Printed circuit board (PCB) metalized half-hole circuit board

Abstract

The utility model relates to the related technical field of circuit boards, in particular to a printed circuit board (PCB) metalized half-hole circuit board, which comprises a placing frame and a threaded hole, the threaded hole is arranged on the upper surface of the placing frame in a penetrating manner, a mounting mechanism is arranged on the surface of one side of the placing frame, and a heat dissipation mechanism is arranged on the surface of one side of the placing frame. According to the PCB metalized half-hole circuit board, the placement frame is fixed through the threaded holes, so that the circuit board is ensured to be stable in use, the circuit board is convenient to fix, the installation efficiency is improved, the cost is reduced, firmness and reliability are achieved, the fault risk is reduced, heat enters the heat conduction pipes through the heat dissipation base, the aluminum cooling fins volatilize heat in the heat dissipation grooves, and the fan can take out heat; the aluminum cooling fins are good in heat conduction; the fan enhances the heat dissipation effect; the dustproof net protects the fan and prevents dust from entering the circuit board to influence operation; pollution to the circuit board is also reduced, cleanliness is kept, and a powerful guarantee is provided for stable operation and performance exertion of the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a PCB metallized half-hole circuit board. Background Technology

[0002] A circuit board, also known as a printed circuit board (PCB), is a crucial component of electronic devices. It is a substrate made of insulating materials, typically fiberglass reinforced plastic, on which conductive lines are printed or etched using specific processes. These lines connect various electronic components to form a complete circuit system. The circuit board provides a stable platform for mounting and connecting electronic components, enabling them to work collaboratively according to their designed functions. Different types of electronic components, such as resistors, capacitors, and integrated circuits, can be fixed to the circuit board through methods such as soldering. The design and manufacturing of circuit boards require consideration of factors such as the rationality of circuit layout, the stability of signal transmission, heat dissipation performance, and anti-interference capabilities. It is widely used in computers, communication equipment, and consumer electronics. Circuit boards, including those used in automotive electronics and many other fields, are a crucial foundation for the development of modern electronic technology. They provide a reliable platform for realizing various complex electronic functions. The addition of a convenient mounting mechanism to circuit boards greatly improves installation efficiency, enabling electronic components to be installed more quickly and accurately, reducing installation time and labor costs. Furthermore, the convenient mounting mechanism enhances installation stability and reliability, ensuring a secure connection of electronic components on the circuit board and reducing the risk of failures due to loosening. Simultaneously, this design facilitates later maintenance and repair; when replacing or repairing electronic components, operations can be performed more conveniently. In short, the convenient mounting mechanism greatly facilitates the use and maintenance of circuit boards, improving their overall performance. Therefore, a metallized half-hole PCB is particularly needed.

[0003] However, existing PCB metallized half-hole circuit boards are relatively troublesome to install, requiring manual alignment and external tools for installation and fixation. Moreover, their heat dissipation effect is not good. Existing PCB heat dissipation solutions mostly adopt passive heat dissipation, which has low heat dissipation efficiency and requires special tools for installation, resulting in a long average installation time. Utility Model Content

[0004] The purpose of this utility model is to provide a PCB metallized half-hole circuit board to solve the problems mentioned in the background art, such as the cumbersome installation of existing PCB metallized half-hole circuit boards, which require manual alignment and external tools for installation and fixation, and the poor heat dissipation effect during use.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a PCB metallized half-hole circuit board, including a mounting bracket and a threaded hole, wherein the upper surface of the mounting bracket is provided with a threaded hole, a mounting mechanism is provided on one side surface of the mounting bracket, and a heat dissipation mechanism is provided on one side surface of the mounting bracket.

[0006] The mounting mechanism includes a placement slot, a circuit board, a mounting slot, a spring, a pressing block, and a slot. The placement slot is provided on the upper surface of the placement frame, the circuit board is provided on the inner surface of the placement frame, the mounting slot is provided on the inner surface of the circuit board, the spring is fixedly connected to the inner surface of the mounting slot, and the pressing block is fixedly connected to one end of the spring.

[0007] Preferably, the two sides of the placement rack are provided with slots.

[0008] Preferably, the springs are provided in four groups and are symmetrically distributed.

[0009] Preferably, the inner side of the mounting groove is connected to the pressing block by a spring to form a telescopic structure.

[0010] Preferably, the inner wall dimensions of the placement slot match the outer wall dimensions of the circuit board.

[0011] Preferably, the heat dissipation mechanism includes a heat dissipation groove, a connecting frame, a dustproof mesh, a fan, an aluminum heat sink, a heat pipe, and a heat dissipation base. A heat dissipation groove is formed on one side surface of the placement rack. A connecting frame is installed on the inner side surface of the heat dissipation groove. Dustproof meshes are installed on both sides of the connecting frame. A fan is provided on the inner side surface of the connecting frame. An aluminum heat sink is installed on one side surface of the connecting frame. A heat pipe is installed on the inner side surface of the aluminum heat sink. A heat dissipation base is attached to the outer side surface of the heat pipe.

