Radiator with heat dissipation position capable of being shifted

Abstract

A radiator with a heat dissipation position capable of being deviated is used for dissipating heat of a heat source structure and comprises a heat conduction component used for being tightly attached to the heat source structure so as to transfer heat generated by the heat source structure; the deflectable component comprises a first connecting part, a second connecting part and a position adjusting part, the first connecting part is connected to the heat conduction component, the second connecting part is used for being connected to the heat source structure through the mounting frame, and the position adjusting part is used for adjusting the relative position of the first connecting part and the second connecting part so as to change the position where the heat conduction component is tightly attached to the heat source structure. In the application, when the position of the heating center of the heat source structure continuously deviates, the part capable of deviating can change the abutting position of the heat conduction part and the heating center of the heat source structure, so that the cooling performance of the radiator is improved. The radiator further has the advantages of being easy, fast and convenient to use and operate.

Description

Technical Field

[0001] This utility model relates to the field of communication technology, and in particular to a heat sink with an offset heat dissipation position. Background Technology

[0002] Radiators are an indispensable and important component of heat dissipation systems. Their main function is to effectively transfer and dissipate the heat generated by equipment to ensure its normal operation and extend its service life. With the upgrading of equipment, the position of the heat-generating center of the heat source structure in the equipment is constantly shifting. As a result, the heat-generating center of the heat source structure and the heat-conducting center of the radiator are not matched, leading to high thermal resistance and low heat dissipation efficiency. Utility Model Content

[0003] To address the aforementioned issues, embodiments of this application provide a heat sink with an offset heat dissipation position, which can accurately match the heat dissipation center of the heat source structure and improve the heat dissipation capacity of the heat sink.

[0004] Therefore, the embodiments of this application adopt the following technical solution: a heat sink with an offset heat dissipation position for dissipating heat from a heat source structure. The heat sink includes: a heat-conducting component for tightly fitting the heat source structure to transfer the heat generated by the heat source structure; and an offset component including a first connecting part, a second connecting part, and a position adjustment part. The first connecting part is connected to the heat-conducting component, the second connecting part is connected to the heat source structure through a mounting frame, and the position adjustment part is used to adjust the relative positions of the first connecting part and the second connecting part to change the position where the heat-conducting component tightly fits the heat source structure.

[0005] This application provides a heat sink with an offset heat dissipation position, including a heat-conducting component and an offset component. When the position of the heat-generating center of the heat source structure continuously shifts, the offset component can change the contact position between the heat-conducting component and the heat-generating center of the heat source structure, thereby improving the heat dissipation performance of the heat sink. The heat sink of this application embodiment also features simple, quick, and convenient operation.

[0006] In one possible implementation, the position adjustment part includes a plurality of first mounting parts, each of which is in a different position; the first connecting part is used to connect to the heat-conducting component through the different first mounting parts, so that the heat-conducting component is in close contact with different positions of the heat source structure.

[0007] In this implementation, the first connecting part cooperates with multiple first mounting parts to achieve that the heat-conducting component is closely attached to different positions of the heat source structure.

[0008] In one possible implementation, the multiple first mounting portions are multiple first limiting holes, and the first connecting portion is a first limiting assembly. The first limiting assembly is used to connect to the heat-conducting component through different first limiting holes, so that the heat-conducting component is tightly attached to different positions of the heat source structure.

[0009] In this implementation, the first limiting component cooperates with multiple first limiting holes to achieve close contact between the heat-conducting component and different positions of the heat source structure.

[0010] In one possible implementation, the first limiting component includes a first limiting structure, and the heat-conducting component is slidably connected to the offset component. During the sliding process of the heat-conducting component, the first limiting structure is used to engage the heat-conducting component through different first limiting holes.

[0011] In this implementation, the heat-conducting component is slidable, and during the sliding process of the heat-conducting component, the first limiting structure is positioned to different first limiting holes, thereby engaging the heat-conducting component.

[0012] In one possible implementation, the offset component includes a crossbeam with a plurality of first limiting holes; the heat-conducting component includes a heat-conducting base with mounting holes; and a first limiting structure is mounted in the mounting holes, the first limiting structure matching one of the plurality of first limiting holes, so that the heat-conducting component is tightly fitted to different positions of the heat source structure.

[0013] In this implementation, the crossbeam is provided with multiple first limiting holes, and the heat-conducting base is provided with mounting holes. This makes full use of the existing structure of the heat sink without adding more usable space, and the cost is also lower.

[0014] In one possible implementation, the first limiting structure is a first limiting ball, which is installed in the mounting hole. During the sliding of the heat-conducting base along the crossbeam, the first limiting ball matches one of the multiple first limiting holes so that the heat-conducting component is tightly attached to different positions of the heat source structure.

[0015] In this implementation, the first limiting ball is only an optional example and does not constitute a limitation on the first limiting structure.

[0016] In one possible implementation, a spring is provided inside the first limiting ball. During the movement of the heat-conducting base along the crossbeam, the spring is in a compressed state, and the first limiting ball is located below the crossbeam. After the first limiting ball moves to the position of the first limiting hole, the first limiting ball is matched and positioned with the first limiting hole at different positions under the action of the spring force, and the heat-conducting component is closely attached to different positions of the heat source structure.

[0017] In this implementation, a spring is provided inside the first limiting ball. The elasticity of the spring can be used to allow the heat-conducting base to move along the crossbeam. When the ball moves to different positions, it matches and positions itself with the first limiting hole at different positions, so that the heat-conducting component is tightly attached to different positions of the heat source structure.

[0018] In one possible implementation, the crossbeam further includes a flange, and the heat-conducting base further includes a groove and a notch; after the flange of the crossbeam passes through the notch, the flange of the crossbeam is engaged in the groove of the heat-conducting base so that the heat-conducting base slides along the crossbeam.

[0019] In this implementation, the groove allows the crossbeam's flange to engage with the groove in the heat-conducting base, enabling the crossbeam to slide along the base. The notch allows the crossbeam to enter the groove from the center, reducing installation space and making installation easier.

[0020] In one possible implementation, the first limiting component includes a second limiting structure and a first fastener, the second limiting structure being used for positioning at different first limiting holes, and the first fastener being used for connecting to the heat-conducting component through the positioned first limiting holes.

[0021] In this implementation, the second limiting structure is used for positioning, and the first fastener is used to fasten the heat-conducting component, thereby enabling the heat-conducting component to be closely attached to different positions of the heat source structure.

[0022] In one possible implementation, the position adjustment part includes a plurality of second mounting parts, each of which is in a different position; the second connecting part is used to connect to the heat source structure through the different second mounting parts so that the heat-conducting component is tightly fitted to different positions of the heat source structure.

[0023] In this implementation, by setting multiple second mounting parts, the overall offsetting purpose of the "heat-conducting component + offset component" is achieved. Furthermore, the second connecting part is connected to the heat source structure through different second mounting parts, so that the heat-conducting component fits tightly against different positions of the heat source structure.

[0024] In one possible implementation, a protruding structure is provided between each second mounting part. The protruding structure is made of a plastic material to allow the second connecting part to move between different second mounting parts.

[0025] In this implementation, a protruding structure is provided between the different second mounting parts. The protruding structure is made of a plastic material, which allows the second connecting part to move between the different second mounting parts.

[0026] In one possible implementation, a protruding structure is provided between each second mounting part, and the second connecting part includes a connecting structure made of a plastic material, so that the second connecting part can move between different second mounting parts.

