Liquid cooling heat dissipation device and server

Abstract

The utility model relates to the technical field of liquid cooling heat dissipation, and discloses a liquid cooling heat dissipation device and a server, the liquid cooling heat dissipation device comprises an upper cover plate and a lower substrate, the upper cover plate and the lower substrate are enclosed to form an accommodating cavity, the upper cover plate is provided with a fluid inlet and a fluid outlet which are communicated with the accommodating cavity, the lower substrate is provided with a plurality of staggered pin fins, and the pin fins are arranged in the accommodating cavity. The needle fins are located in the containing cavity, micro-channels allowing cooling liquid to flow through are formed between the needle fins, an inlet liquid storage cavity is formed in the upper cover plate, one end of the inlet liquid storage cavity is communicated with the fluid inlet, and a plurality of spraying holes communicated with the containing cavity are formed in the other end of the inlet liquid storage cavity. The sectional area of the inlet liquid storage cavity is gradually increased in the direction from the fluid inlet to the spraying hole. According to the liquid cooling heat dissipation device, the pressure loss of the cooling liquid in the liquid cooling heat dissipation device in the flowing process can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to liquid cooling heat dissipation technical field especially relates to a liquid cooling heat dissipation device and server. BACKGROUND

[0002] With the development of science and technology, the computing ability of computer chip is more and more powerful, and the heat dissipation technology is more and more high, and liquid cooling heat dissipation gradually becomes mainstream heat dissipation technology because of strong heat dissipation capacity and low noise.

[0003] At present, the liquid cooling heat dissipation technology of server in data center mainly has two kinds, cold plate type heat dissipation and immersion type heat dissipation. The cold plate type heat dissipation is arranged on the surface of high heat flux density chip, and the cooling liquid flowing in the cold plate heat dissipation device is used to dissipate heat for chip, but it cannot dissipate heat for other heat generating components in the server, and still needs to cooperate with the air cooling heat dissipation device in the computer room to remove the overall heat. And the traditional cold plate heat dissipation device structure is complex, and the cooling liquid has large pressure loss when flowing in the cold plate heat dissipation device, so it needs to be equipped with a large power fluid driving device to drive the cooling liquid to flow in the cold plate heat dissipation device.

[0004] The immersion type heat dissipation is to immerse the server into the insulating cooling liquid, and all heat generating components are cooled by the whole cooling liquid circulation. But because the internal space of the server is large, the flow rate of these cooling liquids is low when flowing through the server components, and the local heat dissipation of high-performance high-heat design power chip cannot be met, that is, the unit volume heat dissipation power needs to be improved. INVENTION CONTENTS

[0005] The utility model provides a new liquid cooling heat dissipation device aiming at the problem of large cooling liquid pressure loss in the cold plate heat dissipation device in the prior art.

[0006] In order to solve the above technical problem, the utility model is realized by the following technical scheme:

[0007] The application discloses a liquid cooling heat dissipation device, which comprises an upper cover plate and a lower base plate, the upper cover plate and the lower base plate are enclosed to form a containing cavity, the upper cover plate is provided with a fluid inlet and a fluid outlet which are communicated with the containing cavity, the lower base plate is provided with a plurality of staggered needle ribs, the needle ribs are located in the containing cavity, and microchannels for the cooling liquid to flow through are formed between the needle ribs; the upper cover plate is provided with an inlet liquid storage cavity, one end of the inlet liquid storage cavity is communicated with the fluid inlet, the other end of the inlet liquid storage cavity is provided with a plurality of injection holes which are communicated with the containing cavity, and the cross-sectional area of the inlet liquid storage cavity gradually increases from the fluid inlet to the injection holes.

[0008] Preferably, the fluid inlet is a circular hole, the inlet liquid storage cavity is a flat hole, and the thickness of the inlet liquid storage cavity is smaller than the inner diameter of the fluid inlet. In this way, the circular pipe flow of the cooling liquid in the fluid inlet is converted into the flat pipe flow in the inlet liquid storage cavity, so that the cooling liquid can uniformly enter the injection holes.

[0009] Preferably, the plurality of injection holes are uniformly arranged above the left and right center lines of the needle ribs, the number of the injection holes is 8-30, the hole spacing between adjacent two injection holes is 1mm-6mm, and the diameter of the injection hole is 0.2mm-1mm. Uniformly arranging the plurality of injection holes above the left and right center lines of the needle ribs can make the cooling liquid uniformly flow into the containing cavity, prevent the uneven distribution of the cooling liquid in the containing cavity, and avoid affecting the heat dissipation uniformity of the liquid cooling heat dissipation device.

