Magnetron sputtering device

Abstract

The utility model discloses a magnetron sputtering device which comprises a support, a vacuum cover is arranged on the upper portion of the support, and a through hole is formed in one side of the vacuum cover. The driving mechanism is arranged on the upper portion of the support, and the driving mechanism is located in the vacuum cover; the vacuumizing mechanism is arranged on one side of the vacuum cover, and the vacuumizing mechanism is communicated with the vacuum cover through the through hole; according to the magnetron sputtering mechanism, the driving part drives the driving gear to achieve different rotating speeds so as to drive the driven gear to achieve different rotating speeds, the driven gear drives the rotating disc to rotate at different rotating speeds, and workpieces located on the upper portion of the rotating disc achieve different sputtering film deposition rates.

Description

TECHNICAL FIELD

[0001] The utility model belongs to vacuum coating equipment technical field, especially, relate to a magnetron sputtering device. BACKGROUND

[0002] Magnetron sputtering is a kind of physical vapor deposition (PVD), and general sputtering method can be used to prepare metal, semiconductor, insulator and other multi-materials, has the advantages such as simple equipment, easy control, large plating area and strong adhesion, and the magnetron sputtering method developed in the 70s of last century realizes high speed, low temperature and low damage. The plane rectangular magnetron sputtering cathode and the plane circular magnetron sputtering cathode mainly applied in the prior art have the common feature that the magnetic field provided in the inside is fixed magnetic field, and the sputtering area under the action of magnetic field and electric field in the sputtering process is fixed as a circular track, and the consumption of target material is V-shaped or U-shaped downward consumption in the fixed circular area.

[0003] At present, when the target material is plated on the workpiece, the total thickness of the plating film is completed by controlling the plating time due to the consistent rotating speed of the workpiece, and there is a lack of a device capable of controlling the rotating speed of the workpiece to realize different single-layer plating film thickness.

[0004] Therefore, how to provide a magnetron sputtering device to control the workpiece at different rotating speeds to realize different single-layer plating film thickness is a technical problem urgently to be solved by the person skilled in the art. UTILITY MODEL CONTENTS

[0005] The utility model mainly solves the technical problem to provide a magnetron sputtering device, which realizes different rotating speeds by driving the driving gear through the driving member, drives the driven gear to different rotating speeds, drives the turntable to different rotating speeds by the driven gear, and realizes different sputtering film deposition rates of the workpiece located on the upper part of the turntable.

[0006] To solve the above technical problems, one technical scheme of the utility model is as follows: a magnetron sputtering device, the device comprises:

[0007] A support is provided with a vacuum cover on the upper part, and a through hole is arranged on one side of the vacuum cover;

[0008] A driving mechanism is arranged on the upper part of the support, and the driving mechanism is located in the vacuum cover;

[0009] A vacuumizing mechanism is arranged on one side of the vacuum cover, and the vacuumizing mechanism is communicated with the vacuum cover through the through hole;

[0010] The magnetron sputtering device comprises a power supply, a detection mechanism, a magnetron sputtering anode and a plurality of magnetron sputtering cathode assemblies, the detection mechanism is used for detecting whether the vacuum degree in the vacuum cover reaches a preset value, the power supply is connected with the plurality of magnetron sputtering cathode assemblies, the detection mechanism is arranged in the vacuum cover, the magnetron sputtering cathode assemblies are embedded in the inner wall of the vacuum cover, one end of the magnetron sputtering anode is arranged at the upper portion of the vacuum cover, and the other end of the magnetron sputtering anode is arranged in the interior of the vacuum cover.

[0011] Preferably, the driving mechanism comprises a driving member, a driving gear, a mounting seat, a plurality of driven gears and a plurality of rotating discs, the driving member is arranged at the lower portion of the support, the output end of the driving member drives the driving gear to rotate through a driving shaft, the mounting seat is arranged at the upper portion of the support, the plurality of driven gears are arrayed at the lower portion of the mounting seat through transmission shafts, the transmission shafts are connected with the mounting seat through first bearings, the lower ends of the transmission shafts are connected with the driven gears, the upper ends of the transmission shafts are connected with the rotating discs, and the driving gear is engaged with the plurality of driven gears.

[0012] Preferably, the driving gear is provided with a plurality of mounting holes, a plurality of second bearings are arranged in the mounting holes, and the second bearings are in contact with the lower portion of the mounting seat.

[0013] Preferably, the magnetron sputtering cathode assembly comprises a mounting plate, one side of the mounting plate is provided with a mounting groove, a water baffle is arranged in the mounting groove, the water baffle can divide the mounting groove into two water flow grooves, a magnet ring is further arranged in the mounting groove, and a target material is further arranged in the mounting groove and can seal the magnet ring in the target material.