[0027] In this implementation, a protruding structure is provided between the different second mounting parts. The connecting structure in contact with the protruding structure is made of a plastic material, which allows the second connecting part to move between the different second mounting parts.

[0028] In one possible implementation, the heat source structure includes a chip, and the heat-conducting component includes a heat-conducting base for tightly fitting the chip to dissipate the heat generated by the chip.

[0029] This implementation provides an exemplary description of the application scenarios for the heat sink, but it does not constitute a limitation on the application scenarios of the heat sink in the embodiments of this application.

[0030] In one possible implementation, the heat source structure further includes a mounting frame, and the offset component includes a crossbeam with a position adjustment part. The heat-conducting base is connected to the crossbeam via a first connecting part, and the crossbeam is also used to connect to the mounting frame via a second connecting part. The position adjustment part is used to adjust the relative positions of the first connecting part and the second connecting part to change the position where the heat-conducting base is in close contact with the chip.

[0031] In this implementation, the structure of the heat sink in the application scenario of heat sink cooling the chip is illustrated as an example, but it does not constitute a limitation on the heat sink structure of the embodiments of this application. Attached Figure Description

[0032] The accompanying drawings used in the description of the embodiments or prior art are briefly introduced below.

[0033] Figure 1 This is a schematic diagram of the heat source structure provided in the embodiments of this application before and after the shift of the heating center;

[0034] Figure 2 This is a schematic diagram of a heat source structure and radiator adapted to Embodiment 1 provided in this application;

[0035] Figure 3 This is a schematic exploded view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 1 provided in this application.

[0036] Figure 4a This is a top view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 1 provided in this application.

[0037] Figure 4bThis is a schematic diagram of a cross-sectional view from the front of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 1 provided in this application.

[0038] Figure 5a This is a top view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) in the middle position of Embodiment 1 provided in this application.

[0039] Figure 5b This is a top view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 1 provided in this application, positioned on the left side.

[0040] Figure 5c This is a top view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 1 provided in this application, located on the right side.

[0041] Figure 5d This is a top view of the heat sink (excluding the fan) of Embodiment 1 provided in this application from the middle, left, and right positions;

[0042] Figure 6a This is a schematic diagram of the heat sink (excluding the fan) in the middle position of Embodiment 1 provided in this application.

[0043] Figure 6b This is a schematic diagram of the heat sink (excluding the fan) in the middle position of Embodiment 1 provided in this application.

[0044] Figure 6c This is a schematic diagram of the heat sink (including fan) in the middle position of Embodiment 1 provided in this application.

[0045] Figure 6d This is a schematic diagram of the heat sink (including fan) in the middle position of Embodiment 1 provided in this application.

[0046] Figure 7a This is a schematic diagram of the heat sink (excluding the fan) in the right-side position of Embodiment 1 provided in this application.

[0047] Figure 7b This is a schematic diagram of the heat sink (excluding the fan) of Embodiment 1 provided in this application from an oblique view on the right side.

[0048] Figure 7c This is a schematic diagram of the heat sink (including fan) in the right-side position of Embodiment 1 provided in this application.

[0049] Figure 7dThis is a schematic diagram of the heat sink (including fan) in the right-side position of Embodiment 1 provided in this application.

[0050] Figure 8 This is a schematic exploded view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 2 provided in this application.

[0051] Figure 9a This is a schematic diagram of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 2 provided in this application from an oblique view.

[0052] Figure 9b This is a top view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 2 provided in this application.

[0053] Figure 9c This is a schematic diagram of a cross-sectional view from the front of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 2 provided in this application.

[0054] Figure 10 This is a schematic diagram of a heat source structure and radiator adapted to Embodiment 3 provided in this application.

[0055] Figure 11a This is a schematic exploded view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 3 provided in this application.

[0056] Figure 11b This is a schematic diagram of the structure of the plastic sleeve in Embodiment 3 provided in this application;

[0057] Figure 11c This is a schematic diagram of the crossbeam structure of Embodiment 3 provided in this application;

[0058] Figure 11d This is a schematic diagram of the structure of the heat-conducting base of Embodiment 3 provided in this application;

[0059] Figure 12a This is a schematic diagram of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 3 provided in this application from an oblique perspective.

[0060] Figure 12b This is a top view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 3 provided in this application.

[0061] Figure 12c This is a front view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 3 provided in this application.

[0062] Figure 12d This is a schematic diagram of a cross-sectional view from the front of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 3 provided in this application.

[0063] Figure 13a This is a top view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) in the middle position of Embodiment 3 provided in this application.

[0064] Figure 13b This is a top view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 3 provided in this application.

[0065] Figure 13c This is a top view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 3 provided in this application.

[0066] Figure 14a This is a schematic diagram of the heat sink in the middle position of Embodiment 3 provided in this application.

[0067] Figure 14b This is a schematic diagram of the heat sink in the middle position of Embodiment 3 provided in this application.

[0068] Figure 14c This is a schematic diagram of the heat sink of Embodiment 3 provided in this application, viewed from the front at the offset position on the right side;

[0069] Figure 14d This is a schematic diagram of the heat sink of Embodiment 3 provided in this application, viewed from the oblique direction at the offset position on the right side;

[0070] Figure 15 This is a schematic exploded view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 4 provided in this application.

[0071] Figure 16 This is a schematic diagram of the crossbeam structure of Embodiment 4 provided in this application;

[0072] Figure 17a This is a top view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 4 provided in this application.

[0073] Figure 17b This is a schematic diagram of a cross-sectional view of the heat sink (excluding heat pipes, heat dissipation fins, and fan) of Embodiment 4 provided in this application.

[0074] The annotations in the attached figures are explained as follows:

[0075] 100-Heat source structure, 101-Circuit board, 102-CPU, 103-Mounting frame, 104-Memory module mounting assembly, 200-Heater, 200*-Another type of heatsink, 201-Heat conduction base, 201*-Another type of heat conduction base, 201**-Yet another type of heat conduction base, 201-1-Groove, 201-2-Notch, 201-3-Mounting threaded hole, 201-4-Heat pipe mounting hole, 201-5-Platform, 201-6-Fixing threaded hole, 201-7-Positioning threaded hole, 201-8-Mounting hole, 201-9-Heat pipe mounting hole, 201-10-Groove, 202-Crossbeam, 202*-Another type of crossbeam, 202**-Yet another type of crossbeam, 20 2***-Another type of crossbeam, 202-1-Side guard, 202-2-First positioning hole, 202-3-Second positioning hole, 202-4-Oblong hole, 203-Fasting screw, 202-5-Fixing groove, 202-6-Oblong hole, 202-7-Installation threaded hole, 202-8-Oblong hole, 202-9-Second limiting protrusion structure, 204 Heat pipe, 205 Heat dissipation fin, 206-Fan, 207-First limiting ball, 208-Fasting screw, 209-Second limiting ball, 210-Plastic sleeve, 210-1-Fixing protrusion structure, 210-2-First limiting protrusion structure, 210-3-Oblong hole type plastic sleeve body, 211-O-ring clip, 212-Installation screw, 213-O-type plastic part. Detailed Implementation

[0076] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0077] In the description of this application, the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0078] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, contact connections, or integral connections. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. In the embodiments of this application, "contact" or "coupling" can refer to direct contact between components or contact between components through adhesives or thermally conductive colloids.

