Solid-state relay heat dissipation device

Abstract

The utility model relates to the field of heat dissipation, in particular to a solid-state relay heat dissipation device which comprises relay mounting plates arranged in series, one side plate surface of each relay mounting plate is used for fixing a relay, the other side plate surface of each relay mounting plate is provided with a U-shaped cooling plate, and the U-shaped opening direction of each cooling plate faces the direction of the corresponding relay mounting plate. The cooling plate and the relay mounting plate are enclosed to form a central heat dissipation area, and heat dissipation aluminum sheets are uniformly arranged in the central heat dissipation area at intervals along the direction vertical to the plate surface of the relay mounting plate; side heat dissipation channels are formed between the cooling plates of the adjacent relay mounting plates, heat dissipation conical pieces are arranged on the side faces of the cooling plates, the heat dissipation conical pieces on the two adjacent cooling plates are arranged in the side heat dissipation channels in a staggered mode, and the symmetry axis of the heat dissipation conical pieces is parallel to the plate faces of the relay mounting plates. An exhaust hole communicated with an air source is formed in the middle of the tip end of the heat dissipation conical piece, and exhaust of the exhaust hole forms a vertical fan-shaped air curtain. According to the utility model, the heat dissipation effect of the solid-state relay is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation, specifically a heat dissipation device for a solid-state relay. Background Technology

[0002] Solid-state relays (SSRs) are electrical components that use semiconductor devices to convert electrical signals into control current. In power systems or industrial automation systems, multiple SSRs are typically deployed to meet control requirements and short-circuit / short-circuit protection needs. Due to the losses of internal electronic components, power consumption, load size, and ambient temperature, SSRs inevitably generate heat during operation. To avoid overheating that could degrade performance and shorten lifespan, existing relays, as described in announcement number "CN211047602U," mount the SSR on a heat sink bracket. Heat sink fins are evenly distributed on the bracket to dissipate heat from the SSR. Under normal operating conditions, the heat sink fins effectively cool the SSR. However, under excessive load or short-circuit conditions, the SSR temperature can rise sharply in a short time. Heat dissipation solely through contact between the heat sink fins and air is insufficient to handle the sudden temperature increase, limiting the heat dissipation effect and making it difficult to quickly cool the SSR. This can easily lead to the burnout of internal electronic components, thus requiring a solution. Utility Model Content

[0003] To avoid and overcome the technical problems existing in the prior art, this utility model provides a heat dissipation device for solid-state relays. This utility model significantly improves the heat dissipation effect of solid-state relays.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A solid-state relay heat dissipation device includes relay mounting plates arranged in series. One side of the relay mounting plate is used to fix the relay, and the other side is provided with a U-shaped cooling plate. The U-shaped opening of the cooling plate faces the relay mounting plate. The cooling plate and the relay mounting plate enclose a central heat dissipation area. Heat dissipation aluminum fins are evenly spaced along the direction perpendicular to the surface of the relay mounting plate within the central heat dissipation area. A side heat dissipation channel is formed between the cooling plates of adjacent relay mounting plates. Heat dissipation cones are provided on the side of the cooling plates. The heat dissipation cones on adjacent cooling plates are staggered within the side heat dissipation channel. The axis of symmetry of each heat dissipation cone is parallel to the surface of the relay mounting plate. An exhaust hole communicating with an air source is opened in the middle of the tip of the heat dissipation cone. The exhaust from the exhaust hole forms a vertical fan-shaped air curtain.

[0006] As a further embodiment of this utility model: each relay mounting plate is provided with a main channel along its length, and the main channels of each relay mounting plate are connected by an air pipe connector; each cooling plate is provided with a branch channel along the arrangement direction of the heat dissipation cones, and the main channel supplies air to the exhaust holes of each heat dissipation cone through the branch channel; along the gas flow direction, the relay mounting plate at the starting end is provided with an air inlet connected to the air source, and the main channel outlet of the relay mounting plate at the end is sealed by an exhaust plug.

[0007] As a further improvement of this utility model, the total exhaust area of ​​the exhaust holes of each heat dissipation cone is smaller than the air intake area of ​​the air inlet.

[0008] As a further improvement of this utility model: the heat dissipation cones are triangular prisms. From a top view, the staggered heat dissipation cones form an S-shaped heat dissipation channel, and the corresponding sides of two adjacent heat dissipation cones are parallel to each other.

[0009] As a further improvement of this utility model: the projections of the heat dissipation cones on the opposing surfaces of two adjacent cooling plates along the direction of the heat dissipation cone arrangement intersect.

