Refrigeration device

Abstract

The refrigeration device disclosed by the embodiment of the utility model comprises a shell assembly which is provided with an air inlet, a heat dissipation air outlet and a heat dissipation air channel communicated with the air inlet and the heat dissipation air outlet; the semiconductor refrigeration part is contained in the shell assembly and is provided with a cold end and a hot end, and the cold end is used for providing cooling capacity; the heat dissipation fan is accommodated in the shell assembly; the cooling part is contained in the shell assembly, the cooling part and the heat dissipation fan are arranged in the heat dissipation air channel, the cooling part is located between the air outlet side of the heat dissipation fan and the heat dissipation air outlet, the heat dissipation fan is used for generating airflow to dissipate heat of the hot end of the semiconductor refrigeration part, and the airflow is exhausted through the heat dissipation air outlet after passing through the cooling part. According to the refrigeration device provided by the embodiment of the invention, the cooling part is arranged and can absorb water to wet the cooling part, so that the cooling part can cool hot air blown out by the heat dissipation fan, air exhausted from the heat dissipation air outlet is normal-temperature or lower-normal-temperature air, and the effect that the refrigeration device cannot blow out hot air is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor temperature adjustment, especially relates to a refrigeration device. BACKGROUND

[0002] With the development of science and technology, thermoelectric coolers (TEC) are increasingly applied to the field of temperature adjustment technology. For example, a thermoelectric cooler can be provided in a portable fan to achieve the effect of cooling the airflow to blow out cold air. The thermoelectric cooler usually has a cold end at one end and a hot end at the opposite end, with a thermocouple pair disposed in between. When the thermoelectric cooler is working, a large amount of heat is generated at the hot end based on the Peltier principle. If the heat dissipation effect is poor, the portable fan may be damaged due to excessive temperature. Some means need to be used to effectively cool the hot end of the thermoelectric cooler.

[0003] In the prior art, a heat dissipation fan is usually provided in the portable fan. The airflow generated by the heat dissipation fan cools the hot end of the thermoelectric cooler and is discharged to the outside of the shell through the heat dissipation air outlet on the portable fan shell. However, this results in the situation that the cold air outlet of the portable fan blows out cold air, while the heat dissipation air outlet blows out hot air, which seriously affects the user's cooling demand and makes the user's use experience poor. SUMMARY

[0004] To solve the problem of poor user cooling experience caused by one end blowing cold air and the other end blowing hot air in the existing portable fan, the embodiments of the utility model disclose a refrigeration device.

[0005] Specifically, the refrigeration device provided by the embodiments of the utility model, for example, comprises: a shell assembly having an air inlet, a heat dissipation air outlet, and a heat dissipation air duct communicating the air inlet and the heat dissipation air outlet; a thermoelectric cooler housed in the shell assembly and having a cold end and a hot end, the cold end being used to provide cold quantity; a heat dissipation fan housed in the shell assembly; and a cooling member housed in the shell assembly, the cooling member and the heat dissipation fan being disposed in the heat dissipation air duct, the cooling member being located between the air outlet side of the heat dissipation fan and the heat dissipation air outlet, the heat dissipation fan being used to generate airflow to dissipate heat from the hot end of the thermoelectric cooler, and the airflow passing through the cooling member and being discharged through the heat dissipation air outlet.

[0006] The refrigeration device provided by the embodiment can achieve the effect that the refrigeration device does not blow out hot air, and improves the cooling experience of a user.

[0007] In an embodiment of the utility model, still include: be connected to the casing assembly, the first liquid storage piece has first liquid storage part, the first liquid storage part is used for storing liquid, the cooling piece has liquid absorption, the cooling piece part sets up in the first liquid storage part, another part is close to the heat dissipation air outlet.

[0008] In an embodiment of the utility model, the first liquid storage piece further includes a wind guide groove spaced from the first liquid storage part, the wind guide groove is located at one end of the first liquid storage piece close to the heat dissipation fan and at the air outlet side of the heat dissipation fan, and the cooling piece is located between the wind guide groove and the heat dissipation air outlet.

