Substrate processing equipment and substrate processing system

Abstract

The utility model discloses substrate processing equipment and a substrate processing system, and relates to the field of substrate processing equipment.The substrate processing equipment comprises a vibration processing module; the vibration machining module is used for driving the machining tool rotating at a high speed to vibrate in the first direction at the set amplitude and frequency in the machining process, so that periodic contact and separation are formed between the machining tool and the substrate, and the substrate is machined. In the embodiment, the vibration machining module drives the machining tool rotating at a high speed to vibrate in the first direction according to the set amplitude and frequency, so that the machining tool and the base plate form periodic contact and separation, the axial force and torque borne by the machining tool are reduced, the friction factor between the machining tool and cuttings is reduced, the machining precision is improved, and the machining efficiency is improved. In addition, timely discharge of cutting chippings is promoted, abrasion of a machining cutter is reduced, and the service life is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of substrate processing equipment, and in particular to a substrate processing equipment and a substrate processing system. Background Technology

[0002] With the rapid development of technology, the miniaturization and integration of electronic devices are becoming increasingly prominent, which places higher demands on the line density and aperture density of substrates (such as printed circuit boards). In the substrate manufacturing process, there are many processing steps, such as drilling, milling, and cutting, and the processing quality directly affects the electrical performance of the substrate.

[0003] Existing substrate processing equipment primarily improves processing accuracy and efficiency by adjusting the electric spindle speed and feed rate. However, this method still faces challenges in achieving relatively low processing accuracy and efficiency when processing special substrates such as high-density substrates or high aspect ratio substrates. Summary of the Invention

[0004] Based on this, the present invention provides a substrate processing equipment and a substrate processing system to solve the technical problem of low processing accuracy and efficiency of existing substrate processing equipment.

[0005] To solve the above problems, the technical solution adopted by this utility model is as follows:

[0006] In a first aspect, a substrate processing apparatus is provided, including a vibration processing module;

[0007] The vibration processing module is used to drive a high-speed rotating processing tool to vibrate in a first direction with a set amplitude and frequency during the processing, so that the processing tool and the substrate form periodic contact and separation, thereby realizing the processing of the substrate.

[0008] Optionally, the vibration processing module includes an ultrasonic vibration processing module, which includes an ultrasonic vibration spindle.

[0009] Optionally, the frequency range of the ultrasonic vibration spindle is 20kHz to 40kHz; the ultrasonic vibration spindle includes an ultrasonic vibration module and a first spindle body;

[0010] One end of the ultrasonic vibration module is connected to one end of the first main shaft.

[0011] The other end of the first spindle is connected to one end of the machining tool.

[0012] Optionally, the ultrasonic vibration spindle includes an ultrasonic scalpel holder;

[0013] The other end of the first spindle body is connected to one end of the ultrasonic scalpel handle;

[0014] The other end of the ultrasonic scalpel handle is connected to one end of the machining tool.

[0015] Optionally, the ultrasonic vibration module includes a transducer and an amplitude transformer;

[0016] One end of the transducer is connected to one end of the amplitude transformer;

[0017] The other end of the amplitude rod is connected to one end of the first main shaft.

[0018] Optionally, the ultrasonic vibration spindle includes a hydrostatic ultrasonic electric spindle.

[0019] Optionally, the hydrostatic ultrasonic electric spindle includes a pneumatic hydrostatic ultrasonic electric spindle, which includes a second spindle body, a pneumatic circuit structure, an air-bearing vibrating plate, and a rotating shaft core disposed inside the second spindle body.

[0020] The air-bearing vibrating plate is provided on the rotating shaft core;

[0021] The air passage structure is located inside the second spindle body and is used to guide high-pressure air to act on both sides of the air-bearing vibrating plate, thereby driving the air-bearing vibrating plate to drive the rotating shaft core to vibrate along the first direction, and then driving the machining tool to vibrate synchronously along the first direction.

[0022] Optionally, the hydrostatic ultrasonic electric spindle further includes a hydrostatic ultrasonic electric spindle, which includes a liquid bearing, an ultrasonic liquid vibration module, and a third spindle body;

[0023] One end of the third spindle is connected to one end of the machining tool;

[0024] The liquid bearing is used to provide hydrostatic pressure to support the third spindle in floating.

[0025] One end of the ultrasonic liquid vibration module is connected to the other end of the third spindle body, and is used to provide ultrasonic vibration during rotation to drive the third spindle body to vibrate along the first direction, and drive the machining tool to vibrate synchronously along the first direction.

[0026] Optionally, the processing type of the substrate includes drilling, milling, or cutting, and / or the substrate includes a high aspect ratio substrate, a multilayer stacked substrate, or a high-density interconnect substrate.

[0027] Optionally, the substrate processing equipment further includes a bed, a gantry system, and a worktable located below the vibration processing module;

[0028] A passage is formed between the gantry system and the bed;

[0029] The gantry system and / or the worktable are movably disposed on the bed along a third direction, and the worktable can move into or out relative to the channel;

[0030] The vibration processing module is movably disposed in the gantry system along the second direction, and the vibration processing module is also movable along the first direction;

[0031] Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.

[0032] In a second aspect, a substrate processing system is provided, wherein the substrate includes a PCB board, a packaging substrate, and a glass substrate; the substrate processing system includes at least one substrate processing device as described in the first aspect above.