[0079] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0080] To facilitate understanding of the solutions provided in the embodiments of this application, a brief introduction to some of the terms involved in this solution will be given first.

[0081] Cooling fins, also known as heat sinks, are typically thin sheets of metal with numerous parallel fin-like structures. The principle of finned heat dissipation refers to using the shape and arrangement of the fins to increase the heat dissipation area and improve heat dissipation efficiency. In a heat sink, the fins are fixed to the pipes or the surface of the heat sink, in contact with the heat source. When the heat source generates heat, the fins conduct the heat to their surface, and then transfer the heat to the surrounding air through natural or forced convection. Because the multiple tooth-like structures of the fins increase the heat dissipation area, heat is more easily dissipated into the air, thus effectively improving heat dissipation efficiency. Finned heat sinks are widely used in electronic equipment, automotive engines, and air conditioning systems, and are a highly efficient and reliable heat dissipation method. For example, the fins of a heat sink contact copper pipes, increasing the heat dissipation area. The fins are made of thin aluminum alloy with a certain heat capacity. The contact between the fins and the copper pipes or base is to quickly remove heat from the surface of the load device, improving overall heat dissipation efficiency.

[0082] Radiators are an indispensable and important component of heat dissipation systems. Their main function is to effectively transfer and dissipate the heat generated by the equipment to ensure the normal operation of the equipment and extend its service life.

[0083] Figure 1 This is a schematic diagram showing the shift of the heating center of the heat source structure provided in the embodiments of this application before and after the shift. Figure 1 As shown, with the upgrading of equipment, the position of the heat-generating center of the heat source structure 100 in the equipment is constantly shifting. Consequently, the heat-generating center of the heat source structure 100 and the heat-conducting center of the radiator 200 are mismatched, resulting in high thermal resistance and low heat dissipation efficiency. Figure 1 The diagram on the left is a schematic diagram of the heat source structure before the heating center shifts. Figure 1 The diagram on the right is a schematic diagram of the heat source structure after the heating center has shifted.

[0084] For example, taking the Central Processing Unit (CPU) as an example, due to the upgrade of the CPU, the heat center of the CPU is constantly shifting compared to the CPU before the upgrade. Existing air coolers are all pressed on the center of the CPU's geometry, which means that the existing air coolers cannot perform well in terms of heat dissipation in the new generation of CPUs. Therefore, a kind of offset cooler is needed to accurately press on the heat center of the CPU and improve the heat dissipation capacity of the air cooler.

[0085] In view of this, embodiments of this application provide a heat sink with an offset heat dissipation position for dissipating heat from a heat source structure. The heat sink includes: a heat-conducting component for tightly fitting the heat source structure to remove the heat generated by the heat source structure; and an offset component including a first connecting part, a second connecting part, and a position adjustment part. The first connecting part is connected to the heat-conducting component, the second connecting part is connected to the heat source structure, and the position adjustment part is used to adjust the relative positions of the first connecting part and the second connecting part to change the position where the heat-conducting component is tightly fitted to the heat source structure.

[0086] In this embodiment, the radiator is specifically a radiator with an offset heat dissipation center, which can accurately match the heat dissipation center of the heat source structure. It provides an offset installation solution without increasing the cost of the radiator body, thereby improving the overall heat dissipation capacity of the radiator.

[0087] The technical solutions of the embodiments of this application will be described in detail below with specific examples. These specific examples can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0088] Example 1

[0089] The technical solution of Embodiment 1 will be described exemplarily below with reference to the accompanying drawings.

[0090] Figure 2 This is a schematic diagram of a heat source structure and heat sink adapted to Embodiment 1, as provided in this application. Figure 2 As shown, the heat source structure 100 includes a circuit board 101, a CPU 102, and a mounting frame 103. The CPU 102 is one of the heat-generating devices in the heat source structure 100. The mounting frame 103 is disposed around the CPU 102 for mounting the heat sink 200. Optionally, the heat source structure 100 may also include any other components, such as a memory module mounting assembly 104, such as slots and clips, for mounting memory modules. It can also be understood that the mounting frame 103 may not be an integral part of the heat source structure 100, but rather an additional mounting frame 103 added as a mounting adapter for mounting the heat sink 200.

[0091] The heat sink 200 adapted to Embodiment 1 can be used in any heat dissipation scenario to dissipate heat for any heat source structure 100. The heat source structure 100 described above is only an example of the heat source structure 100 in the application scenario of the heat sink 200 and does not constitute a limitation on the heat source structure 100.

[0092] Furthermore, such as Figure 2 As shown, the heat sink 200 includes a heat-conducting base 201, a crossbeam 202, fastening screws 203, heat-conducting pipes 204, heat dissipation fins 205, and a fan 206.

[0093] The installation process of the heat sink 200 is illustrated by way of example. Figure 2 As shown, the crossbeam 202 needs to be installed on the mounting frame 103. For example, the mounting frame 103 has two parallel mounting holes with fastening screws 203 for fixing the crossbeam 202 in the middle. The two ends of the mounting frame 103 are fixed to the circuit board 101 by fasteners.

[0094] Specifically, after matching the installation positions of the heat sink 200 and the heat source structure 100, the fastening screws 203 are tightened, and the crossbeam 202 of the heat sink 200 is fixedly connected to the mounting frame 103 of the heat source structure 100, thereby fixing the heat sink 200 to the heat source structure 100. The heat-conducting base 201 in the heat sink 200 is in close contact with the CPU 102 in the heat source structure 100. The heat-conducting base 201 and other heat-conducting components carry away the heat generated by the CPU 102, thus achieving the function of cooling the CPU 102.

[0095] The working principle of the heat sink 200 is illustrated by way of example. Figure 2 As shown, the CPU 102 generates heat, which is conducted to the heat-conducting base 201, which is in close contact with the CPU 102. The heat-conducting base 201 then conducts the heat to the heat pipe 204, which in turn conducts the heat to the heat sink fins 205. The heat sink fins 205 increase the heat dissipation area and improve heat dissipation efficiency. Optionally, to further increase the heat dissipation efficiency of the heat sink fins 205, one or more fans 206 can be installed around the heat sink fins 205, for example... Figure 2 As shown, a fan 206 is attached to the side of the heat sink 205. The fan 206 can increase the airflow speed, thereby increasing the heat dissipation efficiency of the heat sink 205.

[0096] It should be noted that the structure of the heat source structure 100 can be implemented in any way, and the specific implementation of the heat source structure 100 will not be described in detail in this embodiment. The heat pipe 204, heat sink fins 205, and fan 206 are optional structures for the heat-conducting components, and they can be implemented in any way. The specific implementation of the heat pipe 204, heat sink fins 205, and fan 206 will not be described in detail in this embodiment. In the following description of some embodiments, for the sake of conciseness and clarity in expressing the technical solution of the embodiments of this application, some structures such as the heat pipe 204, heat sink fins 205, fan 206, and heat source structure 100 are omitted.

[0097] Figure 3 This is a schematic exploded view of the heat sink according to Embodiment 1 provided in this application. Figure 3 As shown, in Embodiment 1, the radiator 200 further includes a first limiting ball bearing 207. Further, the crossbeam 202 includes a flange 202-1 and a first positioning hole 202-2. Further, the heat-conducting base 201 includes a groove 201-1, a notch 201-2, a mounting threaded hole 201-3, and a heat pipe mounting hole 201-4.

