Instant heating groove device for semiconductor processing and wet process machine table

Abstract

The utility model discloses an instant heating groove device for semiconductor processing and a wet process machine table, and relates to the technical field of semiconductor processing, and the instant heating groove device for semiconductor processing comprises an inner groove body, a first outer groove body, a second outer groove body and an instant heating assembly; the inner tank body is in a ball kettle shape; the first outer tank body is sleeved outside the inner tank body, and a first heating chamber is formed between the first outer tank body and the inner tank body; the second outer tank body is sleeved outside the first outer tank body, and a second heating chamber is formed between the second outer tank body and the first outer tank body; the instant heating assembly communicates with the first heating cavity and is used for circularly providing a first heat-conducting medium into the first heating cavity; and the second heating chamber is used for accommodating a second heat-conducting medium. And through cooperation between preheating of the second heat-conducting medium and heating of the first heat-conducting medium provided by the instant heating assembly, the solution in the inner tank body rapidly reaches the target temperature, and the heating efficiency is further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, in particular to a semiconductor processing instant heating tank device and wet processing machine. BACKGROUND

[0002] In the field of semiconductor manufacturing, cleaning and wet etching are two crucial steps that are essential to ensure the cleanliness of the wafer surface and the precise removal of material layers. In order to achieve these goals, the tank device design in the wet processing machine must be able to efficiently control the temperature of the solution inside the tank, as different chemical solutions have different reaction rates and cleaning effects at different temperatures. Therefore, the design of the heating module in the tank device is increasingly important.

[0003] The traditional heating method is water bath heating, for example, the Chinese invention patent CN118053795B discloses a scientific research type wet etching full automatic system and machine, which designs a heating chamber between the outer tank body and the inner tank body, the outer tank body is provided with a medium input pipe and a medium output pipe communicating with the heating chamber, and then a heating device is installed in the heating chamber for heating the heat conduction heating in the heating chamber to heat the water area of the inner tank body. However, the above-mentioned heating method has the following shortcomings after research: 1. The heating efficiency is relatively low; 2. The heating uniformity is relatively poor.

[0004] Therefore, it is urgent to provide a new solution to solve the above technical problems. CONTENT OF THE INVENTION

[0005] Therefore, the purpose of the present application is to provide a semiconductor processing instant heating tank device and wet processing machine to solve the technical problems of low heating efficiency and poor instant heating uniformity of the existing water bath heating method.

[0006] To achieve the above technical purpose, the present application provides a semiconductor processing instant heating tank device, which comprises an inner tank body, a first outer tank body, a second outer tank body and an instant heating assembly.

[0007] The inner tank body is in the shape of a spherical kettle.

[0008] The first outer tank body is sleeved outside the inner tank body, and a first heating chamber is formed between the first outer tank body and the inner tank body.

[0009] The second outer tank body is sleeved outside the first outer tank body, and a second heating chamber is formed between the second outer tank body and the first outer tank body.

[0010] The instant heating assembly is in communication with the first heating chamber and is used to provide a first heat conduction medium to the first heating chamber.

[0011] The second heating chamber is used to accommodate a second heat conduction medium.

[0012] Further, the first outer tank and the second outer tank are both shaped to match the inner tank.

[0013] Further, the outer tank is provided with a first medium inlet and a first medium outlet.

[0014] The instant heating assembly comprises an instant heater and a circulating pump.

[0015] The input end of the instant heater is connected to the first medium outlet through a first pipeline.

[0016] The output end of the instant heater is connected to the first medium inlet through a second pipeline.

[0017] The circulating pump is installed between the input end of the instant heater and the first pipeline, or between the output end of the instant heater and the second pipeline.

[0018] Further, the first medium inlet is arranged at the top of the side wall of the first outer tank.

[0019] The first medium outlet is arranged at the bottom wall of the first outer tank, or at the bottom of the side wall of the first outer tank.

[0020] Further, the first medium inlet is multiple and evenly distributed around the circumference of the first outer tank.

[0021] Further, the second outer tank is provided with a second medium inlet for input of the second heat-conducting medium and a second medium outlet for output of the second heat-conducting medium.

[0022] Further, the first medium outlet is installed with an on-off valve.

[0023] The first pipeline or the second pipeline is further installed with a first flow valve.

[0024] The second medium inlet is installed with a second flow valve.

[0025] Further, the first heat-conducting medium is a liquid heat-conducting medium.

[0026] The second heat-conducting medium is a gaseous heat-conducting medium.

