Curing oven for insulating layer of electronic component

Abstract

The utility model discloses a curing oven for an insulating layer of an electronic component, which comprises an oven body, a control panel is arranged on one side of the oven body, heating pipes are arranged on both sides of the interior of the oven body, cooling mechanisms are arranged on both sides of the oven body, a socket is fixed on one side of the oven body, a guide rail is arranged on the lower portion of the interior of the oven body, and the guide rail is arranged on the lower portion of the interior of the oven body. A discharging mechanism is arranged in the box body; according to the curing oven for the insulating layer of the electronic element, through cooperative use of the discharging mechanism, a plurality of placing boxes are arranged in the placing frame, and a plurality of groups of electronic elements can be placed at the same time during curing, so that the curing efficiency of the electronic elements can be effectively improved; meanwhile, flowing of hot air in the containing box can be accelerated through the vent holes, insulating layers of the electronic elements can be fully heated and cured, the curing effect is ensured, after the electronic elements are cured, the containing box can slide conveniently through the sliding blocks, and therefore the electronic elements can be taken out rapidly.

Description

TECHNICAL FIELD

[0001] The utility model relates to the related technical field of solidification oven, concretely is a kind of solidification oven for electronic component insulating layer. BACKGROUND

[0002] Electronic component is the basic element in electronic circuit, usually has two or more than two lead or metal contact point, for realizing the specific function of electronic device, electronic component is widely used in various industries in modern society, including communication, computer, consumer electronics, automobile, industrial automation, medical treatment, aerospace, energy and education research and other fields, they play a key role in these fields, promote the development and progress of various industries, solidification oven is a kind of equipment specially designed for solidifying insulating layer material on electronic component, the oven is through accurate control temperature and time, ensure that insulating layer material can be fully solidified, so as to achieve the required physical and chemical properties.

[0003] However, the existing solidification oven can only solidify a batch of electronic components at the same time, cannot place more electronic components at the same time, and the solidification efficiency is not high enough, therefore, the present application provides a solidification oven for electronic component insulating layer to meet the needs. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of solidification oven for electronic component insulating layer to solve the problems raised in the above background.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of solidification oven for electronic component insulating layer, including box, the side of the box is provided with control panel, the inside both sides of the box are equipped with heating pipe, the both sides of the box are provided with cooling mechanism, the side of the box is fixed with socket, the inside lower portion of the box is equipped with guide rail, the inside of the box is provided with discharging mechanism;

[0006] The discharging mechanism includes placing rack, plug rod, guide block, sliding slot, sliding block, placing box and vent, the placing rack is installed in the inside of box, the side of the placing rack is equipped with plug rod, the lower portion of the both sides of the placing rack is fixed with guide block, the both sides of the inside of the placing rack are equipped with sliding slot, the inside of the sliding slot is equipped with sliding block, the side of the sliding block is fixed with placing box, the both sides of the placing box are equipped with vent.

[0007] Preferably, the cooling mechanism includes fixed frame, fan, hydraulic cylinder, hydraulic rod and baffle, the fixed frame is fixed in the both sides of box, the inside of the fixed frame is equipped with fan, the both sides of the fixed frame are equipped with hydraulic cylinder, the upper portion of the hydraulic cylinder is equipped with hydraulic rod, the upper portion of the hydraulic rod is fixed with baffle.

[0008] Preferably, the baffle and the fixed frame constitute a telescopic structure through a hydraulic cylinder, and the hydraulic cylinder is symmetrically arranged with the central axis of the fixed frame.

[0009] Preferably, the placing frame and the guide rail constitute a sliding structure through a guide block, and the guide block is matched with the shape of the guide rail.

[0010] Preferably, the placing box and the placing frame constitute a sliding structure through a sliding block, and the placing boxes are distributed at equal intervals in the interior of the placing frame.