[0098] The assembly process of the radiator 100 in Embodiment 1 is described exemplarily. The first limiting ball bearing 207 is installed into the mounting threaded hole 201-3. The flange 202-1 at one end of the crossbeam 202 passes through the notch 201-2, and the flange 202-1 at the other end of the crossbeam 202 is aligned with the outside of the groove 201-1; alternatively, the flange 202-1 at one end of the crossbeam 202 is aligned with the outside of the groove 201-1, and the flange 202-1 at the other end of the crossbeam 202 is moved away from the outside of the groove 201-1, allowing the crossbeam 202 to slide into the interior of the groove 201-1. The fastening screw 203 is tightened to the mounting frame 103. The notch 201-2 allows the crossbeam 202 to enter the groove 201-1 from the middle, resulting in less installation space and easier installation.

[0099] For example, the upper part of the heat-conducting base 201 has a constricted groove 201-1 to accommodate and ensure the movement of the crossbeam 202 in the length direction; the upper part of the heat-conducting base 201 also has a notch 201-2 to accommodate the flange 202-1 of the crossbeam 202, so that the crossbeam 202 can be inserted into the groove 201-1 of the heat-conducting base 201 along the notch 201-2; similarly, by continuing to pull the crossbeam 202, the crossbeam 202 can be disassembled. The distance between the flange 202-1 of the crossbeam 202 and the groove 201-1 of the heat-conducting base 201 has certain length requirements to ensure the normal installation and disassembly of the crossbeam 202.

[0100] like Figure 4aAs shown, the first limiting ball 207 is matched and positioned with the first positioning hole 202-2 in the middle position, and the heat-conducting base 201 is located in the middle position, so that when the heat-generating position of the CPU 102 in the heat source structure 100 is in the middle position, the CPU 102 in the heat source structure 100 is cooled.

[0101] Figure 4b To pass Figure 4a A cross-sectional view showing the centerline. (See example.) Figure 4b As shown, the first limiting ball 207 is equipped with a spring. During the movement of the heat-conducting base 201, the first limiting ball 207 is positioned by matching with the first positioning hole 202-2 at different positions, thereby realizing heat dissipation at different heat-generating positions of the CPU 102 of the heat source structure 100.

[0102] The following is through Figures 5a to 5d The following is an exemplary description of the situation where the first limiting ball 207 positions the heat-conducting base 201 to different positions.

[0103] like Figure 5a As shown, during the movement of the heat-conducting base 201, the first limiting ball 207 matches and positions itself with the first positioning hole 202-2 in the middle position, and the heat-conducting base 201 is located in the middle position, so that when the heat-generating position of the CPU 102 in the heat source structure 100 is in the middle position, the CPU 102 in the heat source structure 100 is cooled.

[0104] like Figure 5b As shown, during the movement of the heat-conducting base 201, the first limiting ball 207 matches and positions itself with the first positioning hole 202-2 on the left side, and the heat-conducting base 201 is located on the left side, so that when the heat-generating position of the CPU 102 in the heat source structure 100 is on the left side, the CPU 102 in the heat source structure 100 is cooled.

[0105] like Figure 5c As shown, during the movement of the heat-conducting base 201, the first limiting ball 207 matches and positions itself with the first positioning hole 202-2 on the right side, and the heat-conducting base 201 is located on the right side, so that when the heat-generating position of the CPU 102 in the heat source structure 100 is on the right side, the CPU 102 in the heat source structure 100 is cooled.

[0106] like Figure 5d As shown, a spring is installed inside the first limiting ball 207. During the movement of the heat-conducting base 201, the spring is in a compressed state, and the first limiting ball 207 is located below the crossbeam 202. After the first limiting ball 207 moves to the position corresponding to the first positioning hole 202-2, the first limiting ball 207, under the action of the spring force, matches and positions itself with the first positioning hole 202-2 at different positions, thereby fixing the heat-conducting base 201 to the corresponding position.

[0107] For example, such as Figure 5d As shown, the first limiting ball 207 can be matched and positioned with the first positioning hole 202-2 in the middle position, so that the heat-conducting base 201 is located in the middle position; the offset direction of the heat-conducting base 201 is to the left, and the first limiting ball 207 can be matched and positioned with the first positioning hole 202-2 in the left position, so that the heat-conducting base 201 is located in the left position; the offset direction of the heat-conducting base 201 is to the right, and the first limiting ball 207 can be matched and positioned with the first positioning hole 202-2 in the right position, so that the heat-conducting base 201 is located in the right position.

[0108] It should be noted that, in this embodiment of the application, there is no limitation on the number of offset positions; the number of offset positions can be any number, including one or more. Figure 5d The two offset positions shown are merely examples and do not limit the number of offset positions in the embodiments of this application.

[0109] The following is through Figures 6a to 6d , Figures 7a to 7d Taking the middle position and the right offset position as examples, the state of the heat sink 100 after offset is illustrated by an example.

[0110] For example, such as Figure 6a As shown, the heat sink 100 is located in the middle position. Specifically, the heat generation center of the CPU 102 is in the middle position. The CPU 102 generates heat, which is conducted to the heat-conducting base 201 located in the middle position and closely attached to the CPU 102. The heat-conducting base 201 conducts the heat to the heat pipe 204, and the heat pipe 204 conducts the heat to the heat dissipation fins 205, thereby achieving heat dissipation for the CPU 102.

[0111] For example, such as Figure 6b As shown, the heat dissipation fins 205 are in two sets. Therefore, the heat sink 100 adapted to Embodiment 1 is also called a "dual-tower" heat sink.

[0112] For example, such as Figure 6c As shown, in order to further increase the heat dissipation efficiency of the heat sink 205, one or more fans 206 can be installed around the heat sink 205.

[0113] For example, such as Figure 6d As shown, a fan 206 is attached to the side of the heat sink 205. The fan 206 can increase the airflow speed, thereby increasing the heat dissipation efficiency of the heat sink 205.

[0114] For example, such as Figures 7a to 7dAs shown, after the heatsink 100 is offset in the indicated direction, it is positioned slightly to the right. Specifically, the heat center of the CPU 102 is located at a certain position on the right. The CPU 102 generates heat, which is conducted to the heat-conducting base 201 located on the right side and in close contact with the CPU 102. The heat-conducting base 201 conducts the heat to the heat pipe 204, and the heat pipe 204 conducts the heat to the cooling fins 205, thereby dissipating heat from the CPU 102.

[0115] It should be noted that the aforementioned heat-conducting components include at least a heat-conducting base 201; optionally, the aforementioned heat-conducting components also include heat pipes 204, heat sink fins 205, fans 206, etc. The aforementioned heat source structure includes at least a CPU 102. The aforementioned offset components refer to the relevant components or structures that realize position offset. The aforementioned first connecting part includes a flange 202-1, a groove 201-1, a first positioning hole 202-2, a first limiting ball 207, etc. The aforementioned second connecting part includes a fastening screw 203, a mounting frame 103, etc. The aforementioned position adjustment part refers to the relevant components or structures that realize the relative position adjustment between the first connecting part and the second connecting part.

[0116] Optionally, the above-mentioned position adjustment part includes a plurality of first mounting parts, such as a first positioning hole 202-2, and each first mounting part has a different position; an example of a first connecting part is a first limiting ball 207, which is used to match different first mounting parts by positioning. After being connected to a heat-conducting component, such as a heat-conducting base 201, the heat-conducting component can be closely attached to different positions of the heat source structure, such as that of the CPU102.

