Inductor heat dissipation device

Abstract

The utility model belongs to the technical field of power supplies, and discloses an inductor heat dissipation device which comprises a base, a shell and a stand column, the base is installed below the shell and forms an installation cavity in a surrounding mode, a water cooling plate and a PCB are arranged in the installation cavity, the water cooling plate is installed on the top face of the base, the PCB is located above the water cooling plate, and the stand column is located above the water cooling plate. A limiting groove is formed in the top surface of the PCB, the limiting groove is in an up-down penetrating shape, the inductor is located in the limiting groove and installed on the PCB, a first through hole is formed in the inductor in the vertical direction, an opening is formed in the position, corresponding to the first through hole, of the PCB, the stand column is located at the position of the first through hole, and the first through hole is communicated with the opening. The bottom end of the limiting groove penetrates through the opening to make contact with the water cooling plate, and heat dissipation glue is poured into the limiting groove. The inductor has the advantages that a more effective heat conduction mode is achieved, it is guaranteed that heat dissipation of the inductor is better, and the space occupancy rate is small.

Description

TECHNICAL FIELD

[0001] The utility model relates to power supply technical field especially relates to a inductance heat abstractor. BACKGROUND

[0002] PCB board is very important component in electric device, and the working of electric device will cause the heating of magnetic device, and the good heat dissipation is an important prerequisite for guaranteeing the stable working of electric device. In the prior art, the heat dissipation of power supply magnetic device is mainly through the air cooling and the glue pouring heat conduction. For specific high-power power supply, the glue pouring heat conduction is not enough to effectively dissipate heat, and the temperature is too high to make the inductance more easily saturated, which influences the reliability of power supply.

[0003] Therefore, it is necessary to provide an inductance heat abstractor, which realizes a more effective heat conduction mode and guarantees better inductance heat dissipation. UTILITY MODEL CONTENT

[0004] The utility model discloses a kind of inductance heat abstractors, high-power power supply direction, provide new scheme for magnetic device heat dissipation, which can effectively solve the technical problems involved in background technology.

[0005] To achieve the above object, the technical scheme of the utility model is as follows:

[0006] A kind of inductance heat abstractor, inductance is used for PCB board, heat abstractor includes base, shell and stand, the base is installed below the shell and is enclosed into a mounting cavity, water-cooled plate and the PCB board are arranged in mounting cavity, the water-cooled plate is installed on the top surface of the base, the PCB board is located above the water-cooled plate, the top surface of the PCB board is provided with limit slot, the limit slot is upper and lower through shape, the inductance is located in the limit slot, and is installed on the PCB board, the inductance is provided with first through-hole along vertical direction, the PCB board is provided with opening corresponding to the position of the first through-hole, the stand is located at the first through-hole, and its bottom end passes through the opening and contacts with the water-cooled plate, and the limit slot is filled with heat dissipation glue.

[0007] As a preferred improvement of the utility model: the heat abstractor further includes fixing screw, the number of the fixing screw is two and is used for fixing the stand, one fixing screw passes through the shell and is connected with the top surface of the stand, and another fixing screw passes through the base and the water-cooled plate and is connected with the bottom surface of the stand.

[0008] As a preferred improvement of the utility model: the top surface of the stand is in abutment with the shell.

[0009] As a preferred improvement of the utility model: the inductor includes a ring-shaped magnetic core, a coil is wound on the magnetic core, the coil includes a first winding part and a second winding part, an installation base plate is arranged below the magnetic core, and the installation base plate is fixed on the PCB.

[0010] As a preferred improvement of the utility model: the PCB through-hole screw is fixed on the water-cooled plate.

[0011] As a preferred improvement of the utility model: the limiting groove is welded on the PCB, and the limiting groove is in the shape of a cuboid.

[0012] As a preferred improvement of the utility model: the water-cooled plate includes a lower plate, a middle plate, an upper plate and a transfer seat, the lower plate, the middle plate and the upper plate are sequentially and closely connected, the middle plate is provided with a liquid channel, the liquid channel is provided with an inlet and an outlet, the upper plate is provided with a connecting hole corresponding to the positions of the inlet and the outlet, the transfer seat is fixed on the upper plate and is arranged corresponding to the positions of the connecting holes, an outer wall of the transfer seat is provided with two transfer holes, the two transfer holes correspond to the two connecting holes respectively, and the transfer holes are used for fixing pipes.

[0013] As a preferred improvement of the utility model: the pipes are connected with a liquid tank, and the liquid tank is provided with a water pump and a refrigeration plate.

[0014] As a preferred improvement of the utility model: the stand is a metal rod.

[0015] As a preferred improvement of the utility model: the installation cavity is provided with a fan.

