Water-fluorine heat exchanger for semiconductor production

Abstract

The utility model discloses a water-fluorine heat exchanger for semiconductor production, which relates to the technical field of semiconductor processing heat exchange and comprises a machine body, a water tank is arranged at the upper end of the machine body, and the water tank, a cooling liquid extraction pipe and a cooling liquid guide pipe form a cooling liquid conveying loop. The cooling liquid guiding and conveying pipe, the heat exchange pipe, the cooling liquid guiding-out pipe and the cooling liquid inlet pipe form a cooling circulation loop, the normal-temperature water input pipe, the water cavity and the normal-temperature water output pipe form a normal-temperature water loop, a PLC used for controlling the PID electric proportional valve is fixedly installed on the inner wall of the side control cavity, and a COM port of the touch screen is connected with a communication port of the PLC. Normal-temperature water is used for carrying out heat exchange on fluorinated liquid, then the fluorinated liquid flows through production equipment to be efficiently cooled, the PLC is used for executing a temperature signal needed by normal operation, the opening angle of the PID electric proportional valve is controlled, the inlet flow of the normal-temperature water is controlled, heat exchange between the water and the fluorinated liquid is accurately achieved, and the production efficiency is improved. And the operation temperature of the production equipment is kept in an optimal state.

Description

Technical Field

[0001] This utility model relates to the field of heat exchange technology in semiconductor processing, specifically a water-fluorine heat exchanger for semiconductor production. Background Technology

[0002] Semiconductor manufacturing has extremely high requirements for temperature, humidity, and cleanliness, and must be carried out in a clean, dust-free, and static-free environment. Semiconductor materials are extremely sensitive to temperature during processing; even slight temperature changes can affect product quality. For example, certain semiconductor manufacturing processes, such as laser operation, reactor operation, etching, and photolithography, generate large amounts of pollutants that require precise temperature control. Therefore, heat exchangers are needed to regulate the temperature and humidity of the production environment, providing a stable and reliable environment for semiconductor manufacturing.

[0003] In current semiconductor manufacturing processes, heat exchange equipment is used to maintain a stable production environment and ensure the normal operation of equipment. Cooling towers are common heat exchange equipment in semiconductor factories, using water circulation to remove heat. After absorbing heat, the water in the cooling tower releases the heat into the atmosphere through evaporation and heat dissipation, thus achieving a cooling effect. This type of equipment is typically used in the cooling systems of large semiconductor production lines.

[0004] However, in actual semiconductor manufacturing processes, cooling towers often experience reduced heat exchange efficiency due to factors such as ventilation blockage, packing blockage, and imbalance in circulating water volume. At the same time, the heat generated during semiconductor manufacturing may be highly concentrated and of large quantity, and cooling towers may not be able to handle this heat quickly enough, leading to decreased production efficiency or equipment overheating, thus failing to meet the precise and high heat dissipation requirements of semiconductor manufacturing processes. Utility Model Content

[0005] The purpose of this invention is to provide a water-fluoride heat exchanger for semiconductor production, in order to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a water-fluoride heat exchanger for semiconductor production, comprising:

[0007] The machine body has a water tank at its upper end, and the water tank is filled with fluorinated liquid;

[0008] The machine body has a built-in pipe installation cavity. A magnetic pump and a plate heat exchanger are installed on the bottom wall of the pipe installation cavity. The inlet of the magnetic pump is connected to a coolant extraction pipe, which is connected to the bottom wall of the water tank. The plate heat exchanger has a water chamber. Coolant delivery pipes and coolant outlet pipes are connected to opposite side walls of the plate heat exchanger, respectively. A heat exchange tube is built into the water chamber, with both ends connected to the coolant delivery pipe and the coolant outlet pipe, respectively. The other end of the coolant delivery pipe is connected to the outlet of the magnetic pump. A coolant inlet pipe is also connected to the bottom wall of the water tank, with its end used to connect to the outlet port of the production equipment.