[0033] In one embodiment of this utility model, the substrate processing equipment includes a vibration processing module. This module drives a high-speed rotating processing tool to vibrate in a first direction with a set amplitude and frequency during processing, causing periodic contact and separation between the processing tool and the substrate to achieve substrate processing. In this embodiment, the vibration processing module drives the high-speed rotating processing tool to vibrate in the first direction with a set amplitude and frequency. This vibration causes a slight change in the displacement of the processing tool within each vibration cycle. This change prompts the contact point between the processing tool and the substrate to be fine-tuned within each cycle. Therefore, when errors occur due to tool offset or inaccurate positioning, these errors can be automatically corrected in the next vibration cycle, effectively reducing tool offset and improving the precision positioning capability, thereby improving processing accuracy and efficiency. Attached Figure Description

[0034] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of a substrate processing equipment according to one embodiment of the present invention;

[0036] Figure 2 This is a partial schematic diagram of a substrate processing equipment in one embodiment of the present invention.

[0037] The accompanying figure is labeled as follows:

[0038] 1. Vibration machining module; 2. Worktable; 3. Crossbeam base; 31. First base; 32. Second base; 4. Crossbeam; 5. Bed; 6. First motion assembly; 7. Second motion assembly; 8. Third motion assembly; 9. Machining tool; 10. Base plate. Detailed Implementation

[0039] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0040] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0041] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0042] To facilitate understanding of the embodiments of this utility model, the substrate involved in this utility model is explained as follows: The substrate 10 involved in this utility model may include a PCB board, a packaging substrate (IC carrier board), and a glass substrate, and is not limited thereto. The embodiments provided by this utility model will be explained below:

[0043] In one embodiment, a first aspect provides a substrate processing apparatus, see [link to previous document]. Figure 1 and Figure 2 The substrate processing equipment includes a vibration processing module 1, which drives a high-speed rotating processing tool 9 to vibrate in a first direction at a set amplitude and frequency during the processing, so that the processing tool 9 and the substrate 10 form periodic contact and separation, thereby realizing the processing of the substrate 10.

[0044] In this embodiment, the high-speed rotating machining tool 9 can be a machining tool 9 with a rotation speed between 50,000 rpm and 300,000 rpm. Preferably, the rotation speed of the machining tool 9 can be 100,000 rpm, 150,000 rpm, 200,000 rpm or 250,000 rpm, and there is no limitation here. Of course, if the vibration machining module 1 uses other rotation speeds to drive the machining tool 9 to perform vibration machining on the substrate 10, it should also be within the protection scope of this utility model.

[0045] As an example, when drilling a substrate 10 using a substrate processing equipment, a vibration processing module 1 is installed on the equipment. During processing, the vibration processing module 1 drives a high-speed rotating cutting tool 9 to vibrate in a first direction with a set amplitude and frequency. This pulsed, discontinuous drilling process causes periodic contact and separation between the cutting tool 9 and the substrate 10, resulting in minute changes in the displacement of the cutting tool 9 within each vibration cycle. These changes prompt fine-tuning of the contact point between the cutting tool 9 and the substrate 10 within each cycle. Therefore, when errors occur in the cutting tool 9 due to offset or inaccurate positioning, these errors can be automatically corrected in the next vibration cycle, effectively reducing cutting tool 9 offset, improving the precision positioning capability, and thus enhancing processing accuracy and efficiency.

[0046] For example, during vibratory drilling, when the high-speed rotating drill bit encounters deviation during drilling, the vibration causes the drill bit to briefly retract and reposition itself, automatically eliminating the deviation and ensuring that the drill bit can accurately re-drill into the target position. This improves the positioning accuracy of the hole, making vibratory drilling exhibit higher precision and efficiency in substrate processing compared to ordinary drilling. It shows significant advantages, especially when processing difficult-to-machine materials such as high aspect ratio substrates, multilayer stacked substrates, and high-density interconnect substrates. Furthermore, the excellent chip-breaking performance generated by vibration facilitates smoother chip removal during processing, reducing chip scraping on the hole surface. The reciprocating pressing action of the machining tool 9 on the inner hole surface during vibratory processing further reduces the surface roughness of the substrate 10 and the surface quality of the hole wall, thus improving the processing quality of the substrate 10. The intermittent action between the machining tool 9 and the substrate 10 greatly reduces friction, ensuring that the machining tool 9 remains in a stable and normal wear stage with a low cutting temperature, stable drill bit performance, and slow wear rate, extending the life of the machining tool 9.

[0047] In practical applications, the vibration processing module 1 can be preset with an amplitude range of 1µm to 20µm and a frequency range of 100Hz to 80kHz. For example, when processing a 2.5mm high aspect ratio substrate (e.g., FR-4 substrate), the frequency can be set to 30 kHz and the amplitude to 1.5µm. This allows the processing tool 9 to vibrate at a frequency of 30,000 times per second when it contacts the substrate 10. This vibration causes the cutting edge of the processing tool 9 to form periodic contact and separation with the substrate 10. The cutting force changes from a continuous force to a pulsed force, and continuous cutting becomes intermittent cutting. The cutting thickness of the processing tool 9 changes periodically with time. Therefore, the average cutting thickness of the processing tool 9 is smaller than that of high-speed drilling under the same processing parameters, effectively reducing the cutting force borne by the processing tool 9, improving the chip removal effect, reducing chip clogging and processing instability caused by material hardness and wear of the processing tool 9, and improving processing accuracy and efficiency.