[0016] The utility model has the beneficial effects as follows:

[0017] The inductor is directly inserted by a stand at a middle position, heat dissipation performance is increased, the inductor adopts ring-shaped heat dissipation design, heat dissipation material uses metal aluminum column heat dissipation material, this heat dissipation mode realizes more effective heat conduction mode on the basis of AB glue heat dissipation, guarantees that the inductor is more excellent in heat dissipation, and space occupancy is small, on the basis of more effective utilization of space, a novel heat dissipation mode is provided, the water-cooled plate at the bottom of the power supply is internally provided with a water flow channel, cold water flows into the water-cooled plate from the water inlet by a water pump, and hot water flows out of the water outlet to take away heat, the heat conduction coefficient between the magnetic inductor and the water-cooled plate and the metal shell is effectively improved, the top and bottom are linked and fixed by screws, heat is conducted out by the upper cover and the bottom plate, and the working temperature is more reliable. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the following embodiment description will be briefly introduced, obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the premise of the drawings.

[0019] Figure 1 It is a schematic diagram of the inductance heat dissipation device of the present application;

[0020] Figure 2 It is an exploded schematic diagram of the heat dissipation device of the present application;

[0021] Figure 3 It is a schematic diagram of the column mounting mode of the present application;

[0022] Figure 4 It is a schematic diagram of the inductance structure of the present application;

[0023] Figure 5 It is a schematic diagram of the water-cooling plate structure of the present application.

[0024] In the figure: 1 - base, 2 - water-cooling plate, 210 - lower plate, 220 - middle plate, 221 - liquid passage, 230 - upper plate, 231 - connecting hole, 240 - transfer seat, 241 - transfer hole, 3 - PCB plate, 301 - opening, 4 - shell, 5 - limiting groove, 6 - inductance, 610 - magnetic core, 611 - first through hole, 620 - coil, 621 - first winding part, 622 - second winding part, 630 - mounting bottom plate, 7 - column, 8 - fixing screw. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below, obviously, the described embodiments are only some embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0026] It should be noted that all directionality indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), if the specific posture changes, the directionality indications also change accordingly.

[0027] In addition, the descriptions such as "first", "second" in the present application are only for the purpose of description and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0028] In the present application, unless otherwise specifically defined and limited, the terms "connection", "fixation" and the like should be broadly understood, for example, "fixation" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate medium, can be internal communication of two elements or interaction relationship of two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] In addition, the technical solutions of various embodiments of the present application can be combined with each other, but it must be based on the fact that the ordinary skilled in the art can realize it, when the combination of technical solutions appears contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist, also not within the scope of protection required by the present application.

[0030] Please refer to Figures 1-3 As shown in the drawings, the utility model provides a kind of inductance heat dissipation device, inductance 6 is used for PCB board 3, heat dissipation device includes base 1, shell 4 and stand 7, the base 1 is installed below the shell 4 and is enclosed into a mounting cavity, water cooling plate 2 and the PCB board 3 are arranged in mounting cavity, the water cooling plate 2 is installed on the top surface of the base 1, the PCB board 3 is located above the water cooling plate 2, the top surface of the PCB board 3 is equipped with limiting slot 5, the limiting slot 5 is upper and lower through shape, the inductance 6 is located in the limiting slot 5, and is installed on the PCB board 3, the inductance 6 is equipped with first through-hole 611 along vertical direction, the PCB board 3 is equipped with opening 301 corresponding the position of the first through-hole 611, the stand 7 is located at the first through-hole 611, and its bottom end passes through the opening 301 and contacts with the water cooling plate 2, the limiting slot 5 is filled with heat dissipation glue (heat-conducting glue, heat-conducting silicone grease etc.).The top surface of the stand 7 is in contact with the shell 4, the through-hole screw of the PCB board 3 is fixed on the water cooling plate 2, the limiting slot 5 is welded on the PCB board 3, and the limiting slot 5 is cuboid.The heat dissipation device further includes fixing screw 8, the number of the fixing screw 8 is two and is used for fixing the stand 7, one fixing screw 8 is connected with the top surface of the stand 7 by passing through the shell 4, and the other fixing screw 8 is connected with the bottom surface of the stand 7 by passing through the base 1 and the water cooling plate 2, and the stand 7 is a metal rod.

[0031] The base 1 and the shell 4 enclose a box, which is equivalent to a power supply case, and the PCB 3 and the water-cooled plate 2 are placed inside, and each electrical device on the PCB 3 is cooled by the water-cooled plate 2. For inductance heat dissipation, a metal aluminum rod (i.e. a column 7) is arranged at the center of the inductor, and then the heat dissipation glue is poured. During use, the inductor generates heat, which is transferred to the metal aluminum rod through the heat dissipation glue, and the metal aluminum rod is in contact with the water-cooled plate 2 and the shell 4 for heat dissipation, so that the inductor can operate stably. Preferably, a fan is arranged in the mounting cavity, and a temperature sensor is arranged to monitor the temperature. When the temperature is too high, the fan is started to cool the inductor, and the air cooling and water cooling are operated at the same time to reduce the temperature of the inductor. The problem of space utilization limitation is solved, and the space utilization is improved. The limitation of the traditional glue pouring method is solved, and the diversity of the scheme is improved. The risk of high temperature of the magnetic device is reduced, and the adaptability is strong, which is suitable for large, medium and small batches.