[0012] Preferably, a heat dissipation base is connected to the inner surface of the heat dissipation groove.

[0013] Compared with existing technologies, the advantages of this utility model are as follows: The metallized half-hole PCB circuit board is fixed to the device via threaded holes using a mounting bracket. This installation method is simple and stable, ensuring the stability of the circuit board during use. For fixing the circuit board itself, during installation, simply press the pressing block to compress the spring into the mounting slot, placing the circuit board into the slot. The spring then pushes the pressing block into the slot to complete the fixation. This method is convenient, greatly improving installation efficiency and reducing installation time and labor costs. Simultaneously, this fixing method is firm and reliable, reducing the risk of circuit board failure due to loosening and other issues, thus ensuring stable operation of the circuit board. Regarding heat dissipation, the heat generated by the circuit board during use can quickly enter the heat pipe through the heat dissipation base, and the heat in the heat pipe is then transferred to the heat pipe... The aluminum heat sink evaporates heat within the heat dissipation slots. Simultaneously, the fan in the connecting frame is activated, carrying away the heat from inside the heat sinks for efficient heat dissipation. This heat dissipation design effectively dissipates heat generated by the circuit board, preventing damage caused by high temperatures and extending its lifespan. Furthermore, the aluminum heat sinks have excellent thermal conductivity, rapidly transferring heat and improving heat dissipation efficiency. The fan further enhances the heat dissipation effect, ensuring the circuit board operates within its normal temperature range and guaranteeing stable performance. In addition, the dust filter plays a crucial role. When the fan is running, the dust filter protects it from dust and other impurities, preventing dust accumulation from affecting its normal operation and reducing dust contamination of the circuit board, keeping it clean. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the front appearance structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the installation mechanism structure of this utility model;

[0016] Figure 3 This is a schematic diagram of the heat dissipation mechanism of this utility model;

[0017] Figure 4 This is a schematic diagram of the aluminum heat sink connecting the heat pipe of this utility model.

[0018] In the diagram: 1. Placement rack; 2. Threaded hole; 3. Mounting mechanism; 301. Placement slot; 302. Circuit board; 303. Mounting slot; 304. Spring; 305. Pressing block; 306. Card slot; 4. Heat dissipation mechanism; 401. Heat dissipation slot; 402. Connecting frame; 403. Dustproof net; 404. Fan; 405. Aluminum heat sink; 406. Heat pipe; 407. Heat dissipation base. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4 The present invention provides a technical solution: a PCB metallized half-hole circuit board, including a placement frame 1 and a threaded hole 2. The threaded hole 2 is provided through the upper surface of the placement frame 1, a mounting mechanism 3 is provided on one side surface of the placement frame 1, and a heat dissipation mechanism 4 is provided on one side surface of the placement frame 1.

[0021] The mounting mechanism 3 includes a placement slot 301, a circuit board 302, a mounting slot 303, a spring 304, a pressing block 305, and a slot 306. The placement slot 301 is formed on the upper surface of the placement frame 1. The circuit board 302 is provided on the inner surface of the placement frame 1. The mounting slot 303 is formed on the inner surface of the circuit board 302. A spring 304 is fixedly connected to the inner surface of the mounting slot 303. A pressing block 305 is fixedly connected to one end of the spring 304. The mechanism utilizes the placement slot 301, circuit board 302, mounting slot 303, spring 304, and pressing block 306. The design of the slot 306 makes installation more convenient. First, the placement frame 1 is fixed to the equipment through the threaded hole 2. Then, the pressing block 305 is pressed, and the pressing block 305 squeezes the spring 304 into the mounting groove 303. When the pressing block 305 squeezes the spring 304 and enters the mounting groove 303, the circuit board 302 can be placed into the placement groove 301. Then, the spring 304 can push the pressing block 305 into the slot 306 to complete the fixing of the circuit board 302 and the placement frame 1.

[0022] Furthermore, slots 306 are provided on both sides of the mounting bracket 1, which allow the circuit board 302 to be fixed in place.

[0023] Furthermore, four sets of springs 304 are provided and symmetrically distributed. The arrangement of four sets of springs 304 makes the system more stable after pressing.

[0024] Furthermore, the inner spring 304 of the mounting groove 303 is connected to the pressing block 305 to form a telescopic structure, and the spring 304 can be installed through the mounting groove 303.

[0025] Furthermore, the inner wall dimensions of the placement slot 301 match the outer wall dimensions of the circuit board 302, allowing the circuit board 302 to be placed by the placement slot 301.

