Carrier for semiconductor packaging product

Abstract

The utility model discloses a carrier for semiconductor packaging products, which comprises a plate-shaped main body part, a plurality of mounting units are arranged on the plate-shaped main body part, each mounting unit comprises a first edge, a second edge, a third edge and a fourth edge, and a rectangular opening is defined by the first edge, the second edge, the third edge and the fourth edge; the semiconductor packaging product is provided with a plurality of bonding pads, the rectangular opening corresponds to the bonding pads so that the bonding pads can be exposed out of the rectangular opening, and the inner edge of the first edge, the inner edge of the second edge, the inner edge of the third edge and the inner edge of the fourth edge are all provided with chamfers. And the chamfer extends downwards to the lower bottom surface of the mounting unit, so that the lower bottom surface of the mounting unit does not cover the bonding pad. According to the utility model, the plurality of mounting units are arranged on the carrier, and the inner edges of the first edges, the second edges, the third edges and the fourth edges of the mounting units are all provided with the chamfers, so that the problem of yellowing of a bonding pad of a semiconductor packaging product caused by residual water spots in the cleaning and blow-drying process can be avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor, especially a kind of carrier of semiconductor packaging product. BACKGROUND

[0002] With the rapid development of semiconductor packaging industry, the demand of semiconductor is increasing, and packaging is mainly completed in the later engineering of semiconductor manufacturing, that is, using film technology and micro connection technology, semiconductor components and other components are arranged, fixed and connected on the frame or substrate, and the terminal is led out, and is fixed by plastic insulating medium.

[0003] Semiconductor packaging products are usually installed on carriers for cleaning and other processes. After installing the semiconductor products, the four corners of the existing carrier will cover part of the solder pads of the semiconductor products, causing the solder pads of the semiconductor products to turn yellow due to the inability to timely drain water from the covered part of the solder pads during production, which seriously affects the yield of semiconductor products. SUMMARY

[0004] The utility model aims at providing a carrier for semiconductor packaging products to solve the problem of solder pad yellowing caused by the existing carrier covering the solder pad of the semiconductor product.

[0005] To achieve the above purpose, the utility model provides a carrier for semiconductor packaging products, which comprises a plate-shaped main body part, a plurality of installation units are provided on the plate-shaped main body part, the plurality of installation units are arrayed, each installation unit comprises a first edge, a second edge, a third edge and a fourth edge, and the first edge, the second edge, the third edge and the fourth edge form a rectangular opening; the semiconductor packaging product has a plurality of arrayed solder pads, the rectangular opening is provided corresponding to the solder pads to make the solder pads exposed from the rectangular opening, the inner edge of the first edge, the inner edge of the second edge, the inner edge of the third edge and the inner edge of the fourth edge are provided with chamfers, the chamfers extend downward to the lower bottom surface of the installation unit to make the lower bottom surface of the installation unit not cover the solder pads.

[0006] Preferably, the inner side middle part of the first edge, the inner side middle part of the second edge, the inner side middle part of the third edge and the inner side middle part of the fourth edge are provided with a recessed avoidance opening towards the outer side of the corresponding edge.

[0007] Preferably, both sides of each avoidance opening are respectively provided with mounting holes.

[0008] Preferably, the angle of the chamfer is 45 degrees, and the length of the chamfer is 0.5mm.

[0009] Preferably, a plurality of the mounting units are arranged in a transverse direction and a longitudinal direction, a first interval is provided between two adjacent mounting units in the transverse direction, a second interval is provided between two adjacent mounting units in the longitudinal direction, and the first interval is greater than the second interval.

[0010] Preferably, a waist-shaped groove is provided in the first interval.

[0011] Preferably, two adjacent mounting units in the same row and two adjacent mounting units in adjacent rows form a mounting group, and a through hole is provided in the middle of the mounting group.

[0012] Preferably, the diameter of the through hole is less than the distance between two adjacent avoiding openings in the transverse direction.

[0013] Preferably, the carrier is rectangular, the length of the carrier is 310 mm, the width of the carrier is 160 mm, the thickness of the carrier is 1.2 mm, and the side length of the rectangular opening is 43.5 mm.

[0014] Preferably, the lower part of the carrier is further provided with a two-dimensional code, and the side length of the two-dimensional code is 4.5 mm.

[0015] Compared with the prior art, the utility model discloses a plurality of mounting units are arranged on the carrier, and the inner edge of the first side, the inner edge of the second side, the inner edge of the third side and the inner edge of the fourth side of the mounting unit are all provided with chamfers, so that the problem of yellowing of the solder pad of the semiconductor packaging product caused by water stain residues during the cleaning and drying process can be avoided, and the production yield is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a top view structural diagram of the carrier of the semiconductor packaging product of the utility model embodiment.