[0009] In an embodiment of the utility model, the wind guide groove includes a wind guide outlet located at one end of the wind guide groove close to the heat dissipation air outlet, and the cooling piece is arranged at the wind guide outlet of the wind guide groove and covers the wind guide outlet.

[0010] In an embodiment of the utility model, the cooling piece has a plurality of cooling air ducts inside, and the heat dissipation fan is used to generate airflow to pass through the wind guide groove to the cooling piece and then pass through the cooling air ducts to the heat dissipation air outlet for exhaust.

[0011] In an embodiment of the utility model, further include: second liquid storage piece, be connected to the casing assembly, the second liquid storage piece has second liquid storage part;Connecting pipe, one end with the first liquid storage piece first liquid storage part intercommunication, and the other end with the second liquid storage piece second liquid storage part intercommunication.

[0012] In an embodiment of the utility model, further include: heat dissipation assembly, the heat dissipation assembly is accommodated in the casing assembly;Wherein, the heat dissipation assembly includes: heat exchange piece, heat conduction is connected to the hot end of the semiconductor refrigeration piece;Liquid pipeline, the second liquid storage part of the second liquid storage piece and the heat exchange piece are communicated;Heat dissipation piece, set up in the heat dissipation air duct and located at the air outlet side of the heat dissipation fan, the heat dissipation piece and the liquid pipeline are communicated;Power piece, the liquid pipeline is communicated to drive liquid flow.

[0013] In an embodiment of the utility model, the shell assembly includes four connecting edges and oppositely arranged first and second ends, the first liquid storage part and the second liquid storage part are arranged at the first end and the second end respectively, and the second liquid storage part is higher than the first liquid storage part in the first direction.

[0014] In an embodiment of the utility model, an overflow valve is arranged in the first liquid storage part, and the overflow valve is selectively arranged in the first liquid storage part or at the communication position of the first liquid storage part and the connecting pipe to open or close the connecting pipe.

[0015] In an embodiment of the utility model, the bottom of the heat dissipation air outlet is higher than the top of the first liquid storage part of the first liquid storage part in the first direction.

[0016] In an embodiment of the utility model, the shell assembly further has a refrigeration air outlet and a refrigeration air duct communicating the air inlet and the refrigeration air outlet; the refrigeration device further includes a cold guide and a refrigeration fan, the cold guide is accommodated in the shell assembly and thermally conducts the cold end of the semiconductor refrigeration part, and the refrigeration fan is accommodated in the shell assembly, the refrigeration fan and the cold guide are located in the refrigeration air duct; wherein the refrigeration fan is used to generate air flow to be blown out by the refrigeration air outlet after passing through the cold guide.

[0017] In an embodiment of the utility model, the shell assembly further includes a wind guide support accommodated in the shell assembly, the wind guide support includes an accommodation part and a wind guide channel, the refrigeration fan is arranged in the accommodation part, the refrigeration fan has an air outlet side, and the cold guide is arranged in the wind guide channel and located at the air outlet side of the refrigeration fan.

[0018] As can be seen from the above, the technical features of the utility model can have one or more of the following beneficial effects: the refrigeration device provided in the embodiment can dissipate heat from the hot end of the semiconductor refrigeration part by arranging a heat dissipation fan in the shell assembly, and can cool the hot air blown out by the heat dissipation fan by arranging a cooling part at the air outlet side of the heat dissipation fan, so that the air finally discharged from the heat dissipation air outlet is at room temperature or lower than room temperature, thereby realizing the effect that the refrigeration device does not blow out hot air and improving the cooling experience of the user. BRIEF DESCRIPTION OF DRAWINGS

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is an exploded view of the refrigeration device provided in an embodiment of the present invention.

[0021] Figure 2a , 2b Figures 2 and 2c are schematic diagrams showing the flow direction of airflow within the heat dissipation duct of the refrigeration unit.

[0022] Figure 3 for Figure 1 A cross-sectional structural diagram of the refrigeration unit.

[0023] Figure 4a and 4b for Figure 1 A schematic diagram showing the relative positions of the middle housing assembly and the first and second liquid reservoirs.

[0024] Figure 5a , 5b Figures 5c and 5c are schematic diagrams showing the flow direction of airflow within the refrigeration duct of the refrigeration device.