[0048] It should be understood that the aforementioned periodic contact and separation, during the processing, manifests as the number of times the processing tool 9 contacts and separates from the substrate 10, determined by the frequency of the vibration processing module 1. For example, one contact and separation cycle is completed every 50µs (1s / 20000 times). The amplitude determines the pressure exerted by the processing tool 9 on the substrate 10 during each contact; the larger the amplitude, the stronger the contact force.

[0049] In one embodiment, the vibration processing module 1 includes an ultrasonic vibration processing module, which includes an ultrasonic vibration spindle. The frequency range of the ultrasonic vibration spindle is above 20kHz. Further, the frequency range of the ultrasonic vibration spindle can be configured in the range of 20kHz to 60kHz. Preferably, it can be configured as 20kHz, 30kHz, or 40kHz. The ultrasonic vibration spindle includes an ultrasonic vibration module and a first spindle body. One end of the ultrasonic vibration module is connected to one end of the first spindle body. The other end of the first spindle body is connected to one end of the processing tool 9.

[0050] It is understood that the ultrasonic vibration spindle protected in this application also includes adding an ultrasonic vibration module to an existing mechanical or electric spindle, enabling the mechanical or electric spindle to possess ultrasonic vibration machining capabilities. Thus, adding a corresponding ultrasonic vibration module to an older machine can also achieve the same performance, and is naturally within the scope of protection of this application. Furthermore, the frequency range of the ultrasonic vibration spindle can be configured to 20kHz~40kHz, but this is only an example and does not constitute a limitation.

[0051] In some embodiments, one end of the ultrasonic vibration module can be connected to one end of the first spindle via a fastening device, such as a thread, a clamp, or a dedicated connector. The other end of the first spindle can be connected to the machining tool 9 via a tool clamping system, such as a dedicated connector or a flange, to ensure that the machining tool 9, driven by the first spindle, forms periodic contact and separation with the substrate 10, thereby completing machining tasks such as cutting, drilling, or milling.

[0052] Furthermore, the ultrasonic vibration spindle also includes an ultrasonic tool holder; the other end of the first spindle body is connected to one end of the ultrasonic tool holder; the other end of the ultrasonic tool holder is connected to one end of the machining tool 9.

[0053] In some implementations, while the first spindle body serves as the primary transmission channel for vibration energy in an ultrasonic vibration spindle, its direct connection to the machining tool 9 often fails to meet the demands of high-precision and high-efficiency machining. By further connecting an ultrasonic tool holder to the first spindle body, the loss of vibration energy during transmission can be minimized, ensuring that the machining tool 9 receives stable and efficient ultrasonic vibration. Compared to directly connecting the first spindle body to the machining tool 9, the ultrasonic tool holder can more effectively focus and transmit vibration energy to the machining tool 9. Furthermore, the ultrasonic tool holder design offers a degree of versatility, adapting to different types of machining tools 9. This allows for easy replacement of different types of machining tools 9 on the same substrate processing equipment to meet the needs of various machining tasks.

[0054] Furthermore, the ultrasonic vibration module includes a transducer and an amplitude transformer; one end of the transducer is connected to one end of the amplitude transformer; the other end of the amplitude transformer is connected to one end of the first main shaft.

[0055] In some embodiments, a transducer is used to convert the electrical signal sent by the ultrasonic generator into ultrasonic vibrations, which are then amplified by an amplitude transformer and transmitted to a first spindle. The first spindle then transmits the vibrations to the machining tool 9, enabling the machining tool 9 to vibrate at extremely high frequencies during the machining of the substrate 10. These minute vibrations result in a very short contact time between the machining tool 9 and the substrate 10 during machining, thereby reducing the heat generated during machining and extending the service life of the machining tool 9. This also reduces material deformation or delamination of the substrate 10 caused by overheating during conventional machining processes.

[0056] It should be noted that the amplitude transformer in this embodiment can be a single-stage amplitude transformer or a multi-stage amplitude transformer. For example, an amplitude transformer composed of a first-stage amplitude transformer and a second-stage amplitude transformer connected in series can be selected according to the processing requirements. Here, no limitation is made.

[0057] In one embodiment, the ultrasonic vibration spindle includes a hydrostatic ultrasonic electric spindle. As an example, the hydrostatic ultrasonic electric spindle can be an electric spindle that integrates hydrostatic technology and ultrasonic vibration. Specifically, the hydrostatic ultrasonic electric spindle includes a gas hydrostatic ultrasonic electric spindle or a hydraulic hydrostatic ultrasonic electric spindle, and the two types of electric spindles will be described below:

[0058] In one embodiment, the pneumatic ultrasonic electric spindle includes a second spindle body, an air circuit structure, an air-bearing vibrating plate, and a rotating shaft core disposed inside the second spindle body; the air-bearing vibrating plate is disposed on the rotating shaft core; the air circuit structure is disposed inside the second spindle body and is used to guide high-pressure air to act on both sides of the air-bearing vibrating plate, thereby driving the air-bearing vibrating plate to drive the rotating shaft core to vibrate along the first direction, and then driving the machining tool 9 to vibrate synchronously along the first direction.