[0009] The water tank, coolant extraction pipe and coolant delivery pipe form a coolant delivery circuit, and the coolant delivery pipe, heat exchange pipe, coolant outlet pipe and coolant inlet pipe form a cooling circulation circuit.

[0010] The plate heat exchanger is also connected to a normal temperature water inlet pipe and a normal temperature water outlet pipe on opposite side walls, and the normal temperature water inlet pipe, water chamber and normal temperature water outlet pipe form a normal temperature water circuit.

[0011] A PID electric proportional valve is installed on the ambient temperature water input pipe. The machine body is also provided with a side control chamber. A PLC for controlling the PID electric proportional valve is fixedly installed on the inner wall of the side control chamber. The opening of the side control chamber is also hinged with a cabinet door. A touch screen is also embedded in the cabinet door. The COM port of the touch screen is connected to the communication port of the PLC.

[0012] In a further embodiment, an inspection port is provided at the upper end of the water tank, and a cover is detachably installed on the inspection port opening. A cover is installed at the upper end of the machine body to cover the water tank.

[0013] One side wall of the water tank is connected to a liquid inlet bend, and the inlet of the liquid inlet bend is threaded with a cap.

[0014] The water tank has connecting pipes inserted at both the top and bottom of one side, and a level gauge is connected between the two connecting pipes located outside the water tank.

[0015] In a further embodiment, a positive pressure valve and a negative pressure valve extending into the water tank are respectively installed on the upper end face of the water tank;

[0016] The water tank is also equipped with a liquid level float switch that is fixedly connected to the top wall of the water tank. The signal output port of the liquid level float switch is connected to the signal input port of the PLC.

[0017] In a further embodiment, a temperature sensor and a pressure sensor are also installed on the coolant outlet pipe.

[0018] In a further embodiment, a flow meter and a temperature sensor are installed on the coolant inlet pipe.

[0019] In a further embodiment, a pressure sensor 2 and a temperature sensor 2 are installed on the ambient temperature water input pipe;

[0020] A Y-type filter 1 is installed on the ambient temperature water inlet pipe, and a Y-type filter 2 is installed on the coolant inlet pipe. Both Y-type filters 1 and Y-type filter 2 have cylindrical filter screens inserted inside them, and the end openings of both Y-type filters 1 and Y-type filter 2 are threaded with end caps.

[0021] In a further embodiment, an expansion module, a circuit breaker, an AC contactor, a transformer, a terminal block, a switching power supply, and a frequency converter are also installed on the inner wall of the side control cavity.

[0022] The circuit breaker terminals are connected to the AC contactor terminals, the AC contactor signal output port is connected to the inverter signal input port, and the inverter output port is connected to the magnetic pump power port.

[0023] The terminals of the switching power supply are connected to the connection points of terminal block one, expanding into multiple 24V DC connection points. The output port of the transformer is connected to terminal block two, expanding into multiple 220V unidirectional connection points. The expansion module includes an input analog module and an output analog module.

[0024] The signal input ports of temperature sensor 1, temperature sensor 2, temperature sensor 3, flow meter 1, flow meter 2, pressure sensor 1, and pressure sensor 2 are all connected to the input analog module terminals. The signal output ports of the frequency converter and the PID electric proportional valve are all connected to the output analog module terminals.

[0025] In a further embodiment, a cooling fan is also installed on the inner wall of the side control cavity.

[0026] In a further embodiment, a branch pipe is connected to the radial sidewall of the coolant outlet pipe, a manual valve is installed on the sidewall of the branch pipe, a return pipe is connected to the end of the branch pipe, and the end of the return pipe is connected to the bottom wall of the water tank.