[0025] Figure 6 for Figure 1 A schematic diagram showing the relative positions of the middle shell assembly, air guide bracket, semiconductor refrigeration component, cold conduction component, heat exchange component, and refrigeration fan.

[0026] Explanation of reference numerals in the attached figures:

[0027] 10-Refrigeration unit;

[0028] 100-Shell assembly; 101-Cooling air outlet; 102-Heat dissipation air outlet; 103-Air inlet; 104-Side enclosure; 105-First end; 106-Second end; 200-Cooling fan; 310-Semiconductor cooling component; 320-Cooling conductive component; 400-Heat dissipation fan; 500-Cooling component; 600-First liquid storage component; 610-First liquid storage section; 611-Overflow valve; 620-Air guide slot; 621-Air guide outlet; 710-Second liquid storage component; 711-Second liquid storage section; 720-Connecting pipe; 800-Heat dissipation assembly; 810-Heat exchange component; 820-Liquid pipeline; 830-Heat dissipation component; 840-Power component; 900-Air guide bracket; 910-Containment section; 920-Air guide channel. Detailed Implementation

[0029] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme of the present application will be described clearly and completely in combination with specific embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0030] It should be noted that the directional terms mentioned in the embodiments of the present application, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side" and the like, are only the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present application, not to limit the present application. In order to understand and facilitate description, the size and thickness of each component shown in the drawings are arbitrarily shown, but the present application is not limited thereto.

[0031] It can be understood that when a component such as a layer, a film, a region or a substrate is referred to as "on" another component, the component can be directly on the other component, or there can be an intermediate component. In addition, in the specification, unless explicitly described as the opposite, the word "comprising" will be understood to mean including the components, but not excluding any other components. In addition, in the specification, "on" means above or below the target component, not necessarily on the top based on gravity.

[0032] In the present application, "heat conduction connection" means that two objects can be in direct contact to form heat transfer, or in indirect contact to form heat transfer, for example, indirect contact through a heat-conducting silicone grease / silicone gel, or a graphite intermediate heat-conducting medium to form heat transfer.

[0033] Some embodiments of the present application will be described in detail below in combination with the drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0034] As shown in Figure 1 The present application provides a refrigeration device 10. The refrigeration device 10 provided by the embodiments of the present application is, for example, a convenient fan (such as a neck fan, a waist fan or a handheld fan, etc.), which can, for example, blow cold wind to the user to cool the user.

[0035] Specifically, as shown in Figure 1As shown, the refrigeration device 10 for example comprises a housing assembly 100, a semiconductor refrigeration piece 310, a heat dissipation fan 400 and a cooling piece 500. Specifically, the housing assembly 100 has an air inlet 103 and a heat dissipation air outlet 102, and the housing assembly 100 further has a heat dissipation air duct communicating the air inlet 103 and the heat dissipation air outlet 102. The semiconductor refrigeration piece 310 for example is accommodated in the housing assembly 100 and has a cold end and a hot end, and the cold end is used to provide cold energy. The heat dissipation fan 400 for example is accommodated in the housing assembly 100, and the heat dissipation fan 400 comprises an air inlet side and an air outlet side, and the semiconductor refrigeration piece 310 is for example located at the air inlet side of the heat dissipation fan. The cooling piece 500 for example is accommodated in the housing assembly 100, and the cooling piece 500 is arranged in the heat dissipation air duct together with the heat dissipation fan 400, and the cooling piece 500 is located between the air outlet side of the heat dissipation fan 400 and the heat dissipation air outlet 102. The heat dissipation fan 400 is used to dissipate heat from the hot end of the semiconductor refrigeration piece 310, and the heat dissipation fan 400 is used to generate air flow to pass through the cooling piece 500 and then be discharged through the heat dissipation air outlet 102.

[0036] It should be noted that the semiconductor refrigeration piece 310 mentioned above can for example be based on the Peltier principle to achieve cold end refrigeration and hot end heat dissipation, and its working principle and specific structure can refer to the related technical solutions in the prior art, which will not be described here.

