Self-holding elastic radiator structure

Abstract

The utility model discloses a self-holding elastic heat dissipation body structure, which comprises an elastic heat dissipation body, a first elastic heat dissipation body and a second elastic heat dissipation body, wherein the elastic heat dissipation body is arranged on a circuit board and abuts against an electronic element; the elastic heat dissipation body comprises a plurality of groups of buckling pins which are clamped with the circuit board; the vertical part is connected with the buckle foot; the deformation part is connected with the vertical part; the abutting part is connected with the deformation part and abuts against the electronic element; the abutting portion is formed by stacking the S-shaped fins, as a whole, the deformation portion and the vertical portion serve as a heat dissipation body for heat dissipation, the abutting portion formed by stacking the S-shaped fins serves as a heat absorption body for heat absorption, the heat absorption and heat dissipation process of the electronic component is completed, and the heat absorption and heat storage capacity of the abutting portion can be increased or reduced by changing the stacking thickness of the S-shaped fins. According to the utility model, the elastic heat dissipation body structure is designed to complete the heat dissipation work of parts needing heat dissipation, including electronic components, and the heat dissipation work is completed by diffusing the heat in contact with the heating body to the deformation part and the vertical part through the abutting part by making contact with the heating body through the abutting part.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation, specifically a self-holding elastic heat sink structure, mainly used for heat dissipation of electronic components mounted on circuit boards. Background Technology

[0002] Electronic components are the basic units that make up electronic systems, and they play a vital role in various electronic devices and systems.

[0003] Taking a surface-mount rectifier bridge as an example, a surface-mount rectifier bridge is a type of electronic component, mainly used to convert alternating current (AC) into direct current (DC).

[0004] When a surface-mount rectifier bridge is soldered onto a circuit board, it generates heat, requiring heat dissipation. Currently, the common heat dissipation method for surface-mount rectifier bridges is air cooling, which is not very efficient. When dealing with high-power products, the surface-mount rectifier bridge may not provide sufficient power. The following methods can be used to address this:

[0005] 1. Replace with a package that has better heat dissipation and higher power, but the cost of replacing the package is high;

[0006] 2. Add a heat sink. However, most heat sinks on the market use screws to attach to heat-generating components for heat dissipation. However, heat sinks have a relatively complex structure and high heat dissipation costs.

[0007] Therefore, designing a low-cost method to dissipate heat from the surface-mount rectifier bridge without affecting its operation is a problem that needs to be solved. Utility Model Content

[0008] Purpose of the utility model: To provide a self-holding elastic heat sink structure to solve the above-mentioned problems existing in the prior art.

[0009] Technical solution: A self-holding elastic heat sink structure, comprising:

[0010] A flexible heat sink is mounted on the circuit board and abuts against the electronic components;

[0011] The elastic heat sink includes:

[0012] The latches are designed in multiple sets to snap onto the circuit board.

[0013] The upright part is connected to the buckle foot;

[0014] The deformable part, connected to the upright part, is in the shape of a "7".

[0015] The abutting part is connected to the deformable part and abuts against the electronic component, and is in a predetermined shape.

[0016] This invention achieves heat dissipation for components requiring heat dissipation, including electronic components, by designing an elastic heat sink structure. The heat from the heat sink is diffused through the contact part to the deformation part and the upright part to complete the heat dissipation. The design of the deformation part not only allows it to adapt to electronic components of different sizes and heights through deformation, but also increases its contact surface with the air during heat dissipation, thereby improving the heat dissipation effect. At the same time, it is less expensive than using a heat sink or changing the package.

[0017] In a further embodiment, the abutting part is formed by stacking serpentine fins. The abutting part serves as a heat-absorbing part. Overall, the deformed part and the upright part serve as heat dissipation bodies, and the abutting part formed by the serpentine stack serves as a heat absorber to absorb heat, thus completing the heat absorption and heat dissipation process for the electronic components. The heat absorption and heat storage capacity of the abutting part can be increased or decreased by changing the thickness of the serpentine fin stack.

[0018] In a further embodiment, transition surfaces are provided on the inner and outer walls of the connection between the upright part and the deformable part, as well as on the bend of the deformable part.

[0019] In a further embodiment, the elastic heat sink is formed by stamping a metal material;

[0020] The metal materials include copper and aluminum.

[0021] Aluminum can also be used. The specific material selection depends on the actual situation. It just needs to be easy to dissipate heat and have flexibility.

[0022] In a further embodiment, the buckle foot includes a buckle post and a barb disposed at the end of the buckle post.

[0023] In a further embodiment, the circuit board has a connection slot that matches the buckle, and the electronic components are soldered onto the circuit board.

[0024] In a further embodiment, the electronic component includes a surface-mount rectifier bridge.

[0025] Beneficial effects: This utility model discloses a self-holding elastic heat sink structure. This utility model completes the heat dissipation work of components that need heat dissipation by designing an elastic heat sink structure, including electronic components. The heat is diffused from the contact part to the heat-generating part and the upright part through the contact part to complete the heat dissipation. The design of the deformation part can not only adapt to electronic components of different models and heights through deformation, but also increase the contact surface with the air during heat dissipation, thereby improving the heat dissipation effect. At the same time, the cost is lower than that of using a heat sink or changing the package. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the present invention assembled on a circuit board and in contact with electronic components.

[0027] Figure 2 This is a cross-sectional view of the present invention when it is assembled on a circuit board and in contact with electronic components.

[0028] Figure 3 This is a schematic diagram of the structure of this utility model.