[0027] Compared with the prior art, the beneficial effects of this utility model are:

[0028] This invention relates to a water-fluoride heat exchanger for semiconductor manufacturing. Before entering the production equipment for heat exchange, the fluorinated liquid circulates to a plate heat exchanger to exchange heat with room temperature water. After the first heat exchange, the fluorinated liquid flows out and enters the production equipment for further heat exchange. The fluorinated liquid that has exchanged heat with the equipment then flows back to the water tank, forming a circulating cooling loop. Simultaneously, a PLC executes a temperature signal required for the normal operation of the production equipment and controls the opening angle of a PID electric proportional valve to control the inflow rate of room temperature water. This allows for precise heat exchange between water and the fluorinated liquid within the plate heat exchanger until the production equipment reaches the preset operating temperature. This helps reduce thermal stress changes in semiconductor materials during processing, thereby improving the yield and reliability of semiconductor products. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0030] Figure 2 This is a schematic diagram of the main body structure from another perspective of the present utility model;

[0031] Figure 3 A schematic diagram of the structure of the main body of this utility model with the cabinet door open;

[0032] Figure 4 This is a half-sectional view of the water tank structure of this utility model;

[0033] Figure 5 This is a schematic diagram of the structure of the coolant extraction pipe, coolant delivery pipe, coolant inlet pipe, coolant outlet pipe, ambient temperature water inlet pipe, ambient temperature water outlet pipe and plate heat exchanger of this utility model.

[0034] Figure 6 This is a schematic diagram from another perspective showing the connection between the coolant extraction pipe, coolant delivery pipe, coolant inlet pipe, coolant outlet pipe, ambient temperature water inlet pipe, ambient temperature water outlet pipe, and plate heat exchanger of this utility model.

[0035] Figure 7 This is a schematic diagram of the assembly structure of the ambient temperature water inlet pipe of this utility model;

[0036] Figure 8 This is a schematic diagram of the assembly structure of the coolant outlet pipe and return pipe of this utility model;

[0037] Figure 9 This is a schematic diagram of the coolant inlet pipe structure of this utility model;

[0038] Figure 10 This is a cross-sectional view of the plate heat exchanger structure of this utility model.

[0039] In the diagram: 1. Main body; 2. Top cover; 3. Level gauge; 4. Filling bend; 5. Touch screen; 6. Cabinet door; 7. Coolant outlet pipe; 71. Manual valve; 8. Coolant inlet pipe; 9. Room temperature water inlet pipe; 10. Room temperature water outlet pipe; 11. PLC; 12. Input analog module; 13. Output analog module; 14. Transformer; 15. Switching power supply; 16. AC contactor; 17. Circuit breaker; 18. Terminal block; 19. Cooling fan; 20. Frequency converter; 21. Water tank; 22. Negative pressure valve; 23. Positive pressure valve; 24. Cover one; 25. 26. Connecting pipe; 27. Liquid level float switch; 28. Magnetic pump; 29. ​​Coolant delivery pipe; 30. Coolant extraction pipe; 31. Plate heat exchanger; 32. Flow meter 1; 33. Branch pipe; 34. Temperature sensor 1; 35. Pressure sensor 1; 36. Return pipe; 37. Pressure sensor 2; 38. Y-type filter 2; 39. Temperature sensor 2; 40. PID electric proportional valve; 41. Flow meter 2; 42. Y-type filter 1; 43. End cap; 44. Cylindrical filter screen; 45. Temperature sensor 3; 46. Reversing pipe; 47. Heat exchange tube. Detailed Implementation

[0040] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0041] This embodiment provides a water-fluorine heat exchanger for semiconductor production, such as... Figure 1 , Figure 2 and Figure 4 As shown, the device includes a body 1, with a water tank 21 at the top. Specifically, a liquid charging bend 4 is connected to one side wall of the water tank 21, and a cap 2 is threaded onto the opening of the liquid charging bend 4. The cap 2 is rotated off, and fluorinated liquid is poured into the water tank 21 through the opening of the liquid charging bend 4. Then, the cap 2 is screwed back onto the opening of the liquid charging bend 4 to seal the water tank 21. The fluorinated liquid is used as a refrigerant.