[0037] For example, referring to Figs. Figure 2a , 2b and 2c, the red dashed arrows in the figures for example show that air enters the heat dissipation air duct through the air inlet 103 and flows to the air inlet side of the heat dissipation fan 400, and the air flow generated by the operation of the heat dissipation fan 400 flows to the heat dissipation air outlet 102 through the air outlet side and is discharged. Further, the heat dissipation fan 400 is used to dissipate heat from the hot end of the semiconductor refrigeration piece 310, so the air flow generated by the operation of the heat dissipation fan 400 is for example hot air. In the embodiments of the present application, the cooling piece 500 is for example arranged in the heat dissipation air duct and between the air outlet side of the heat dissipation fan 400 and the heat dissipation air outlet 102. The cooling piece 500 for example is a wet curtain, water-absorbing foam, water-absorbing non-woven fabric, activated carbon fiber, etc., and in the present solution, a wet curtain is preferred, which for example has a honeycomb structure and has the advantages of high water absorption, high water resistance, mold resistance, etc. For example, a water tank can be arranged in the housing assembly 100 or a water source can be connected externally to supply water to the cooling piece 500 so that the cooling piece 500 remains wet. By arranging the cooling piece 500, the hot air flow generated by the heat dissipation fan 400 can be cooled by the cooling piece 500 and then discharged through the heat dissipation air outlet 102, so that the air flow discharged through the heat dissipation air outlet 102 is normal temperature air or air below normal temperature, achieving the effect that the refrigeration device 10 does not blow hot air, thereby improving the cooling experience of the user.

[0038] To sum up, the refrigeration device provided in the embodiment can dissipate heat from the hot end of the semiconductor refrigeration element through the heat dissipation fan arranged in the shell assembly, and the cooling element arranged at the air outlet side of the heat dissipation fan can absorb water to be wet, so that the hot air blown by the heat dissipation fan can be cooled by the cooling element after passing through the cooling element, and the air finally discharged from the heat dissipation air outlet is normal temperature or lower than normal temperature, thereby realizing the effect that the refrigeration device cannot blow hot air and improving the cooling experience of the user.

[0039] Further, referring to Figure 1 and 3 , the refrigeration device 10 further comprises, for example, a first liquid storage element 600, which is connected to the shell assembly 100, for example. The first liquid storage element 600 has, for example, a first liquid storage portion 610, and the cooling element 500 is arranged in the first liquid storage portion 610 and located at one end of the first liquid storage portion 610 close to the heat dissipation air outlet 102. For example, the first liquid storage portion 610 is used to store liquid, for example, the first liquid storage portion 610 contains, for example, heat dissipation liquid, for example, liquid with high specific heat capacity, such as water, and the following is exemplified with water as the heat dissipation liquid. The cooling element 500 extends into the first liquid storage portion 610 at one end, and the water in the first liquid storage portion 610 is used to ensure the wetness of the cooling element 500. By arranging the first liquid storage portion 610, water can be more conveniently supplied to the cooling element 500 to ensure its wetness.

[0040] Further, referring to Figure 1 and Figure 3 , the first liquid storage element 600 further comprises, for example, an air guide groove 620 spaced from the first liquid storage portion 610, which is located at one end of the first liquid storage element 600 close to the heat dissipation fan 400 and at the air outlet side of the heat dissipation fan 400, and the cooling element 500 is located between the air guide groove 620 and the heat dissipation air outlet 102. As shown in Figure 2b and 2c , the external air enters the heat dissipation air duct through the air inlet 103 and flows to the air inlet side of the heat dissipation fan 400, and then flows out from the air outlet side of the heat dissipation fan 400, passes through the air guide groove 620 so that the airflow can flow through the cooling element 500 and be discharged out of the shell assembly 100 through the heat dissipation air outlet 102. That is, the air guide groove 620 can be understood as a component part of the heat dissipation air duct. By arranging the air guide groove 620, the airflow flowing out from the air outlet side of the heat dissipation fan 400 can be guided to flow through the cooling element 500 and then be discharged through the heat dissipation air outlet 102.

