Double-platform feeding and discharging device for three-temperature sorting machine

By designing a dual-platform loading and unloading device, the problem of low detection efficiency in existing three-temperature sorting machines is solved, achieving a highly efficient chip detection process and reducing the idle time in the detection area.

CN223566590UActive Publication Date: 2025-11-18KUNSHAN NEW JINHONG INTELLIGENT EQUIP TECH CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202423159517.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-20
Publication Date
2025-11-18
Estimated Expiration
2034-12-20

AI Technical Summary

Technical Problem

The existing three-temperature sorting machine has low detection efficiency, mainly because the number of chips that can be accommodated at the detection station is limited, which requires frequent transfer of the robotic arm after each detection, thus affecting efficiency.

Method used

The device employs a dual-platform loading and unloading system, including a lower-level transfer component and an upper-level transfer component. The lower platform transports the chip to be tested, while the upper platform transports the chip that has completed testing. Combined with a temperature control unit, this achieves efficient chip transport and testing.

Benefits of technology

This improves the efficiency of chip detection, reduces the idle time of the detection area, and enhances the overall detection efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223566590U_ABST
    Figure CN223566590U_ABST
Patent Text Reader

Abstract

The utility model relates to a double-platform feeding and discharging device for a three-temperature sorting machine, which comprises a lower-layer material moving component, a lower-layer material moving component, a lower-layer material moving component and a lower-layer material moving component, the upper-layer material moving assembly is fixedly mounted on the lower-layer platform, and the upper-layer material moving assembly comprises an upper-layer driving part and an upper-layer platform driven by the upper-layer driving part; the temperature control part comprises a temperature guide plate, a refrigerant flow channel formed by extending in the temperature guide plate and a heating piece attached to the temperature guide plate, and the temperature guide plate is fixedly installed in the lower layer platform; the semiconductors needing to be detected are conveyed through the lower-layer material moving assembly, and the detected semiconductors are conveyed through the upper-layer material moving assembly, so that the situation that the detection area is vacant during feeding and discharging of the semiconductors is reduced, and the detection efficiency of the semiconductors is improved.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of semiconductor detection, and particularly relates to a double-platform feeding and discharging device for a three-temperature sorting machine. BACKGROUND

[0002] Due to individual differences in the production process of semiconductors or chips, the performance is high or low, the quality is good or bad, and the appearance has flaws, so the chips need to be sorted in time during the production process, thereby providing a reference for subsequent production.

[0003] According to Chinese patent CN216705129U, a chip high-low temperature sorting test machine is disclosed. The machine reabsorbs the chip through a carrying manipulator, places the chip in a workpiece placement position in a transfer disc, and a transplanting manipulator takes the chip from the transfer disc and places it in a preheating position in a preheating disc. After the preheating disc preheats the chip to a specified temperature, the transplanting manipulator takes the chip from the preheating disc and places it in a detection station. A chip pressure test module slides to the detection station directly above, presses a temperature control head on the surface of the chip through a positioning pin hole to control the temperature, and controls the temperature of the chip in real time through the temperature control head during the test process. The transplanting manipulator takes back the test chip and places it back in the transfer disc to send the chip out of the sealed shuttle channel, and the carrying manipulator takes away the chip. However, the number of chips accommodated by the detection station is limited, and after each detection is completed, the transplanting manipulator needs to remove the chip and take the chip from the preheating disc and place it in the detection station, which greatly reduces the detection efficiency.

[0004] Therefore, it is necessary to develop a double-platform feeding and discharging device for a three-temperature sorting machine to solve the above problems. Content of the utility model

[0005] The utility model aims at providing a double-platform feeding and discharging device for a three-temperature sorting machine with high detection efficiency.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a double-platform feeding and discharging device for a three-temperature sorting machine, which comprises:

[0007] The lower layer material moving assembly comprises a lower layer driving part and a lower layer platform driven by the lower layer driving part.

[0008] The upper layer material moving assembly is fixedly installed on the lower layer platform, and comprises an upper layer driving part and an upper layer platform driven by the upper layer driving part.

[0009] The temperature control part comprises a temperature guide plate, a refrigerant flow channel formed in the temperature guide plate, and a heating sheet attached to the temperature guide plate. The temperature guide plate is fixedly installed in the lower layer platform.

[0010] Further, the lower layer driving part comprises a driving motor, a pair of transmission wheels driven by the driving motor, and a transmission belt surrounding the pair of transmission wheels, the transmission belt driving the lower layer platform to move.

