Composite base material and composite foil
By using a double-sided release film to bond with the substrate layer and adhesive layer in the composite substrate, the problems of large space occupation during winding and uneven adhesive layer are solved, achieving efficient production and ensuring mechanical properties, making it suitable for mass production of composite foil materials.
Patent Information
- Application Number
- CN202422456759.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-10-11
AI Technical Summary
Existing composite substrates occupy a large space during the winding process, are inconvenient to transfer and store, and are prone to uneven adhesive layer during production, resulting in loss of the substrate's mechanical properties.
The double-sided release film is bonded to the substrate layer and adhesive layer. Through the design of heavy release force surface and light release force surface, the inner and outer rings are prevented from sticking together, and the mechanical properties of the substrate are maintained during the production process, simplifying the process flow.
It effectively reduces the volume of the winding process, improves production efficiency, lowers costs, and ensures the mechanical properties and stability of composite foils, making it suitable for mass production of ultra-thin products.
Smart Images
Figure CN223561516U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to composite substrate technical field more particularly, relate to a kind of composite substrate and composite foil. BACKGROUND
[0002] In prior art, there is a composite foil (such as composite current collector) production process based on adhesive layer to realize the compounding of substrate layer and foil layer. The adhesive layer on the substrate layer provides adhesion on the substrate layer, and the substrate layer includes a base film. In such process production, the composite substrate with adhesive layer on the surface is an important component, which has multiple formation methods. The more common one is to coat adhesive solution directly on both sides of the substrate layer, pre-solidify to form adhesive layer, and then obtain by winding after covering release film on both sides of the adhesive layer. Moreover, in the process of actually producing composite foil, such composite substrate is not continuously produced into composite foil after being obtained; generally, it is prepared in advance and put into production when composite foil is produced, to ensure the efficiency of composite foil production process.
[0003] However, based on the existing composite substrate, as the continuous winding and the increase of the number of turns, the overall thickness of the composite substrate increases significantly, which occupies a considerable space; it is inconvenient to transfer and store, and when production is needed, it is transferred to the unwinding position, which brings inconvenience to the production of composite foil.
[0004] Therefore, there is an urgent need for a composite substrate that can provide adhesive layers on both sides of the substrate layer for compounding, while also improving the condition of occupying a large space after winding, to facilitate storage, transfer and production. UTILITY MODEL CONTENT
[0005] The utility model aims to overcome at least one of the above-mentioned deficiencies of the prior art, and provides a composite substrate that can improve the compounding effect of the adhesive layer, while using double-sided release film as a separator between the inner and outer winding layers after winding, to facilitate winding, storage and transfer, and to cooperate with the downstream rapid production, while reducing the volume and space occupied by winding.
[0006] The utility model discloses a technical scheme, a kind of composite substrate, including substrate layer, first glue layer, second glue layer and release film, the release film is double-sided release film, the first glue layer is located between release film and substrate layer, the second glue layer is located on substrate layer side deviating from the first glue layer. After winding and placing after the formation of second glue layer of composite substrate, adjacent inner and outer ring glue layer is isolated by double-sided release film, and it is convenient to peel off while subsequent unwinding. The substrate layer is convenient to tightly bond downstream layer structure, such as foil layer, which needs to be compounded, by the first glue layer, second glue layer, improve the stability of bonding and compounding. And in the production process, the process of this kind of way to compound foil layer is more simple, can greatly reduce production threshold and cost. So as to realize the mass production of corresponding ultra-thin products, such as the production of composite current collector. More importantly, using the double-sided release film, it is convenient to store and transfer after the production of composite substrate, especially in the production process, can improve the production efficiency of the product based on composite substrate. And single-layer release film is beneficial to significantly reduce cost and reduce the amount of corresponding release film.
[0007] In addition, if the prior art is used to form a composite substrate, i.e. the first glue layer and the second glue layer are directly formed on the substrate layer by coating, since the transmission range is long during production, in order to form a uniform and spread glue layer, the substrate layer needs to be stretched as much as possible. When the substrate layer is an ultra-thin structure of only a few microns, such stretching will damage the mechanical properties of the substrate layer. The mechanical properties of the resulting composite substrate are insufficient. For the present application, during the production of the composite substrate, the first glue layer can be coated on the release film, and then the release film carrying the first glue layer is compounded on the substrate layer. Then, the second glue layer is coated on the other side of the substrate layer. After peeling off from the release film, the first glue layer is transferred to the substrate layer. Based on the above process of the present application, the first glue layer is formed on the release film by using the release film which needs to be peeled off finally, and the release film with good tensile resistance is used as the support for stretching, so that the substrate layer of the composite substrate can retain its original mechanical properties, and the first glue layer and the second glue layer are also uniform and spread. The composite substrate formed accordingly has good mechanical properties, and the two sides also have good bonding properties.