[0042] like Figure 3 , Figure 5 , Figure 6 and Figure 10As shown, the machine body 1 has a built-in pipe installation cavity. A magnetic pump 27 and a plate heat exchanger 30 are installed on the bottom wall of the pipe installation cavity. The inlet of the magnetic pump 27 is connected to a coolant extraction pipe 29, which is connected to the bottom wall of the water tank 21. The plate heat exchanger 30 has a water chamber. The two opposite side walls of the plate heat exchanger 30 are respectively connected to a coolant delivery pipe 28 and a coolant outlet pipe 7. The water chamber contains a heat exchange tube 46, and both ends of the heat exchange tube 46 are connected to the coolant delivery pipe 28 and the coolant outlet pipe 7, respectively. The other end of the coolant delivery pipe 28 is connected to the outlet of the magnetic pump 27. The bottom wall of the water tank 21 is also connected to a coolant inlet pipe 8, and the end of the coolant inlet pipe 8 is used to connect to the outlet port of the production equipment.

[0043] The water tank 21, the coolant extraction pipe 29 and the coolant delivery pipe 28 form a coolant delivery circuit. The coolant delivery pipe 28, the heat exchange pipe 46, the coolant outlet pipe 7 and the coolant inlet pipe 8 form a cooling circulation circuit. The plate heat exchanger 30 is also connected to the opposite side walls of the two sides by a normal temperature water inlet pipe 9 and a normal temperature water outlet pipe 10. The normal temperature water inlet pipe 9, the water chamber and the normal temperature water outlet pipe 10 form a normal temperature water circuit.

[0044] The cooling process of the semiconductor manufacturing equipment is as follows: The magnetic pump 27 provides negative pressure to the coolant extraction pipe 29, drawing the fluorinated liquid from the water tank 21 and introducing it into the plate heat exchanger 30 through the coolant delivery pipe 28. The fluorinated liquid entering the plate heat exchanger 30 flows through the heat exchange tube 46 and undergoes a first heat exchange with the room temperature water in the water chamber. At this time, the temperature of the fluorinated liquid is lower than the temperature of the fluorinated liquid in the water tank 21. Subsequently, the fluorinated liquid after the first heat exchange enters the production equipment through the coolant outlet pipe 7 for a second heat exchange. The fluorinated liquid in the second heat exchange will carry away the heat of the production equipment, causing the temperature of the production equipment to drop. It then flows back into the water tank 21 through the coolant inlet pipe 8. The above is the cooling process of room temperature water and fluorinated liquid undergoing a second heat exchange.

[0045] For precise temperature control, such as Figure 7 As shown, a PID electric proportional valve 39 is installed on the ambient temperature water inlet pipe 9. The PID electric proportional valve 39 is a valve where the controlled variable is proportional to the control signal. It combines an electric actuator and a valve body. Specifically, the electric actuator has a built-in servo controller that converts the current signal (or voltage signal) into a motor stroke signal. The motor drives the gears and worm gear to reduce the output, thereby driving the valve stem to perform a partial rotation motion from 0 to 90°, achieving the angular stroke control adjustment function. During the control process, the size of the valve opening angle determines the control opening degree and cross-sectional area, thus achieving the control of fluid flow rate.

[0046] At the same time, such as Figure 3As shown, the machine body 1 is also provided with a side control cavity. A PLC 11 for controlling the PID electric proportional valve 39 is fixedly installed on the inner wall of the side control cavity. The opening of the side control cavity is also hinged with a cabinet door 6. A touch screen 5 is also embedded in the cabinet door 6. The COM port of the touch screen 5 is connected to the communication port of the PLC 11.

[0047] like Figure 5 , Figure 6 , Figure 8 and Figure 9 As shown, a temperature sensor 33 and a pressure sensor 34 are also installed on the coolant outlet pipe 7. A flow meter 31 and a temperature sensor 44 are installed on the coolant inlet pipe 8. A pressure sensor 36 and a temperature sensor 38 are installed on the ambient temperature water inlet pipe 9.