[0011] Further, the lower layer platform is provided with a lower layer sliding block at the bottom, and a lower layer track below the lower layer platform, the lower layer sliding block moving along the lower layer track.

[0012] Further, the lower layer platform is provided with a lower layer sliding block at the bottom, and a lower layer track below the lower layer platform, the lower layer sliding block moving along the lower layer track.

[0013] Further, the lower layer moving assembly is further provided with a first sensor, the lower layer platform is fixedly provided with a first sensing sheet, and the first sensor detects the position of the first sensing sheet.

[0014] Further, the upper layer moving assembly comprises a support frame and an upper layer track installed on the support frame, the number of the support frame is a pair, and the support frame is located on the upper surface of both ends of the lower layer platform, and the upper layer track is laid on the top of the support frame.

[0015] Further, the upper layer driving part comprises a pushing cylinder and a connecting piece pushed by the pushing cylinder, and the connecting piece is fixedly connected with the upper layer platform.

[0016] Further, the upper layer platform is provided with an upper layer sliding block at the bottom, the upper layer sliding block is movably connected with the upper layer track, and the pushing cylinder pushes the upper layer platform to move along the upper layer track through the connecting piece.

[0017] Further, the upper layer moving assembly is further provided with a second sensor, the second sensor is installed on the lower layer platform, the upper layer platform is fixedly provided with a second sensing sheet, and the second sensor detects the position of the second sensing sheet.

[0018] Further, the upper surface of the lower layer platform and the upper layer platform is fixedly provided with a material placing disc, and the material placing disc is provided with a material placing position recessed inward from the surface of the material placing disc.

[0019] Compared with the prior art, the three-temperature sorting machine with the double-platform feeding and discharging device has the characteristics of high detection efficiency, the lower layer moving assembly is used for conveying the semiconductor to be detected, the upper layer moving assembly is used for conveying the semiconductor after detection, the vacancy of the detection area during feeding and discharging is reduced, and the detection efficiency of the semiconductor is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment description, obviously, the drawings in the following description are only some embodiments of the utility model, and for the ordinary skilled in the art, other drawings can be obtained without creative labor on the premise of the drawings.

[0021] Figure 1 It is a three-dimensional structure schematic view of the double-platform feeding and discharging device for the three-temperature sorting machine.

[0022] Figure 2 It is a three-dimensional structure schematic view of the double-platform feeding and discharging device for the three-temperature sorting machine. Figure 1 It is a three-dimensional structure schematic view of the double-platform feeding and discharging device for the three-temperature sorting machine.

[0023] Figure 3 It is a three-dimensional structure schematic view of the double-platform feeding and discharging device for the three-temperature sorting machine. Figure 1 It is a three-dimensional structure schematic view of the double-platform feeding and discharging device for the three-temperature sorting machine.

[0024] Figure 4 It is a three-dimensional structure schematic view of the double-platform feeding and discharging device for the three-temperature sorting machine. Figure 3 It is a three-dimensional structure schematic view of the double-platform feeding and discharging device for the three-temperature sorting machine.

[0025] In the drawing: 1, bottom plate; 2, lower layer material moving assembly; 3, upper layer material moving assembly; 4, temperature control part; 21, lower layer track; 22, lower layer driving part; 20, lower layer platform; 23, driving motor; 24, transmission wheel; 25, transmission belt; 26, lower layer sliding block; 27, clamping plate; 28, first sensor; 29, first induction sheet; 210, mounting groove; 31, support frame; 32, upper layer track; 33, upper layer driving part; 34, upper layer platform; 35, pushing cylinder; 36, connecting piece; 37, upper layer sliding block; 38, second sensor; 39, second induction sheet; 41, temperature guide plate; 42, heating sheet; 43, coolant flow channel; 5, material placing disc; 51, material placing position. DETAILED DESCRIPTION

[0026] The technical scheme in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model, obviously, the described embodiments are only some embodiments of the utility model, and not all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the ordinary skilled in the art without creative labor are within the protection scope of the utility model.

[0027] Please refer to Figures 1 to 4The utility model discloses a double -platform feeding and discharging device for three -temperature sorting machine, it includes bottom plate 1, the lower layer material shifting subassembly 2 of installing on bottom plate 1, the upper layer material shifting subassembly 3 located the lower layer material shifting subassembly 2 top, temperature control part 4 of changing the temperature of the lower layer material shifting subassembly 2.

[0028] Please see Figure 1 Bottom plate 1 is in horizontal state, is installed in three -temperature sorting machine inside, is used for bearing the lower layer material shifting subassembly 2 and upper layer material shifting subassembly 3 and temperature control part 4.