[0027] Further, the inner tank is arranged with a plurality of temperature sensors and liquid level sensors along the depth direction.

[0028] Further, the outer top of the side wall of the inner tank is sleeved with an overflow tank.

[0029] The bottom of the inner tank is connected with a liquid discharge pipe.

[0030] Further, the first heating chamber is provided with a spiral flow guide groove surrounding the inner tank body, for guiding the first heat conducting medium to form a circulating flow.

[0031] The application further discloses a wet processing machine comprising the instant heating tank device for semiconductor processing.

[0032] From the above technical solutions, the instant heating tank device for semiconductor processing has the following beneficial effects:

[0033] 1. The inner tank body adopts a spherical kettle structure design, which provides an optimized space for heat circulation and flow through the curved surface form, saves more space compared to a traditional square tank, and has a narrow slot feature, which reduces the conduction area with the external air and reduces the loss of volatile liquid.

[0034] 2. The first heat conducting medium is provided by the instant heating assembly, which effectively improves the heating efficiency compared to the traditional water bath heating built-in setting mode of the heater, and realizes the module externalization, so that the overall size of the tank body can be miniaturized, and the spherical kettle-shaped inner tank body can achieve better heating uniformity.

[0035] 3. The second heat conducting medium preheats and cooperates with the first heat conducting medium provided by the instant heating assembly, so that the solution in the inner tank body can quickly reach the target temperature (such as 37℃), and the heating efficiency is further improved.

[0036] 4. The second heat conducting medium also provides a heat preservation effect, thereby reducing the energy consumption in the constant temperature stage, and achieving a good balance between efficient heating and low consumption heat preservation. DETAILED DESCRIPTION

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0038] Figure 1 Fig. 1 is a structural schematic diagram of a semiconductor processing instant heating tank device provided in the present application;

[0039] In the figure: 1, inner tank body; 11, liquid discharge pipe; 12, overflow tank; 2, first outer tank body; 21, first medium inlet; 22, first medium outlet; 3, second outer tank body; 31, second medium inlet; 32, second medium outlet; 33, second flow valve; 41, first heating chamber; 42, second heating chamber; 5, instant heating assembly; 51, circulating pump; 52, instant heater; 53, first pipeline; 54, second pipeline; 55, on-off valve; 56, first flow valve; 61, temperature sensor; 62, liquid level sensor. DETAILED DESCRIPTION

[0040] The technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0041] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0042] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be replaceably connected, or it can be integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0043] The embodiments of the present application disclose a kind of instant heating tank device for semiconductor processing and wet process machine.

[0044] Please refer to Figure 1 An embodiment of the instant heating tank device for semiconductor processing provided in the embodiments of the present application includes:

[0045] Inner tank body 1, first outer tank body 2, second outer tank body 3 and instant heating assembly 5.

[0046] The inner tank 1 is in the shape of a spherical kettle, and has a slot at the top.

[0047] The first outer tank 2 is sleeved outside the inner tank 1 and is sealingly connected with the inner tank 1, so as to form a first heating chamber 41 with the inner tank 1.

[0048] The second outer tank 3 is sleeved outside the first outer tank 2 and is sealingly connected with the first outer tank 2, so as to form a second heating chamber 42 with the first outer tank 2.

[0049] The instant heating assembly 5 is in communication with the first heating chamber 41, and is used to provide a first heat-conducting medium to the first heating chamber 41 in circulation, and the second heating chamber 42 is used to accommodate a second heat-conducting medium.

[0050] In the preheating stage: the second heat-conducting medium is used to preheat the first outer tank 2, so that the temperature of the first outer tank 2 approaches the target temperature (37-40℃), reducing the temperature difference loss when the first heat-conducting medium is injected by the instant heating assembly 5, and accelerating the overall temperature rise.

[0051] In the heating stage: the second heat-conducting medium creates a “smoldering environment” for the first outer tank 2, wrapping the first outer tank 2 to continuously transfer heat, assisting the instant heating assembly 5 to improve heating efficiency, while avoiding local overheating in the first heating chamber.

[0052] In the constant temperature stage: the second heat-conducting medium is used to keep the temperature of the second outer tank 3, realizing the heat preservation effect, reducing the start-stop frequency of the instant heating assembly 5, and reducing energy waste.

[0053] The instant heating tank device for semiconductor processing designed in the present application has the following beneficial effects:

[0054] 1. The inner tank 1 adopts a spherical kettle structure design, which provides an optimized space for heat circulation and flow through the curved surface form, saving more space compared to traditional square tanks, and having a narrow slot feature to reduce the conduction area with the external air and reduce the loss of volatile liquids.