[0048] like Figure 3 As shown, a circuit breaker 17, an AC contactor 16, a transformer 14, a terminal block 18, a switching power supply 15, and a frequency converter 20 are also installed on the inner wall of the side control cavity. The circuit breaker 17 is connected to the mains power, and its terminals are connected to the terminals of the AC contactor 16. The signal output port of the AC contactor 16 is connected to the signal input port of the frequency converter 20. The output of the frequency converter 20 is connected to the power port of the magnetic pump 27 to control the power supply of the magnetic pump 27. The AC contactor 16 is used to control the power supply of the magnetic pump 27. When its coil is energized, the contacts close, and the magnetic pump 27 is energized and runs; when the coil is de-energized, the contacts open, and the magnetic pump 27 is de-energized and stops. The control signal of the frequency converter 20 is controlled by the analog output of the PLC 11, which ultimately controls the flow rate of the fluorinated liquid drawn by the magnetic pump 27 from the water tank 21 into the plate heat exchanger 30.

[0049] The output port of transformer 20 is connected to terminal block two, expanding into multiple 220V unidirectional power connection points. All 220V unidirectional power is provided by the expanded terminal block two. The terminals of switching power supply 15 are connected to the connection points of terminal block one 18, expanding into multiple 24V DC power connection points. The 24V DC power connection points are then connected to multiple expansion modules, including input analog module 12 and output analog module 13, which are fixed to the inner wall of the side control cavity. The signal input ports of temperature sensor one 33, temperature sensor two 38, temperature sensor three 44, flow meter one 31, flow meter two 40, pressure sensor one 34, and pressure sensor two 36 are all connected to the terminals of input analog module 12. The signal output ports of frequency converter 2 and PID electric proportional valve 39 are all connected to the terminals of analog module 13.

[0050] Transformer 14 converts 380V three-phase electricity into 220V single-phase electricity to power PLC 11 and switching power supply 15. Input analog module 12 and output analog module 13 serve as expansion modules, acting as digital-to-analog signal conversion bridges for temperature sensor 33, temperature sensor 38, temperature sensor 44, flow meter 31, flow meter 40, pressure sensor 34, and pressure sensor 36. Among these, only temperature sensor 33 provides calculation data to PLC 11; the other sensors are only used to monitor status signals in the relevant pipelines.

[0051] PLC 11, as the central controller, is responsible for receiving and processing signals from temperature sensor 1 (33), temperature sensor 2 (38), temperature sensor 3 (44), flow meter 1 (31), flow meter 2 (40), pressure sensor 1 (34), and pressure sensor 2 (36).

[0052] To strictly control the operating temperature of the semiconductor manufacturing equipment to a specific value, the following steps are taken: First, a preset operating temperature value is displayed on the touchscreen 5, and the same operating temperature value is configured in the settings interfaces of both the touchscreen 5 and PLC 11. Fluorinated liquid enters the production equipment through the coolant outlet pipe 7. Temperature sensor 33 monitors the temperature of the fluorinated liquid entering the production equipment in real time, and pressure sensor 34 monitors the pressure signal of the fluorinated liquid flowing into the production equipment. Simultaneously, the fluorinated liquid returns to the production equipment through the coolant inlet pipe 8. Temperature sensor 44 monitors the temperature of the fluorinated liquid flowing out of the production equipment in real time, and flow meter 31 monitors the flow rate of the fluorinated liquid flowing out of the production equipment. The fluorinated liquid enters the production equipment through the coolant outlet pipe 7 and returns to the water tank 21 through the coolant inlet pipe 8, forming a cooling loop. In this loop, the temperature and flow rate of the fluorinated liquid entering the production equipment, as well as the temperature and pressure signals of the fluorinated liquid flowing out of the production equipment, are monitored.