[0117] Optionally, the plurality of first mounting portions are plurality of first limiting holes, an example of which is a first positioning hole 202-2; an example of a first connecting portion is a first limiting component, such as a first limiting ball 207; the first limiting component is used to connect to the heat-conducting component through different first limiting holes so that the heat-conducting component is tightly fitted to different positions of the heat source structure.

[0118] Optionally, the first limiting component includes a first limiting structure, such as a first limiting ball 207; the heat-conducting component is slidably connected to the offset component, and during the sliding process of the heat-conducting component, the first limiting structure is used to engage the heat-conducting component through different first limiting holes.

[0119] In one example, for a dual-tower heatsink, the heatsink fins are designed as an upward-extending U-shaped structure with a gap of 2.5mm. The central mounting threaded hole 201-3 is an M4 threaded hole, which is matched with the first limiting ball 207 for mounting M4. The crossbeam is designed in the shape of an airplane, and the first limiting ball 207 and the crossbeam 202 slide and lock together to achieve the offset of the fastener. The fastener is a shorthand for the heatsink 100, generally referring to the tightly fitting heat dissipation device that is fastened above the CPU 102.

[0120] Example 2

[0121] The application scenario of Embodiment 2 is the same as that of Embodiment 1. For details regarding the heat source structure 100 and the heat-conducting components such as the heat pipe 204, heat dissipation fins 205, and fan 206, please refer to the relevant descriptions in Embodiment 1. Embodiment 2 will not repeat these details. The difference from Embodiment 1 is that Embodiment 2 provides another type of heat-conducting base 201* and another type of crossbeam 202*, which will be described in detail below.

[0122] The technical solution of Embodiment 2 will be described below with reference to the accompanying drawings.

[0123] Figure 8 This is a schematic exploded view of the heat sink of Embodiment 2 provided in this application. Figure 8 As shown, in Embodiment 2, the radiator 200 further includes fastening screws 208 and second limiting balls 209. Further, the crossbeam 202* includes a second positioning hole 202*-3 and an oblong hole 202*-4. Further, the heat-conducting base 201* includes a platform 201*-5, a fixing threaded hole 201*-6, and a positioning threaded hole 201*-7. The number of fastening screws 208 and second limiting balls 209 shown in the figure is merely an example. That is, the crossbeam 202* does not have a retaining edge 202*-1 and is provided with two sets of sliding limiting structures (such as the second limiting balls 209 and the second positioning hole 202*-3). When it needs to be moved to contact the heat source, the fastening screws 208 are loosened, the beam is slidably adjusted to the appropriate position, and then the fastening screws 208 are tightened to fix it.

[0124] For example, in combination Figures 9a-9c The assembly process of the heat sink 100 in Embodiment 2 will be described exemplarily. Figure 9aAs shown, the two second limiting balls 209 are respectively installed into the two positioning threaded holes 201*-7. The crossbeam 202* is placed on the platform 201*-5. According to the offset of the heat-conducting base 201*, the two second limiting balls 209 are matched into the corresponding second positioning holes 202*-3, and the fastening screws 208 are passed through the elongated hole 202*-4 and tightened to the fixing threaded hole 201*-6. The heat sink 100 in Embodiment 2 is now installed. Finally, the fastening screws 203 are tightened to the mounting frame 103, thereby connecting the heat sink 100 and the heat source structure 100.

[0125] like Figure 9b As shown, in the top view, the two second limiting balls 209 are matched and positioned with the second positioning hole 202*-3 in the middle position. After the fastening screw 208 is tightened, the heat-conducting base 201* is located in the middle position, so that when the heat-generating position of the CPU 102 in the heat source structure 100 is in the middle position, the CPU 102 in the heat source structure 100 is cooled.

[0126] Figure 9c To pass Figure 9b A cross-sectional view showing the centerline. (See example.) Figure 9c As shown, the fastening screw 208 passes through the elongated hole 202*-4 and is tightened to the fixing threaded hole 201*-6, thereby fixing the heat-conducting base 201* to the crossbeam 202*. The two second limiting balls 209 are matched to the corresponding second positioning holes 202*-3, and the heat-conducting base 201* is installed in the corresponding position.

[0127] It should be noted that other offset positions can be implemented, including but not limited to: after removing or loosening the fastening screw 208, the two second limit balls 209 can be matched to the corresponding second positioning holes 202*-3, and then the fastening screw 208 can be passed through the elongated hole 202*-4 and tightened to the fixing threaded hole 201*-6.

[0128] The second limiting ball 209 and the first limiting ball 207 have the same structure, which will not be described in detail here.

[0129] It should be noted that the aforementioned heat-conducting components include at least a heat-conducting base 201*; optionally, the aforementioned heat-conducting components also include heat pipes 204, heat sink fins 205, fans 206, etc. The aforementioned heat source structure includes at least a CPU 102. The aforementioned offset components refer to the relevant components or structures that realize position offset. The aforementioned first connecting part includes a second positioning hole 202*-3, an oblong hole 202*-4, a platform 201*-5, a fixing threaded hole 201*-6, a positioning threaded hole 201*-7, a fastening screw 208, a second limiting ball 209, etc. The aforementioned second connecting part includes a fastening screw 203, a mounting frame 103, etc. The aforementioned position adjustment part refers to the relevant components or structures that realize the relative position adjustment between the first connecting part and the second connecting part. Optionally, the aforementioned position adjustment part includes multiple first mounting parts, such as second positioning holes 202*-3 and elongated holes 202*-4, each with a different position; examples of first connecting parts include fastening screws 208 and second limiting balls 209, used to match different first mounting parts through positioning. After being connected to a heat-conducting component such as a heat-conducting base 201*, the heat-conducting component can be closely fitted to different positions of the heat source structure of, for example, CPU102.

[0130] Optionally, the multiple first mounting portions are multiple first limiting holes, such as first positioning holes 202*-2; examples of the first connecting portions are first limiting components, such as fastening screws 208 and second limiting balls 209; the first limiting components are used to connect to the heat-conducting components through different first limiting holes so that the heat-conducting components are tightly fitted to different positions of the heat source structure.

[0131] Optionally, the first limiting component includes a second limiting structure (e.g., a second limiting ball 209) and a first fastener (e.g., a fastening screw 208). The second limiting structure is used to position itself in different first limiting holes, and the first fastener is used to connect to the heat-conducting component through the positioned first limiting hole.

[0132] Example 3

[0133] The technical solution of Embodiment 3 will be described below with reference to the accompanying drawings.

[0134] Figure 10 This is a schematic diagram of the heat source structure and heat sink adapted to Embodiment 3, as provided in this application. Figure 10As shown, unlike the heat sinks 200 corresponding to Embodiments 1 and 2, in another heat sink 200* adapted to Embodiment 3, the heat dissipation fins 205 and the fan 206 are set as a group. Therefore, the heat sink 200* adapted to Embodiment 3 is also called a "single-tower" heat sink. Unlike Embodiments 1 and 2, Embodiment 3 provides another type of heat-conducting base 201** and another type of crossbeam 202**, which will be described in detail below.

[0135] like Figure 10 As shown, the heat source structure 100 includes a circuit board 101, a CPU 102, and a mounting frame 103. The CPU 102 is one of the heat-generating devices in the heat source structure 100. The mounting frame 103 is disposed around the CPU 102 for mounting a heat sink 200*. Optionally, the heat source structure 100 may also include any other components, such as a memory module mounting assembly 104, such as slots and clips, for mounting memory modules.

