Computer cooling fin with aluminum profile structure

Abstract

The utility model discloses a computer cooling fin with an aluminum profile structure, which comprises a cooling plate, a cooling column is fixedly connected to the front surface of the cooling plate, a connecting strip is fixedly connected to the outer side of the cooling column, a cavity is formed in one end of the cooling column, gallium indium alloy is mounted in the cavity, and the inner side of the cooling column is in threaded connection with a threaded sleeve through the cavity. The front face of the threaded sleeve is fixedly connected with a handle, the top and the bottom of the heat dissipation plate are locally and fixedly connected with installation plates, an installation groove is formed in the bottom of the heat dissipation plate, heat dissipation silicone grease is installed on the inner side of the installation groove, and a CPU is arranged on the inner side of the installation groove through the heat dissipation silicone grease. Meanwhile, enough heat dissipation silicone grease can be reserved at the splicing position between the heat dissipation plate and the CPU, so that the installation effect is improved, the heat transfer efficiency of the heat dissipation fins is improved through the arranged heat dissipation columns and gallium-indium alloy, and therefore the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a fin technical field, especially a computer cooling fin of aluminium profile structure. BACKGROUND

[0002] The fin is a device for dissipating heat of the electronic components in the electric appliance, which is made of aluminum alloy, brass or bronze into plate, sheet, multiple sheet, etc., such as the CPU in the computer, the power supply tube in the TV, and the power amplifier tube in the power amplifier, which all need to use the fin. Generally, a layer of heat-conducting silicone grease is coated on the contact surface between the electronic component and the fin in use, so that the heat emitted by the component can be more effectively conducted to the fin, and then dissipated to the surrounding air through the fin.

[0003] According to the search, the computer cooling fin disclosed in Chinese patent publication No. CN107656599A includes a cooling base plate, a cooling base block mounted on the upper end of the cooling base plate, and a plurality of cooling fins uniformly arranged on the cooling base block, which can further improve the cooling effect. By setting the graphene cooling layer, the cooling speed of the fin is improved, and by setting the spinning cooling layer, the cooling performance is further improved.

[0004] However, in the use of the existing computer cooling fin, when the CPU emits heat, the heat will be absorbed by the heat conduction performance of the fin, and then the heat will be dissipated by increasing the contact area with the air through the cooling fins on the fin. However, the interface thermal resistance of the fin is large during cooling, which leads to low heat transfer efficiency of the fin, thereby affecting the cooling efficiency. Moreover, during the installation of the computer cooling fin, it cannot be positioned and installed, and the cooling plate needs to be moved back and forth during the installation process, which causes the cooling silicone grease coated on the cooling plate to be easily squeezed out of the cooling plate and the CPU, thereby affecting the installation effect. Therefore, it is necessary to design a computer cooling fin of aluminium profile structure. UTILITY MODEL CONTENTS

[0005] The main purpose of the utility model is to provide a computer cooling fin of aluminium profile structure, which can effectively solve the problem of large interface thermal resistance of the fin during cooling, which leads to low heat transfer efficiency of the fin, thereby affecting the cooling efficiency, and the problem of inability to position and install the computer cooling fin during installation, and the problem of the need to move the cooling plate back and forth during the installation process, which causes the cooling silicone grease coated on the cooling plate to be easily squeezed out of the cooling plate and the CPU, thereby affecting the installation effect.

[0006] To achieve the above-mentioned purpose, the technical scheme adopted by the utility model is as follows:

[0007] The utility model provides an aluminium profile structure's computer cooling fin, including the heat dissipation board, the front surface fixed connection of heat dissipation board has the heat dissipation column, the outer side fixed connection of heat dissipation column has the connecting strip, the one end of heat dissipation column is equipped with the cavity, the inside mounting of cavity has gallium indium alloy, the inner side of heat dissipation column is connected with the nipple through the cavity screw thread, the front surface fixed connection of nipple has the handle, the top and bottom partial fixed connection of heat dissipation board has the mounting plate, the bottom of heat dissipation board is equipped with the installation groove, the inner side mounting of installation groove has the heat dissipation silicone grease, the inner side of installation groove is provided with CPU through the heat dissipation silicone grease.

[0008] In order to make the cooling fin can be installed with the cooling fan, as the utility model discloses an aluminium profile structure's computer cooling fin, one side fixed connection of connecting strip has the mounting column, one end fixed connection of mounting column has the screw mouth.

[0009] In order to make the cooling fin can be more large area and air contact, as the utility model discloses an aluminium profile structure's computer cooling fin, the outer side fixed connection of heat dissipation column and connecting strip all has the heat dissipation fin, the heat dissipation fin is provided with a plurality of, the outer surface smooth of a plurality of heat dissipation fins.

[0010] In order to make the cooling fin can be firmly installed on the computer, as the utility model discloses an aluminium profile structure's computer cooling fin, the front surface screw thread connection of mounting plate has the bolt, the outer side swing joint of bolt has the telescopic spring.

