Liquid cooling server

Abstract

The utility model relates to the technical field of cooling of servers, in particular to a liquid cooling server. The utility model aims to solve the problem of uneven contact between cooling liquid and a heating electronic device. The liquid-cooled server comprises a box body, the top of the box body is provided with an opening, and the lower part of the box body is provided with a liquid outlet; the spraying module covers the opening, the spraying module is provided with a liquid inlet used for introducing cooling liquid from the outside, and a plurality of spraying units are arranged on the surface, facing the interior of the box body, of the spraying module; the plurality of electronic device units are arranged in the box body, and heat exchange is carried out on the electronic device units through the cooling liquid sprayed by the spraying unit; the at least one electronic device unit comprises a shell, an electronic device and a heat transfer device, the electronic device and the heat transfer device are arranged in the shell, the heat transfer device is in heat conduction connection with the electronic device, the shell is provided with a liquid inlet hole and a liquid outlet hole, the liquid inlet hole guides cooling liquid sprayed by the at least one spraying unit into the shell, and the cooling liquid immerses the heat transfer device; and cooling liquid is led out from the liquid outlet hole to the outside of the shell.

Description

TECHNICAL FIELD

[0001] The utility model relates to the cooling technical field of server, more particularly to a liquid cooling server. BACKGROUND

[0002] In actual server modification, the heat generating electronic devices in the server are usually connected with heat dissipation fins to promote heat dissipation. Since the supply manufacturers of electronic devices are various, the heat dissipation fins of different electrical devices are arranged vertically or horizontally. For the horizontally arranged case, the channel formed between the adjacent fin protrusions is horizontally extended, and the channel openings are located at the two ends in the horizontal direction. At this time, if the spray module sprays from top to bottom, the cooling liquid will be blocked by the fin protrusions and cannot be smoothly sprayed into the entire fin, and the heat dissipation efficiency is greatly reduced. If the full immersion liquid cooling method is used, it will cause waste of cooling liquid and increase the cost of server modification. SUMMARY

[0003] The utility model aims at overcoming at least one defect of the prior art, and provides a liquid cooling server to solve the problem of uneven contact between the cooling liquid and the heat generating electronic devices.

[0004] The utility model takes the technical scheme that a liquid cooling server is provided, which comprises a box body having an open top and a liquid outlet at the lower part;

[0005] A spray module is provided on the open top, and the spray module is provided with a liquid inlet for introducing cooling liquid from the outside. The surface of the spray module facing the inside of the box body is provided with a plurality of spray units.

[0006] A plurality of electronic device units are arranged in the inside of the box body, and the electronic device units are heat exchanged by the cooling liquid sprayed by the spray units. At least one of the electronic device units comprises a shell, an electronic device arranged in the inside of the shell, and a heat transfer device. The heat transfer device is in thermal contact with the electronic device. The shell is provided with a liquid inlet hole and a liquid outlet hole. The liquid inlet hole is used to introduce the cooling liquid sprayed by at least one of the spray units into the inside of the shell, and the cooling liquid immerses the heat transfer device. The liquid outlet hole is used to guide the cooling liquid out of the shell.

[0007] In the scheme, on one hand, the spraying unit can directly guide the cooling liquid into the shell interior, thereby performing immersion liquid cooling on the heat transfer device and electronic device in the shell interior, which can avoid the adverse situation of poor heat dissipation effect caused by the structure of the heat transfer device blocking the cooling liquid sprayed from top to bottom; on the other hand, the spraying unit can also directly retain the heat dissipation mode of direct spraying liquid cooling for other electronic device units, so that the parallel cooling mode of spraying liquid cooling and immersion liquid cooling can be realized in the server interior, which can not only satisfy sufficient heat exchange between the heat generating electronic device and the cooling liquid, but also avoid the waste of cooling liquid caused by the complete liquid cooling scheme, thereby helping to reduce the modification cost of the server.

[0008] Further, the liquid inlet hole is arranged at the top of the shell.

[0009] The scheme makes the cooling liquid guided by the spraying unit enter the shell interior from top to bottom, improves the contact frequency with the heat transfer device, and avoids the adverse situation that the upper part of the heat transfer device cannot contact the cooling liquid in the first time when the liquid is introduced from the lower part.

[0010] Further, the spraying unit is provided with a spraying outlet, and the spraying outlet of at least one spraying unit corresponds to the position of the liquid inlet hole.