[0008] Further, the double-sided release film has a heavy release force side and a light release force side; the first adhesive layer is located between the heavy release force side of the release film and the surface of the substrate layer close to the release film. That is, the first adhesive layer is attached to the heavy release force side of the release film and the surface of the substrate layer close to the release film on both sides. Further, the heavy release force side and the light release force side both have release force, and the release force of the heavy release force side is greater than that of the light release force side. After obtaining the composite substrate, it is wound, and the winding makes the light release force side of the release film located on the outer surface of the corresponding coil, and the second adhesive layer is located on the inner surface. That is, after winding, the inner side of each coil is the second adhesive layer, and the outer side is the light release side of the release layer. By setting the heavy and light release force sides, the accidental peeling of the release film caused by the adhesion of the inner and outer adjacent coils during unwinding is effectively avoided. That is, during unwinding, for the wound composite substrate, the second adhesive layer of the outer coil layer is easily peeled off from the light release side of the adjacent inner coil layer, and the heavy release force side of the inner coil layer is not easily peeled off from the first adhesive layer, at this time, it can be smoothly unwound in turn. In order to facilitate subsequent separate peeling of the release film and the first adhesive layer.
[0009] Further, the difference between the release force of the heavy release force side and the release force of the light release force side is greater than or equal to 5 gf / 25 mm. Further, the difference between the release force of the heavy release force side and the release force of the light release force side is in the range of 5 gf / 25 mm to 25 gf / 25 mm. Further, the ratio of the release force of the heavy release side to the release force of the light release side is (1.5-3):1. Within the ratio and difference range, the difference in peeling force can be effectively formed, so as to ensure that the double-sided release film is separated during winding to reduce the space occupied by the winding, and the inner and outer coils are not adhered during unwinding.
[0010] Further, the release force of the heavy release force side is in the range of 15-30 gf / 25 mm; and the release force of the light release force side is in the range of 5-10 gf / 25 mm. In an embodiment of the present application, by setting the release force of the heavy release force side and the release force of the light release force side, it can be ensured that there is no adhesion and other conditions during unwinding and expansion, so as to realize continuous assembly line production.
[0011] Further, the first adhesive layer is formed by coating on the release film, and the second adhesive layer is formed by coating on the substrate layer. As mentioned above, in this way, the overstretching of the substrate layer can be effectively avoided, the mechanical property loss of the substrate layer in the pretreatment process before compounding can be reduced, and the problem of too large volume during winding in the production process can be avoided. The composite substrate structure formed accordingly also has uniform spreading and thickness of the adhesive layer, high tensile strength, etc. The overstretching of the substrate layer is effectively avoided, the performance of the substrate layer is protected from being lost, the tensile strength and elongation of the substrate layer can be reduced, the substrate layer with smaller thickness or lower tensile strength but better conductive performance can be used, and the selection range of the substrate layer is expanded. The composite substrate with thinner winding thickness can be obtained, the space occupied by the composite substrate during winding is significantly reduced, and the placement, deployment and adjustment of the material during the production process are facilitated.
[0012] Further, a functional layer is arranged between the substrate layer and the first adhesive layer, between the substrate layer and the second adhesive layer, and / or between the first adhesive layer and the release film. The functional layer is at least used to enhance the adhesion or the coupling between the corresponding adhesive layer and the metal or to reduce the peeling force between the release film and the first adhesive layer.
[0013] Further, the composite substrate is composed of the substrate layer, the first adhesive layer, the second adhesive layer and the release film, and the first adhesive layer and the second adhesive layer are respectively arranged on both sides of the substrate layer, and the release film is arranged on the first adhesive layer. That is, the composite substrate is formed by the above-mentioned several layers.
[0014] Further, the substrate layer is at least one of PET, PP, PI, PE, PVC, PBT, PC, PS, ABS, PA, PASF, PVDF, PEDOT, PANI and PPy film; and / or, the thickness of the substrate layer is in the range of 1.9-6 μm; the thickness of the first adhesive layer and the second adhesive layer is 0.8-4 μm. Further, the thickness of the first adhesive layer and the second adhesive layer is the same.