[0055] 2. The first heat-conducting medium provided by the instant heating assembly 5 effectively improves the heating efficiency compared to the traditional water bath heating built-in setting method, while realizing the module externalization, so that the overall size of the tank can be miniaturized, and the spherical kettle-shaped inner tank 1 can achieve better heating uniformity.

[0056] 3. The second heat-conducting medium preheating cooperates with the first heat-conducting medium heating provided by the instant heating assembly 5, so that the solution in the inner tank 1 quickly reaches the target temperature (such as 37℃), further improving the heating efficiency.

[0057] 4. The second heat-conducting medium also provides a heat preservation effect, thereby reducing the energy consumption in the constant temperature stage, achieving a good balance between efficient heating and low consumption.

[0058] 5, three-layer closed structure design, realize heating (temperature control) - heat preservation - protection trinity.

[0059] The above is an embodiment of a semiconductor processing instant heating tank device provided by the embodiment of the application, and the following is an embodiment of a semiconductor processing instant heating tank device provided by the embodiment of the application, please refer to Figure 1 .

[0060] Based on the above embodiment one scheme:

[0061] Further, the shapes of the first outer tank body 2 and the second outer tank body 3 are matched with the inner tank body 1. The matched shapes make the structure of the whole device more compact and the space utilization rate higher. And this adaptability is conducive to the uniform distribution of heat of the first heating chamber 41 and the second heating chamber 42, and can better realize the heating and heat preservation effect of the first outer tank body 2 and the inner tank body 1.

[0062] Further, the outer tank body is provided with a first medium inlet and a first medium outlet 22; the instant heating assembly 5 comprises an instant heater 52 and a circulating pump 51; the input end of the instant heater 52 is connected to the first medium outlet 22 through a first pipeline 53; the output end of the instant heater 52 is connected to the first medium inlet 21 through a second pipeline 54; the circulating pump 51 is installed between the input end of the instant heater 52 and the first pipeline 53, or between the output end of the instant heater 52 and the second pipeline 54.

[0063] This connection mode ensures that the first heat-conducting medium can form a stable circulation loop between the instant heating assembly 5 and the first heating chamber 41. Through the action of the circulating pump 51, the first heat-conducting medium flows out from the first medium outlet 22 of the first outer tank body 2, is heated after passing through the instant heater 52, and then reenters the first heating chamber 41 through the first medium inlet 21 to continuously provide heat for the inner tank body 1. This circulating heating mode can flexibly adjust the temperature and flow of the first heat-conducting medium according to the actual temperature demand of the inner tank body 1, so as to realize accurate temperature control.

[0064] The instant heater 52 is an existing instant heating structure design, such as an instant heating pipe, which is not described in detail.

[0065] Further, the first medium inlet 21 is arranged at the top position of the side wall of the first outer tank body 2; and the first medium outlet 22 is arranged at the bottom wall of the first outer tank body 2, or at the bottom position of the side wall of the first outer tank body 2.

[0066] Such a setting is conducive to the first heat-conducting medium to form a good flow path in the first heating chamber 41. The first heat-conducting medium entering from the first medium inlet 21 at the top can fill the entire first heating chamber 41 from top to bottom, fully contacting the inner tank 1 and uniformly transferring heat to the inner tank 1. The first medium outlet 22 at the bottom facilitates the discharge of the first heat-conducting medium that has released part of the heat, ensuring that the first heat-conducting medium in the first heating chamber 41 always maintains a high temperature, improving the heating efficiency.

[0067] Further, the first medium inlet 21 is multiple and uniformly distributed around the circumference of the first outer tank 2. Multiple uniformly distributed first medium inlets 21 enable the first heat-conducting medium to enter the first heating chamber 41 more uniformly, avoiding the problem of local overheating or uneven heating caused by a single inlet. The first heat-conducting medium enters the first heating chamber 41 from all directions at the same time, quickly forming a uniform heat field in the first heating chamber 41, further improving the heating effect and uniformity of the inner tank 1.

[0068] Further, the second outer tank 3 is provided with a second medium inlet 31 for the input of the second heat-conducting medium and a second medium outlet 32 for the output of the second heat-conducting medium. The arrangement of the second medium inlet 31 and the second medium outlet 32 facilitates the entry and exit of the second heat-conducting medium, so that the flow and temperature of the second heat-conducting medium can be flexibly controlled according to the needs of different stages. In the preheating stage, a certain temperature of the second heat-conducting medium can be quickly injected through the second medium inlet 31 to rapidly heat the first outer tank 2; in the heating stage, the input and output of the second heat-conducting medium is continuously adjusted to maintain a "smoldering environment"; in the constant temperature stage, precise temperature maintaining effect is achieved by appropriately controlling the output of the second heat-conducting medium.

