Laser power supply heat dissipation device

Abstract

The utility model belongs to the technical field of electric appliance devices, and discloses a laser power supply heat dissipation device which comprises a heat dissipation assembly, a heat conduction assembly and a top cover, the heat dissipation assembly comprises a bottom plate, an installation frame is fixed above the front side of the bottom plate, a fan is arranged on the installation frame and blows air from front to back, and the heat conduction assembly comprises a heat conduction plate. Mounting plates are arranged below the left side and the right side of the heat conduction plate respectively and connected to the upper portion of the bottom plate, a plurality of guide plates are arranged at the bottom of the heat conduction plate, the guide plates are arranged in the front-back direction, the guide plates are located between the two mounting plates and located behind the mounting frame, and the upper portion of the heat conduction plate is used for mounting a power source power assembly. The power supply power assembly is located between the top cover and the heat conduction plate. The beneficial effects of the utility model are that the structure is simple, the efficiency is high, the investment cost of equipment manufacturers of the high-power laser power supply power assembly module and the maintenance cost of the equipment in use can be reduced, the utilization rate of the equipment is improved, and the consumption of resources is reduced.

Description

Technical Field

[0001] This utility model relates to the field of electrical device technology, and in particular to a laser power supply heat dissipation device. Background Technology

[0002] The power supply unit includes various electrical components, such as transformers, choke coils, and other electrical parts. These components generate heat during operation, and elevated temperatures can affect the operational stability of the electrical devices. Good heat dissipation is a crucial prerequisite for stable power supply operation. Currently, most high-power laser power supplies use water-cooling systems for heat dissipation. However, this system design is complex, water-cooling systems occupy a large space, and water purification and equipment maintenance costs are high, which does not meet the needs of most enterprises.

[0003] Therefore, it is necessary to provide a laser power supply heat dissipation device that can improve the problems of complex overall system design, large space occupation, and high water purification and facility maintenance costs of water cooling systems, thereby reducing the investment costs for equipment manufacturers and the maintenance costs during equipment use. Utility Model Content

[0004] This utility model discloses a laser power supply heat dissipation device, which provides forced heat dissipation for high-power laser power supplies to meet the equipment's operating conditions and can effectively solve the technical problems involved in the background art.

[0005] To achieve the above objectives, the technical solution of this utility model is as follows:

[0006] A laser power supply heat dissipation device includes a heat dissipation component, a heat conduction component, and a top cover. The heat dissipation component includes a base plate, a mounting bracket fixed above the front side of the base plate, and a fan mounted on the mounting bracket that blows air from front to back. The heat conduction component includes a heat conduction plate, and mounting plates are provided below the left and right sides of the heat conduction plate. The mounting plates are connected to the top of the base plate. Multiple guide plates are provided at the bottom of the heat conduction plate, arranged in a front-back direction and located between two mounting plates and behind the mounting bracket. A power supply component is mounted on top of the heat conduction plate. The top cover is mounted on the heat conduction plate, and the power supply component is located between the top cover and the heat conduction plate.

[0007] A laser power supply heat dissipation method is disclosed. High-power laser power supplies mostly employ water-cooling systems, which are complex in design, occupy a large space, and incur high costs for water purification and equipment maintenance. This proposed solution improves upon these issues, reducing initial investment costs for equipment manufacturers and ongoing maintenance expenses. The laser power supply power module is mounted on an integrated air-cooled structural profile (thermal conductive component). Thermally conductive potting compound is applied to the laser power supply power module, transferring heat from the module to the air-cooled structural profile. The air-cooling system then cools the entire laser power supply to meet the system's operating requirements. The integrated air-cooled structural profile is made of high thermal conductivity aluminum, the thermally conductive potting compound has a high thermal conductivity coefficient, and the fan assembly is a high-speed, high-airflow fan.

[0008] As a preferred improvement of this utility model, the power supply component is a PCBA board.

[0009] As a preferred improvement of this utility model, thermally conductive adhesive is provided between the power supply component and the heat-conducting plate.

[0010] As a preferred improvement of this utility model, there are multiple fans, which are evenly distributed in the left-right direction.

[0011] As a preferred improvement of this utility model: the mounting bracket includes a front mounting plate, and the front mounting plate is provided with multiple ventilation openings.