[0015] Further, the composite substrate is applied in the production of composite foil. In addition to simplifying the process, the composite substrate can be directly compounded on the side of the second adhesive layer, and after the release film is peeled off, the side of the first adhesive layer is compounded, which can fully protect the mechanical properties of the corresponding composite foil and the stability of the composite structure.
[0016] Further, the composite foil includes a single-sided composite foil formed by a single-sided composite foil layer of the composite substrate and a composite current collector formed by a double-sided composite foil layer of the composite substrate.
[0017] Another purpose of the utility model lies in providing a kind of composite foil, including aforementioned composite substrate and foil layer attached on second adhesive layer.The composite foil can be used in corresponding foil demand product, and also can be rolled as intermediate product, and based on release film function, also realize unwinding non-adhesion condition.
[0018] Compared with prior art, the beneficial effects of the present application are: the composite substrate described in the present application can be tightly bonded to the downstream composite layer structure, such as foil layer, through the first adhesive layer and the second adhesive layer, improving the stability of bonding and compounding; and in the production process, the process of compounding foil layer in this way is more simple, which can greatly reduce the production threshold and cost; so as to realize mass production of corresponding ultra-thin products, such as the production of composite current collector. More importantly, by using the double-sided release film, the production cost can be reduced, and the composite substrate can be stored and transferred after production, especially in the production process, the production efficiency of the product based on the composite substrate can be improved. And the overall mechanical properties of the composite substrate are guaranteed, and the composite foil formed based on the composite substrate also has good mechanical properties, stability and safety, etc. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 It is a schematic diagram of the composite substrate of the present application.
[0020] Figure 2 It is a schematic diagram of the structure of the single-sided composite foil layer of the present application.
[0021] Figure 3 It is a schematic diagram of the structure of the composite substrate in rolled state.
[0022] BRIEF DESCRIPTION OF DRAWINGS: composite substrate 5100, substrate layer 5110, first adhesive layer 5121A, second adhesive layer 5121B, release film 5122, heavy release force surface 5122A, light release force surface 5122B, metal foil layer 5200, composite foil 5300. DETAILED DESCRIPTION
[0023] The utility model drawings are only used for illustrative purposes, and cannot be understood as a limitation of the utility model. In order to better illustrate the following embodiments, some components of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.
[0024] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings and specific embodiments. However, those skilled in the art will understand that the embodiments described below are only some embodiments of this utility model, not all embodiments, and are only used to illustrate this utility model, and should not be regarded as limiting the scope of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Where the manufacturers of reagents or instruments are not specified, they are all conventional products that can be purchased commercially.
[0025] Example 1
[0026] like Figure 1 As shown, this embodiment discloses a composite substrate 5100, including a substrate layer 5110, a first adhesive layer 5121A, a second adhesive layer 5121B, and a release film 5122. The release film 5122 is a double-sided release film. The first adhesive layer 5121A is located between the release film 5122 and the substrate layer 5110, and the second adhesive layer 5121B is located on the side of the substrate layer 5110 opposite to the first adhesive layer 5121A. In this embodiment, the double-sided release film has a heavy release force surface 5122A and a light release force surface 5122B. The first adhesive layer 5121A is located between the heavy release force surface 5122A of the release film and the surface of the substrate layer 5110 near the release film 5122. That is, the first adhesive layer 5121A is attached to the heavy release force surface 5122A of the release film and the surface of the substrate layer 5110 near the release film 5122 on both sides. Both the heavy release surface 5122A and the light release surface 5122B have release forces, and the release force of the heavy release surface 5122A is greater than that of the light release surface 5122B. The first adhesive layer 5121A is formed by coating on the release film 5122, and the second adhesive layer 5121B is formed by coating on the substrate layer 5110.
[0027] When it is in the winding state, such as Figure 3 As shown; the relationship between the Nth ring and the adjacent outer ring (N+1) is as follows. Figure 3As shown in the enlarged view. By the composite substrate of the present application, the winding thickness can be effectively reduced, and the adhesion between different turns during unwinding can be avoided. For the composite substrate 5100, winding makes the release film light release force surface 5122B located on the outer surface of the corresponding turn, and the second adhesive layer 5121B located on the inner surface. That is, after winding, the inner side of each turn is the second adhesive layer 5121B, and the outer side is the release layer light release surface. When unwinding, for the wound composite substrate 5100, the second adhesive layer 5121B of the outer turn layer (N+1) is easy to peel off from the light release surface of the adjacent inner turn layer (N), and the heavy release force surface 5122A of the inner turn layer (N) is not easy to peel off from the first adhesive layer 5121A. At this time, it can be smoothly unwound in turn. In order to facilitate the subsequent separate peeling of the release film 5122 and the first adhesive layer 5121A.