[0069] Further, the first medium outlet 22 is installed with an on-off valve 55; the first pipe 53 or the second pipe 54 is further installed with a first flow valve 56; and the second medium inlet 31 is installed with a second flow valve 33.

[0070] The on-off valve 55 can be conveniently controlled to determine whether the first heat-conducting medium flows out of the first heating chamber 41, and when it is necessary to stop the circulation of the first heat-conducting medium, the on-off valve 55 can be closed. The first flow valve 56 is used to accurately adjust the flow of the first heat-conducting medium, and according to the actual heating needs of the inner tank 1, the flow rate of the first heat-conducting medium can be flexibly changed to achieve better heating effect and temperature control precision. The second flow valve 33 can control the flow of the second heat-conducting medium entering the second heating chamber 42, and in different stages such as preheating, heating and constant temperature stage, the flow of the second heat-conducting medium is adjusted to achieve the best heating and temperature maintaining effect of the first outer tank 2.

[0071] Further, the first heat-conducting medium is a liquid heat-conducting medium, such as water, heat-conducting oil, etc.; and the second heat-conducting medium is a gaseous heat-conducting medium, such as air.

[0072] The liquid heat-conducting medium has a high specific heat capacity and good heat-conducting performance, and can carry more heat and effectively transfer the heat to the inner tank 1. Water, as a common liquid heat-conducting medium, is widely available, low in cost, and stable in chemical properties; heat-conducting oil has a higher boiling point and better thermal stability, and is suitable for higher temperature heating requirements. Air, as a gaseous heat-conducting medium, has good fluidity and diffusivity, and can uniformly wrap the first outer tank 2 to achieve uniform heat transfer. At the same time, air as a heat-conducting medium does not require additional storage and transportation equipment, reducing the complexity and cost of the device.

[0073] Taking the first heat-conducting medium as a liquid heat-conducting medium as an example, the on-off valve 55 can be a magnetic valve, and the first flow valve 56 is a liquid flow valve; taking the second heat-conducting medium as a gaseous heat-conducting medium as an example, the second flow valve 33 is a gas flow valve.

[0074] Further, the inner tank 1 is provided with a plurality of temperature sensors 61 and liquid level sensors 62 along the depth direction.

[0075] The temperature sensor 61 can monitor the temperature change at different depth positions in the inner tank 1 in real time, and feed back the temperature data to the control system, so as to timely adjust the working state of the instant heating assembly 5 and ensure that the temperature of the inner tank 1 is stable within the target range. The liquid level sensor 62 can accurately detect the liquid level of the liquid in the inner tank 1, and can timely issue an alarm when the liquid level is too low, reminding the operator to supplement the liquid and ensuring the safe and stable operation of the device.

[0076] Further, the outer top position of the side wall of the inner tank 1 is provided with an overflow tank 12; and the bottom of the inner tank 1 is connected with a liquid discharge pipe 11. The overflow tank 12 can effectively prevent the liquid in the inner tank 1 from overflowing due to accidental circumstances (such as too fast liquid injection, liquid expansion caused by heating, etc.) and causing pollution to the surrounding environment or damaging the equipment. When the liquid in the inner tank 1 exceeds a certain height, the excess liquid will flow into the overflow tank 12 for temporary storage, avoiding the liquid flowing out of the device directly. The liquid discharge pipe 11 facilitates the periodic cleaning or replacement of the liquid in the inner tank 1, and the liquid in the inner tank 1 can be smoothly discharged by opening the valve on the liquid discharge pipe 11.

[0077] Further, the first heating chamber 41 is provided with a flow guide spiral groove surrounding the inner tank 1, for guiding the first heat-conducting medium to form a circulating flow.

[0078] The design of the flow guide spiral groove can form an orderly circulation of the first heat-conducting medium in the first heating chamber 41. This circulation not only increases the contact time and contact area of the first heat-conducting medium with the inner groove body 1, thereby more efficiently transferring heat to the inner groove body 1, but also makes the temperature distribution in the first heating chamber 41 more uniform. When the first heat-conducting medium flows along the flow guide spiral groove, it constantly washes the sidewall of the inner groove body 1, so that each part of the inner groove body 1 can be fully heated, avoiding the case that the local temperature difference is too large.