[0041] Further, referring to Figure 2cThe air guide groove 620 has an air guide outlet 621, for example, at one end of the air guide groove 620 close to the heat dissipation air outlet 102. The cooling member 500 is arranged at the air guide outlet 621 of the air guide groove 620 and covers the air guide outlet 621. In this way, all the air flow through the air guide groove 620 first passes through the cooling member 500 to be cooled before flowing to the heat dissipation air outlet 102. For example, the cooling member 500 has a plurality of cooling air passages inside. The air flow generated by the heat dissipation fan 400 passes through the air guide groove 620 to the cooling member 500 and then through the cooling air passages to the heat dissipation air outlet 102.

[0042] As described above, referring to Figure 3 The refrigeration device 10 further includes a second liquid storage member 710 and a connecting pipe 720. The second liquid storage member 710 is connected to the housing assembly 100 and has a second liquid storage portion 711 for containing a heat dissipation liquid. The heat dissipation liquid is the same as the heat dissipation liquid described above (the heat dissipation liquid is exemplified by water hereinafter). One end of the connecting pipe 720 is in communication with the first liquid storage portion 610 of the first liquid storage member 600, and the other end is in communication with the second liquid storage portion 711 of the second liquid storage member 710. For example, the second liquid storage member 710 is a water tank, and the connecting pipe 720 is a connecting conduit. The second liquid storage member 710 and the connecting pipe 720 supply water to the first liquid storage portion 610 of the first liquid storage member 600. The second liquid storage portion 711 of the second liquid storage member 710 is filled with water to ensure that the first liquid storage portion 610 has sufficient water, which is convenient for operation.

[0043] In one specific embodiment, referring to Figure 1 and Figure 3The refrigeration device 10 further comprises a heat dissipation assembly 800 which is accommodated in the housing assembly 100. Specifically, the heat dissipation assembly 800 comprises a heat exchange member 810, a liquid pipeline 820 and a heat dissipation member 830, wherein the heat exchange member 810 is in thermal conduction connection with the hot end of the semiconductor refrigeration member 310, the liquid pipeline 820 is in communication with the heat exchange member 810 and the second liquid storage part 711 of the second liquid storage member 710, the heat dissipation member 830 is arranged in the heat dissipation air duct and is located at the air outlet side of the heat dissipation fan 400, the heat dissipation member 830 is in communication with the liquid pipeline 820, and a power member 840 is in communication with the liquid pipeline 820. For example, the liquid pipeline 820 has circulating heat dissipation liquid (e.g. water) therein, the heat exchange member 810 is a hollow structure of metal, for example, a water cooling head, and the inside of the heat exchange member 810 is in communication with the liquid pipeline 820, so that the heat dissipation liquid (e.g. water) in the liquid pipeline 820 can flow into the heat exchange member 810. The heat exchange member 810 is attached to the hot end, for example, to cool the hot end by the heat dissipation liquid (e.g. water). The high specific heat capacity of the heat dissipation liquid can absorb the heat in the hot end, thereby dissipating heat from the hot end. The heat dissipation member 830 is a hollow structure of metal, for example, a water cooling row, which is provided with a large number of metal fins, and the heat dissipation liquid passes through the metal fins to increase the heat dissipation area. The inside of the heat dissipation member 830 is in communication with the liquid pipeline 820, so that the heat dissipation liquid in the liquid pipeline 820 can flow into the heat exchange member 810. The power member 840 is used to provide power for the heat dissipation liquid, so that the heat dissipation liquid can circulate in the liquid pipeline 820 and flow through the heat exchange member 810, the heat dissipation member 830 and the power member 840. The power member 840 is a water pump or other power device capable of providing circulation of the heat dissipation liquid, and the present application does not make specific limitation thereto.