[0029] The attached figures are labeled as follows:

[0030] 1. Circuit board; 2. Electronic component; 3. Elastic heat sink; 31. Clip; 32. Stand; 33. Deformable part; 34. Abutment part. Detailed Implementation

[0031] This application relates to a self-holding elastic heat sink structure. Currently, the traditional heat dissipation method for surface-mount rectifier bridges is air cooling, which uses the flow of air to transfer heat away. This heat dissipation method mainly relies on the contact surface between the heat source and the air to dissipate heat, which is not very efficient. When the power is large, the device temperature rises high, affecting the device life.

[0032] This invention achieves heat dissipation for components requiring heat dissipation, including electronic components, by designing an elastic heat sink structure. The heat from the heat sink is diffused through the contact part to the deformation part and the upright part to complete the heat dissipation. The design of the deformation part not only allows it to adapt to electronic components of different sizes and heights through deformation, but also increases its contact surface with the air during heat dissipation, thereby improving the heat dissipation effect. At the same time, it is less expensive than using a heat sink or changing the package.

[0033] The design of this application can adapt to more models of surface-mount rectifier bridges at a lower cost by designing the deformation part, while also increasing the contact surface between the deformation part and the air during the heat dissipation process, resulting in better heat dissipation.

[0034] The following detailed explanation uses specific implementation methods.

[0035] A self-holding elastic heat sink structure, comprising:

[0036] The elastic heat sink 3 is mounted on the circuit board 1 and abuts against the electronic component 2;

[0037] The elastic heat sink 3 includes:

[0038] The latch 31 is designed in multiple sets and is snapped into the circuit board 1.

[0039] The upright part 32 is connected to the buckle 31;

[0040] The deformable part 33 is connected to the upright part 32 and is in the shape of a 7.

[0041] The contact portion 34 is connected to the deformable portion and abuts against the electronic component, and is in a predetermined shape.

[0042] This utility model completes the heat dissipation of components that need heat dissipation by designing an elastic heat sink 3 structure, including electronic components. The heat is diffused through the contact part 34 to the deformation part 33 and the upright part 32 to complete the heat dissipation by contacting the heat sink 34 with the heat sink 35. The design of the deformation part 33 can not only adapt to electronic components of different heights by deformation, but also increase its contact surface with the air during heat dissipation, thereby improving the heat dissipation effect. At the same time, it is less expensive than using a heat sink or changing the package.

[0043] The contact portion 34 is formed by stacking serpentine fins. The contact portion 34 serves as a heat-absorbing portion. Overall, the deformable portion 33 and the upright portion 32 serve as heat dissipation bodies, while the serpentine stacked contact portion 34 serves as a heat absorber, thus completing the heat absorption and heat dissipation process for the electronic components. The heat absorption and heat storage capacity of the contact portion 34 can be increased or decreased by changing the thickness of the serpentine fin stack.

[0044] The connection between the upright part 32 and the deformable part 33, as well as the bend of the deformable part 33, are provided with transition curved surfaces on both the inner and outer walls.

[0045] The elastic heat sink 3 is formed by stamping metal material;

[0046] The metal material includes copper.

[0047] Aluminum can also be used. The specific material selection depends on the actual situation. It just needs to be easy to dissipate heat and have flexibility.

[0048] The buckle 31 includes a buckle post and a barb disposed at the end of the buckle post.

[0049] The circuit board 1 has a connection slot that matches the buckle 31, and the electronic component 2 is soldered onto the circuit board 1.

[0050] The electronic component 2 includes a surface-mount rectifier bridge.

[0051] Working principle description: During operation, the contact part 34 abuts against the surface mount rectifier bridge and extends the retaining foot 31 into the connecting slot. The retaining foot 31 completes the snap-fit ​​with the circuit board 1. After snap-fit, in order to make the heat sink structure more stable, the retaining foot 31 can be soldered onto the circuit board 1. During heat dissipation, the contact part 34 abuts against the surface mount rectifier bridge to absorb heat and conduct the heat to the deformation part 33 and the upright part 32 to complete the heat dissipation work of the surface mount rectifier bridge.

[0052] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various equivalent transformations can be made to the technical solutions of the present invention, and all such equivalent transformations fall within the protection scope of the present invention.

Claims

1. A self-holding elastic heat sink structure, characterized in that, include: An elastic heat sink (3) is mounted on the circuit board (1) and abuts against the electronic components (2); The elastic heat sink (3) includes: The latch (31) is designed in multiple sets and is snapped into the circuit board (1); The upright part (32) is connected to the buckle (31); The deformable part (33) is connected to the upright part (32); The abutting part (34) is connected to the deformable part and abuts against the electronic component (2), and is in a predetermined shape.

2. The self-holding elastic heat sink structure according to claim 1, characterized in that: The abutment portion (34) is formed by stacking serpentine fins.

3. The self-holding elastic heat sink structure according to claim 1, characterized in that: The connection between the upright part (32) and the deformable part (33) and the bending part of the deformable part (33) are provided with transition curved surfaces on the inner and outer walls.

4. The self-holding elastic heat sink structure according to claim 1, characterized in that: The elastic heat sink (3) is formed by stamping metal.

5. The self-holding elastic heat sink structure according to claim 1, characterized in that: The buckle (31) includes a buckle post and a barb provided at the end of the buckle post.

6. The self-holding elastic heat sink structure according to claim 1, characterized in that: The circuit board (1) has a connecting slot adapted to the buckle (31), and the electronic component (2) is soldered onto the circuit board (1).

7. The self-holding elastic heat sink structure according to claim 1, characterized in that: The electronic component (2) includes a surface-mount rectifier bridge.

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