[0079] In addition, the flow guide spiral groove can also have a certain buffering effect, slowing down the flow speed of the first heat-conducting medium, making the heat transfer more stable. Compared with directly injecting the first heat-conducting medium into the first heating chamber 41, the circulation formed by the flow guide spiral groove can make the first heat-conducting medium stay around the inner groove body 1 for a longer time, fully release heat, and further improve the heating efficiency.

[0080] The inner groove body 1 and the first outer groove body 2 of the present application can be made of glass, while the second outer groove body 3 can be made of a heat-insulating material with good heat-insulating effect and structural strength, or a heat-insulating protective material can be provided on the outer surface, without specific limitation.

[0081] The present application also discloses a wet process machine, which comprises the above-mentioned instant heating tank device for semiconductor processing.

[0082] The above provides a detailed introduction to the instant heating tank device for semiconductor processing and the wet process machine of the present application. For those skilled in the art, according to the idea of the embodiments of the present application, there will be changes in specific implementation and application range. In view of the above, the content of the present specification should not be understood as a limitation of the present application.

Claims

1. A semiconductor processing instant heating tank device characterized by comprising: The device comprises an inner tank (1), a first outer tank (2), a second outer tank (3) and an instant heating assembly (5). The inner tank (1) is in the shape of a spherical kettle. The first outer tank (2) is sleeved on the outer side of the inner tank (1) and forms a first heating chamber (41) with the inner tank (1). The second outer tank (3) is sleeved on the outer side of the first outer tank (2) and forms a second heating chamber (42) with the first outer tank (2). The instant heating assembly (5) is in communication with the first heating chamber (41) and is used to provide a first heat-conducting medium in circulation to the first heating chamber (41). The second heating chamber (42) is used to accommodate a second heat-conducting medium.

2. The semiconductor processing instant heating tank apparatus according to claim 1, characterized by The shapes of the first outer tank (2) and the second outer tank (3) are adapted to the shape of the inner tank (1).

3. The semiconductor processing instant heating tank apparatus according to claim 1, characterized by The outer tank is provided with a first medium inlet (21) and a first medium outlet (22). The instant heating assembly (5) comprises an instant heater (52) and a circulating pump (51). The input end of the instant heater (52) is connected to the first medium outlet (22) through a first pipeline (53). The output end of the instant heater (52) is connected to the first medium inlet (21) through a second pipeline (54). The circulating pump (51) is installed between the input end of the instant heater (52) and the first pipeline (53) or between the output end of the instant heater (52) and the second pipeline (54).

4. The semiconductor processing instant heating tank apparatus according to claim 3, characterized by The first medium inlet (21) is arranged at the top of the side wall of the first outer tank (2). The first medium outlet (22) is arranged at the bottom wall of the first outer tank (2) or at the bottom of the side wall of the first outer tank (2).

5. The semiconductor processing instant heating tank apparatus according to claim 4, wherein The first medium inlet (21) is a plurality of inlets and is uniformly distributed around the circumference of the first outer tank (2).

6. The semiconductor processing instant heating tank apparatus according to claim 3, wherein The second outer tank (3) is provided with a second medium inlet (31) for the input of the second heat-conducting medium and a second medium outlet (32) for the output of the second heat-conducting medium.

7. The semiconductor processing instant heating tank apparatus according to claim 6, wherein The first medium outlet (22) is installed with an on-off valve (55). The first pipeline (53) or the second pipeline (54) is further installed with a first flow valve (56). The second medium inlet (31) is installed with a second flow valve (33).

8. The semiconductor processing instant heating tank apparatus according to claim 1, characterized by The first heat-conducting medium is a liquid heat-conducting medium. The second heat-conducting medium is a gaseous heat-conducting medium.

9. The semiconductor processing instant heating tank apparatus according to claim 1, characterized by A plurality of temperature sensors (61) and liquid level sensors (62) are arranged in the inner tank (1) along the depth direction.

10. The semiconductor processing instant heating tank apparatus according to Claim 1, wherein An overflow tank (12) is sleeved on the outer top of the side wall of the inner tank (1). A liquid discharge pipe (11) is connected to the bottom of the inner tank (1).

11. The semiconductor processing instant heating tank apparatus according to Claim 1, wherein The first heating chamber (41) is provided with a flow guide spiral groove around the inner tank (1) for guiding the first heat-conducting medium to form a circulating flow.

12. A wet bench characterized by The device comprises the instant heating tank device for semiconductor processing according to any one of claims 1 to 11.

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