[0014] Preferably, the two ends of the mounting groove are respectively provided with water inlet holes and water outlet holes, the other side of the mounting plate is respectively provided with a first connecting seat and a second connecting seat, the first connecting seat is used for mounting a water inlet pipe, and the second connecting seat is used for mounting a water outlet pipe.

[0015] Preferably, the target material is made of stainless steel.

[0016] The magnetron sputtering device has the following beneficial effects:

[0017] The magnetron sputtering device drives the driving gear to rotate at different speeds through the driving member, drives the driven gears to rotate at different speeds, drives the rotating discs to rotate at different speeds through the driven gears, and makes the workpieces arranged on the rotating discs have different sputtering film deposition rates.

[0018] In addition, the device can realize film plating of multiple workpieces at the same time through one driving gear driving multiple driven gears to rotate, improves the efficiency of the device, and saves costs.

[0019] Finally, the device has a simple structure and is easy to operate. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is the overall structure schematic diagram of the utility model;

[0021] Figure 2 is the drive mechanism schematic diagram of the utility model;

[0022] Figure 3 is the magnetron sputtering cathode assembly schematic diagram of the utility model;

[0023] Figure 4 is the cross section direction schematic diagram of the magnetron sputtering cathode assembly of the utility model;

[0024] Figure 5 is Figure 4 the cross section schematic diagram.

[0025] The marks of each part in the drawings are as follows:

[0026] 1, support;

[0027] 2, vacuum cover;21, through hole;

[0028] 3, drive mechanism;31, drive piece;32, drive gear;321, mounting hole;322, second bearing;33, mounting seat;34, driven gear;35, rotary table;36, drive shaft;37, transmission shaft;

[0029] 4, vacuumizing mechanism;

[0030] 5, magnetron sputtering mechanism;51, magnetron sputtering anode piece;52, magnetron sputtering cathode assembly;521, mounting plate;522, mounting groove;523, water baffle;524, magnet ring;525, target material;526, water inlet hole;527, water outlet hole;528, first connecting seat;529, second connecting seat. DETAILED DESCRIPTION

[0031] The preferred embodiments of the utility model are described in detail below with reference to the drawings, so that the advantages and features of the utility model can be more easily understood by the person skilled in the art, and the protection scope of the utility model can be more clearly and explicitly defined.

[0032] Embodiment: refer to Figures 1-5 The magnetron sputtering device comprises:

[0033] The support 1 is provided with the vacuum cover 2 at the upper portion, and the vacuum cover 2 is provided with the through hole 21 at one side;

[0034] The drive mechanism 3 is arranged at the upper portion of the support 1, and the drive mechanism 3 is located in the vacuum cover 2;

[0035] A vacuumizing mechanism 4 is arranged at one side of the vacuum cover 2, and the vacuumizing mechanism 4 communicates with the vacuum cover 2 through the through hole 21;

[0036] A magnetron sputtering mechanism 5 comprises a power supply, a detection mechanism, a magnetron sputtering anode 51 and a plurality of magnetron sputtering cathode assemblies 52, the power supply is connected with the plurality of magnetron sputtering cathode assemblies 52, the detection mechanism is arranged in the vacuum cover 2, the magnetron sputtering cathode assembly 52 is embedded in the inner wall of the vacuum cover 2, one end of the magnetron sputtering anode 51 is arranged at the upper portion of the vacuum cover 2, and the other end of the magnetron sputtering anode 51 is arranged in the interior of the vacuum cover 2.

[0037] As shown in Figure 2 , the driving mechanism 3 comprises a driving piece 31, a driving gear 32, a mounting seat 33, a plurality of driven gears 34 and a plurality of rotating discs 35, the driving piece 31 is arranged at the lower portion of the support 1, the output end of the driving piece 31 drives the driving gear 32 to rotate through a driving shaft 36, the mounting seat 33 is arranged at the upper portion of the support 1, the plurality of driven gears 34 are arrayed and distributed at the lower portion of the mounting seat 33 through transmission shafts 37, the transmission shaft 37 is connected with the mounting seat 33 through a first bearing, the lower end of the transmission shaft 37 is connected with the driven gear 34, the upper end of the transmission shaft 37 is connected with the rotating disc 35, and the driving gear 32 is engaged with the plurality of driven gears 34.

[0038] The driving gear 32 is provided with a plurality of mounting holes 321, a plurality of second bearings 322 are arranged in the mounting holes 321, the second bearings 322 are in contact with the lower portion of the mounting seat 33, rolling friction is realized, and the friction between them is reduced.

[0039] The driving piece 31 is a servo motor, and the controller can control the servo motor to realize different rotating speeds. The magnetron sputtering device drives the driving gear 32 to realize different rotating speeds through the driving piece 31, drives the driven gear 34 to realize different rotating speeds, drives the rotating disc 35 to realize different rotating speeds, and the workpiece located at the upper portion of the rotating disc 35 realizes different sputtering film deposition rates.