[0028] In this embodiment, in order to provide a certain degree of release force difference, the ratio of the release force of the heavy release force surface 5122A to the release force of the light release force surface 5122B is (1.5-3):1. Specifically, the release force of the heavy release force surface 5122A is 15-30 gf / 25 mm; the release force of the light release force surface 5122B is 5-10 gf / 25 mm. Specifically, the release force of the heavy release force surface 5122A is 15 gf / 25 mm, and the release force of the light release force surface 5122B is 5 gf / 25 mm.
[0029] The substrate layer 5110 can adopt at least one of PET, PP, PI, PE, PVC, PBT, PC, PS, ABS, PA, PASF, PVDF, PEDOT, PANI and PPy film, and in this embodiment, PET is adopted; the thickness of the substrate layer 5110 is 1.9-6 μm; the thickness of the first adhesive layer 5121A and the second adhesive layer 5121B is 0.8-4 μm. In this embodiment, the thickness of the first adhesive layer 5121A and the second adhesive layer 5121B is the same.
[0030] The composite substrate 5100 can be applied to the preparation of the composite foil 5300; the composite foil 5300 includes a single-sided composite foil 5300 formed by the single-sided composite metal foil layer 5200 of the composite substrate 5100 and a double-sided composite metal foil layer 5200 formed by the composite substrate 5100 after peeling off the release film.
[0031] When further improvement of the performance of the composite substrate 5100 is required, functional layers may be provided between the substrate layer 5110 and the first adhesive layer 5121A, between the substrate layer 5110 and the second adhesive layer 5121B, and / or between the first adhesive layer 5121A and the release film 5122. These functional layers are at least used to enhance adhesion, enhance the coupling between the corresponding adhesive layer and the metal, or reduce the peel force between the release film 5122 and the first adhesive layer 5121A. When only a stable and minimally layered structure is required, the composite substrate 5100 may also consist only of the substrate layer 5110, the first adhesive layer 5121A, the second adhesive layer 5121B, and the release film 5122, with the first adhesive layer 5121A and the second adhesive layer 5121B located on opposite sides of the substrate layer 5110, and the release film 5122 covering the first adhesive layer 5121A.
[0032] Example 2
[0033] like Figure 2 As shown, this embodiment discloses a composite foil 5300, including the aforementioned composite substrate 5100 and a foil layer 5200 attached to the second adhesive layer 5121B. The composite foil 5300 can be used in corresponding foil-demanding products, and can also be wound up as an intermediate product, and based on the release film 5122, it can also achieve unwinding without sticking.
[0034] Example 3
[0035] This embodiment discloses a method for producing composite substrate 5100, including the following steps:
[0036] S1. Apply adhesive liquid to one side of the release film 5122 to form a first adhesive layer 5121A, and then laminate the release film 5122 carrying the first adhesive layer 5121A to one side of the substrate; that is, use the first adhesive layer 5121A to laminate the release film 5122 and the substrate.
[0037] S2. Apply adhesive to the other side of the substrate to form a second adhesive layer 5121B, thereby obtaining a composite substrate 5100.
[0038] The release film 5122 is a double-sided release film.
[0039] In this embodiment, step S1 includes:
[0040] S11. Unwind the release film 5122 and simultaneously apply adhesive to one side surface of the release film 5122; pre-cure the adhesive to form the first adhesive layer 5121A.
[0041] S12, drive the release film 5122 carrying the first adhesive layer 5121A, and drive the substrate at the same time, so that the first adhesive layer 5121A side of the release film 5122 faces the substrate side; the release film 5122 carrying the first adhesive layer 5121A and the substrate are pressed together when moving to the same pressing position;
[0042] In this embodiment, step S2 includes:
[0043] S21, coat the other side of the substrate with adhesive solution, and pre-solidify to form a second adhesive layer 5121B;
[0044] S22, drive the obtained composite substrate 5100 downstream, and wind up with the second adhesive layer 5121B surface as the inner surface and the exposed surface of the release film 5122 as the outer surface.