[0032] In the embodiment, the inductor 6 includes a ring-shaped magnetic core 610, a coil 620 is wound on the magnetic core 610, the coil 620 includes a first winding part 621 and a second winding part 622, and a mounting bottom plate 630 is arranged below the magnetic core 610 and fixed to the PCB 3. The ring-shaped inductor heat dissipation design is adopted. It should be pointed out that other components can be used to achieve the above-mentioned effects, which should belong to the inventive concept of the present application, and should belong to the protection scope of the present application.

[0033] As an embodiment, the water-cooled plate 2 includes a lower plate 210, a middle plate 220, an upper plate 230 and a transfer seat 240, the lower plate 210, the middle plate 220 and the upper plate 230 are sequentially and closely connected, the middle plate 220 is provided with a liquid channel 221 (annular, spiral, etc.), the liquid channel 221 is provided with an inlet and an outlet, the upper plate 230 is provided with a connecting hole 231 corresponding to the positions of the inlet and the outlet, the transfer seat 240 is fixed to the upper plate 230 and arranged corresponding to the positions of the connecting holes 231, the outer wall of the transfer seat 240 is provided with two transfer holes 241, the two transfer holes 241 correspond to the two connecting holes 231 respectively, and the transfer holes 241 are used for fixing pipes. The pipes are connected with a liquid tank, and the liquid tank is provided with a water pump and a refrigeration plate. It should be pointed out that other components can be used to achieve the above-mentioned effects, which should belong to the inventive concept of the present application, and should belong to the protection scope of the present application.

[0034] Although the embodiments of the present application have been disclosed as above, it is not limited to the application listed in the specification and the embodiments, and it can be applied to various fields suitable for the present application. For those skilled in the art, other modifications can be easily realized, and therefore the present application is not limited to specific details and the figures shown and described herein.

Claims

1. An inductive heat sink device, an inductor (6) for a PCB board (3), characterized in that: The heat dissipation device comprises a base (1), a shell (4) and a column (7), the base (1) is installed below the shell (4) and encloses an installation cavity, a water cooling plate (2) and a PCB plate (3) are arranged in the installation cavity, the water cooling plate (2) is installed on the top surface of the base (1), the PCB plate (3) is located above the water cooling plate (2), the top surface of the PCB plate (3) is provided with a limiting groove (5), the limiting groove (5) is in a through shape from top to bottom, an inductor (6) is located in the limiting groove (5) and is installed on the PCB plate (3), the inductor (6) is provided with a first through hole (611) in the vertical direction, the PCB plate (3) is provided with an opening (301) corresponding to the position of the first through hole (611), the column (7) is located at the first through hole (611) and the bottom end thereof is in contact with the water cooling plate (2) through the opening (301), and the limiting groove (5) is filled with heat dissipation glue.

2. An inductive heat sink device as claimed in claim 1, characterized in that: The heat dissipation device further comprises fixing screws (8), the number of the fixing screws (8) is two and the fixing screws (8) are used for fixing the column (7), one fixing screw (8) is connected with the top surface of the column (7) through the shell (4), and the other fixing screw (8) is connected with the bottom surface of the column (7) through the base (1) and the water cooling plate (2).

3. The inductive heat dissipating device of claim 1, wherein: The top surface of the column (7) is in abutment with the shell (4).

4. The inductive heat sink device of claim 1, wherein: The inductor (6) comprises a ring-shaped magnetic core (610), a coil (620) is wound on the magnetic core (610), the coil (620) comprises a first winding part (621) and a second winding part (622), and a mounting bottom plate (630) is arranged below the magnetic core (610) and is fixed on the PCB plate (3).

5. The inductive heat sink device of claim 1, wherein: The through hole screw of the PCB plate (3) is fixed on the water cooling plate (2).

6. The inductive heat sink device of claim 1, wherein: The limiting groove (5) is welded on the PCB plate (3) and is in a cuboid shape.

7. The inductive heat sink device of claim 1, wherein: The water cooling plate (2) comprises a lower plate (210), a middle plate (220), an upper plate (230) and a transfer seat (240), the lower plate (210), the middle plate (220) and the upper plate (230) are sequentially and closely connected, the middle plate (220) is provided with a liquid channel (221), the liquid channel (221) is provided with an inlet and an outlet, the upper plate (230) is provided with a connecting hole (231) corresponding to the positions of the inlet and the outlet, the transfer seat (240) is fixed on the upper plate (230) and is arranged corresponding to the positions of the connecting holes (231), the outer wall of the transfer seat (240) is provided with two transfer holes (241), the two transfer holes (241) correspond to the two connecting holes (231) respectively, and the transfer holes (241) are used for fixing pipes.

8. An inductive heat sink device as claimed in claim 7, characterized in that: The pipes are connected with a liquid tank, the liquid tank is provided with a water pump and a refrigeration plate.

9. The inductive heat dissipating device of claim 1, wherein: The column (7) is a metal rod.

10. The inductive heat dissipating device of claim 1, wherein: The installation cavity is provided with a fan.

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