[0040] It needs to be further explained that, as shown in Figure 3 , the magnetron sputtering cathode assembly 52 comprises a mounting plate 521, one side of the mounting plate 521 is provided with a mounting groove 522, the mounting groove 522 is provided with a water baffle 523, the water baffle 523 can separate the mounting groove 522 into two water flow grooves, the mounting groove 522 is further provided with a magnet ring 524, the mounting groove 522 is further provided with a target material 525, and the target material 525 can seal the magnet ring 524 in the interior thereof.

[0041] After the vacuum cover 2 is vacuumized by the vacuumizing mechanism 4, the mounting plate 521 is electrified, one side of the mounting plate 521 provided with the magnet ring 524 forms a plasma area, plasma is formed in the plasma area, the plasma collides with the target material 525, atoms in the target material 525 are gradually sputtered, and the sputtered atoms are arranged on the surface of the workpiece.

[0042] Wherein, the two ends of the mounting groove 522 are respectively provided with water inlet holes 526 and water outlet holes 527, the other side of the mounting plate 521 is respectively provided with a first connecting seat 528 and a second connecting seat 529, the first connecting seat 528 is used for mounting a water inlet pipe, and the second connecting seat 529 is used for mounting a water outlet pipe. Water is injected into the mounting groove 522 through the water inlet holes 526, the water flows through two water flow grooves and then flows out of the water outlet holes 527, so that a circulating water path is formed, and the mounting plate 521 can be fully cooled.

[0043] It should be particularly pointed out that the target material 525 is made of stainless steel.

[0044] In the description of the utility model, it should be pointed out that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the embodiment and the drawing, or the orientation or positional relationship commonly used when the utility model product is used, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0045] The above is only an embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structural transformation or direct or indirect application in other related technical fields based on the contents of the utility model specification and drawings is also included in the patent protection range of the utility model.

Claims

1. A magnetron sputtering device, characterized by, The device comprises: a bracket, an upper portion of the bracket is provided with a vacuum cover, one side of the vacuum cover is provided with a through hole; a driving mechanism, the driving mechanism is arranged on the upper portion of the bracket and is located in the vacuum cover; a vacuumizing mechanism, the vacuumizing mechanism is arranged on one side of the vacuum cover and communicates with the vacuum cover through the through hole; a magnetron sputtering mechanism, the magnetron sputtering mechanism comprises a power supply, a detection mechanism, a magnetron sputtering anode and a plurality of groups of magnetron sputtering cathode assemblies, the power supply is connected with the plurality of groups of magnetron sputtering cathode assemblies, the detection mechanism is arranged in the vacuum cover, the magnetron sputtering cathode assemblies are embedded in the inner wall of the vacuum cover, one end of the magnetron sputtering anode is arranged on the upper portion of the vacuum cover, and the other end of the magnetron sputtering anode is arranged in the vacuum cover.

2. A magnetron sputtering device according to claim 1, wherein: The driving mechanism comprises a driving piece, a driving gear, a mounting seat, a plurality of driven gears and a plurality of rotating discs, the driving piece is arranged on the lower portion of the bracket, the output end of the driving piece drives the driving gear to rotate through a driving shaft, the mounting seat is arranged on the upper portion of the bracket, the plurality of driven gears are arrayed on the lower portion of the mounting seat through transmission shafts, the transmission shafts are connected with the mounting seat through first bearings, the lower ends of the transmission shafts are connected with the driven gears, the upper ends of the transmission shafts are connected with the rotating discs, and the driving gear is engaged with the plurality of driven gears.

3. A magnetron sputtering device as claimed in claim 2, characterized in that: The driving gear is provided with a plurality of mounting holes, a plurality of second bearings are arranged in the mounting holes, and the second bearings are in contact with the lower portion of the mounting seat.

4. A magnetron sputtering device as claimed in claim 3, characterized in that: The magnetron sputtering cathode assembly comprises a mounting plate, one side of the mounting plate is provided with a mounting groove, a water baffle is arranged in the mounting groove, the water baffle can divide the mounting groove into two water flow grooves, a magnet ring is further arranged in the mounting groove, and a target material is further arranged in the mounting groove and can seal the magnet ring in the target material.

5. A magnetron sputtering device as claimed in claim 4, characterized in that: The two ends of the mounting groove are respectively provided with water inlet holes and water outlet holes, the other side of the mounting plate is respectively provided with a first connecting seat and a second connecting seat, the first connecting seat is used for mounting a water inlet pipe, and the second connecting seat is used for mounting a water outlet pipe.

6. A magnetron sputtering device as claimed in claim 5, characterized in that: The material of the target material is stainless steel.

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