[0053] In the ambient temperature water inlet pipe, ambient temperature water enters the water chamber of plate heat exchanger 30 from ambient temperature water inlet pipe 9, exchanges heat with heat exchange tube 46, and is then discharged from ambient temperature water outlet pipe 10. During this process, temperature sensor 2 38 is used to monitor the temperature of the ambient temperature water entering plate heat exchanger 30, pressure sensor 2 36 is used to monitor the pressure signal of the ambient temperature water entering plate heat exchanger 30, and flow meter 2 40 is used to monitor the flow rate of the ambient temperature water entering plate heat exchanger 30. These signals are converted into electrical signals and input to PLC 11. Combined with the temperature of the fluorinated liquid input to the production equipment monitored in real time by temperature sensor 1 33, a PID control algorithm is executed. The PID electric proportional valve 39 adjusts the valve opening angle according to the received control signal, thereby controlling the flow rate of ambient temperature water entering plate heat exchanger 30 and exchanging heat with the fluorinated liquid. The fluorinated liquid after one heat exchange is circulated through the production equipment for cooling treatment until the operating temperature of the production equipment remains stable at the preset temperature value.

[0054] In summary, by executing a preset operating temperature signal through PLC 11 and controlling the opening angle of the PID electric proportional valve 39, precise and stable control of the semiconductor production equipment can be achieved.

[0055] In this embodiment, further, such as Figure 4 As shown, a connecting pipe 25 is inserted into both the upper and lower ends of one side of the water tank 21. A level gauge 3 is connected between the two connecting pipes 25 located outside the water tank 21. The fluorinated liquid filled into the water tank 21 will enter the level gauge 3 through the two connecting pipes 25 respectively, so that the staff can observe the level of the fluorinated liquid in the water tank 21 from outside the machine body 1, so as to ensure that when the level of fluorinated liquid is low, it can be detected and added in time.

[0056] Furthermore, a positive pressure valve 23 and a negative pressure valve 22 extending into the water tank 21 are respectively installed on the upper surface of the water tank 21; such as Figure 4 As shown, the positive pressure valve 23 can discharge high-pressure air from the water tank 21 because the temperature inside the water tank is higher and the air pressure is greater than the external pressure. Meanwhile, the negative pressure valve 22 introduces outside air into the water tank 21 to prevent the pressure inside the water tank 21 from being lower than the external pressure. The positive pressure valve 23 and the negative pressure valve 22 work together to balance the pressure inside the water tank 21.

[0057] Additionally, a liquid level float switch 26 is installed inside the water tank 21 and fixedly connected to the top wall of the water tank 21, such as... Figure 4As shown, the signal output port of the level float switch 26 is connected to the signal input port of PLC 11. The rise or fall of the fluorinated liquid level will cause the float to move up and down, thus causing the level float switch 26 to engage or disengage, outputting a switch signal to PLC 11 to provide the PLC 11 with a high or low liquid level signal. The signal output port of PLC 11 is also connected to an alarm. The level float switch 26 has a preset low or ultra-low liquid level alarm signal. At low liquid level, only an alarm is triggered without stopping the machine. At ultra-low liquid level, circuit breaker 17 disconnects the circuit and stops the machine.

[0058] An inspection port is provided at the upper end of the water tank 21. The inspection port opening is detachably covered with a cover 24. An upper cover 2 is installed at the upper end of the body 1 and covers the water tank 21. By opening the upper cover 2, the condition inside the water tank 21 can be inspected through the inspection port so that the staff can find out if there are any impurities and also clean the inner wall.

[0059] To prevent impurities from entering the plate heat exchanger 30 with room temperature water, a Y-type filter 41 is installed on the room temperature water inlet pipe 9. Similarly, to prevent impurities from being mixed into the fluorinated liquid after heat exchange from the production equipment, a Y-type filter 37 is installed on the coolant inlet pipe 8. Specifically, both Y-type filters 41 and 37 have cylindrical filter screens 43 inserted inside, and both Y-type filters 41 have end caps 42 threadedly connected to their end openings. Figure 7 and Figure 9 As shown, the end of the cylindrical filter screen 43 furthest from the end cap 42 is open for liquid entry. Impurities will be retained inside the cylindrical filter screen 43, while the liquid continues to flow through the mesh holes on the side wall of the cylindrical filter screen 43, thus achieving impurity filtration. Periodically open the end cap 42, remove the cylindrical filter screen 43 from the Y-type filter, clean the impurities inside the cylindrical filter screen 43, then reinstall the cylindrical filter screen 43 into the Y-type filter, and then reinstall the end cap 42.