[0136] Furthermore, for "single-tower" radiators, since the heat pipe routing of the 200* radiator is different from that of "double-tower" radiators, the offset direction of the "single-tower" radiator is also different from that of the "double-tower" radiator (for example, it is perpendicular). Therefore, the crossbeam is designed to be offset, and the offset is achieved by adding a plastic clip.

[0137] Specifically, in Embodiment 3, slidable screw holes are provided, allowing the fastening screws 203 to be installed onto the mounting frame 103 at different locations. A plastic sleeve is added, which is integrally connected to the crossbeam; the thickness of the plastic sleeve is consistent with the crossbeam and possesses a certain degree of plasticity to ensure the sliding of the fastening screws 203. The interior of the plastic sleeve has multiple locking protrusions defining three spatial positions: the middle position is conventional, and the other two positions are offset vertically, achieving accurate contact with the heating centers at different offset positions of the heat source structure 100.

[0138] It can be further understood that the mounting frame 103 is not an inherent part of the heat source structure 100, but rather a transitional mounting adapter added for mounting the radiator 200*. Therefore, due to the different structure of the radiator 200*, the mounting frame 103 is obtained after adaptive modifications. The specific implementation of the mounting frame 103 will not be described in detail in the embodiments of this application.

[0139] It should be noted that the heat sink 200* adapted to Embodiment 3 can be applied to any heat dissipation scenario to dissipate heat for any heat source structure 100. The heat source structure 100 mentioned above is only an example of the heat source structure 100 in the application scenario of the heat sink 200*, and does not constitute a limitation on the heat source structure 100.

[0140] Furthermore, such as Figure 10 As shown, the heat sink 200* adapted to Embodiment 3 includes a heat-conducting base 201**, a crossbeam 202**, fastening screws 203, a heat-conducting pipe 204, heat dissipation fins 205, and a fan 206. That is to say, compared with Embodiments 1 and 2, the heat-conducting base 201**, the crossbeam 202**, and their connection relationship are different, while the rest are the same. For the same parts, Embodiment 3 will not describe them again.

[0141] The installation process of the heat sink 200* is illustrated as an example. Figure 10 As shown, the crossbeam 202** needs to be installed on the mounting frame 103. For example, the mounting frame 103 has two parallel mounting holes with fastening screws 203 for fixing the crossbeam 202** in the middle. The two ends of the mounting frame 103 are fixed to the circuit board 101 by fasteners.

[0142] Specifically, after matching the installation positions of the heat sink 200* and the heat source structure 100, tighten the fastening screws 203. The crossbeam 202** of the heat sink 200* is then fixedly connected to the mounting frame 103 of the heat source structure 100, thereby fixing the heat sink 200* to the heat source structure 100. The heat-conducting base 201** in the heat sink 200* is in close contact with the CPU 102 in the heat source structure 100. The heat-conducting base 201** and other heat-conducting components carry away the heat generated by the CPU 102, thus achieving the function of cooling the CPU 102.

[0143] For example, the working principle of the heat sink 200* is illustrated. Figure 10 As shown, the CPU 102 generates heat, which is conducted to the heat-conducting base 201**, which is in close contact with the CPU 102. The heat-conducting base 201** then conducts the heat to the heat pipe 204, which in turn conducts the heat to the heat sink fins 205. The heat sink fins 205 increase the heat dissipation area and improve heat dissipation efficiency. Optionally, to further increase the heat dissipation efficiency of the heat sink fins 205, one or more fans 206 can be installed around the heat sink fins 205, for example... Figure 10 As shown, a fan 206 is attached to the side of the heat sink 205. The fan 206 can increase the airflow speed, thereby increasing the heat dissipation efficiency of the heat sink 205.

[0144] It should be noted that the structure of the heat source structure 100 can be implemented in any way, and the specific implementation of the heat source structure 100 will not be described in detail in this embodiment. The heat pipe 204, heat sink fins 205, and fan 206 are optional structures for the heat-conducting components, and they can be implemented in any way. The specific implementation of the heat pipe 204, heat sink fins 205, and fan 206 will not be described in detail in this embodiment. In the following description of some embodiments, for the sake of conciseness and clarity in expressing the technical solution of the embodiments of this application, some structures such as the heat pipe 204, heat sink fins 205, fan 206, and heat source structure 100 are omitted.

[0145] It should be understood that the heat source structure 100 includes, but is not limited to, chips (such as CPUs), resistors, capacitors, potentiometers, electron tubes, electromechanical components, connectors, discrete semiconductor devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micromotors, electronic transformers, relays, PCBs, integrated circuits, and piezoelectric sensors, etc.

[0146] Figure 11a This is a schematic exploded view of the heat sink of Embodiment 3 provided in this application. Figure 11a As shown in Embodiment 1, the radiator 200* also includes a plastic sleeve 210, an O-ring 211, and mounting screws 212.

[0147] Furthermore, such as Figure 11b As shown, the plastic sleeve 210 includes a fixing protrusion structure 210-1, a first limiting protrusion structure 210-2, and an elongated hole-shaped plastic sleeve body 210-3. The first limiting protrusion structure 210-2 can divide the inner cavity of the elongated hole-shaped plastic sleeve body 210-3 into multiple second mounting parts.

[0148] Furthermore, such as Figure 11c As shown, the crossbeam 202** includes a fixing groove 202-5, an oblong hole 202-6, and a mounting threaded hole 202-7.

[0149] Furthermore, such as Figure 11d As shown, the heat-conducting base 201** includes mounting holes 201-8, heat pipe mounting holes 201-9, and grooves 201-10. The grooves 201-10 can reduce the contact area between the heat-conducting base 201** and the crossbeam 202**, thereby increasing the heat dissipation area.

[0150] For example, in combination Figures 11a to 11dThe assembly process of the radiator 100 in Embodiment 3 will be described exemplarily. The installation steps are not in any particular order. The elongated oval-shaped plastic sleeve body 210-3 of the plastic sleeve 210 is snapped into the elongated oval hole 202-6 of the crossbeam 202**; specifically, the fixing protrusion structure 210-1 is snapped into the fixing groove 202-5, thereby achieving a fixed connection between the plastic sleeve 210 and the crossbeam 202**. Match the mounting threaded hole 202-7 and the mounting hole 201-8, pass the mounting screw 212 through the mounting hole 201-8, and tighten it into the threaded hole 202-7, thereby fixing the heat-conducting base 201** to the crossbeam 202**. The fastening screw 203 passes through the inner cavity of the elongated plastic sleeve body 210-3. An O-ring 211 is installed at the end of the fastening screw 203, thereby securing the fastening screw 203 to the crossbeam 202** and preventing the fastening screw 203 from falling off. The fastening screw 203 is then tightened to the mounting frame 103.

[0151] like Figure 12a As shown, the first limiting protrusion structure 210-2 can divide the inner cavity of the elongated plastic sleeve body 210-3 into multiple second mounting parts. The fastening screw 203 is engaged with the second mounting part in the middle position for matching and positioning, so that the crossbeam 202** is in the middle position, and the heat-conducting base 201** is in the middle position, thereby dissipating heat from the CPU 102 in the heat source structure 100 when the heat-generating position of the CPU 102 in the heat source structure 100 is in the middle position.