[0059] In some embodiments, by setting a rotating shaft core inside the second spindle body and connecting one end of the machining tool 9 to the output end of the rotating shaft core via a detachable connection, high efficiency and stability of transmission are ensured. Simultaneously, by setting an air passage structure inside the second spindle body, high-pressure air is introduced into the second spindle body through the air passage structure and acts on both sides of the air-bearing vibrating plate mounted on the rotating shaft core, thereby creating a certain pressure difference on both sides of the air-bearing vibrating plate. This pressure difference serves as a driving force, enabling the air-bearing vibrating plate to drive the rotating shaft core to generate high-frequency, low-amplitude vibrations along the first direction. With the vibration of the rotating shaft core, the machining tool 9 is further driven to vibrate at high frequency in the same direction during the cutting process. This vibration not only significantly improves cutting efficiency but also helps reduce cutting forces, reduce wear on the machining tool 9, and can improve the quality of the machined surface to a certain extent, achieving a high-precision, high-efficiency ultrasonic machining process.

[0060] In another embodiment, the hydrostatic ultrasonic electric spindle includes a liquid bearing, an ultrasonic liquid vibration module, and a third spindle body; one end of the third spindle body is connected to one end of the machining tool 9; the liquid bearing is used to provide liquid static pressure to support the third spindle body to float; one end of the ultrasonic liquid vibration module is connected to the other end of the third spindle body to provide ultrasonic vibration during rotation to drive the third spindle body to vibrate in a first direction and drive the machining tool 9 to vibrate synchronously in the first direction.

[0061] In some embodiments, the hydrostatic ultrasonic electric spindle includes an electric spindle that supports the high-speed rotation of a third spindle body via hydrostatic pressure. As an example, the hydrostatic ultrasonic electric spindle may include a liquid bearing, an ultrasonic liquid vibration module, a third spindle body, and a liquid supply system. The liquid supply system supplies high-pressure liquid to the liquid bearing, forming a uniform liquid film. As the third spindle body rotates, this film generates sufficient hydrostatic pressure to allow the hydrostatic third spindle body to float without mechanical contact and maintain extremely high rotational accuracy and stability. The ultrasonic liquid vibration module is connected to the other end of the third spindle body and provides ultrasonic vibration during rotation to drive the third spindle body to vibrate along a first direction, and to drive the machining tool 9 to vibrate synchronously along the first direction, thereby achieving precision machining of the substrate 10.

[0062] In one embodiment, the processing type of the substrate 10 includes drilling, milling, or cutting.

[0063] As an example, drilling is a processing method that forms holes in a substrate 10.

[0064] In some embodiments, when the vibration processing module 1 performs a drilling operation on the substrate 10, the drill bit is driven to vibrate at a high frequency in a first direction (e.g., a direction perpendicular to the surface of the substrate 10) with a set amplitude and frequency. This vibration causes periodic contact and separation between the drill bit and the substrate 10, effectively reducing cutting force, reducing cutting heat, and promoting timely chip removal.

[0065] During the drilling process, the vibration processing module 1 not only ensures the accuracy of the drilling, namely the position, diameter, and depth of the hole, but also protects the integrity of the substrate 10 and surrounding circuit structure by reducing cutting stress and thermal effects. Furthermore, vibration helps remove burrs and residues generated during drilling, improving the quality of the drilling.

[0066] A roulette wheel is a processing method that removes excess material from a substrate 10 to form a specific shape or structure.

[0067] In some embodiments, when the vibration processing module 1 performs a milling operation on the substrate 10, a special tool is driven to precisely remove excess material from the substrate 10 along a preset trajectory by vibrating at a set amplitude and frequency. During this process, ultrasonic vibration not only significantly reduces cutting resistance and thermal impact, ensuring the accuracy and integrity of the processing area, but also promotes the smooth discharge of chips, effectively preventing tool clogging and wear.

[0068] Milling is a surface treatment and fine machining method for a substrate 10.

[0069] In some embodiments, when the vibration processing module 1 performs milling operation on the substrate 10, the milling cutter is driven with a set amplitude and frequency to make the cutting process more precise and delicate, which reduces the damage to the substrate 10 caused by cutting heat and mechanical stress, and ensures the smoothness and accuracy of the processed edge.

[0070] Cutting is a processing method for forming a substrate 10 into the desired shape and structure.

[0071] In some embodiments, when the vibration processing module 1 performs a cutting operation on the substrate 10, the cutting tool is driven with a set amplitude and frequency, causing a high-frequency impact between the cutting tool and the substrate 10 material during vibration, thereby achieving precise and efficient cutting. This cutting method not only reduces damage to the substrate 10 material and ensures the smoothness and flatness of the processed edges, but also greatly improves processing accuracy and production efficiency.

[0072] In one embodiment, the substrate 10 includes a high aspect ratio substrate, a multilayer stacked substrate, or a high-density interconnect substrate.