[0045] The double-sided release film used in this embodiment has a heavy release force side 5122A and a light release force side 5122B; the first adhesive layer 5121A is formed on the heavy release force side 5122A in step S1. Both the heavy release force side 5122A and the light release force side 5122B have release force, and the release force of the heavy release force side 5122A is greater than that of the light release force side 5122B. Preferably, the release force of the heavy release force side 5122A is in the range of 15-30 gf / 25 mm, and the release force of the light release force side 5122B is in the range of 5-10 gf / 25 mm.
[0046] After obtaining the composite substrate 5100 in step S2, winding is performed so that the light release force side 5122B of the release film is located at the outer circle and the second adhesive layer 5121B is located at the inner circle. That is, after winding, the inner side of each circle is the second adhesive layer 5121B and the outer side is the light release force side 5122B of the release layer.
[0047] Embodiment 4
[0048] This embodiment discloses a method for producing a composite foil 5300, comprising the steps of:
[0049] A1, using the method described in embodiment 3 to obtain a composite substrate 5100;
[0050] A2, unwinding the composite substrate 5100 to the metal foil layer 5200, and compounding the foil layer through the second adhesive layer 5121B;
[0051] A3, peeling off the release film 5122 on the first adhesive layer 5121A side before the composite substrate 5100 reaches the metal foil layer 5200, so that the first adhesive layer 5121A side faces the metal foil layer 5200, and compounding the foil layer through the first adhesive layer 5121A.
[0052] Wherein, A2 and A3 are not understood as fixed sequence steps, and step A3 can be performed first and then step A2 in this embodiment.
[0053] Specifically, the metal foil layer / foil material layer 5200 in the embodiment includes a copper foil layer. Further, the substrate layer 5110 can adopt PET, PP and PI film.
[0054] Obviously, the above embodiment of the utility model is only for clearly illustrating the technical scheme of the utility model, and is not a limitation on the specific embodiments of the utility model. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model claim should be included in the protection scope of the utility model claim.
Claims
1. A composite substrate, characterized in that, It includes a substrate layer, a first adhesive layer, a second adhesive layer, and a release film. The release film is a double-sided release film. The first adhesive layer is located between the release film and the substrate layer, and the second adhesive layer is located on the substrate layer on the side opposite to the first adhesive layer.
2. The composite substrate according to claim 1, characterized in that, The double-sided release film has a heavy release force surface and a light release force surface; the first adhesive layer is located between the heavy release force surface of the release film and the surface of the substrate layer near the release film.
3. The composite substrate according to claim 2, characterized in that, The difference between the release force on the heavy release force surface and the release force on the light release force surface is greater than or equal to 5gf / 25mm.
4. The composite substrate according to claim 3, characterized in that, The release force range of the heavy release surface is 15gf / 25mm to 30gf / 25mm; the release force range of the light release surface is 5gf / 25mm to 10gf / 25mm.
5. The composite substrate according to claim 1, characterized in that, The first adhesive layer is formed by coating the release film, and the second adhesive layer is formed by coating the substrate layer.
6. The composite substrate according to claim 1, characterized in that, A functional layer is also provided between the substrate layer and the first adhesive layer, between the substrate layer and the second adhesive layer, and / or between the first adhesive layer and the release film.
7. The composite substrate according to claim 1, characterized in that, It consists of a substrate layer, a first adhesive layer, a second adhesive layer and a release film, with the first adhesive layer and the second adhesive layer located on opposite sides of the substrate layer, and the release film covering the first adhesive layer.
8. The composite substrate according to any one of claims 1 to 7, characterized in that, The substrate layer is made of one of PET, PP, PI, PE, PVC, PBT, PC, PS, ABS, PA, PASF, PVDF, PEDOT, PANI and PPy films; and / or the thickness of the substrate layer is in the range of 1.9μm to 6μm; the thickness of the first adhesive layer and the second adhesive layer is in the range of 0.8μm to 4μm.
9. The composite substrate according to claim 8, characterized in that, The first adhesive layer and the second adhesive layer have the same thickness.
10. A composite foil material, characterized in that, It includes the composite substrate as described in any one of claims 1 to 9 and the foil layer attached to the second adhesive layer.
11. The composite foil according to claim 10, characterized in that, The composite foil includes single-sided composite foil and double-sided composite foil.