[0012] As a preferred improvement of this utility model: connecting and fixing plates are provided on the upper left and right sides of the base plate, and the connecting and fixing plates are screwed to the mounting plate.

[0013] As a preferred improvement of this utility model: a top cover fixing plate is provided on both the left and right sides above the heat conduction plate, the top cover is screwed to the top cover fixing plate, and the power supply component is located between the two top cover fixing plates.

[0014] As a preferred improvement of this utility model: a positioning plate is provided above the heat-conducting plate, and the power supply component is provided with positioning holes corresponding to the positioning plate.

[0015] As a preferred improvement of this utility model, the heat-conducting plate is a high thermal conductivity aluminum plate.

[0016] As a preferred improvement of this utility model, the heat-conducting plate is provided with screw holes.

[0017] The beneficial effects of this utility model are as follows:

[0018] The laser power supply module is mounted on a high thermal conductivity aluminum profile with an integrated air-cooled structure. The entire laser power supply is cooled by a high-speed, high-airflow fan cooling system, which has a good heat dissipation effect. This can reduce the investment cost for equipment manufacturers of high-power laser power supply modules and the maintenance cost during equipment use, improve equipment utilization, and reduce resource consumption. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0020] Figure 1 This is a schematic diagram of a laser power supply heat dissipation device according to the present invention;

[0021] Figure 2 This is an exploded view of the heat dissipation device of this utility model;

[0022] Figure 3 This is a schematic diagram of the heat dissipation component structure of this utility model;

[0023] Figure 4 This is a schematic diagram of the thermal conductive component structure of this utility model.

[0024] In the diagram: 100-heat dissipation component, 110-base plate, 120-mounting bracket, 130-fan, 140-connecting mounting plate, 200-heat conduction component, 210-heat conduction plate, 211-top cover mounting plate, 212-positioning plate, 220-mounting plate, 230-guide plate, 300-top cover, 400-power supply component. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0026] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0027] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0029] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0030] Please see Figures 1-4 As shown, this utility model provides a laser power supply heat dissipation device, including a heat dissipation component 100, a heat conduction component 200, and a top cover 300. The heat dissipation component 100 includes a base plate 110, and a mounting bracket 120 is fixed above the front side of the base plate 110. A fan 130 is provided on the mounting bracket 120, and the fan 130 blows air from front to back. The heat conduction component 200 includes a heat conduction plate 210, and mounting plates 220 are provided below the left and right sides of the heat conduction plate 210. 20 is connected above the base plate 110. The bottom of the heat-conducting plate 210 is provided with multiple guide plates 230. The guide plates 230 are arranged in the front-back direction. The guide plates 230 are located between the two mounting plates 220 and behind the mounting bracket 120. The heat-conducting plate 210 is used to install the power supply component 400. The top cover 300 is installed on the heat-conducting plate 210. The power supply component 400 is located between the top cover 300 and the heat-conducting plate 210.

[0031] In high-power laser power supply applications, the water-cooling system is eliminated, and a new laser power supply cooling method is adopted. The laser power supply power module is mounted on an integrated air-cooled structural profile. Thermally conductive potting compound is applied to the laser power supply power module, transferring heat from the laser power supply power module to the integrated air-cooled structural profile. The air-cooling system then cools the entire laser power supply, thus achieving heat dissipation and cooling to meet the system's operational requirements. Alternatively, the laser power supply power module is mounted on a high-thermal-conductivity aluminum profile within the integrated air-cooled structure. High-thermal-conductivity potting compound is applied to the laser power supply power module, transferring heat from the device to the integrated high-thermal-conductivity aluminum profile. A high-speed, high-airflow fan air-cooling system then cools the entire laser power supply. This reduces the cost of the high-power laser power supply power module, decreases investment costs for equipment manufacturers, reduces maintenance costs during operation, improves equipment utilization, and reduces resource consumption.

[0032] In one embodiment, the power supply component 400 is a PCBA board, and thermally conductive adhesive is provided between the power supply component 400 and the heat-conducting plate 210. There are multiple fans 130, evenly distributed along the left-right direction, and the mounting bracket 120 includes a front mounting plate with multiple ventilation openings.