[0026] Furthermore, the heat dissipation mechanism 4 includes a heat dissipation slot 401, a connecting frame 402, a dust filter 403, a fan 404, an aluminum heat sink 405, a heat pipe 406, and a heat dissipation base 407. A heat dissipation slot 401 is formed on one side surface of the mounting bracket 1. A connecting frame 402 is installed on the inner surface of the heat dissipation slot 401. Dust filters 403 are installed on both sides of the connecting frame 402. A fan 404 is installed on the inner surface of the connecting frame 402. An aluminum heat sink 405 is installed on one side surface of the connecting frame 402. A heat pipe 406 is installed on the inner surface of the aluminum heat sink 405. A heat dissipation base 407 is attached to the outer surface of the heat pipe 406. The heat dissipation is achieved through the heat dissipation slot 401. 1. The arrangement of the connecting frame 402, dust filter 403, fan 404, aluminum heat sink 405, heat pipe 406, and heat sink base 407 improves heat dissipation. During the use of the circuit board 302, the heat generated inside the circuit board 302 will enter the heat pipe 406 through the heat sink base 407. Then, the heat in the heat pipe 406 will evaporate in the heat sink 401 through the aluminum heat sink 405. Then, the fan 404 in the connecting frame 402 will be activated to carry away the heat inside the heat sink 401 for heat dissipation. The dust filter 403 protects the fan 404 when it is rotating.

[0027] Furthermore, a heat dissipation base 407 is connected to the inner surface of the heat dissipation slot 401, and the heat dissipation base 407 allows heat to be absorbed.

[0028] Working principle: First, the placement rack 1 is fixed to the equipment through the threaded hole 2. Then, the pressing block 305 is pressed, and the pressing block 305 compresses the spring 304 into the mounting groove 303. When the pressing block 305 compresses the spring 304 and enters the mounting groove 303, the circuit board 302 can be placed into the placement groove 301. Then, the spring 304 pushes the pressing block 305 into the slot 306 to fix the circuit board 302 to the placement rack 1. During the use of the circuit board 302, the heat generated inside the circuit board 302 will enter the heat conduction pipe 406 through the heat dissipation base 407. Then, the heat in the heat conduction pipe 406 will evaporate in the heat dissipation groove 401 through the aluminum heat sink 405. Then, the fan 404 in the connecting frame 402 is started to carry out the heat from the heat dissipation groove 401 for heat dissipation. The dustproof net 403 protects the fan 404 when it is rotating.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A PCB metallized half-hole circuit board, comprising a mounting bracket (1) and a threaded hole (2), characterized in that: The upper surface of the placement rack (1) is provided with a threaded hole (2), a mounting mechanism (3) is provided on one side surface of the placement rack (1), and a heat dissipation mechanism (4) is provided on one side surface of the placement rack (1). The mounting mechanism (3) includes a placement slot (301), a circuit board (302), a mounting slot (303), a spring (304), a pressing block (305), and a card slot (306). The upper surface of the placement rack (1) is provided with a placement slot (301). The inner surface of the placement rack (1) is provided with a circuit board (302). The inner surface of the circuit board (302) is provided with a mounting slot (303). The inner surface of the mounting slot (303) is fixedly connected with a spring (304). One end of the spring (304) is fixedly connected with a pressing block (305).

2. The PCB metallized half-hole circuit board according to claim 1, characterized in that: The two sides of the placement rack (1) are provided with slots (306).

3. A PCB metallized half-hole circuit board according to claim 1, characterized in that: The spring (304) is provided in four sets and is symmetrically distributed.

4. A PCB metallized half-hole circuit board according to claim 1, characterized in that: The inner spring (304) of the mounting groove (303) is connected to the pressing block (305) to form a telescopic structure.

5. A PCB metallized half-hole circuit board according to claim 1, characterized in that: The inner wall dimensions of the placement slot (301) match the outer wall dimensions of the circuit board (302).

6. A PCB metallized half-hole circuit board according to claim 1, characterized in that: The heat dissipation mechanism (4) includes a heat dissipation groove (401), a connecting frame (402), a dustproof net (403), a fan (404), an aluminum heat sink (405), a heat pipe (406), and a heat dissipation base (407). A heat dissipation groove (401) is provided on one side surface of the placement rack (1). A connecting frame (402) is installed on the inner side surface of the heat dissipation groove (401). A dustproof net (403) is installed on both sides of the connecting frame (402). A fan (404) is provided on the inner side surface of the connecting frame (402). An aluminum heat sink (405) is installed on one side surface of the connecting frame (402). A heat pipe (406) is installed on the inner side surface of the aluminum heat sink (405). A heat dissipation base (407) is attached to the outer side surface of the heat pipe (406).

7. A PCB metallized half-hole circuit board according to claim 6, characterized in that: The inner surface of the heat sink (401) is connected to a heat sink base (407).

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