[0011] The scheme does not need to arrange an additional communication component between the liquid inlet hole and the spraying unit, and can realize that the spraying unit directly sprays and delivers the cooling liquid to the shell interior through the liquid inlet hole.

[0012] Further, the spraying outlet of at least one spraying unit abuts against the liquid inlet hole.

[0013] The scheme can ensure that the cooling liquid output by the spraying unit corresponding in position is completely guided into the shell interior through the liquid inlet hole, improve the flow efficiency of the cooling liquid, and further improve the heat exchange level with the heat transfer device.

[0014] In some embodiments, the liquid outlet hole is arranged at the lower part of the shell.

[0015] The scheme only needs to ensure that the liquid inlet speed of the liquid inlet hole is faster than the liquid discharge speed of the liquid outlet hole, so as to ensure that the heat transfer device in the shell interior is completely immersed, and at the same time, since the cooling liquid has continuously exchanged heat with the heat transfer device and electronic device during the process of being guided into the shell interior from top to bottom, the liquid outlet hole arranged at the lower part of the shell can discharge the cooling liquid with increased temperature after heat exchange in the first time, thereby improving the heat exchange level of the cooling liquid and the heat transfer device.

[0016] In some embodiments, the liquid outlet hole is arranged at the upper part of the shell, and the position of the liquid outlet hole is higher than that of the heat transfer device.

[0017] The present scheme can ensure that the cooling liquid flows out of the shell from the liquid outlet hole after completely immersing the heat transfer device, avoiding the complicated situation of controlling the flow of the liquid inlet hole and the liquid outlet hole.

[0018] Further, the heat transfer device is a heat dissipation fin.

[0019] Further, the heat dissipation fin comprises a plurality of fin protrusions arranged side by side, and a liquid passing groove with two open ends is formed between adjacent fin protrusions, and the liquid passing groove has a horizontal extension length.

[0020] Further, the position of the liquid inlet hole corresponds to one of the open ends of the liquid passing groove, and the position of the liquid outlet hole corresponds to the other open end of the liquid passing groove.

[0021] The present scheme can cover the area of the flow channel between the liquid inlet hole and the liquid outlet hole with the heat dissipation fin, so that the low-temperature cooling liquid introduced from the liquid inlet hole can be fully heat exchanged with the heat dissipation fin, and then be guided out of the shell from the liquid outlet hole, thereby improving the heat exchange level.

[0022] Further, the box body comprises an electronic device accommodating area and a cooling liquid buffer area arranged in an up-down manner, the electronic device accommodating area and the cooling liquid buffer area are communicated, and the cooling liquid buffer area is provided with the liquid outlet hole.

[0023] Compared with the prior art, the present utility model has the beneficial effects that: by corresponding arrangement of part of the spray outlet and the liquid inlet hole of the packaging structure containing the heat dissipation device of the server, the spray cooling liquid can perform immersion liquid cooling on the heat dissipation device in the packaging structure, the heat dissipation level is improved, the spray liquid cooling mode of other components can be maintained, the amount of cooling liquid is reduced, and the heat dissipation problem of the heat dissipation fin arranged horizontally in the packaging structure is solved. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 Structure of some embodiments of the present utility model Figure 1 .

[0025] Figure 2 Structure of some embodiments of the present utility model Figure 2 .

[0026] Figure 3 Structure of some embodiments of the present utility model Figure 3 .

[0027] Figure 4 Electronic device unit structure diagram of some embodiments of the present utility model.

[0028] Figure 5 Exploded view of the electronic device unit of some embodiments of the present utility model.

[0029] Reference signs: box 100, open mouth 110, liquid outlet 120, electronic device accommodating area 130, cooling liquid buffer area 140, spraying module 200, liquid inlet 210, spraying unit 220, electronic device unit 300, shell 310, liquid inlet hole 311, liquid outlet hole 312, first main body member 313, first baffle 314, second main body member 315, second baffle 316, electronic device 320, heat transfer device 330, fin protrusion 331. DETAILED DESCRIPTION

[0030] The drawings of the utility model are only used for example description and cannot be understood as the limitation of the utility model. In order to better illustrate the following embodiments, some components in the drawings can be omitted, enlarged or reduced, and the size of the actual product is not represented; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings can be omitted.