[0011] In order to make the cooling fin heat transfer effect is better, as the utility model discloses an aluminium profile structure's computer cooling fin, the heat dissipation board includes the heat dissipation column of heat dissipation board front surface and the connecting strip of heat dissipation column outer side and the heat dissipation fin connected with connecting strip and heat dissipation column is integral type structure.

[0012] In order to make the cooling fin can be installed with the cooling fan, as the utility model discloses an aluminium profile structure's computer cooling fin, the mounting column is provided with four, four mounting columns are located at the four corners of heat dissipation board front surface respectively, and the mounting column and heat dissipation board are integral type structure.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] 1. The utility model discloses a mounting slot is set up, when installing the heat dissipation fin on the CPU, the staff spreads the heat dissipation silicone grease in the mounting slot of the bottom of the heat dissipation plate, and then the mounting slot under the heat dissipation plate is aligned on the CPU, and when the mounting slot is not aligned with the CPU, the staff only needs to push the heat dissipation plate and adjusts the position, and when adjusting, because the heat dissipation silicone grease is located in the mounting slot, the heat dissipation silicone grease will not be extruded in the moving process, and when the position is adjusted, the mounting slot will be sleeved on the CPU, thereby positioning effect is achieved, and enough heat dissipation silicone grease can be reserved between the heat dissipation plate and the CPU, thereby improving the installation effect.

[0015] 2. The utility model discloses a heat dissipation column and gallium-indium alloy are set up, and after installing, when the CPU emits heat in the operation process, the heat will be transferred to the heat dissipation plate, at this moment, the heat will be transferred to the heat dissipation column, connecting strip and heat dissipation fin, and the heat is dissipated by the contact of heat dissipation fin and air, and when dissipating heat, because gallium-indium alloy is installed in the heat dissipation column, at this moment, the heat will be absorbed by gallium-indium alloy, and gallium-indium alloy will melt after being heated and thereby consumes heat, which optimizes the heat dissipation effect, and the heat of gallium-indium alloy will be transferred to the heat dissipation column and be dissipated by heat dissipation fin, thereby improving the heat dissipation fin heat transfer efficiency, and the heat dissipation efficiency is improved. DRAWINGS

[0016] Figure 1 It is the whole structure schematic diagram of the utility model;

[0017] Figure 2 It is the local structure schematic diagram of the utility model heat dissipation column;

[0018] Figure 3 It is the local structure schematic diagram of the utility model mounting plate;

[0019] Figure 4 It is the sectional view of the utility model heat dissipation plate.

[0020] In the drawing: 1, heat dissipation plate; 2, heat dissipation column; 3, cavity; 4, screw sleeve; 5, handle; 6, connecting strip; 7, heat dissipation fin; 8, mounting column; 9, screw mouth; 10, mounting plate; 11, bolt; 12, extension spring; 13, gallium-indium alloy; 14, mounting slot; 15, heat dissipation silicone grease; 16, CPU. SPECIFIC IMPLEMENTATION

[0021] Clearly, the described embodiments are merely part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0022] Embodiment

[0023] As Figures 1-4 shown, an aluminum profile structure computer cooling fin, including the heat sink 1, the front of the heat sink 1 is fixedly connected with the heat column 2, the outer side of the heat column 2 is fixedly connected with the connecting strip 6, one end of the heat column 2 is provided with the cavity 3, the inside of the cavity 3 is installed with gallium indium alloy 13, the inner side of the heat column 2 is screwed with the sleeve 4 through the cavity 3, the front of the sleeve 4 is fixedly connected with the handle 5, the top and bottom of the heat sink 1 is partially fixedly connected with the mounting plate 10, the bottom of the heat sink 1 is provided with the mounting groove 14, the inner side of the mounting groove 14 is installed with the heat-conducting silicone grease 15, the inner side of the mounting groove 14 is provided with the CPU 16 through the heat-conducting silicone grease 15.

[0024] Specific use, the mounting groove 14 under the heat sink 1 is aligned on the CPU 16, and when the mounting groove 14 is not aligned with the CPU 16, the staff only needs to push the heat sink 1 to adjust the position, and when adjusting, since the heat-conducting silicone grease 15 is located in the mounting groove 14, the heat-conducting silicone grease 15 will not be extruded during the movement, and when the position is adjusted, the mounting groove 14 will be sleeved on the CPU 16, thereby playing a positioning role.

[0025] In this embodiment, one side of the connecting strip 6 is fixedly connected with the mounting column 8, one end of the mounting column 8 is fixedly connected with the screw port 9.

[0026] Specific use, the heat fan is butt jointed on the mounting column 8, and then the screw is inserted into the screw port 9 to complete the installation.

[0027] In this embodiment, the outer side of the heat column 2 and the connecting strip 6 is fixedly connected with the heat fin 7, the heat fin 7 is provided with a plurality of, the outer surface of the plurality of heat fins 7 is smooth.

[0028] Specific use, the heat area contacted with air through the heat fin 7, thereby playing a heat dissipation role.

[0029] In this embodiment, the front of the mounting plate 10 is screwed with the bolt 11, the outer side of the bolt 11 is movably connected with the extension spring 12.