[0152] like Figure 12b As shown, in the top view, the fastening screw 203 is engaged with the second mounting part in the middle position for matching and positioning. The crossbeam 202** is located in the middle position, and the heat-conducting base 201** is located in the middle position. Thus, when the heat-generating position of the CPU 102 in the heat source structure 100 is in the middle position, the CPU 102 in the heat source structure 100 is cooled.

[0153] like Figure 12c As shown, in the front view, the heat-conducting base 201** is fixedly connected to the crossbeam 202** by mounting screws 212. Therefore, when the crossbeam 202** is in the middle position, the heat-conducting base 201** is also in the middle position.

[0154] Figure 12d To pass Figure 12b A cross-sectional view showing the centerline. (See example.) Figure 12dAs shown, the mounting screw 212 passes through the mounting hole 201-8 and is tightened into the threaded hole 202-7, thereby fixing the heat-conducting base 201** to the crossbeam 202**. For example, the fastening screw 203 is a captive screw with an internal threaded hole. The threaded hole of the fastening screw 203 can engage with a stud in the mounting frame 103, thereby fastening the fastening screw 203 to the mounting frame 103.

[0155] The following is through Figures 13a to 13c The following description will be provided as an example of the case where the fastening screw 203 is engaged with the second mounting portion at different positions within the inner cavity of the elongated hole-shaped plastic sleeve body 210-3.

[0156] like Figure 13a As shown, the fastening screw 203 is snapped into the second mounting part in the middle position for matching and positioning. The crossbeam 202** is located in the middle position, and the heat-conducting base 201** is located in the middle position. Thus, when the heat-generating position of the CPU 102 in the heat source structure 100 is in the middle position, the CPU 102 in the heat source structure 100 is cooled.

[0157] like Figure 13b As shown, during the movement of the fastening screw 203, the first limiting protrusion structure 210-2 is made of plastic material. The fastening screw 203 can cross the first limiting protrusion structure 210-2 and move from the second mounting part in the middle position to the second mounting part in the lower position. The fastening screw 203 is engaged with the second mounting part in the lower position for matching and positioning; then the crossbeam 202** is located in the upper position, and then the heat-conducting base 201** is located in the upper position, so that when the heat-generating position of the CPU 102 in the heat source structure 100 is in the upper position, heat dissipation is performed on the CPU 102 in the heat source structure 100.

[0158] like Figure 13c As shown, during the movement of the fastening screw 203, the first limiting protrusion structure 210-2 is made of plastic material. The fastening screw 203 can cross the first limiting protrusion structure 210-2 and move from the second mounting part in the middle position to the second mounting part in the upper position. The fastening screw 203 is engaged with the second mounting part in the upper position for matching and positioning; then the crossbeam 202** is located in the lower position, and then the heat-conducting base 201** is located in the lower position, so that when the heat-generating position of the CPU 102 in the heat source structure 100 is in the lower position, heat dissipation is performed on the CPU 102 in the heat source structure 100.

[0159] It should be noted that the terms "middle," "top," "bottom," "left," and "right" mentioned above are only descriptions from a top-down or main-view perspective. In practical applications, these terms can be transformed based on the specific location of the usage scenario, such as "front" or "rear." In this embodiment, the number of offset positions is not limited; there can be any number of offset positions, including one or more. Figures 13a to 13c The two offset positions shown are merely examples and do not limit the number of offset positions in the embodiments of this application.

[0160] The following is through Figures 14a to 14d Taking the middle position and the right offset position as examples, the state of the heat sink 100 after offset is illustrated by an example.

[0161] For example, such as Figure 14a As shown, the heat sink 100 is located in the middle position. Specifically, the heat generation center of the CPU 102 is in the middle position. The CPU 102 generates heat, which is conducted to the heat-conducting base 201** located in the middle position and closely attached to the CPU 102. The heat-conducting base 201** conducts the heat to the heat pipe 204, and the heat pipe 204 conducts the heat to the heat dissipation fins 205, thereby achieving heat dissipation for the CPU 102.

[0162] For example, such as Figure 14b As shown, the heat dissipation fins 205 are a group, therefore, the heat sink 100 adapted to Embodiment 3 is also called a "single tower" heat sink.

[0163] For example, such as Figure 14c As shown, the heatsink 100 is located on the right side. Specifically, the heat-generating center of the CPU 102 is on the right side. The CPU 102 generates heat, which is conducted to the heat-conducting base 201** located on the right side and closely attached to the CPU 102. The heat-conducting base 201** conducts the heat to the heat pipe 204, and the heat pipe 204 conducts the heat to the heat dissipation fins 205, thereby dissipating heat from the CPU 102.

[0164] For example, such as Figure 14d As shown, the heat sink 100 is located on the right side. When the heat-generating position of the CPU 102 in the heat source structure 100 shifts to the right, it dissipates heat from the CPU 102 in the heat source structure 100.

[0165] It should be noted that the aforementioned heat-conducting components include at least a heat-conducting base 201**; optionally, the aforementioned heat-conducting components also include heat pipes 204, heat sink fins 205, fans 206, etc. The aforementioned heat source structure includes at least a CPU 102. The aforementioned offset components refer to the relevant components or structures that realize positional offset. The aforementioned first connecting part includes mounting screws 212, etc. The aforementioned second connecting part includes fastening screws 203, mounting frame 103, plastic sleeves 210, O-rings 211, etc. The aforementioned position adjustment part refers to the relevant components or structures that realize the relative positional adjustment between the first connecting part and the second connecting part.

[0166] Optionally, the position adjustment part includes multiple second mounting parts, each with a different position; the second connecting part is used to connect to the heat source structure through the different second mounting parts, so that the heat-conducting component fits tightly against different positions of the heat source structure. For example, the inner cavity of the elongated plastic sleeve body 210-3, divided by the first limiting protrusion structure 210-2, yields multiple limiting slots, which are examples of multiple second mounting parts.

[0167] Optionally, a protruding structure (such as a first limiting protrusion structure 210-2) is provided between each second mounting part, the protruding structure being made of a plastic material, so that the second connecting part can move between different second mounting parts.

[0168] Example 4

[0169] The application scenario of Embodiment 4 is the same as that of Embodiment 3. For details regarding the heat source structure 100 and the heat-conducting components such as the heat pipe 204, heat dissipation fins 205, and fan 206, please refer to the relevant description in Embodiment 3. Embodiment 4 will not repeat these details. The difference from Embodiment 3 is that Embodiment 4 provides another type of crossbeam 202***.

[0170] The technical solution of Embodiment 2 will be described below with reference to the accompanying drawings.

[0171] Figure 15 This is a schematic exploded view of the heat sink of Embodiment 4 provided in this application. Figure 15 As shown, in Embodiment 4, the radiator 200* also includes an O-ring plastic part 213, but excludes the plastic sleeve 210. The crossbeam 202*** is modified; the structure of other components is described in Embodiment 3, and will not be repeated in Embodiment 4.

[0172] Furthermore, such as Figure 16 As shown in Embodiment 4, the crossbeam 202*** includes a threaded mounting hole 202-7, an oblong hole 202-8, and a second limiting protrusion structure 202-9.

[0173] In Embodiment 4, the second limiting protrusion structure 202-9 can divide the inner cavity of the elongated hole 202-8 into multiple second mounting portions. The O-ring plastic part 213 is fitted onto the outside of the fastening screw 203 and contacts the inner wall of the elongated hole 202-8. During the movement of the fastening screw 203, the O-ring plastic part 213 is made of a plastic material; therefore, the fastening screw 203 can cross the second limiting protrusion structure 202-9 and move from one second mounting portion to another. Furthermore, when the heat-generating position of the CPU 102 in the heat source structure 100 is at a certain position, the heat-conducting base 201 can move to match that position, thereby dissipating heat from the CPU 102 after the heat-generating position has shifted.