[0029] Please see Figures 1 to 2 The lower layer material shifting subassembly 2 includes the lower layer track 21 of laying on bottom plate 1, the lower layer drive part 22 of installing in the lower layer track 21 outside, the lower layer platform 20 of being pushed by the lower layer drive part 22, and the number of lower layer track 21 is a pair, and the relative parallel arrangement is set up, and the lower layer drive part 22 includes drive motor 23, a pair of transmission wheel 24 driven by drive motor 23, transmission belt 25 around the pair of transmission wheel 24, and drive motor 23 is installed on bottom plate 1, and drive transmission wheel 24 rotates, and the pair of transmission wheel 24 is installed at the both ends of lower layer track 21 respectively, and is linked through transmission belt 25.

[0030] The lower layer platform 20 includes the lower layer slider 26 at its bottom and the clamping plate 27 at one end of the lower layer platform 20, the lower layer slider 26 is installed at the bottom of the both ends of the lower layer platform 20 respectively, the lower layer slider 26 is movably connected with the pair of lower layer tracks 21 respectively, and the clamping plate 27 is located above or below the lower layer platform 20 and clamps the transmission belt 25 with the lower layer platform 20, and the drive motor 23 drives the lower layer platform 20 to move along the lower layer track 21 through the transmission belt 25.

[0031] The lower layer material shifting subassembly 2 is further provided with a first sensor 28, the first sensor 28 is installed on the bottom plate 1, and the lower layer platform 20 is fixedly provided with a first sensing sheet 29, and the first sensor 28 is used for detecting the position of the first sensing sheet 29.

[0032] Please see Figure 2 The upper layer material shifting subassembly 3 includes support frame 31, upper layer track 32 installed on support frame 31, upper layer drive part 33 installed on one side of upper layer track 32, upper layer platform 34 pushed by upper layer drive part 33, and the number of support frame 31 is a pair, and is located on the upper surface of the both ends of lower layer platform 20 respectively, and the bottom of support frame 31 is fixedly connected with lower layer platform 20, and the top thereof extends vertically upward, and upper layer track 32 is laid on the top of support frame 31, and extends from one end of support frame 31 to the other end thereof, and upper layer track 32 is parallel with lower layer track 21.

[0033] The upper layer driving part 33 comprises a pushing cylinder 35, a connecting piece 36 pushed by the pushing cylinder 35, one end of the connecting piece 36 extends to the upper layer platform 34 and is fixedly connected with the upper layer platform 34, the bottom of the upper layer platform 34 is provided with an upper layer sliding block 37, the upper layer sliding block 37 is movably connected with the upper layer track 32, and the pushing cylinder 35 pushes the upper layer platform 34 to move along the upper layer track 32 through the connecting piece 36.

[0034] The upper layer material moving assembly 3 is further provided with a second sensor 38, the second sensor 38 is installed on the lower layer platform 20, the upper layer platform 34 is fixedly provided with a second sensing sheet 39, and the second sensor 38 is used for detecting the position of the second sensing sheet 39.

[0035] Please refer to Figures 3 to 4 The temperature control part 4 comprises a temperature guide plate 41 and a heating sheet 42 attached to the temperature guide plate 41, the lower layer platform 20 is provided with a mounting groove 210, the temperature guide plate 41 is located in the mounting groove 210 and is fixedly connected with the lower layer platform 20, the temperature guide plate 41 is provided with a refrigerant flow channel 43, the refrigerant flow channel 43 extends in the temperature guide plate 41 in a zigzag manner, when cooling medium passes through the refrigerant flow channel 43, the temperature of the temperature guide plate 41 is reduced, and when the heating sheet 42 generates heat, the temperature of the temperature guide plate 41 is increased.

[0036] Specifically, the lower layer platform 20 and the upper layer platform 34 are both fixedly provided with a material placing disc 5 on the upper surface, the material placing disc 5 has a material placing position 51 formed by being recessed inward from the surface, and the shape, position and number of the material placing position 51 can be changed according to requirements.

