the partitioning of the first partition 14 and the shape and size of the first steel sheets 12 can also be configured with other different partitioning structures.

[0027] Please refer to Figure 1 and Figure 2Each first steel sheet 12 is provided with a first printing area 13. Two first printing areas 13 are symmetrically arranged about the first steel sheet 12, and the first printing areas 13 are arranged in an L-shape. A first positioning hole 15 is opened at the center of the two first printing areas 13, and both the first printing areas 13 and the first positioning holes 15 are arranged through the first steel sheet 12.

[0028] Please refer to Figure 1 and Figure 3 The second stencil 2 has a second frame 21 along its edge, and multiple second steel sheets 22 are mounted on the second frame 21. The second frame 21 is made of hollow aluminum, and the second steel sheets 22 are made of stainless steel. Second partitions 24, also made of hollow aluminum, separate the multiple second steel sheets 22. In this embodiment, the second frame 21 is divided into four different regions by the second partitions 24, which are arranged along its length and width. One second steel sheet 22 is mounted in each region, allowing the printing stencil for small-pitch LED packaging to be printed simultaneously using multiple workstations. The positions and shapes of the second partitions 24 and the second steel sheets 22 correspond to the positions and shapes of the first partition 14 and the first steel sheet 12, respectively. When the first stencil 1 and the second stencil 2 are stacked together for printing, the position of each first steel sheet 12 corresponds one-to-one with the position of the second steel sheet 22. In other embodiments, the partitioning of the second partition 24 and the shape and size of the second steel sheet 22 can also be set to other different partitioning structures.

[0029] Please refer to Figure 1 and Figure 3 Each second stencil 22 has a second printing area 23. Two second printing areas 23 are symmetrically arranged about the second stencil 22, and each second printing area 23 has an L-shaped structure. The positions of the first printing area 13 and the second printing area 23 correspond to each other, but the spacing between the first printing areas 13 is greater than the spacing between the second printing areas 23. When the first stencil 1 and the second stencil 2 are stacked together for printing, a printing channel with inconsistent spacing is formed between the first printing area 13 and the second printing area 23. This transfers the solder paste from the first stencil 1 to the pads of the Mini-LED and from the second stencil 2 to the pads of electronic components (capacitors, resistors, ICs, and connectors, etc.), preventing solder bridging and hole blockage. A second positioning hole 25 is provided at the center of each of the two second printing areas 23, and both the second printing area 23 and the positioning hole 25 penetrate the second stencil 22. The shape and position of the second positioning hole 25 correspond one-to-one with those of the first positioning hole 15. When the first stencil 1 and the second stencil 2 are stacked together for printing, the first stencil 1 and the second stencil 2 can be precisely positioned by inserting positioning parts inside the first positioning hole 15 and the second positioning hole 25, so as to avoid displacement of the circuit board during the processing and affect the printing accuracy.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] It should be understood that the terms "length", "width", "up", "down", "front and back", "left and right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Based on the preferred embodiments of this utility model described above, those skilled in the art can make various changes and modifications without departing from the scope of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A printed stencil for small-pitch LED packaging, characterized in that: The system includes a first steel mesh (1) and a second steel mesh (2) used in combination. The first steel mesh (1) has multiple first printing areas (13), and the second steel mesh (2) has multiple second printing areas (23). The spacing between the first printing areas (13) is greater than the spacing between the second printing areas (23). The edge of the second steel mesh (2) is provided with a second frame (21). Multiple second steel sheets (22) are installed on the second frame (21). The multiple second steel sheets (22) are separated by a second partition (24). Each second steel sheet (22) is provided with a second printing area (23). The second frame (21) is divided into four different areas by the second partition (24) provided along the length and width of the second frame (21).

2. The printed stencil for small-pitch LED packaging according to claim 1, characterized in that: The first steel mesh (1) has a first frame (11) on its edge, and a plurality of first steel plates (12) are installed on the first frame (11).

3. The printed stencil for small-pitch LED packaging according to claim 2, characterized in that: A first partition (14) is provided between multiple first steel sheets (12) for separation, and a first printing area (13) is provided on each first steel sheet (12).

4. The printed stencil for small-pitch LED packaging according to claim 3, characterized in that: The first printing area (13) is symmetrically arranged as two with respect to the first steel sheet (12), and a first positioning hole (15) is provided at the center of the two first printing areas (13).

5. The printed stencil for small-pitch LED packaging according to claim 4, characterized in that: The first printing area (13) and the first positioning hole (15) are both set through the first steel sheet (12).

6. The printed stencil for small-pitch LED packaging according to claim 1, characterized in that: The second printing area (23) is symmetrically set as two with respect to the second steel sheet (22), and a second positioning hole (25) is provided at the center of the two second printing areas (23).

7. The printed stencil for small-pitch LED packaging according to claim 6, characterized in that: The second printing area (23) and the second positioning hole (25) are both set through the second steel sheet (22).