[0033] In one embodiment, connecting and fixing plates 140 are provided on the upper left and right sides of the base plate 110, and the connecting and fixing plates 140 are screwed to the mounting plate 220. Top cover fixing plates 211 are provided on both the left and right sides above the heat-conducting plate 210, and the top cover 300 is screwed to the top cover fixing plates 211. The power supply component 400 is located between the two top cover fixing plates 211. A positioning plate 212 is provided above the heat-conducting plate 210, and the power supply component 400 has positioning holes corresponding to the positioning plate 212. The heat-conducting plate 210 is a high thermal conductivity aluminum plate, and screw holes are provided on the heat-conducting plate 210. It should be further noted that any other components used to achieve the above effects should fall within the inventive concept of this utility model and should be protected within the scope of this utility model.

[0034] The laser power supply power component module PCBA is mounted on a high thermal conductivity aluminum profile HS1 with an integrated air-cooled structure. High thermal conductivity potting compound A / B is applied to the laser power supply power component module PCBA. The heat from the device is conducted to the integrated high thermal conductivity aluminum profile HS1, and the entire laser power supply is cooled by a high-speed, high-airflow fan system FAN1, FAN2, and FAN3. Through the above device, the initial investment cost for high-power laser power supply power component module equipment manufacturers and the maintenance cost during equipment use can be reduced, the equipment utilization rate can be improved, and resource consumption can be reduced.

[0035] Working principle: Install the fan 130, then screw the mounting plate 220 to the connecting fixing plate 140. Coat the surface of the heat-conducting plate 210 with thermally conductive adhesive. Install PCBA board (power supply component 400) and other components, then install the top cover 300. Connect the PCBA board to other components for normal operation. During operation, the heat of the PCBA board is transferred to the heat-conducting plate 210. Start the fan 130, and the fan 130 blows air onto the guide plate 230. The air passes through the gaps between the guide plates 230 and is separated from the heat dissipation device. With the flow of air, the heat-conducting plate 210 is cooled, thereby achieving the effect of cooling the power supply component 400.

[0036] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A laser power supply heat dissipation device, characterized in that: The device includes a heat dissipation assembly (100), a heat conduction assembly (200), and a top cover (300). The heat dissipation assembly (100) includes a base plate (110), a mounting bracket (120) fixed above the front side of the base plate (110), and a fan (130) mounted on the mounting bracket (120). The fan (130) blows air from front to back. The heat conduction assembly (200) includes a heat conduction plate (210), and mounting plates (220) are provided on the lower left and right sides of the heat conduction plate (210). The mounting plates (220) are connected to the base plate. Above the heat-conducting plate (210), a plurality of guide plates (230) are provided at the bottom of the heat-conducting plate (210). The guide plates (230) are arranged in the front-back direction. The guide plates (230) are located between the two mounting plates (220) and behind the mounting bracket (120). The heat-conducting plate (210) is used to install the power supply component (400). The top cover (300) is installed on the heat-conducting plate (210). The power supply component (400) is located between the top cover (300) and the heat-conducting plate (210).

2. The laser power supply heat dissipation device according to claim 1, characterized in that: The power supply component (400) is a PCBA board.

3. The laser power supply heat dissipation device according to claim 1, characterized in that: Thermal adhesive is provided between the power supply component (400) and the heat-conducting plate (210).

4. The laser power supply heat dissipation device according to claim 1, characterized in that: There are multiple fans (130), which are evenly distributed in the left-right direction.

5. A laser power supply heat dissipation device according to claim 1, characterized in that: The mounting bracket (120) includes a front mounting plate with multiple ventilation openings.

6. The laser power supply heat dissipation device according to claim 1, characterized in that: The base plate (110) is provided with connecting and fixing plates (140) on the upper left and right sides, and the connecting and fixing plates (140) are screwed to the mounting plate (220).

7. A laser power supply heat dissipation device according to claim 1, characterized in that: The heat-conducting plate (210) is provided with top cover fixing plates (211) on both the left and right sides above it. The top cover (300) is screwed to the top cover fixing plates (211). The power supply component (400) is located between the two top cover fixing plates (211).

8. A laser power supply heat dissipation device according to claim 1, characterized in that: A positioning plate (212) is provided above the heat-conducting plate (210), and the power supply component (400) is provided with positioning holes corresponding to the positioning plate (212).

9. A laser power supply heat dissipation device according to claim 1, characterized in that: The heat-conducting plate (210) is a high thermal conductivity aluminum plate.

10. A laser power supply heat dissipation device according to claim 1, characterized in that: The heat-conducting plate (210) is provided with screw holes.

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