[0010] As a further improvement of this utility model, a fixing seat is provided at the end of the cooling plate away from the relay mounting plate to fix the heat dissipation device.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. Under normal operating conditions, this invention removes heat from the solid-state relay through the heat dissipation aluminum fins in the central heat dissipation area and the heat dissipation cones in the side heat dissipation channels. When the solid-state relay is overloaded, the air source vents through the exhaust port, which sprays air to form a vertical fan-shaped air curtain. This fan-shaped air curtain directs the airflow to the bottom and top of the side heat dissipation channels. The exhaust from the exhaust port is directed towards the axis of symmetry between two adjacent heat dissipation cones on the opposing cooling plate. After reaching the opposing cooling plate, the airflow is split to both sides, flowing along the sides of the two opposing heat dissipation cones. This accelerates airflow and, through the air curtain at the exhaust port, rapidly removes heat from the surface of the heat dissipation cones, significantly improving the heat dissipation effect of the solid-state relay.

[0013] 2. The multiple relay mounting plates of this utility model are connected in sequence, and the main channels are connected through air pipe joints. After the air source is connected, air can be supplied to the exhaust holes on each cooling plate synchronously. By setting the difference between the total exhaust area and the recent area of ​​the air inlet, each exhaust hole can be pressurized and exhausted, increasing the air curtain flow rate.

[0014] 3. The sides of adjacent heat dissipation cones of this utility model are arranged parallel to each other, so that the cooling airflow flows evenly along the sides of the heat dissipation channel, thereby improving the heat dissipation efficiency. Attached Figure Description

[0015] Figure 1 This is a top view of the structure of this utility model.

[0016] In the picture:

[0017] 1. Relay mounting plate; 11. Main channel; 12. Air pipe connector;

[0018] 13. Air intake; 14. Exhaust plug;

[0019] 2. Cooling plate; 21. Central heat dissipation area; 22. Heat sink aluminum fins;

[0020] 23. Heat dissipation cone; 24. Flow channel; 3. Fixture. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1 In this embodiment of the invention, a solid-state relay heat dissipation device includes multiple sets of relay mounting plates 1. The number of relay mounting plates 1 corresponds to the number of solid-state relays in the system. The solid-state relays can be mounted and fixed on the front side of the relay mounting plates 1. A U-shaped cooling plate 2 is provided on the back side of the relay mounting plates 1. The opening of the cooling plate 2 faces the relay mounting plate 1. Preferably, the cooling plate 2 is integrally formed with the relay mounting plate 1.

[0023] The cooling plate 2 and the relay mounting plate 1 enclose a central heat dissipation area 21. Multiple sets of heat dissipation aluminum fins 22 are evenly spaced within the central heat dissipation area 21. Each heat dissipation aluminum fin 21 evenly divides the cavity of the central heat dissipation area 21, and each heat dissipation aluminum fin 21 is arranged perpendicularly to the surface of the relay mounting plate 1.

[0024] The opening width of the cooling plate 2 is smaller than the length of the relay mounting plate 1. After the relay mounting plates 1 are connected sequentially in a straight line, there is still a certain gap between the cooling plates 2 on the back of adjacent relay mounting plates 1. A side heat dissipation channel is formed between the opposing surfaces of two adjacent cooling plates 2, and the side heat dissipation channel has an S-shaped layout. The cooling plate 2 is provided with heat dissipation cones 23 located in the side heat dissipation channel, and the heat dissipation cones 23 on the two opposing cooling plates 2 are staggered.

[0025] The heat dissipation cone 23 is preferably triangular prism shaped, and the length of the heat dissipation cone 23, the length of the heat dissipation aluminum fin 21, and the height of the relay mounting plate 1 correspond to each other. The base of the triangular prism of the heat dissipation cone 23 is an isosceles triangle, the apex angle of the isosceles triangle is less than 45°, and the axis of symmetry of each heat dissipation cone 23 is arranged parallel to the surface of the relay mounting plate 1.

[0026] The corresponding sides of two adjacent sets of staggered heat dissipation cones 23 in the side heat dissipation channel are arranged in parallel, and the projections of the heat dissipation cones 23 on the opposite surfaces of two adjacent cooling plates 2 along the arrangement direction of the heat dissipation cones 23 intersect.