[0174] like Figure 17a As shown, in the top view, the fastening screw 203 is engaged with the second mounting part in the middle position for matching and positioning, the crossbeam 202*** is located in the middle position, and the heat conduction base 201** is located in the middle position, so that when the heat-generating position of the CPU 102 in the heat source structure 100 is in the middle position, the CPU 102 in the heat source structure 100 is cooled.

[0175] like Figure 17b As shown, in the frontal view, the O-ring plastic part 213 is made of a plastic material. The O-ring plastic part 213 is fitted onto the outside of the fastening screw 203 and contacts the inner wall of the elongated hole 202-8. Therefore, the fastening screw 203 can move from one position of the second mounting part to another by compressing the O-ring plastic part 213, passing over the second limiting protrusion structure 202-9. The further heat dissipation process of the heat-conducting base 201 at different positions can be found in the relevant description of Embodiment 3; Embodiment 4 will not be repeated.

[0176] It should be noted that the aforementioned heat-conducting components include at least a heat-conducting base 201**; optionally, the aforementioned heat-conducting components also include heat pipes 204, heat sink fins 205, fans 206, etc. The aforementioned heat source structure includes at least a CPU 102. The aforementioned offset components refer to the relevant components or structures that realize positional offset. The aforementioned first connecting part includes mounting screws 212, etc. The aforementioned second connecting part includes fastening screws 203, mounting frame 103, O-ring plastic parts 213, O-ring snap rings 211, etc. The aforementioned position adjustment part refers to the relevant components or structures that realize the relative positional adjustment between the first connecting part and the second connecting part.

[0177] Optionally, the position adjustment part includes multiple second mounting parts, each with a different position; the second connecting part is used to connect to the heat source structure through the different second mounting parts, so that the heat-conducting component fits tightly against different positions of the heat source structure. For example, the inner cavity of the elongated hole 202-8, divided by the second limiting protrusion structure 202-9 of the crossbeam 202***, yields multiple limiting slots, which are examples of multiple second mounting parts.

[0178] Optionally, a protruding structure (such as a second limiting protrusion 202-9) is provided between each second mounting part, and the second connecting part includes a connecting structure made of plastic material (such as an O-ring plastic part 213) to allow the second connecting part to move between different second mounting parts.

[0179] In this embodiment, the air-cooled radiator is offset by moving the heat-conducting base (e.g., in Embodiment 1 and Embodiment 2) or moving the crossbeam (e.g., in Embodiment 3 and Embodiment 4).

[0180] The types, quantities, shapes, installation methods, and structures of the heat sink components provided in the embodiments of this application are not limited to the above embodiments. All technical solutions implemented under the principles of this application are within the protection scope of this solution. Any one or more embodiments or figures in the specification, combined in a suitable manner, are within the protection scope of this solution.

[0181] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application. Those skilled in the art should understand that although this application has been described in detail with reference to the foregoing embodiments, modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the spirit and scope of the technical solutions in the embodiments of this application.

Claims

1. A heat sink with an offset heat dissipation position, characterized in that, The heat sink is used to dissipate heat from a heat source structure, and includes: A thermally conductive component is used to fit tightly against the heat source structure to transfer the heat generated by the heat source structure; The offset component includes a first connecting part, a second connecting part, and a position adjustment part. The first connecting part is connected to the heat-conducting component, the second connecting part is used to connect to the heat source structure via a mounting frame, and the position adjustment part is used to adjust the relative positions of the first connecting part and the second connecting part to change the position where the heat-conducting component is in close contact with the heat source structure.

2. The radiator according to claim 1, characterized in that, The position adjustment part includes a plurality of first mounting parts, each of which is in a different position; the first connecting part is used to connect to the heat-conducting component through different first mounting parts, so that the heat-conducting component is tightly fitted to different positions of the heat source structure.

3. The radiator according to claim 2, characterized in that, The plurality of first mounting portions are plurality of first limiting holes, and the first connecting portion is a first limiting component. The first limiting component is used to connect to the heat-conducting component through different first limiting holes so that the heat-conducting component is tightly fitted to different positions of the heat source structure.

4. The radiator according to claim 3, characterized in that, The first limiting component includes a first limiting structure. The heat-conducting component is slidably connected to the offset component. During the sliding process of the heat-conducting component, the first limiting structure is used to engage the heat-conducting component through different first limiting holes.

5. The radiator according to claim 4, characterized in that, The offset component includes a crossbeam with the plurality of first limiting holes; the heat-conducting component includes a heat-conducting base with mounting holes; the first limiting structure is installed in the mounting holes and matches one of the plurality of first limiting holes so that the heat-conducting component is tightly fitted to different positions of the heat source structure.

6. The radiator according to claim 5, characterized in that, The first limiting structure is a first limiting ball, which is installed in the mounting hole. During the sliding of the heat-conducting base along the crossbeam, the first limiting ball matches one of the plurality of first limiting holes.

7. The radiator according to claim 6, characterized in that, The first limiting ball is equipped with a spring inside. During the movement of the heat-conducting base along the crossbeam, the spring is in a compressed state, and the first limiting ball is located below the crossbeam. After the first limiting ball moves to the position of the first limiting hole, the first limiting ball is matched and positioned with the first limiting hole at different positions under the action of the spring force, and the heat-conducting component is closely attached to different positions of the heat source structure.

8. The radiator according to claim 5, characterized in that, The crossbeam also includes a flange, and the heat-conducting base also includes a groove and a notch; after the flange of the crossbeam passes through the notch, the flange of the crossbeam is engaged in the groove of the heat-conducting base so that the heat-conducting base slides along the crossbeam.

9. The radiator according to claim 3, characterized in that, The first limiting component includes a second limiting structure and a first fastener. The second limiting structure is used to be positioned at different first limiting holes, and the first fastener is used to be connected to the heat-conducting component through the positioned first limiting holes.

10. The radiator according to claim 1, characterized in that, The position adjustment part includes a plurality of second mounting parts, each of which is in a different position; the second connecting part is used to connect to the heat source structure through different second mounting parts, so that the heat-conducting component is tightly fitted to different positions of the heat source structure.

11. The radiator according to claim 10, characterized in that, A protruding structure is provided between each of the second mounting portions, the protruding structure being made of a plastic material, so that the second connecting portion can move between different second mounting portions.

12. The radiator according to claim 10, characterized in that, A protruding structure is provided between each of the second mounting portions, and the second connecting portion includes a connecting structure made of plastic material, so that the second connecting portion can move between different second mounting portions.

13. The radiator according to any one of claims 1-12, characterized in that, The heat source structure includes a chip, and the heat-conducting component includes a heat-conducting base, which is used to tightly fit the chip to remove the heat generated by the chip.

14. The radiator according to claim 13, characterized in that, The heat source structure further includes a mounting frame, and the offset component includes a crossbeam. The crossbeam is provided with the position adjustment part, and the heat-conducting base is connected to the crossbeam through the first connecting part. The crossbeam is also used to connect to the mounting frame through the second connecting part. The position adjustment part is used to adjust the relative positions of the first connecting part and the second connecting part to change the position where the heat-conducting base is in close contact with the chip.

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