[0010] Preferably, the lower base plate is provided with an injection flow guide structure opposite to the position of the injection hole, the cross section of the injection flow guide structure is an isosceles triangle, the top angle of the isosceles triangle ranges from 40° to 65°, a round corner is arranged between the injection flow guide structure and the lower base plate, and the radius of the round corner ranges from 0.2mm to 1mm. After the cooling liquid enters the containing cavity through the injection hole, the cooling liquid collides with the injection flow guide structure, the local thermal boundary layer thickness is reduced, and the heat exchange is enhanced. Meanwhile, the injection flow guide structure adjusts the vertical flow of the cooling liquid to the horizontal flow, greatly reduces the pressure loss generated in the front injection process, and the injection flow guide structure is designed as an isosceles triangle, so that the cooling liquid can be evenly distributed to the left and right containing cavities, and the uneven heat dissipation is avoided.

[0011] Preferably, the cross-sectional shape of the needle rib is one of a rhombus, a circle, a water drop, and an oblong.

[0012] Preferably, the cross-sectional shape of the needle rib is a rhombus, and the length-width ratio of the rhombus is 1.5-3. The rhombus-shaped needle rib can prevent the heat transfer efficiency from being reduced due to the low-speed area of the wake flow, and further reduce the pressure loss.

[0013] Preferably, the distance between adjacent needle ribs is 0.2mm-1mm along the flow direction of the cooling liquid, and / or the distance between adjacent needle ribs is 0.8mm-2.5mm along the direction perpendicular to the flow direction of the cooling liquid, and / or the hydraulic diameter of a single needle rib is 0.1mm-0.7mm. Through verification, compared with the traditional rectangular flow channel, the temperature at the bottom of the lower substrate is obviously reduced at different Reynolds numbers, and the reduction is about 5K-10K, and the comprehensive heat dissipation performance is obviously improved.

[0014] Preferably, the liquid cooling heat dissipation device further comprises a fluid driving device and a connecting pipe, one end of the connecting pipe is communicated with the fluid driving device, and the other end of the connecting pipe is communicated with the fluid inlet. The liquid cooling heat dissipation device can reduce the pressure loss in the flow process of the cooling liquid, and further reduce the power of the fluid driving device.

[0015] The utility model also provides a kind of server, scheme as follows:

[0016] A kind of server, including cabinet, chip and liquid cooling heat dissipation device as described above are arranged in cabinet, liquid cooling heat dissipation device is arranged above chip, and the side of lower substrate far from containing cavity is attached to chip.

[0017] Preferably, the cabinet is provided with insulating cooling liquid, the heat generating elements of the server are immersed in the cooling liquid, the suction inlet of the fluid driving device is arranged at the upstream position of the cooling liquid to suck in the cooling liquid with low temperature, and the cooling liquid outlet of the liquid cooling heat dissipation device is connected to the liquid discharge pipe, and the outlet of the liquid discharge pipe is arranged at the downstream position of the cooling liquid.

[0018] The scheme combines the cold plate type heat dissipation and immersion type heat dissipation, can dissipate heat for other heat generating elements in the server, and can improve the heat dissipation efficiency of the chip, solves the problem of low local heat dissipation efficiency of the immersion type heat dissipation. Moreover, the liquid cooling heat dissipation device in the scheme does not need to worry about the risk of cooling liquid leakage, can greatly simplify the sealing structure design, and solves the problem of complex sealing structure caused by the non-insulating cooling liquid in the traditional cold plate type heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the structure schematic view of the utility model liquid cooling heat dissipation device.

[0020] Figure 2 is the structural schematic diagram of the liquid cooling heat dissipation device in the server.

[0021] Figure 3 is the partial structural schematic diagram of the lower base plate of the liquid cooling heat dissipation device.

[0022] The part names referred to by the numbers in the drawings are as follows:

[0023] 1 - upper cover plate, 2 - lower base plate, 3 - fluid inlet, 4 - fluid outlet, 5 - needle rib, 6 - inlet liquid storage cavity, 7 - injection hole, 8 - injection guide structure, 9 - fluid driving device, 10 - connecting pipe, 12 - outlet liquid storage cavity. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0025] As shown in Figure 1 and Figure 2 , the present application protects a liquid cooling heat dissipation device, which comprises an upper cover plate 1 and a lower base plate 2. The upper cover plate 1 and the lower base plate 2 form a sealed containing cavity by welding. A plurality of needle ribs 5 are arranged on the lower base plate 2 in a staggered manner. The needle ribs 5 form microchannels for the cooling liquid to flow through. The needle ribs 5 are located in the containing cavity. The upper cover plate 1 is provided with a fluid inlet 3 and a fluid outlet 4 which are in communication with the containing cavity. The cooling liquid enters the containing cavity from the fluid inlet 3, flows through the microchannels between the needle ribs 5, and is discharged from the fluid outlet 4. The needle rib 5 is a protrusion arranged on the lower base plate 2. A plurality of needle ribs 5 are arranged on the lower base plate 2 in the length and width directions. The positions of the adjacent two rows of needle ribs 5 are staggered, forming a staggered arrangement. The upper cover plate 1 is further provided with an inlet liquid storage cavity 6. One end of the inlet liquid storage cavity 6 is in communication with the fluid inlet 3. The other end of the inlet liquid storage cavity 6 is provided with a plurality of injection holes 7 which are in communication with the containing cavity. The cross-sectional area of the inlet liquid storage cavity 6 gradually increases from the fluid inlet 3 to the injection holes 7. The cooling liquid first enters the inlet liquid storage cavity 6 from the fluid inlet 3, and then enters the containing cavity from the injection holes 7. The cross-sectional area of the inlet liquid storage cavity 6 is designed to gradually increase from the fluid inlet 3 to the injection holes 7. This not only gradually increases the flow channel of the cooling liquid, but also facilitates the uniform distribution of the cooling liquid into the containing cavity from the plurality of injection holes 7, thereby reducing the pressure loss in the flow process of the cooling liquid.

[0026] Further, as shown inFigure 1 As shown, the fluid inlet 3 is a circular hole pipe, and the shape of the inlet liquid storage cavity is a triangular gradually expanding flat pipe. The thickness of the flat pipe can be designed according to specific working conditions, but the thickness of the flat pipe should be less than the inner diameter of the fluid inlet 3. In this way, the circular pipe flow of the cooling liquid in the fluid inlet 3 is converted into the flat pipe flow in the inlet liquid storage cavity 6, which facilitates the uniform entry of the cooling liquid into the injection hole 7.

[0027] Further, as shown in the figure, Figure 3 As shown, along the direction of the flow of the cooling liquid, there is a needle rib 5 left and right center line at the middle position of the needle rib 5. The number of needle ribs on both sides of the needle rib 5 left and right center line is equal, and the positions are corresponding. A plurality of injection holes 7 are uniformly arranged above the left and right symmetry lines of the needle rib 5. In this way, the cooling liquid can flow uniformly into the containing cavity, preventing uneven distribution of the cooling liquid in the containing cavity and avoiding affecting the uniformity of heat dissipation of the liquid cooling heat dissipation device.

[0028] The number of injection holes can be designed according to the size of the chip to be cooled and the flow condition of the cooling liquid. Preferably, the number of injection holes 7 is 8-30, the hole spacing of the injection hole 7 is 1mm-6mm, and the diameter of the injection hole is 0.2mm-1mm. If the number of injection holes 7 is too small or the hole spacing of the injection hole 7 is too large, a cooling liquid vacuum zone will be formed between adjacent injection holes 7, affecting the uniformity of the cooling liquid entering the containing cavity; if the number of injection holes 7 is too large or the hole spacing of the injection hole 7 is too small, the processing difficulty is large.

[0029] Preferably, the position of the lower substrate 2 opposite to the injection hole 7 is provided with an injection flow guide structure 8. The injection flow guide structure 8 is a triangular protrusion arranged on the lower substrate 2, and the cross-sectional area thereof is preferably an isosceles triangle, and the top angle thereof ranges from 40° to 65°. After the cooling liquid enters the containing cavity through the injection hole, it collides with the injection flow guide structure, which reduces the local thermal boundary layer thickness and enhances heat exchange. At the same time, the injection flow guide structure 8 adjusts the vertical flow of the cooling liquid to horizontal flow, greatly reducing the pressure loss generated in the front injection process. Designing the injection flow guide structure 8 as an isosceles triangle can make the cooling liquid evenly distributed to the left and right containing cavities, avoiding uneven heat dissipation.

[0030] Preferably, a round corner is arranged between the injection flow guide structure 8 and the lower substrate 2, and the radius of the round corner ranges from 0.2mm to 1mm. In this way, the transition between the injection flow guide structure 8 and the lower substrate 2 is smoother, further reducing the pressure loss.