[0031] Embodiment 1

[0032] As shown in Figures 1-4 The embodiment provides a liquid-cooled server, which comprises a box 100, the top of the box 100 is provided with an open mouth 110, and the lower part of the box 100 is provided with a liquid outlet 120; a spraying module 200 covers the open mouth 110, the spraying module 200 is provided with a liquid inlet 210 for introducing cooling liquid from the outside, and the surface of the spraying module 200 facing the inside of the box 100 is provided with a plurality of spraying units 220; a plurality of electronic device units 300 are arranged in the inside of the box 100, and the electronic device units 300 are all heat-exchanged by the cooling liquid sprayed by the spraying units 220; wherein at least one electronic device unit 300 comprises a shell 310, an electronic device 320 arranged in the inside of the shell 310 and a heat transfer device 330, the heat transfer device 330 is in thermal connection with the electronic device 320, the shell 310 is provided with a liquid inlet hole 311 and a liquid outlet hole 312, the liquid inlet hole 311 is used for introducing the cooling liquid sprayed by at least one spraying unit 220 into the inside of the shell 310, the cooling liquid fills the shell and immerses the heat transfer device 330, and the liquid outlet hole 312 is used for leading the cooling liquid out of the shell 310.

[0033] In specific implementation, the spraying module 200 can adopt a spraying plate, and each spraying unit 220 can be a plurality of groups of spraying hole arrays arranged on the lower surface of the spraying plate. In order to sufficiently spray and cool the electronic device units 300, the positions of the spraying hole arrays are arranged correspondingly to different electronic device units 300. Specifically, the distribution density of the spraying hole arrays can be arranged according to the heat production of the electronic device units 300. The more heat produced by the electronic device units 300, the more spraying hole arrays are arranged to spray and cool the electronic device units 300.

[0034] In specific implementation, reference Figure 5The electronic device 320 packaged by the shell 310 is a GPU module, specifically a 4090 graphics card, as the main heat-generating electronic device, and needs to be connected with the heat dissipation device 330 to increase the heat dissipation area. In order to simplify the structure, the heat dissipation device 330 of the embodiment is specifically a heat dissipation fin. In order to save horizontal space of the server, the smaller plane of the GPU module is arranged on the inner bottom surface of the box body 100. At this time, the heat dissipation surface of the heat dissipation fin is longitudinal and side by side. The heat dissipation fin includes a plurality of fin protrusions 331 arranged side by side. The adjacent fin protrusions 331 form a liquid passing groove with two open ends. The liquid passing groove has a horizontal extension length. At this time, combined with Figure 3 It can be understood that since the spray module 200 is arranged on the top opening 110 of the box body 100, the cooling liquid is sprayed from top to bottom in the box body 100 by the spray unit 220. Most of the cooling liquid is blocked by the fin protrusions 331, resulting in low heat exchange between the cooling liquid and the heat dissipation fin, and the heat dissipation efficiency of the GPU is greatly reduced.

[0035] In order to avoid the disadvantageous situation that the cooling liquid and the heat dissipation fin cannot fully contact and exchange heat, as shown in Figures 4-5 The shell 310 is used to package the GPU module. Specifically, the GPU and the heat dissipation fin are packaged in the shell 310. In some embodiments, in order to adapt to the shape of the conventional GPU, the shell 310 is a cube composed of a first main body member 313, a first baffle 314, a second main body member 315 and a second baffle 316. The first main body member 313 and the second main body member 315 form a hollow shell 310 main frame. The GPU board is installed on one of the surfaces in the shell 310 main frame. In order to reduce the occupied space of the shell 310, the surface with a larger area of the GPU board is arranged on the inner surface with a larger area in the shell 310 main frame. At the same time, in order to maximize the heat dissipation area, the heat dissipation device 330 is also arranged on the surface with a larger area of the GPU board.