[0044] Specifically, referring to Figure 3The heat dissipation fan 400 is, for example, an axial fan, and the heat dissipation member 830 is located at the air outlet side of the heat dissipation fan 400. Thus, the external airflow enters the heat dissipation air duct through the air inlet 103, flows to the air inlet side of the heat dissipation fan 400, and then flows out of the air outlet side of the heat dissipation fan 400, passes through the heat dissipation member 830, and carries away the heat of the heat dissipation member 830 to cool the heat dissipation member 830. Then, the airflow flows through the air guide groove 620, is cooled by the cooling member 500, and is discharged from the heat dissipation air outlet 102. By arranging the heat dissipation assembly 800, the heat of the hot end of the semiconductor refrigeration sheet 310 can be dissipated by the heat dissipation liquid (for example, water). The high specific heat capacity of the heat dissipation liquid (for example, water) can effectively conduct the heat away from the hot end, thereby improving the heat dissipation efficiency. Moreover, by reasonably arranging the heat dissipation fan 400 and the heat dissipation member 830, the heat of the heat dissipation liquid in the heat dissipation member 830 can be blown out by the heat dissipation fan 400, so that the heat dissipation liquid can be cooled after flowing through the heat dissipation member 830. Thus, the heat dissipation liquid in the liquid pipeline 820 can be at a lower temperature, so that it can dissipate heat from the hot end.

[0045] As described above, the number of semiconductor refrigeration members 310 is two, and the hot ends of the two semiconductor refrigeration members 310 are oppositely arranged. The two sides of the heat exchange member 810 are respectively in thermal conduction connection with the hot ends of the two semiconductor refrigeration members 310. By arranging two semiconductor refrigeration members 310, the refrigeration efficiency of the refrigeration device 10 can be improved.

[0046] In addition, referring to Figure 4a and 4b The housing assembly 100, for example, includes four surrounding edges 104 connected with each other and oppositely arranged first and second ends 105 and 106. The first and second liquid storage members 600 and 710 are arranged at the first and second ends 105 and 106, respectively. The refrigeration air outlet 101 and the heat dissipation air outlet 102 are arranged on two opposite surrounding edges 104, respectively. The second liquid storage part 711 of the second liquid storage member 710 is higher than the first liquid storage part 610 of the first liquid storage member 600 in the first direction. Here, the first direction is, for example, the x direction in Figure 3 By arranging the second liquid storage part 711 to be higher than the first liquid storage part 610, the water in the second liquid storage part 711 can flow into the first liquid storage part 610 based on its own gravity through the connecting pipe 720. Thus, it is not necessary to arrange a power device to drive the water. This not only avoids interference with the power end 840 of the heat dissipation assembly 800, but also facilitates internal arrangement.

[0047] It should be noted that, referring to Figure 3The first liquid storage part 610 of the first liquid storage member 600 is provided with an overflow valve 611. The overflow valve 611 is selectively located in the first liquid storage part 610 of the first liquid storage member 600 and is arranged corresponding to the connecting pipe 720, or the overflow valve 611 is selectively located at the communication position between the first liquid storage part 610 of the first liquid storage member 600 and the connecting pipe 720 and partially located in the connecting pipe 720. The overflow valve 611 mentioned herein is for example a float which can move in the first liquid storage part 610 corresponding to the connecting pipe 720. For example, when the water in the first liquid storage part 610 reaches a threshold value, the overflow valve 611 will float at the communication position between the first liquid storage part 610 of the first liquid storage member 600 and the connecting pipe 720 and partially located in the connecting pipe 720, so that the second liquid storage part 711 cannot supply water to the first liquid storage part 610, thereby avoiding the water level in the first liquid storage part 610 from overflowing from the cooling member 500.

[0048] Preferably, referring to Figure 3 , the bottom of the heat dissipation air outlet 102 is higher than the top of the first liquid storage part 610 of the first liquid storage member 600 in the first direction (x direction). Figure 3 For example, referring to Figure 3 , the height of the bottom of the heat dissipation air outlet 102 in the first direction x is h1, and the height of the top of the first liquid storage part 610 of the first liquid storage member 600 in the first direction x is h2, h1 is greater than h2. In this way, even if the amount of water in the first liquid storage part 610 is relatively large, the water in the first liquid storage part 610 will not overflow from the heat dissipation air outlet 102.