[0060] A cooling fan 19 is also installed on the inner wall of the side control cavity, such as Figure 3 As shown, the terminal of the cooling fan 19 is connected to a 220V unidirectional electrical connection point. The cooling fan 19 cools the heat generated by all components in the side control cavity during operation.

[0061] Furthermore, such as Figure 7As shown, a branch pipe 32 is connected to the radial side wall of the coolant outlet pipe 7. A manual valve 71 is installed on the side wall of the branch pipe 32. A return pipe 35 is connected to the end of the branch pipe 32, and the end of the return pipe 35 is connected to the bottom wall of the water tank 21. The fluorinated liquid flows through the coolant outlet pipe 7. By manually rotating the manual valve 71 on the side wall of the externally connected branch pipe 32, the fluorinated liquid in the coolant outlet pipe 7 is diverted through the branch pipe 32 to the return pipe 35. This allows some of the fluorinated liquid to be returned to the water tank 21, reducing the pressure of the fluorinated liquid entering the production equipment and meeting the fluorinated liquid inlet pressure requirements of different production equipment.

[0062] Also, such as Figure 10 As shown, a reversing pipe 45 is provided at the position where the room temperature water inlet pipe 9 is connected inside the water cavity. The opening of the reversing pipe 45 is offset from the position where the room temperature water outlet pipe 10 is connected to the water cavity. In this way, room temperature water can be sprayed into the water cavity instead of directly sprayed into the position where the room temperature water outlet pipe 10 is connected to the water cavity, thereby increasing the flow surface of room temperature water in the water cavity, prolonging the time that room temperature water flows through the water cavity, and improving the heat exchange efficiency.

[0063] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A water-fluorine heat exchanger for semiconductor production, characterized in that, include: The machine body (1) has a water tank (21) at its upper end, and the water tank (21) is filled with fluorinated liquid; The machine body (1) has a built-in pipeline installation cavity. A magnetic pump (27) and a plate heat exchanger (30) are installed on the bottom wall of the pipeline installation cavity. The inlet of the magnetic pump (27) is connected to a coolant extraction pipe (29), which is connected to the bottom wall of the water tank (21). The plate heat exchanger (30) has a water cavity. The two opposite side walls of the plate heat exchanger (30) are respectively connected to a coolant delivery pipe (28) and a coolant outlet pipe (7). The water cavity has a heat exchange tube (46). The two ends of the heat exchange tube (46) are respectively connected to the coolant delivery pipe (28) and the coolant outlet pipe (7). The other end of the coolant delivery pipe (28) is connected to the outlet of the magnetic pump (27). The bottom wall of the water tank (21) is also connected to a coolant inlet pipe (8), the end of which is used to connect to the outlet port of the production equipment. The water tank (21), coolant extraction pipe (29) and coolant delivery pipe (28) form a coolant delivery circuit, and the coolant delivery pipe (28), heat exchange pipe (46), coolant outlet pipe (7) and coolant inlet pipe (8) form a cooling circulation circuit. The plate heat exchanger (30) is also connected to a normal temperature water inlet pipe (9) and a normal temperature water outlet pipe (10) on opposite side walls. The normal temperature water inlet pipe (9), the water chamber and the normal temperature water outlet pipe (10) form a normal temperature water circuit. A PID electric proportional valve (39) is installed on the ambient temperature water input pipe (9). The machine body (1) is also provided with a side control cavity. A PLC (11) for controlling the PID electric proportional valve (39) is fixedly installed on the inner wall of the side control cavity. A cabinet door (6) is also hinged to the opening of the side control cavity. A touch screen (5) is also embedded in the cabinet door (6). The COM port of the touch screen (5) is connected to the communication port of the PLC (11).