[0073] As an example, a high aspect ratio substrate refers to a substrate with a relatively large thickness, such as a substrate with a thickness of 1.0 mm to 10.0 mm. A multilayer substrate refers to a circuit board composed of multiple substrate layers, each with its own independent circuit pattern and interconnection structure. For example, a substrate with 4 to 20 layers and a thickness of 1.5 mm to 10.0 mm. High-density interconnect (HDI) substrates refer to printed circuit boards with a high wiring density.

[0074] In one embodiment, such as Figure 1 As shown, the substrate processing equipment also includes a bed 5, a gantry system, and a worktable 2 located below the vibration processing module 1.

[0075] In some embodiments, the gantry system includes a beam base 3 and a beam 4 disposed on the beam base 3. Specifically, the beam base 3 includes a first base 31 and a second base 32 spaced apart. One end of the first base 31 and the second base 32 are connected to the beam 4 by fasteners or other means, thereby forming the gantry system. This connection method allows the substrate processing equipment to be quickly disassembled and reassembled when it needs to be moved or adjusted, improving the operating efficiency and flexibility of the substrate processing equipment. The beam 4 can also be made of a rigid material, such as marble, steel, or aluminum alloy, to ensure that it can withstand the weight and load of the vibration processing module 1 during processing, preventing deformation.

[0076] Furthermore, a channel is formed between the gantry system and the bed 5. As an example, one end of the first base 31 and the second base 32 can be connected to the crossbeam 4, and the other end can be connected to the bed 5, thereby forming a channel for the movement of the worktable 2 between the first base 31 and the second base 32.

[0077] Furthermore, the gantry system and / or the worktable 2 are movably disposed in the bed 5 along a third direction; that is, the gantry system is movably disposed in the bed 5 along a third direction, or the worktable 2 is movably disposed in the bed 5 along a third direction, or the gantry system and the worktable 2 are movably disposed in the bed 5 along a third direction. When the gantry system and / or the worktable 2 move, the worktable 2 can move in or out relative to the passage. If the gantry system moves, the worktable 2 can pass through or through the passage to achieve movement in or out relative to the passage.

[0078] In some embodiments, the bed 5 serves as a supporting base, on which a gantry system and / or a worktable 2 are movably mounted along a third direction. As an example, a third motion component 8 for movement along a third direction can be provided between the bed 5 and the worktable 2. One end of the third motion component 8 is connected to the bed 5 via a threaded connection, pin connection, key connection, or quick-locking device, and the other end is also connected to the worktable 2 via a threaded connection, pin connection, key connection, or quick-locking device. This allows the third motion component 8 to drive the worktable 2 to move along a third direction, enabling the worktable 2 to move the substrate 10 into or out of the channel, thus improving the automation and efficiency of the substrate processing equipment. The gantry system can also be fixed to the bed 5 by fixing the worktable 2, forming a channel together with the bed 5 for relative movement of the worktable 2. Specifically, this invention does not limit the scope of the invention.

[0079] It should be noted that the worktable 2, as the main support platform of the substrate 10, can be set below the vibration processing module 1, and the surface of the worktable 2 can also be designed as a plane with adjustable height to adapt to the processing requirements of substrates 10 of different thicknesses. This utility model does not limit this.

[0080] In some embodiments, the third motion component 8 may include a third linear motor, a third rolling guide, and a third slider. The third linear motor and the third rolling guide are mounted on the bed 5, and the third slider is disposed on the third rolling guide and connected to the worktable 2 and the third linear motor. During operation, by controlling the third linear motor, it drives the third slider to move along the third rolling guide in a third direction, thereby driving the worktable 2 to move in a third direction, thus moving in or out of the channel formed between the gantry system and the bed 5.

[0081] Furthermore, the vibration processing module 1 is movably disposed in the gantry system along the second direction, and the vibration processing module 1 can move along the first direction.

[0082] As an example, a first motion component 6 for moving in a first direction and a second motion component 7 for moving in a second direction can be provided between the vibration processing module 1 and the crossbeam 4. In this way, the vibration processing module 1 is driven to move in the first direction by the first motion component 6, and the first motion component 6 is driven to move in the second direction by the second motion component 7, so that the first motion component 6 drives the vibration processing module 1 to move in the second direction, thereby realizing the movement of the crossbeam 4 in the second direction.

[0083] Specifically, one end of the vibration processing module 1 can be detachably connected to one end of the first motion component 6; the other end of the first motion component 6 can be detachably connected to one end of the second motion component 7; and the other end of the second motion component 7 can be detachably connected to the crossbeam 4. The first motion component 6 and the second motion component 7 can employ high-precision ball screws or linear guide rails to ensure smooth and precise movement when driving the vibration processing module 1 along the first direction; however, no specific limitations are imposed here.

[0084] In some embodiments, the first motion component 6 may include a first linear motor, a first rolling guide rail, a first slider, and a base plate. The first linear motor and the first rolling guide rail are fixed to the front of the base plate. The first slider is disposed on the first rolling guide rail and connected to the first linear motor. The vibration processing module 1 can be fixed to the first slider, or connected to the first slider via a fixing component. During operation, by controlling the first linear motor, the first linear motor drives the first slider to move along the first rolling guide rail in a first direction, thereby driving the vibration processing module 1 to move in the first direction. Preferably, the first rolling guide rail is made of a high-precision and low-friction material, such as steel or aluminum alloy, to ensure the smoothness and accuracy of the first slider's movement on the first rolling guide rail, effectively reducing vibration or friction that affects processing accuracy.