[0037] When the double-platform feeding and discharging device for the three-temperature sorting machine is used, other equipment such as a mechanical hand and a suction device is used to place the semiconductor to be detected on the lower layer platform 20, when low temperature is needed, cooling medium passes through the refrigerant flow channel 43 to reduce the temperature of the temperature guide plate 41 and the lower layer platform 20, when high temperature is needed, the heating sheet 42 generates heat to increase the temperature of the temperature guide plate 41 and the lower layer platform 20, the lower layer platform 20 and the upper layer platform 34 are staggered, the lower layer driving part 22 pushes the lower layer platform 20 to reach a detection position, other detection components grasp or suck the semiconductor to test, after testing is completed, the upper layer driving part 33 pushes the upper layer platform 34 to move above the lower layer platform 20, other detection components place the tested semiconductor on the upper layer platform 34, the upper layer driving part 33 pushes the upper layer platform 34 to move again, the lower layer platform 20 and the upper layer platform 34 are staggered, other equipment such as a mechanical hand and a suction device is used to transfer the tested semiconductor, and meanwhile, other detection components continue to grasp or suck the semiconductor not detected on the lower layer platform 20 to test.

[0038] The utility model discloses a double -platform unloading device for three temperature sorting machine has the characteristics of high detection efficiency, through the lower layer material transfer subassembly conveying needs the semiconductor of detecting, the semiconductor of the upper layer material transfer subassembly conveying detection is completed, has reduced the semiconductor in unloading, and the empty condition of detection area appears, has increased the detection efficiency of semiconductor.

[0039] The above is only the preferred embodiment of the present application, but the protection scope of the present application is not limited to this. Any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A double platform feeding and discharging device for three-temperature sorting machines, characterized in that, It includes: Lower layer material moving assembly (2), including lower layer driving part (22), lower layer platform (20) driven by the lower layer driving part (22); Upper layer material moving assembly (3) is fixedly installed on the lower layer platform (20), and the upper layer material moving assembly (3) includes upper layer driving part (33), upper layer platform (34) driven by the upper layer driving part (33); Temperature control part (4), including temperature guide plate (41), refrigerant flow channel (43) formed in the temperature guide plate (41), heating sheet (42) attached to the temperature guide plate (41), the temperature guide plate (41) is fixedly installed in the lower layer platform (20).

2. The dual platform up and down loading device for three-temperature sorters of claim 1, wherein, The lower layer driving part (22) includes a drive motor (23), a pair of transmission wheels (24) driven by the drive motor (23), a transmission belt (25) surrounding the pair of transmission wheels (24), and the transmission belt (25) drives the lower layer platform (20) to move.

3. The double platform loading and unloading device for three-temperature sorting machines according to claim 2, characterized in that, The bottom of the lower layer platform (20) is provided with a lower layer sliding block (26), and the lower layer platform (20) is provided with a lower layer rail (21) below.

4. The dual platform up and down loading device for three-temperature sorters of claim 2, wherein, The outer end of the lower layer platform (20) is fixedly provided with a clamping plate (27), and the clamping plate (27) clamps the transmission belt (25) with the lower layer platform (20).

5. The dual platform up and down loading device for triple temperature sorter according to claim 1, wherein, The lower layer material moving assembly (2) is also provided with a first sensor (28), and the lower layer platform (20) is fixedly provided with a first induction sheet (29), and the first sensor (28) detects the position of the first induction sheet (29).

6. The dual platform up and down loading device for triple temperature sorter according to claim 1, wherein, The upper layer material moving assembly (3) includes a support frame (31) and an upper layer rail (32) installed on the support frame (31), the number of the support frame (31) is a pair, which is located on the upper surface of the two ends of the lower layer platform (20), and the upper layer rail (32) is laid on the top of the support frame (31).

7. The dual platform up and down loading device for three-temperature sorters of claim 6, wherein, The upper layer driving part (33) includes a push cylinder (35) and a connecting piece (36) pushed by the push cylinder (35), and the connecting piece (36) is fixedly connected with the upper layer platform (34).

8. The dual platform up and down loading device for three-temperature sorters of claim 7, wherein, The bottom of the upper layer platform (34) is provided with an upper layer sliding block (37), the upper layer sliding block (37) is movably connected with the upper layer rail (32), and the push cylinder (35) pushes the upper layer platform (34) to move along the upper layer rail (32) through the connecting piece (36).

9. The dual platform up and down loading device for triple temperature sorter according to claim 1, wherein, The upper layer material moving assembly (3) is also provided with a second sensor (38), and the second sensor (38) is installed on the lower layer platform (20), and the upper layer platform (34) is fixedly provided with a second induction sheet (39), and the second sensor (38) detects the position of the second induction sheet (39).

10. The dual platform up and down loading device for triple temperature sorter of claim 1, wherein, The upper surface of the lower layer platform (20) and the upper layer platform (34) is fixedly provided with a material placing disc (5), and the material placing disc (5) has a material placing position (51) recessed inward from the surface thereof.

Citation Information

Patent Citations

  • Chip high and low temperature sorting tester

    CN216705129U