[0030] Specific use, the mounting plate 10 is located in the installation position, and then the bolt 11 is rotated and fixed in the through hole in the installation position to complete the installation.

[0031] In the embodiment, the heat dissipation plate 1 comprises the heat dissipation column 2 on the front of the heat dissipation plate 1, the connecting strip 6 outside the heat dissipation column 2, and the heat dissipation fins 7 connected with the connecting strip 6 and the heat dissipation column 2, which are integrated.

[0032] In specific use, the heat dissipation fins in the integrated structure can better perform heat transfer and ensure the heat dissipation effect.

[0033] In the embodiment, four mounting columns 8 are arranged, and the four mounting columns 8 are respectively arranged at four corners on the front of the heat dissipation plate 1, and the mounting column 8 is in an integrated structure with the heat dissipation plate 1.

[0034] In specific use, the heat dissipation fan is butted against the mounting column 8, and then the screw is inserted into the screw hole 9 to complete the installation.

[0035] Working principle: when the heat dissipation fin is installed on the CPU 16, the worker applies the heat dissipation silicone grease 15 to the mounting groove 14 at the bottom of the heat dissipation plate 1, and then aligns the mounting groove 14 under the heat dissipation plate 1 on the CPU 16, and when the mounting groove 14 is not aligned with the CPU 16, the worker only needs to push the heat dissipation plate 1 to adjust the position, and when adjusting, since the heat dissipation silicone grease 15 is in the mounting groove 14, the heat dissipation silicone grease 15 will not be extruded in the moving process, and when the position is adjusted, the mounting groove 14 will be sleeved on the CPU 16, thereby playing a positioning role, and at the same time, enough heat dissipation silicone grease 15 can be reserved at the splicing part between the heat dissipation plate 1 and the CPU 16, and after installation, when the CPU 16 generates heat in the running process, the heat will be transferred to the heat dissipation plate 1, at this time, the heat will be transferred to the heat dissipation column 2, the connecting strip 6 and the heat dissipation fin 7, and at the same time, the heat is dissipated by the contact between the heat dissipation fin 7 and the air, and when dissipating heat, since the gallium-indium alloy 13 is installed in the heat dissipation column 2, at this time, the heat will be absorbed by the gallium-indium alloy 13, and at the same time, the gallium-indium alloy 13 will melt after being heated to consume the heat, thereby optimizing the heat dissipation effect, and at the same time, the heat of the gallium-indium alloy 13 will be transferred to the heat dissipation column 2 and dissipated by the heat dissipation fin 7.

[0036] The basic principle and main features of the utility model and the advantages of the utility model are shown and described. The skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and the description in the specification only illustrate the principle of the utility model, and various changes and improvements of the utility model can be made without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model. The protection scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A computer heat sink of aluminium profile construction comprising a heat sink plate (1) characterised in that: The front surface of the heat dissipation plate (1) is fixedly connected with a heat dissipation column (2), the outer side of the heat dissipation column (2) is fixedly connected with a connecting strip (6), one end of the heat dissipation column (2) is provided with a cavity (3), the inside of the cavity (3) is mounted with a gallium-indium alloy (13), the inner side of the heat dissipation column (2) is threadedly connected with a screw sleeve (4) through the cavity (3), the front surface of the screw sleeve (4) is fixedly connected with a handle (5), the top and bottom of the heat dissipation plate (1) are partially fixedly connected with a mounting plate (10), the bottom of the heat dissipation plate (1) is provided with a mounting groove (14), the inner side of the mounting groove (14) is mounted with a heat dissipation silicone grease (15), the inner side of the mounting groove (14) is provided with a CPU (16) through the heat dissipation silicone grease (15).

2. The computer heat sink of claim 1, wherein: One side of the connecting strip (6) is fixedly connected with a mounting column (8), one end of the mounting column (8) is fixedly connected with a screw mouth (9).

3. A computer heat sink with an aluminum profile structure according to claim 1, characterized in that: The outer sides of the heat dissipation column (2) and the connecting strip (6) are fixedly connected with heat dissipation fins (7), the heat dissipation fins (7) are provided with a plurality of heat dissipation fins (7), and the outer surfaces of the plurality of heat dissipation fins (7) are smooth.

4. A computer heat sink with an aluminum profile structure according to claim 1, characterized in that: The front surface of the mounting plate (10) is threadedly connected with a bolt (11), and the outer side of the bolt (11) is movably connected with an extension spring (12).

5. A computer heat sink with an aluminum profile structure according to claim 1, characterized in that: The heat dissipation plate (1) comprises a heat dissipation column (2) on the front surface of the heat dissipation plate (1), a connecting strip (6) on the outer side of the heat dissipation column (2), and heat dissipation fins (7) connected with the connecting strip (6) and the heat dissipation column (2) are of an integral structure.

6. The computer heat sink of claim 2, wherein: The mounting column (8) is provided with four mounting columns (8), and the four mounting columns (8) are respectively located at the four corners of the front surface of the heat dissipation plate (1), and the mounting column (8) and the heat dissipation plate (1) are of an integral structure.

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