[0017] Figure 2 It is Figure 1 It is an enlarged view of A in the middle.

[0018] Figure 3 It is a structural schematic diagram of the semiconductor packaging product and the carrier after being connected of the utility model embodiment. DETAILED DESCRIPTION

[0019] In order to make the technical content, structural features and effects of the utility model clear, the following will be described in detail in combination with the embodiments and the drawings.

[0020] For example, Figures 1 to 3As shown, the utility model embodiment provides a kind of carrier 10 of semiconductor package product, including plate main part 1, plate main part 1 is equipped with several installation units 2, several installation units 2 array arrangement, each installation unit 2 includes first side 21, second side 22, third side 23 and fourth side 24, first side 21, second side 22, third side 23 and fourth side 24 form rectangular opening 25;Semiconductor package product 20 has several array arrangement pads 201, rectangular opening 25 is set to pad 201 to make pad 201 expose from rectangular opening 25, the inner edge of first side 21, the inner edge of second side 22, the inner edge of third side 23 and the inner edge of fourth side 24 are equipped with chamfer 28, chamfer 28 extends to the lower bottom surface 29 of installation unit 2 downwards to make the lower bottom surface 29 of installation unit 2 not cover pad 201. Specifically, each carrier 10 can install multiple semiconductor package products 20, the edge of each semiconductor package product 20 is equipped with installation frame, by the installation frame of each semiconductor package product 20 corresponding with the installation unit 2 on carrier 10 is connected each other and makes the pad 201 of semiconductor package product 20 expose from rectangular opening 25, as Figure 2 As shown, rectangular opening 25 corresponds to the area surrounded by first side 21, second side 22, third side 23 and fourth side 24 in inside dotted line frame, so that multiple semiconductor package products 20 are washed using carrier 10 Process treatment, and since the inner edge of first side 21, the inner edge of second side 22, the inner edge of third side 23 and the inner edge of fourth side 24 are equipped with chamfer 28, the angle of chamfer 28 can be 45 degrees, the length of chamfer 28 can be 0.5 millimeter, so that the inner edge of first side 21, the inner edge of second side 22, the inner edge of third side 23 and the inner edge of fourth side 24 are not covered pad 201 or the gap between pad 201 is large, so that the pad 201 of semiconductor package product 20 can be avoided to yellow problem caused by water stain remaining during washing and drying process, improve production yield.

[0021] The utility model embodiment sets up several installation units 2 on carrier 10, and the inner edge of first side 21, the inner edge of second side 22, the inner edge of third side 23 and the inner edge of fourth side 24 of installation unit 2 are equipped with chamfer 28, so that the pad 201 of semiconductor package product 20 edge can be avoided to yellow problem caused by water stain remaining during washing and drying process, improve production yield.

[0022] In the utility model embodiment, as Figure 2As shown, the inner middle part of the first edge 21, the inner middle part of the second edge 22, the inner middle part of the third edge 23, and the inner middle part of the fourth edge 24 are all provided with an avoiding opening 27 recessed to the outer side of the corresponding edge. Specifically, the mounting frame of each semiconductor packaging product 20 is provided with a protruding screw locking part at the position corresponding to the avoiding opening 27, and the avoiding opening 27 can avoid the screw locking part, so that the semiconductor packaging product 20 can be flatly mounted on the carrier 10.

[0023] In the embodiment of the utility model, the two sides of each avoiding opening 27 are provided with mounting holes 26. Specifically, as shown in Figure 2 As shown, the avoiding opening 27 is specifically four, and the two sides of each avoiding opening 27 are provided with mounting holes 26, so that each mounting unit 2 has eight mounting holes 26, and the semiconductor packaging product 20 is provided with a connecting hole corresponding to the mounting hole 26 for bolt connection, and the eight mounting holes 26 make the connection of the carrier 10 and the semiconductor packaging product 20 more balanced and stable, and the mounting effect is good.

[0024] In the embodiment of the utility model, the mounting units 2 are arranged in the transverse and longitudinal directions, the first interval is between the two adjacent mounting units 2 in the transverse direction, the second interval is between the two adjacent mounting units 2 in the longitudinal direction, and the first interval is greater than the second interval. Specifically, the carrier 10 is rectangular, the length L of the carrier 10 is 310 mm, the width W of the carrier 10 is 160 mm, the thickness of the carrier 10 is 1.2 mm, the rectangular opening 25 is a square with a side length of 43.5 mm, the carrier 10 is arranged with five mounting units 2 in the transverse direction and three mounting units 2 in the longitudinal direction, so that fifteen semiconductor packaging products 20 can be installed, and the efficiency of the semiconductor packaging product 20 cleaning process is greatly improved.