[0085] The second motion component 7 may include a second linear motor, a second rolling guide rail, and a second slider. As an example, the second linear motor and the second rolling guide rail can be mounted on the crossbeam 4, and the second slider can be mounted on the second rolling guide rail, connected to the back of the base plate and the second linear motor respectively. During operation, by controlling the second linear motor, the second linear motor drives the second slider to move along the second rolling guide rail in a second direction, thereby driving the second motion component 7 to drive the first motion component 6, which in turn drives the vibration processing module 1 to move in the second direction. Through the above arrangement, the vibration processing module 1 can move not only in the first direction but also in the second direction, achieving omnidirectional, high-precision processing of the substrate 10.

[0086] In summary, the vibration processing module 1 is driven by the first motion component 6 and the second motion component 7 to perform precision processing in the first and second directions, respectively. After processing, the worktable 2 is driven by the third motion component 8 to move out in the third direction, so that the worktable 2 moves the substrate 10 out of the processing area, allowing the operator to easily unload and reload the substrate 10. The entire process improves the working efficiency and operational convenience of the substrate processing equipment.

[0087] In this design, the first, second, and third directions are all perpendicular to each other. Specifically, this perpendicularity ensures that the first motion component 6, the second motion component 7, and the third motion component 8 do not interfere with each other when operating independently in their respective directions, thus achieving precise and stable motion control. For example, when the first motion component 6 drives the vibration processing module 1 to move in the first direction, the second motion component 7 can simultaneously adjust its processing position in the second direction, while the third motion component 8 can flexibly adjust the movement of the worktable 2 in the third direction. Through this design, the substrate processing equipment can be precisely positioned and operated in three-dimensional space, thereby achieving complex processing tasks.

[0088] On the other hand, a processing method based on a substrate processing equipment is provided, applicable to the substrate processing equipment of the first aspect embodiment described above. The substrate processing equipment includes a vibration processing module 1 and a control system. The processing method of the substrate processing equipment includes:

[0089] S10: Obtain the processing parameters of the substrate 10;

[0090] In this embodiment, the processing parameters of the substrate 10 include substrate parameters and processing type parameters. Specifically, the substrate parameters include substrate type and inherent substrate parameters. The substrate type includes high aspect ratio substrate, multilayer stacked substrate or high density interconnect (HDI) substrate, and the inherent substrate parameters include high aspect ratio substrate parameters, multilayer stacked substrate parameters or high density interconnect substrate parameters.

[0091] As an example, parameters for high aspect ratio substrates include:

[0092] Thickness: For example, 1.0mm~10.0mm;

[0093] Aperture: for example, 0.2mm~1.0mm;

[0094] Aspect ratio: for example, 5:1 to 10:1 or higher;

[0095] Material type: For example, FR-4 material.

[0096] The parameters of the multilayer stacked substrate include:

[0097] Number of floors: For example, 4 to 20 floors or more;

[0098] Total thickness: for example, 1.5mm~10.0mm;

[0099] Material type: For example, FR~4 material.

[0100] High-density interconnect substrate parameters include:

[0101] Thickness: For example, 0.5mm~3.0mm;

[0102] Aperture: for example, 0.1mm~0.3mm;

[0103] Line width and spacing: for example, 50µm~150µm.

[0104] Material type: For example, low dielectric constant materials.

[0105] Machining type parameters include drilling parameters, milling parameters, milling parameters, or cutting parameters.

[0106] Specifically, drilling parameters include: drilling depth, spindle speed, and feed rate.

[0107] The parameters of the router include: cutting width, router cutter diameter, cutting speed, router cutter speed, and feed rate.

[0108] Milling parameters include: depth of cut, cutter diameter, spindle speed, and feed rate.

[0109] Cutting parameters include: cutting depth, cutting speed, and cutting accuracy.

[0110] S20. Determine the amplitude and frequency corresponding to the processing substrate 10 based on the processing parameters;

[0111] In this embodiment, the amplitude range can be 1µm to 20µm, and the frequency range can be 2kHz to 40kHz. Preferably, the amplitude can be configured as 5µm, 10µm, 15µm, or 18µm, and the frequency can be configured as 5kHz, 10kHz, 20kHz, 30kHz, or 35kHz; no specific limitation is imposed. The amplitude and frequency suitable for the substrate 10 are determined based on the processing parameters of the substrate 10 to optimize the processing effect and ensure processing quality. Specifically, the corresponding amplitude and frequency can be preset according to the processing parameters of the substrate 10. Furthermore, the corresponding amplitude and frequency can be automatically retrieved by inputting the processing parameters of the substrate 10. Other methods can also be used to determine the amplitude and frequency; no limitation is imposed here.

[0112] As an example, a database of processing parameters for substrate 10 can be pre-established, covering the aforementioned processing parameters of substrate 10, the corresponding amplitude and frequency of substrate 10, and the processing effect. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis. This parameter prediction model is used to predict the amplitude and frequency corresponding to the processing parameters of substrate 10.