[0011] Preferably, the ventilation holes are distributed in parallel on both sides of the placing box, and the ventilation holes are used in cooperation with the placing box.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] 1. The solidification oven for the insulating layer of electronic components, through the cooperation of the discharging mechanism, multiple placing boxes are arranged in the interior of the placing frame, multiple groups of electronic components can be placed at the same time during solidification, thereby the solidification efficiency of the electronic components can be effectively improved, the setting of the ventilation holes can accelerate the flow of hot air in the placing box, the insulating layer of the electronic components can be fully heated and solidified, the solidification effect is ensured, and after the solidification of the electronic components is completed, the placing box can be conveniently slid through the setting of the sliding block, thereby the electronic components can be quickly taken out.

[0014] 2. The solidification oven for the insulating layer of electronic components, through the setting of the cooling mechanism, after the solidification of the electronic components is completed, the switch of the hydraulic cylinder is opened to drive the baffle to rise, and the fan is started, the heat emission in the box body can be accelerated, the temperature in the interior of the box body can be rapidly reduced, thereby the cooling time is shortened, the temperature uniformity can be improved and the heat dissipation process can be accelerated. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a whole structure schematic view of the utility model;

[0016] Figure 2 It is a structure schematic view of the interior of the box body of the utility model;

[0017] Figure 3 It is a structure schematic view of the cooling mechanism of the utility model;

[0018] Figure 4 It is a structure schematic view of the discharging mechanism of the utility model.

[0019] In the figure: 1, box; 2, control panel; 3, heating pipe; 4, cooling mechanism; 401, fixed frame; 402, fan; 403, hydraulic cylinder; 404, hydraulic rod; 405, baffle; 5, socket; 6, guide rail; 7, discharging mechanism; 701, placing rack; 702, inserting rod; 703, guide block; 704, sliding groove; 705, sliding block; 706, placing box; 707, ventilation hole. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0021] Please refer to Figures 1-2 The present application provides a technical scheme: a curing oven for electronic component insulation layer, comprising a box 1, the box 1 is provided with a control panel 2 on one side, heating pipes 3 are installed on both sides of the inside of the box 1, cooling mechanisms 4 are arranged on both sides of the box 1, the cooling mechanism 4 comprises a fixed frame 401, a fan 402, a hydraulic cylinder 403, a hydraulic rod 404 and a baffle 405, the fixed frame 401 is fixed on both sides of the box 1, the fan 402 is installed in the fixed frame 401, the hydraulic cylinder 403 is installed on both sides of the fixed frame 401, the hydraulic rod 404 is installed above the hydraulic cylinder 403, and the baffle 405 is fixed above the hydraulic rod 404. The heat dissipation in the box 1 can be accelerated, the temperature inside the box 1 can be quickly reduced, the cooling time can be shortened, the temperature uniformity can be improved and the heat dissipation process can be accelerated, the baffle 405 constitutes a telescopic structure with the fixed frame 401 through the hydraulic cylinder 403, the hydraulic cylinder 403 is symmetrically arranged about the central axis of the fixed frame 401, the baffle 405 can protect the fan 402 during the curing process, after the curing of the electronic component is completed, the switch of the hydraulic cylinder 403 can be opened to drive the baffle 405 to rise, a socket 5 is fixed on one side of the box 1, a guide rail 6 is installed below the inside of the box 1, and a discharging mechanism 7 is arranged in the inside of the box 1.

[0022] Please refer to Figure 2 and Figure 4The discharging mechanism 7 comprises a placing rack 701, an inserting rod 702, a guide block 703, a sliding groove 704, a sliding block 705, a placing box 706 and a ventilation hole 707, the placing rack 701 is installed in the inside of the box body 1, one side of the placing rack 701 is provided with the inserting rod 702, the lower sides of both sides of the placing rack 701 are fixedly provided with the guide block 703, the placing rack 701 and the guide rail 6 form a sliding structure through the guide block 703, the guide block 703 is matched with the guide rail 6 in shape, so as to facilitate the sliding of the placing rack 701 in the inside of the box body 1, both sides of the inside of the placing rack 701 are provided with the sliding groove 704, the sliding block 705 is installed in the sliding groove 704, the placing box 706 and the placing rack 701 form a sliding structure through the sliding block 705, the placing box 706 is distributed at equal intervals in the inside of the placing rack 701, a plurality of groups of electronic components can be placed at the same time during curing, so that the curing efficiency of the electronic components can be effectively improved, and after the curing of the electronic components is completed, the placing box 706 is conveniently slid through the sliding block 705, so that the electronic components can be quickly taken out, one side of the sliding block 705 is fixedly provided with the placing box 706, both sides of the placing box 706 are provided with the ventilation hole 707, the ventilation holes 707 are distributed in parallel on both sides of the placing box 706, the ventilation hole 707 is used in cooperation with the placing box 706, the setting of the ventilation hole 707 can accelerate the flow of hot air in the placing box 706, so that the insulating layer of the electronic component can be fully heated and cured, and the curing effect is ensured.