2. The water-fluoride heat exchanger for semiconductor production according to claim 1, characterized in that, The water tank (21) has an inspection port at the top, and the inspection port is detachably fitted with a cover (24). The upper part of the body (1) is fitted with a cover (2) that covers the water tank (21). The water tank (21) has a liquid inlet bend (4) connected to one side wall, and the liquid inlet bend (4) is threaded with a cap. The water tank (21) has connecting pipes (25) inserted at both the top and bottom of one side, and a level gauge (3) is connected between the two connecting pipes (25) located outside the water tank (21).

3. The water-fluoride heat exchanger for semiconductor production according to claim 2, characterized in that, The upper end face of the water tank (21) is respectively equipped with a positive pressure valve (23) and a negative pressure valve (22) extending into the water tank (21); The water tank (21) is also equipped with a liquid level float switch (26) that is fixedly connected to the top wall of the water tank (21). The signal output port of the liquid level float switch (26) is connected to the signal input port of the PLC (11).

4. The water-fluoride heat exchanger for semiconductor production according to claim 1, characterized in that, Temperature sensor 1 (33) and pressure sensor 1 (34) are also installed on the coolant outlet pipe (7).

5. The water-fluoride heat exchanger for semiconductor production according to claim 4, characterized in that, The coolant inlet pipe (8) is equipped with a flow meter (31) and a temperature sensor (44).

6. The water-fluoride heat exchanger for semiconductor production according to claim 5, characterized in that, Pressure sensor 2 (36) and temperature sensor 2 (38) are installed on the ambient temperature water input pipe (9); A Y-type filter 1 (41) is installed on the ambient temperature water inlet pipe (9), and a Y-type filter 2 (37) is installed on the coolant inlet pipe (8). A cylindrical filter screen (43) is inserted into both the Y-type filter 1 (41) and the Y-type filter 2 (41). The end openings of both the Y-type filter 1 (41) and the Y-type filter 2 (41) are threaded with end caps (42).

7. The water-fluoride heat exchanger for semiconductor production according to claim 6, characterized in that, The inner wall of the side control cavity is also equipped with an expansion module, a circuit breaker (17), an AC contactor (16), a transformer (14), a terminal block (18), a switching power supply (15), and a frequency converter (20). The circuit breaker (17) terminals are connected to the AC contactor (16) terminals, the AC contactor (16) signal output port is connected to the inverter (20) signal input port, and the inverter (20) output port is connected to the power port of the magnetic pump (27). The terminals of the switching power supply (15) are connected to the connection points of terminal block one (18) to expand into multiple 24V DC connection points. The output port of the transformer (14) is connected to terminal block two to expand into multiple 220V unidirectional connection points. The expansion module includes an input analog module (12) and an output analog module (13). The signal input ports of temperature sensor 1 (33), temperature sensor 2 (38), temperature sensor 3 (44), flow meter 1 (31), flow meter 2 (40), pressure sensor 1 (34), and pressure sensor 2 (36) are all connected to the terminals of the input analog module (12). The signal output ports of the frequency converter (20) and the PID electric proportional valve (39) are all connected to the terminals of the analog module (13).

8. The water-fluoride heat exchanger for semiconductor production according to claim 6, characterized in that, A cooling fan (19) is also installed on the inner wall of the side control cavity.

9. The water-fluoride heat exchanger for semiconductor production according to claim 4, characterized in that, The coolant outlet pipe (7) is also connected to a branch pipe (32) on its radial side wall. A manual valve (71) is also installed on the side wall of the branch pipe (32). The end of the branch pipe (32) is connected to a return pipe (35), and the end of the return pipe (35) is connected to the bottom wall of the water tank (21).

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