[0027] An exhaust port is provided at the center of the tip of the heat dissipation cone 23. After air is released through the exhaust port, it forms a vertical fan-shaped air curtain, which propels the airflow to the bottom and top of the side heat dissipation channel. The exhaust from the exhaust port is directed towards the axis of symmetry between two adjacent heat dissipation cones 23 on the opposing cooling plate 2. After the airflow reaches the opposing cooling plate 2, it splits to both sides, flowing along the sides of the two opposing heat dissipation cones 23. This accelerates the airflow and, through the air curtain of the exhaust port, quickly removes heat from the surface of the heat dissipation cone 23, improving the heat dissipation effect.

[0028] The relay mounting plate 1 has a main channel 11 inside along its length. An air inlet 13 is installed at the entrance of the main channel 11 of the relay mounting plate 1 at the beginning end. The air inlet is connected to an air source. The outlet of the main channel 11 of the relay mounting plate 1 at the end end is sealed by an exhaust plug 14.

[0029] The cooling plate 2 has a branch flow channel 24 that communicates with the main flow channel 11. Each branch flow channel 24 is connected to the exhaust port of the heat dissipation cone 23 to supply air to the exhaust port. The total exhaust area of ​​the exhaust ports of each heat dissipation cone 23 is smaller than the intake area of ​​the air inlet 13, which can accelerate the exhaust speed of each exhaust port and make each exhaust port form a jet-type high-pressure fan-shaped air curtain.

[0030] When the relay mounting plates 1 are connected in series, their main flow channels 11 are connected through air pipe connectors 12. A fixing seat 3 is provided at the end of the cooling plate 2 away from the relay mounting plate 1. The length of the fixing seat 3 corresponds to the length of the relay mounting plate 1. The relay mounting plate 1 can be directly fixed to the power system through the fixing seat 3. After fixing, each solid-state relay can still be disassembled and installed at any time.

[0031] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0032] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

Claims

1. A heat dissipation device for a solid-state relay, characterized in that, The system includes a relay mounting plate (1) arranged in series. One side of the relay mounting plate (1) is used to fix the relay, and the other side is provided with a U-shaped cooling plate (2). The U-shaped opening of the cooling plate (2) faces the relay mounting plate (1). The cooling plate (2) and the relay mounting plate (1) enclose a central heat dissipation area (21). Heat dissipation aluminum fins (22) are evenly spaced along the direction perpendicular to the surface of the relay mounting plate (1) in the central heat dissipation area (21). A side heat dissipation channel is formed between the cooling plates (2) of adjacent relay mounting plates (1). Heat dissipation cones (23) are provided on the side of the cooling plate (2). The heat dissipation cones (23) on two adjacent cooling plates (2) are staggered in the side heat dissipation channel. The axis of symmetry of each heat dissipation cone (23) is arranged parallel to the surface of the relay mounting plate (1). An exhaust hole connected to the air source is opened in the middle of the tip of the heat dissipation cone (23). The exhaust from the exhaust hole forms a vertical fan-shaped air curtain.

2. The solid-state relay heat dissipation device according to claim 1, characterized in that, Each relay mounting plate (1) has a main channel (11) along its length, and the main channels (11) of each relay mounting plate (1) are connected to each other through a gas pipe connector (12); each cooling plate (2) has a branch channel (24) along the arrangement direction of the heat dissipation cones (23), and the main channel (11) supplies air to the exhaust holes of each heat dissipation cone (23) through the branch channel (24); along the gas flow direction, the relay mounting plate (1) at the beginning end is provided with an air inlet (13) connected to the air source, and the outlet of the main channel (11) of the relay mounting plate (1) at the end end is closed by an exhaust plug (14).

3. The solid-state relay heat dissipation device according to claim 2, characterized in that, The total exhaust area of ​​the exhaust holes of each heat dissipation cone (23) is smaller than the air intake area of ​​the air inlet (13).

4. A solid-state relay heat dissipation device according to any one of claims 1 to 3, characterized in that, The heat dissipation cones (23) are triangular prisms. From a top view, the interlaced heat dissipation cones (23) form an S-shaped heat dissipation channel, and the corresponding sides of two adjacent heat dissipation cones (23) are parallel to each other.

5. A solid-state relay heat dissipation device according to claim 4, characterized in that, The projections of the heat dissipation cones (23) on the opposite surfaces of two adjacent cooling plates (2) along the arrangement direction of the heat dissipation cones (23) intersect.

6. A solid-state relay heat dissipation device according to any one of claims 1 to 3, characterized in that, The cooling plate (2) is provided with a mounting base (3) at the end away from the relay mounting plate (1) to fix the heat dissipation device.

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