[0049] In addition, in one specific embodiment, referring to Figure 1 and Figure 5ac, the shell assembly 100 further has a refrigeration air outlet 101 and a refrigeration air duct connecting the air inlet 103 and the refrigeration air outlet 101. The refrigeration device 10 further comprises a cold guide 320 and a refrigeration fan 200, the cold guide 320 is accommodated in the shell assembly 100 and is in thermal conduction connection with the cold end of the semiconductor refrigeration element 310, the refrigeration fan 200 is also accommodated in the shell assembly 100, and the refrigeration fan 200 and the cold guide 320 are both located in the refrigeration air duct. The refrigeration fan 200 is used to generate air flow, which is blown out of the refrigeration air outlet 101 after passing through the cold guide 320. For example, the cold guide 320 is a metal cold guide, for example, a cold aluminum sheet, and the cold guide 320 can also be, for example, a cold silica gel, which is not limited in the present application. The cold guide 320 is a fin-type cold guide, which has a plurality of fins to absorb the cold energy generated by the cold end of the semiconductor refrigeration element 310 during operation, so that the air flow blown out of the refrigeration air outlet 102 can be heat-exchanged with the air flow while the cold guide 320 guides the air flow blown out of the air outlet side of the refrigeration fan 200 to the refrigeration air outlet 102, so that the air finally blown out of the refrigeration air outlet 102 is cold air, thereby achieving the refrigeration and cooling of the user. By providing the cold guide 320, the contact area for heat exchange between the cold end of the semiconductor refrigeration element 310 and the air flow can be increased, thereby improving the heat exchange efficiency and the refrigeration effect of the refrigeration device 10.

[0050] For example, referring to Figure 5a 、 5b and 5c, the green dashed arrows in the figure represent, for example, the air entering the refrigeration air duct from the air inlet 103 and flowing to the air inlet side of the refrigeration fan 200, and then flowing from the air outlet side of the refrigeration fan 200 to the refrigeration air outlet 101 and being blown out. Further, the semiconductor refrigeration element 310 is located, for example, on the air outlet side of the refrigeration fan 200, and the cold end of the semiconductor refrigeration sheet 310 can be refrigerated, so that when the air flow blown out of the air outlet side of the refrigeration fan 200 passes through the cold end of the semiconductor refrigeration sheet 310, the air flow can be heat-exchanged with the air flow, so that the air flow finally blown out of the refrigeration air outlet 101 is cold air, thereby achieving the refrigeration and cooling of the user.

[0051] In one specific embodiment, referring to Figure 1 and Figure 6 , the refrigeration device 10 further comprises an air guide bracket 900, which is accommodated in the shell assembly 100, the air guide bracket 900 comprises a containing portion 910 and an air guide channel 920, the refrigeration fan 200 is arranged in the containing portion 910, and the refrigeration fan 200 has an air outlet side, the cold guide 320 is arranged in the air guide channel 920 and located on the air outlet side of the refrigeration fan 200.

[0052] For example, referring to Figure 5b and5c The external air enters the refrigeration air duct through the air inlet 103 and flows to the air inlet side of the refrigeration fan 200, and is discharged from the air outlet side of the refrigeration fan 200 and then guided by the air guiding channel 920 to flow to the refrigeration air outlet 101 after heat exchange by the heat conducting member 320 and then discharged. That is, the air guiding channel 920 can be understood as a component of the refrigeration air duct. By arranging the air guiding bracket 900 to guide the air flow discharged from the air outlet side of the refrigeration fan 200, the air flow can flow to the refrigeration air outlet 101 after heat exchange by the heat conducting member 320 and then discharged. For example, the refrigeration fan 200 is a cross-flow fan.

[0053] In summary, the refrigeration device provided by the embodiment can dissipate heat from the hot end of the semiconductor refrigeration member by arranging the heat dissipation fan in the shell assembly, and can cool the hot air blown by the heat dissipation fan by arranging the cooling member on the air outlet side of the heat dissipation fan. The cooling member can absorb water to be wet, so that the hot air blown by the heat dissipation fan can be cooled by the cooling member after passing through the cooling member, and the air finally discharged from the heat dissipation air outlet is normal temperature or lower than normal temperature, which realizes the effect that the refrigeration device does not blow hot air and improves the cooling experience of the user.

[0054] It can be understood that the foregoing various embodiments are only exemplary descriptions of the present application, and under the premise that the technical features do not conflict, the structures are not contradictory, and the purpose of the application is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used.