[0036] In operation, on one hand, the spraying unit 220 can directly introduce the cooling liquid into the shell 310, thereby realizing immersion liquid cooling of the heat transfer device 330 and the electronic device 320 in the shell 310, which can avoid the adverse situation that the heat dissipation effect is poor due to the structure of the heat transfer device 330 blocking the cooling liquid sprayed from top to bottom. On the other hand, the spraying unit 220 can also directly spray the other electronic device unit 300 to retain the heat dissipation mode of direct spraying liquid cooling. In specific implementation, the other electronic device unit 300 can include a hard disk, a memory, a CPU, etc. In this way, the parallel cooling mode of spraying liquid cooling and immersion liquid cooling can be realized in the server, which can not only satisfy sufficient heat exchange between the heat-generating electronic device unit 300 and the cooling liquid, but also avoid waste of the cooling liquid caused by the complete liquid cooling scheme, thereby helping to reduce the modification cost of the server. It is easy to understand that the packaging structure of the GPU module in the embodiment can also be used for other electronic device units 300, which only need to be packaged by a shell structure suitable for the electronic device unit 300, and a corresponding spraying unit 220 is arranged to inject the cooling liquid, thereby realizing immersion liquid cooling of the electronic device unit 300.

[0037] Reference Figures 4-5 The liquid inlet hole 311 is arranged at the top of the shell 310, specifically, the liquid inlet hole 311 is arranged at the top of the main frame of the shell 310, so that the cooling liquid introduced by the spraying unit 220 enters the shell 310 from top to bottom, thereby improving the contact frequency with the heat transfer device 330 and avoiding the adverse situation that the upper part of the heat transfer device 330 cannot contact the cooling liquid in the first time when the liquid is introduced from the lower part.

[0038] Preferably, the spraying unit 220 is arranged on the top of the shell 310, and the liquid inlet hole 311 is arranged at the bottom of the shell 310. Figure 3 For example, the spraying hole array is arranged, the spraying unit 220 is arranged with a spraying outlet, and the position of the liquid inlet hole 311 corresponds to the spraying outlet of at least one spraying unit 220. In specific implementation of the embodiment, at least one spraying hole array corresponds to the position of the liquid inlet hole 311. At this time, no additional connecting component is needed between the liquid inlet hole 311 and the spraying unit 220, and the spraying unit 220 can directly spray and deliver the cooling liquid into the shell 310 through the liquid inlet hole 311.

[0039] In some embodiments, the liquid inlet hole 311 and the spraying unit 220 can also be connected through a connecting component, for example, a liquid pipeline, so that the cooling liquid output by the corresponding spraying unit 220 can be completely introduced into the shell 310 through the liquid inlet hole 311, thereby improving the efficiency of introducing the cooling liquid. In this embodiment, the position of the liquid inlet hole 311 does not have to correspond to the spraying unit 220, and the position of the shell 310 in the cabinet 100 can be more flexibly arranged.

[0040] In some embodiments, the liquid inlet hole 311 abuts against the spraying outlet of at least one spraying unit 220. In specific implementation, reference is made toFigure 1 、 3 , 4, the liquid inlet hole 311 is arranged at the top of the shell 310, and the top of the shell 310 abuts against the lower surface of the spray unit 220, so that the liquid inlet hole 311 abuts against the spray unit 220 corresponding to the outside. At this time, the cooling liquid input by the spray unit 220 can also be completely introduced into the shell 310 through the liquid inlet hole 311, improving the efficiency of introducing the cooling liquid into the shell 310, and it is not necessary to additionally provide a communication component between the liquid inlet hole 311 and the spray unit 220.

[0041] As shown in Figures 4-5 , the liquid outlet hole 312 is arranged at the lower part of the shell 310. At this time, it is only necessary to ensure that the liquid inlet speed of the liquid inlet hole 311 is faster than the liquid discharge speed of the liquid outlet hole 312 to ensure that the heat transfer device 330 inside the shell 310 is completely immersed, and at the same time, the liquid inlet hole 311 is located at the top, and the cooling liquid is introduced into the shell 310 from top to bottom during the process of heat exchange with the heat transfer device 330 and the electronic device 320. The liquid outlet hole 312 arranged at the lower part of the shell 310 can discharge the cooling liquid with increased temperature after heat exchange in the first time, improving the heat exchange level of the cooling liquid and the heat transfer device 330.

[0042] In some embodiments, the liquid outlet hole 312 is arranged at the upper part of the shell 310, and the position of the liquid outlet hole 312 is higher than that of the heat transfer device 330, for example, arranged at the top of the shell 310. At this time, it can be ensured that the cooling liquid flows out of the shell 310 from the liquid outlet hole 312 only after completely immersing the heat transfer device 330, avoiding the cumbersome situation of needing to control the flow of the liquid inlet hole 311 and the liquid outlet hole 312.