[0113] Specifically, when the user inputs the processing parameters of the substrate 10, the control system immediately initiates an automatic query and matching mechanism to quickly filter out similar or related cases from the historical database based on the input processing parameters of the substrate 10. Then, the system uses a parameter prediction model to intelligently analyze the amplitude and frequency settings in these cases, comprehensively considering multiple dimensions such as processing accuracy, processing quality, and tool wear, and finally recommends the optimal amplitude and frequency.

[0114] For example, a user needs to process a batch of substrates 10 with a thickness of 1.6 mm, a hole diameter of 0.3 mm, and a material type of FR-4. After inputting these parameters, the control system determines the corresponding amplitude and frequency through a pre-trained parameter prediction model; for example, the amplitude is set to 2.5 µm and the frequency is set to 30 kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0115] As another example, a table relating the processing parameters of substrate 10 to amplitude and frequency can be pre-established. When the user inputs the processing parameters of substrate 10, the control system determines the corresponding amplitude and frequency of substrate 10 by querying the pre-established table. For example, a 1.0 mm thick high aspect ratio substrate corresponds to a frequency of 30 kHz and an amplitude of 1.5 µm. A 2.0 mm thick high aspect ratio substrate corresponds to a frequency of 28 kHz and an amplitude of 2 µm. It should be noted that the above is only an example; the specific processing parameters of substrate 10, and the corresponding amplitude and frequency, can be pre-set according to actual conditions and are not limited here.

[0116] S30. Based on the amplitude and frequency corresponding to the substrate 10, the vibration processing module 1 drives the high-speed rotating processing tool 9 to vibrate in the first direction, so that the processing tool 9 and the substrate 10 form periodic contact and separation, so as to realize the processing of the substrate 10.

[0117] In this embodiment, after obtaining the corresponding amplitude and ultrasonic parameters, the vibration processing module 1 is controlled to drive the processing tool 9 to vibrate in the first direction with the set amplitude and frequency, so that the processing tool 9 and the substrate 10 form periodic contact and separation, thereby realizing the processing of the substrate 10. Through the periodic contact and separation processing method, not only is the processing accuracy improved, but material loss and heat impact are also reduced, providing strong technical support for the fine processing of the substrate 10.

[0118] For example, using a 5.4mm high aspect ratio substrate 10, a 0.2mm through-hole is drilled to verify the following:

[0119] Table 1

[0120]

[0121] As shown in Table 1, regarding drilling accuracy, the experiment compared traditional drilling and ultrasonic drilling under the same rotational speed, feed rate, and drilling method. The results showed that traditional drilling resulted in drill bit breakage during processing, making it impossible to complete 400 holes, and the accuracy was low. Ultrasonic drilling, on the other hand, successfully completed 400 holes with an accuracy of CPK=1.895 (≥1.33), far exceeding the standard value. Furthermore, by adjusting the amplitude, the experiment revealed that increasing the amplitude significantly improved drilling accuracy, but also accompanied by a certain degree of decrease in drill bit life. Specifically, when the amplitude increased from 1µm to 2µm, the accuracy CPK increased from 1.539 to 1.895, and the drill bit life also increased slightly. However, when the amplitude continued to increase to 3µm, although the accuracy further improved to 1.995, the drill bit life decreased. Therefore, determining the amplitude and frequency corresponding to the substrate 10 ensured the optimal drilling state. Finally, regarding temperature control, the experiment used an infrared thermal imager to monitor the temperature of the substrate 10 during the drilling process of conventional drilling and ultrasonic drilling. Under the same parameters, ultrasonic drilling technology can reduce the temperature of the substrate 10 by about 20%, reduce friction and wear between the drill bit and the drilled substrate 10, extend the service life of the drill bit, improve drilling speed and efficiency, and ensure the accuracy and shape of the drill hole.

[0122] In summary, by acquiring the processing parameters of the substrate 10, determining the corresponding amplitude and frequency based on the processing parameters, and using the determined amplitude and frequency to control the vibration processing module 1 to drive the processing tool 9, the processing tool 9 and the substrate 1010 form periodic contact and separation, thereby achieving precise processing and ensuring that the processing tool 9 can work under optimal vibration conditions, effectively improving processing accuracy and efficiency.

[0123] In one embodiment, the vibration processing module 1 includes an ultrasonic vibration processing module, which includes a pneumatic ultrasonic spindle. In step S30, that is, according to the amplitude and frequency corresponding to the substrate 10, the vibration processing module 1 drives the high-speed rotating processing tool 9 to vibrate in the first direction, including the following steps:

[0124] S31. Output the corresponding current signal according to the amplitude and frequency of the substrate 10;

[0125] S32. Convert the current signal into a gas signal, and control the input air pressure of the pneumatic ultrasonic spindle according to the gas signal, so that the pneumatic ultrasonic spindle drives the high-speed rotating machining tool 9 to vibrate in the first direction according to the input air pressure.