[0055] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A refrigeration apparatus, characterized by comprising: The application relates to a semiconductor refrigeration device. The application comprises: a shell assembly having an air inlet, a heat dissipation air outlet, and a heat dissipation air duct connecting the air inlet and the heat dissipation air outlet; a semiconductor refrigeration component accommodated in the shell assembly and having a cold end and a hot end, the cold end being used for providing cold energy; a heat dissipation fan accommodated in the shell assembly; 2. A refrigeration device as claimed in claim 1, characterized in that a cooling component accommodated in the shell assembly, the cooling component being arranged in the heat dissipation air duct together with the heat dissipation fan, the cooling component being located between the air outlet side of the heat dissipation fan and the heat dissipation air outlet, the heat dissipation fan being used for generating air flow to dissipate heat of the hot end of the semiconductor refrigeration component, and the air flow passing through the cooling component and being discharged through the heat dissipation air outlet. The application further comprises:

3. A refrigeration device as claimed in claim 2, characterized in that a first liquid storage component connected to the shell assembly, the first liquid storage component having a first liquid storage part used for storing liquid, the cooling component having liquid absorption, and a part of the cooling component being arranged in the first liquid storage part and another part being close to the heat dissipation air outlet.

4. The refrigeration appliance of claim 3, wherein, The first liquid storage component further comprises an air guide groove spaced from the first liquid storage part, the air guide groove being located at one end of the first liquid storage component close to the heat dissipation fan and at the air outlet side of the heat dissipation fan, and the cooling component being located between the air guide groove and the heat dissipation air outlet.

5. The refrigeration appliance of any of claims 1-4, wherein, The air guide groove comprises an air guide outlet located at one end of the air guide groove close to the heat dissipation air outlet, and the cooling component is arranged at the air guide outlet of the air guide groove and covers the air guide outlet.

6. The refrigeration appliance of claim 2, wherein, The cooling component has a plurality of cooling air ducts inside, and the heat dissipation fan is used for generating air flow to pass through the cooling component and then pass through the cooling air ducts to the heat dissipation air outlet. The application further comprises: a second liquid storage component connected to the shell assembly, the second liquid storage component having a second liquid storage part; 7. A refrigerator as claimed in claim 6, characterised in that a connecting pipe in communication with the first liquid storage part at one end and in communication with the second liquid storage part at the other end. The application further comprises: a heat dissipation assembly accommodated in the shell assembly, wherein the heat dissipation assembly comprises: a heat exchange component in thermal conduction connection with the hot end of the semiconductor refrigeration component; a liquid pipeline in communication with the heat exchange component and the second liquid storage part; a heat dissipation component arranged in the heat dissipation air duct and located at the air outlet side of the heat dissipation fan, the heat dissipation component being in communication with the liquid pipeline; 8. The refrigeration appliance of claim 6, wherein, a power component in communication with the liquid pipeline to drive liquid flow.

9. The refrigeration appliance of claim 8, wherein, The shell assembly comprises four surrounding edges connected to each other and first and second ends arranged opposite to each other, the first and second liquid storage components are arranged at the first and second ends respectively, and the second liquid storage part is higher than the first liquid storage part in a first direction.

10. The refrigeration appliance of claim 8, wherein, An overflow valve is arranged in the first liquid storage part, and the overflow valve is selectively arranged in the first liquid storage part or at the communication position of the first liquid storage part and the connecting pipe to open or close the connecting pipe.

11. The refrigeration appliance of any of claims 1-4, 6-10, wherein, The bottom of the heat dissipation air outlet is higher than the top of the first liquid storage part in the first direction. The shell assembly further has a refrigeration air outlet and a refrigeration air duct connecting the air inlet and the refrigeration air outlet. The refrigeration device further comprises a cold guide and a refrigeration fan, the cold guide is accommodated in the shell assembly and is in thermal conduction connection with the cold end of the semiconductor refrigeration element, and the refrigeration fan is accommodated in the shell assembly, and the refrigeration fan and the cold guide are located in the refrigeration air duct. The refrigeration fan is used to generate air flow, which is blown out by the refrigeration air outlet after passing through the cold guide.

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