[0043] In a more preferred embodiment, the position of the liquid inlet hole 311 corresponds to one end opening of the liquid passing groove of the heat dissipation fin, and the position of the liquid outlet hole 312 corresponds to the other end opening of the liquid passing groove. Referring to Figure 5 , one end opening of the liquid passing groove faces the first baffle 314, and the other end opening faces the second baffle 316. In this embodiment, the liquid inlet hole 311 is arranged at the top of the main frame of the shell 310 and close to the first baffle 314, and the liquid outlet hole 312 is directly arranged at the lower part of the second baffle 316. At this time, the flow channel between the liquid inlet hole 311 and the liquid outlet hole 312 covers the area completely covering the heat dissipation fin. After the low-temperature cooling liquid introduced from the liquid inlet hole 311 is fully heat-exchanged with the heat dissipation fin, the cooling liquid with increased temperature is discharged from the shell 310 through the liquid outlet hole 312, improving the heat exchange level of the cooling liquid and the heat dissipation fin.

[0044] In addition, referring to Figure 2The box 100 comprises an electronic device accommodating area 130 and a cooling liquid buffer area 140 arranged in an up-down mode, the electronic device accommodating area 130 and the cooling liquid buffer area 140 are communicated, and the cooling liquid buffer area 140 is provided with a liquid outlet 120. The electronic device units 300 are all arranged inside the electronic device accommodating area 130, the cooling liquid sprayed by the spraying module 200 is in contact with the electronic device units 300 to exchange heat, and then passes downwards to the cooling liquid buffer area 140, and then flows out of the box 100 through the liquid outlet 120, so that the cooling liquid which is heated after heat exchange can be prevented from staying in the electronic device accommodating area 130, so as to prevent the cooling liquid from being in contact with the electronic device units 300 to cause the heat exchange efficiency to be reduced.

[0045] Obviously, the above embodiments of the utility model are only examples for clearly illustrating the technical scheme of the utility model, and are not a limitation on the specific embodiments of the utility model. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model claim should be included in the protection scope of the utility model claim.

Claims

1. A liquid-cooled server, comprising: include: The container has an open top and a liquid outlet at the bottom; The spray module covers the opening, and the spray module is provided with an inlet for introducing coolant from the outside. The surface of the spray module facing the inside of the housing is provided with multiple spray units. Several electronic device units are disposed inside the housing. Each electronic device unit exchanges heat with coolant sprayed by the spray unit. At least one of the electronic device units includes a housing and electronic devices and heat transfer devices disposed inside the housing. The heat transfer devices are thermally connected to the electronic devices. The housing is provided with a liquid inlet and a liquid outlet. The liquid inlet is used to introduce coolant sprayed by at least one of the spray units into the housing and the coolant immerses the heat transfer devices. The liquid outlet is used to discharge coolant to the outside of the housing.

2. The liquid-cooled server of claim 1, wherein, The liquid inlet is located at the top of the housing.

3. The liquid-cooled server of claim 2, wherein, Each spray unit is provided with a spray outlet, and the spray outlet of at least one spray unit corresponds to the position of the liquid inlet.

4. The liquid-cooled server of claim 3, wherein, At least one of the spray units has its spray outlet abutting against the liquid inlet.

5. The liquid-cooled server of any of claims 1-4, wherein, The liquid outlet is located at the lower part of the shell.

6. The liquid-cooled server of any of claims 1-4, wherein, The liquid outlet is located on the upper part of the housing, and the position of the liquid outlet is higher than that of the heat transfer device.

7. The liquid-cooled server of any of claims 1-4, wherein, The heat transfer device is a heat sink fin.

8. The liquid-cooled server of claim 7, wherein, The heat dissipation fins include a plurality of fin protrusions arranged side by side, and liquid-passing grooves with openings at both ends are formed between adjacent fin protrusions, the liquid-passing grooves having a horizontal extension length.

9. The liquid-cooled server of any of claim 8, wherein, The position of the liquid inlet corresponds to the opening at one end of the liquid passage groove, and the position of the liquid outlet corresponds to the opening at the other end of the liquid passage channel.

10. The liquid-cooled server of any of claims 1-4, 7, 8, wherein, The enclosure includes an electronic device housing area and a coolant buffer area arranged vertically, the electronic device housing area and the coolant buffer area are connected, and the coolant buffer area is provided with the coolant outlet.

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