[0023] Working principle: when the curing oven for the insulating layer of electronic components is used, first, the external power supply is turned on, then the electronic components are placed in the placing box 706, a plurality of placing boxes 706 are arranged in the inside of the placing rack 701, a plurality of groups of electronic components can be placed at the same time during curing, then the placing rack 701 is pushed into the inside of the box body 1 and the inserting rod 702 is inserted into the socket 5, the insulating layer material of the electronic components is cured through the heating pipe 3, after the curing of the electronic components is completed, the switch of the hydraulic cylinder 403 is opened to drive the baffle 405 to rise, and the fan 402 is started, the heat in the box body 1 can be dissipated, the temperature in the inside of the box body 1 can be rapidly reduced, so that the cooling time is shortened, finally, the placing box 706 is conveniently slid through the setting of the sliding block 705, so that the electronic components can be quickly taken out, when the device is not used, the external power supply of the device is cut off, the model of the fan 402 is 200FZY2-D, the model of the hydraulic cylinder 403 is ROB20X50-CM, and in this way, the use process of the curing oven for the insulating layer of electronic components is completed.

[0024] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A curing oven for insulating layers of electronic components, comprising a housing (1), characterized in that: A control panel (2) is provided on one side of the box (1), heating pipes (3) are installed on both sides of the inside of the box (1), cooling mechanisms (4) are provided on both sides of the box (1), a socket (5) is fixed on one side of the box (1), a guide rail (6) is installed at the bottom inside the box (1), and a feeding mechanism (7) is provided inside the box (1). The feeding mechanism (7) includes a placement frame (701), a rod (702), a guide block (703), a groove (704), a slider (705), a placement box (706), and a ventilation hole (707). The placement frame (701) is installed inside the box (1). A rod (702) is installed on one side of the placement frame (701). Guide blocks (703) are fixed on the lower sides of both sides of the placement frame (701). A groove (704) is opened on both sides of the interior of the placement frame (701). A slider (705) is installed inside the groove (704). A placement box (706) is fixed on one side of the slider (705). A ventilation hole (707) is opened on both sides of the placement box (706).

2. The curing oven for insulating layers of electronic components according to claim 1, characterized in that, The cooling mechanism (4) includes a fixed frame (401), a fan (402), a hydraulic cylinder (403), a hydraulic rod (404), and a baffle (405). The fixed frame (401) is fixed on both sides of the housing (1). The fan (402) is installed inside the fixed frame (401). The hydraulic cylinder (403) is installed on both sides of the fixed frame (401). The hydraulic rod (404) is installed above the hydraulic cylinder (403). The baffle (405) is fixed above the hydraulic rod (404).

3. A curing oven for insulating layers of electronic components according to claim 2, characterized in that, The baffle (405) forms a telescopic structure with the fixed frame (401) via a hydraulic cylinder (403), and the hydraulic cylinder (403) is symmetrically arranged about the central axis of the fixed frame (401).

4. A curing oven for insulating layers of electronic components according to claim 1, characterized in that, The placement rack (701) forms a sliding structure with the guide block (703) and the guide rail (6), and the shape of the guide block (703) matches that of the guide rail (6).

5. A curing oven for insulating layers of electronic components according to claim 1, characterized in that, The placement box (706) forms a sliding structure with the placement frame (701) through the slider (705), and the placement box (706) is evenly distributed inside the placement frame (701).

6. A curing oven for insulating layers of electronic components according to claim 1, characterized in that, The ventilation holes (707) are distributed in parallel on both sides of the placement box (706), and the ventilation holes (707) are used in conjunction with the placement box (706).

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