[0031] As shown in the figure, Figure 1As shown, two fluid outlets 4 are symmetrically arranged at the left and right ends of the upper cover plate 1, and an outlet liquid storage cavity 12 is further arranged between the fluid outlet 4 and the needle rib 5. Such design enables the cooling liquid to enter the containing cavity from the injection hole above the left and right center lines of the needle rib, and under the action of the injection flow guide structure 8, the cooling liquid is evenly divided into two parts and flows into the microchannels formed by the needle ribs on both sides, and then is buffered by the outlet liquid storage cavity 12 and discharged from the fluid outlets 4 on both sides. Such design of cooling liquid entering from the middle and discharging from both sides has better heat dissipation effect than the traditional cooling liquid entering from one end and discharging from the other end, because the path of the cooling liquid flowing through the high heat generating element (such as a chip) is shortened, which can reduce the problem of large difference in front and back heat dissipation effect caused by long flow channel, and improve the uniformity of heat dissipation.

[0032] Preferably, the cross-sectional shape of the needle rib can be rhombic, circular, drop-shaped or oblong. Designing the needle rib into such shape can reduce the obstruction to the cooling liquid and further reduce the pressure loss. The cross-sectional shape of the needle rib refers to the shape after the needle rib is cut by a plane parallel to the lower substrate 2.

[0033] Further, the cross-sectional shape of the needle rib is preferably rhombic or drop-shaped. When it is rhombic, the length-width ratio of the rhombus is 1.5-3. The rhombic or drop-shaped needle rib can prevent the heat transfer efficiency from being reduced due to the low-speed area of the wake flow, and further reduce the pressure loss.

[0034] The arrangement density of the needle ribs is uniformly distributed along the direction of the flow of the cooling liquid. Preferably, along the direction of the flow of the cooling liquid, the spacing between adjacent needle ribs is 0.2mm-1mm. Preferably, along the direction perpendicular to the flow direction of the cooling liquid, the spacing between adjacent needle ribs is 0.8mm-2.5mm. Preferably, the hydraulic diameter of a single needle rib is 0.1mm-0.7mm. Through verification, compared with the traditional rectangular flow channel, the temperature at the bottom of the lower substrate 2 is obviously reduced under different Reynolds numbers, and the reduction is about 5K-10K, and the comprehensive heat dissipation performance is obviously improved.

[0035] Further, the liquid cooling heat dissipation device further comprises a fluid driving device 9, which is used to drive the cooling liquid into the containing cavity of the liquid cooling heat dissipation device, so that the cooling liquid flows through the microchannels between the needle ribs at a certain flow rate. The liquid cooling effect is directly related to the flow rate, and the greater the flow rate, the better the heat dissipation effect, therefore, the fluid driving device 9 can improve the heat dissipation effect. The specific type of the fluid driving device 9 is not limited in the embodiment, as long as it can drive the cooling liquid into the containing cavity of the liquid cooling heat dissipation device 9, the fluid driving device can be selected from the existing centrifugal pump, positive displacement pump or jet pump, or the future driving device. Specifically, the fluid driving device 9 can be a centrifugal pump, a positive displacement pump or a jet pump. Figure 2 As shown, the fluid driving device 9 is connected to the fluid inlet 3 of the liquid cooling heat dissipation device through a connecting pipe 10.

[0036] The utility model discloses another embodiment still protects a kind of server, the server includes cabinet, chip and the liquid cooling heat sink as described above are arranged in cabinet, liquid cooling heat sink is arranged above chip, more specifically, the lower substrate 2 of liquid cooling heat sink is attached to chip on the side away from containing cavity.When flowing coolant is passed into liquid cooling heat sink, it can take away the heat generated by chip, and dissipate heat for chip.To further improve the heat dissipation performance of liquid cooling heat sink, heat-conducting material, such as heat-conducting silicone grease, heat-conducting pad, etc.

[0037] The server in the above scheme can be the same as the traditional cold plate type heat dissipation, and the liquid cooling heat sink only dissipates heat for the chip, and other heat generating elements rely on the air cooling heat dissipation system to dissipate heat. The utility model also protects another kind of server, which combines cold plate type heat dissipation and immersion type heat dissipation in the heat dissipation system, and the implementation mode is as follows:

[0038] In the server cabinet, an insulating coolant is provided, and the heat generating elements of the server are immersed in the coolant. The liquid cooling heat sink is attached above the chip (not shown). The fluid driving device sucks in the coolant with a lower temperature from the upstream of the coolant, drives the coolant into the containing cavity of the liquid cooling heat sink, and discharges the coolant from the fluid outlet 4 of the liquid cooling heat sink after absorbing the heat generated by the chip. Preferably, a liquid discharge pipe can be connected to the fluid outlet 4 of the liquid cooling heat sink to discharge the high-temperature coolant to the downstream of the coolant, away from the high-heat generating element position. This scheme combines cold plate type heat dissipation and immersion type heat dissipation, which can dissipate heat for other heat generating elements in the server and improve the heat dissipation efficiency of the chip, solving the problem of low local heat dissipation efficiency of immersion type heat dissipation. Moreover, because the coolant needs to contact with electronic components in immersion type heat dissipation, the coolant used is insulating coolant, such as fluorinated liquid, synthetic oil, and silicone oil. Therefore, the liquid cooling heat sink in this scheme does not need to worry about the risk of coolant leakage, which can greatly simplify the sealing structure design and solve the problem of complex sealing structure caused by the use of non-insulating coolant in traditional cold plate type heat dissipation.