[0126] In this embodiment, after determining the amplitude and frequency, the control system generates corresponding current signals. These current signals directly correspond to the desired amplitude and frequency, for example, implemented using an advanced digital signal processor (DSP) or microcontroller. This allows for precise calculation based on the input amplitude and frequency values, resulting in a matching current signal output. The current signal is then converted into a pneumatic signal using a dedicated signal conversion device, such as an electro-pneumatic converter (E / P converter) or a proportional solenoid valve, which is not limited here. The converted pneumatic signal is used to control the input air pressure of the pneumatic ultrasonic spindle, thereby achieving precise control of the amplitude and frequency of the pneumatic ultrasonic spindle. This causes the pneumatic ultrasonic spindle to drive the high-speed rotating machining tool 9 to vibrate in the first direction based on the input air pressure. The input air pressure range of the pneumatic ultrasonic spindle can be set to 0.2 MPa to 0.8 MPa, preferably 0.4 MPa to 0.6 MPa, but the specific range is not limited.

[0127] For example, when machining a high aspect ratio substrate 10 with a thickness of 2.5 mm, the determined frequency is 25 kHz and the amplitude is 2 µm. Next, the control system calculates the corresponding current signal, assuming it is 100 mA, and converts this current signal into a 0.5 MPa air pressure signal through an E / P converter. This air pressure signal is used to control the input air pressure of the vibration machining module 1, so that the high-pressure air entering the spindle body comes into contact with the air-bearing vibration plate fixed on the rotating shaft core and generates a pressure difference on both sides of the air-bearing vibration plate, thereby driving the rotating shaft core to vibrate in the first direction, and further causing the rotating shaft core to drive the machining tool 9 to vibrate in the first direction, thereby precisely controlling the vibration of the machining tool 9.

[0128] The second aspect provides a substrate processing system, which includes at least one substrate processing device as described in the first aspect embodiment.

[0129] It should be noted that the substrate processing equipment provided in the first aspect embodiment of this utility model can also be configured as a substrate processing equipment with two vibration processing modules 1 or six vibration processing modules 1. Here, this utility model does not make any limitation.

[0130] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A substrate processing equipment, characterized in that, Includes gantry system and vibration processing module; The vibration processing module is movably disposed in the gantry system along the second direction, and the vibration processing module can move along the first direction. It is used to drive a high-speed rotating processing tool to vibrate in the first direction with a set amplitude and frequency during the processing, so that the processing tool and the substrate form periodic contact and separation, so as to realize the processing of the substrate.

2. The substrate processing equipment according to claim 1, characterized in that, The vibration processing module includes an ultrasonic vibration processing module, which in turn includes an ultrasonic vibration spindle.

3. The substrate processing equipment according to claim 2, characterized in that, The frequency range of the ultrasonic vibration spindle is 20kHz~40kHz; the ultrasonic vibration spindle includes an ultrasonic vibration module and a first spindle body. One end of the ultrasonic vibration module is connected to one end of the first main shaft. The other end of the first spindle is connected to one end of the machining tool.

4. The substrate processing equipment according to claim 3, characterized in that, The ultrasonic vibration spindle also includes an ultrasonic scalpel holder; The other end of the first spindle body is connected to one end of the ultrasonic scalpel handle; The other end of the ultrasonic scalpel handle is connected to one end of the machining tool.

5. The substrate processing equipment according to claim 3, characterized in that, The ultrasonic vibration module includes a transducer and an amplitude transformer. One end of the transducer is connected to one end of the amplitude transformer; The other end of the amplitude rod is connected to one end of the first main shaft.

6. The substrate processing equipment according to claim 2, characterized in that, The ultrasonic vibration spindle includes a hydrostatic ultrasonic electric spindle.

7. The substrate processing equipment according to claim 6, characterized in that, The hydrostatic ultrasonic electric spindle includes a pneumatic hydrostatic ultrasonic electric spindle, which includes a second spindle body, a pneumatic circuit structure, an air-bearing vibrating plate, and a rotating shaft core disposed inside the second spindle body. The air-bearing vibrating plate is provided on the rotating shaft core; The air passage structure is located inside the second spindle body and is used to guide high-pressure air to act on both sides of the air-bearing vibrating plate, thereby driving the air-bearing vibrating plate to drive the rotating shaft core to vibrate along the first direction, and then driving the machining tool to vibrate synchronously along the first direction.

8. The substrate processing equipment according to claim 6, characterized in that, The hydrostatic ultrasonic electric spindle also includes a hydrostatic ultrasonic electric spindle, which includes a liquid bearing, an ultrasonic liquid vibration module, and a third spindle body. One end of the third spindle is connected to one end of the machining tool; The liquid bearing is used to provide hydrostatic pressure to support the third spindle in floating. One end of the ultrasonic liquid vibration module is connected to the other end of the third spindle body, and is used to provide ultrasonic vibration during rotation to drive the third spindle body to vibrate along the first direction, and drive the machining tool to vibrate synchronously along the first direction.

9. The substrate processing equipment according to any one of claims 1-8, characterized in that, The substrate is processed by drilling, milling, or cutting, and / or the substrate includes a high aspect ratio substrate, a multilayer stacked substrate, or a high-density interconnect substrate.

10. The substrate processing equipment according to any one of claims 1-8, characterized in that, The substrate processing equipment also includes a bed and a worktable located below the vibration processing module; A passage is formed between the gantry system and the bed; The gantry system and / or the worktable are movably disposed on the bed along a third direction, and the worktable can move into or out relative to the channel; Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.

11. A substrate processing system, characterized in that, The substrate includes a PCB board, a packaging substrate, and a glass substrate; the substrate processing system includes at least one substrate processing device as described in any one of claims 1-10.

Images