[0039] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the utility model, but not to limit them; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent substitutions for part or all of the technical features; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A liquid cooling heat sink, characterized by: The application relates to a liquid cooling heat dissipation device, which comprises an upper cover plate (1) and a lower base plate (2), the upper cover plate (1) and the lower base plate (2) are enclosed to form a containing cavity, the upper cover plate (1) is provided with a fluid inlet (3) and a fluid outlet (4) which are communicated with the containing cavity, the lower base plate (2) is provided with a plurality of needle ribs (5) which are arranged in a staggered manner, the needle ribs (5) are located in the containing cavity, the needle ribs form micro-channels for the flow of cooling liquid, the upper cover plate (1) is provided with an inlet liquid storage cavity (6), one end of the inlet liquid storage cavity (6) is communicated with the fluid inlet (3), the other end of the inlet liquid storage cavity (6) is provided with a plurality of injection holes (7) which are communicated with the containing cavity, and the cross-sectional area of the inlet liquid storage cavity (6) gradually increases from the fluid inlet (3) to the injection holes (7).

2. The liquid cooling heat sink of claim 1, wherein: The fluid inlet (3) is a circular hole, the inlet liquid storage cavity (6) is a flat hole, and the thickness of the inlet liquid storage cavity (6) is smaller than the inner diameter of the fluid inlet (3).

3. The liquid cooling heat sink of claim 1, wherein: The plurality of injection holes (7) are uniformly arranged above the center lines of the left and right needle ribs (5), the number of the injection holes (7) is 8-30, the interval between two adjacent injection holes (7) is 1mm-6mm, and the diameter of the injection holes (7) is 0.2mm-1mm.

4. The liquid cooling heat sink of claim 3, wherein: The lower base plate (2) is provided with an injection flow guide structure (8) at a position opposite to the injection holes (7), the cross section of the injection flow guide structure (8) is an isosceles triangle, the top angle of the isosceles triangle ranges from 40 DEG to 65 DEG, a round corner is arranged between the injection flow guide structure (8) and the lower base plate (2), and the radius of the round corner ranges from 0.2mm to 1mm.

5. The liquid cooling heat sink of claim 1, wherein: The cross-sectional shape of the needle rib (5) is one of a rhombus, a circle, a water drop and an oblong.

6. The liquid cooling heat sink of claim 1, wherein: The cross-sectional shape of the needle rib (5) is a rhombus, and the length-width ratio of the rhombus is 1.5-3.

7. The liquid cooling heat sink of claim 6, wherein: The interval between two adjacent needle ribs (5) along the flow direction of the cooling liquid is 0.2mm-1mm, the interval between two adjacent needle ribs (5) along the direction perpendicular to the flow direction of the cooling liquid is 0.8mm-2.5mm, and the hydraulic diameter of a single needle rib (5) is 0.1mm-0.7mm.

8. The liquid cooling heat sink of any one of claims 1-7, wherein: The liquid cooling heat dissipation device further comprises a fluid driving device (9) and a connecting pipe (10), one end of the connecting pipe (10) is communicated with the fluid driving device (9), and the other end of the connecting pipe (10) is communicated with the fluid inlet (3).

9. A server, characterized by: The application further relates to a server, which comprises a case, a chip and the liquid cooling heat dissipation device as claimed in any one of claims 1-8, the liquid cooling heat dissipation device is arranged above the chip, and the side of the lower base plate (2) far from the containing cavity is attached to the chip.

10. The server of claim 9, wherein: The case is provided with insulating cooling liquid, the heat generating elements of the server are immersed in the cooling liquid, the suction inlet of the fluid driving device (9) is arranged at an upstream position of the cooling liquid to suck the cooling liquid with low temperature into the liquid cooling heat dissipation device, the outlet of the liquid cooling heat dissipation device is connected with a liquid discharge pipe, and the outlet of the liquid discharge pipe is arranged at a downstream position of the cooling liquid.

Images