[0025] In the embodiment of the utility model, the first interval is provided with a waist-shaped groove 3, and the waist-shaped groove 3 can make the carrier 10 have smaller deformation.

[0026] In the embodiment of the utility model, the two adjacent mounting units 2 in the same row and the two adjacent mounting units 2 in the adjacent row form a mounting group, and a through hole 4 is arranged in the middle of the mounting group. Specifically, as shown in Figure 1As shown, the installation group is as shown in region B, two adjacent installation units 2 in the same row are respectively a first installation unit 211 and a second installation unit 212, the installation unit 2 below the first installation unit 211 is a third installation unit 213, the installation unit 2 below the second installation unit 212 is a fourth installation unit 214, the first installation unit 211, the second installation unit 212, the third installation unit 213 and the fourth installation unit 214 form an installation group, a through hole 4 is arranged in the middle of the installation group, in the embodiment of the utility model, the carrier 10 can have eight through holes 4, the through hole 4 is arranged to further reduce the deformation of the carrier 10, so that the service life of the carrier 10 is longer, of course, the number of through holes 4 can be adjusted according to actual needs, and here, no limitation is made.

[0027] Further, the diameter of the through hole 4 is less than the distance between the two adjacent avoiding openings 27 in the transverse direction. Specifically, the diameter of the through hole 4 is slightly less than the distance between the two adjacent avoiding openings 27 in the transverse direction, so as to ensure that the carrier 10 has small deformation and also ensure the strength of the carrier 10, and the design is ingenious.

[0028] In the embodiment of the utility model, the lower part of the carrier 10 is further provided with a two-dimensional code 5, and the side length of the two-dimensional code 5 is 4.5mm. By arranging the two-dimensional code 5 on the carrier 10, the relevant information of the carrier 10 can be conveniently read, and the information can be conveniently followed up, tracked and managed, and the design is ingenious.

[0029] The above disclosed is only a preferred embodiment of the utility model, and of course cannot limit the scope of the utility model, therefore, equivalent changes made according to the patent application scope of the utility model still belong to the scope covered by the utility model.

Claims

1. A carrier for semiconductor package products, characterized by, The plate-shaped main body part is provided with a plurality of mounting units arranged in an array, each of the mounting units comprises a first edge, a second edge, a third edge and a fourth edge, and the first edge, the second edge, the third edge and the fourth edge form a rectangular opening. The semiconductor packaging product has a plurality of pads arranged in an array, the rectangular opening is arranged corresponding to the pads so that the pads are exposed from the rectangular opening, and the inner edge of the first edge, the inner edge of the second edge, the inner edge of the third edge and the inner edge of the fourth edge are all provided with chamfers extending downward to the lower bottom surface of the mounting unit so that the lower bottom surface of the mounting unit does not cover the pads.

2. The carrier for semiconductor package products according to claim 1, wherein The inner middle part of the first edge, the inner middle part of the second edge, the inner middle part of the third edge and the inner middle part of the fourth edge are all provided with a recessed avoidance opening towards the outer side of the corresponding edge.

3. The carrier for semiconductor package products according to claim 2, wherein Both sides of each avoidance opening are respectively provided with mounting holes.

4. The carrier for semiconductor package products according to claim 1, wherein The angle of the chamfer is 45 degrees, and the length of the chamfer is 0.5 mm.

5. The carrier for semiconductor package products according to claim 2, wherein, The plurality of mounting units are arranged in an array along the transverse direction and the longitudinal direction, the first interval between two adjacent mounting units in the transverse direction is greater than the second interval between two adjacent mounting units in the longitudinal direction.

6. The carrier for semiconductor package products according to claim 5, wherein The first interval is provided with a waist-shaped groove.

7. The carrier for semiconductor package products according to claim 5, wherein Two adjacent mounting units in the same row and two adjacent mounting units in adjacent rows form a mounting group, and a through hole is formed in the middle of the mounting group.

8. The carrier for semiconductor package products according to claim 7, wherein The diameter of the through hole is smaller than the distance between two adjacent avoidance openings in the transverse direction.

9. The carrier for semiconductor package products as recited in claim 1, wherein, The carrier is rectangular, the length of the carrier is 310 mm, the width of the carrier is 160 mm, the thickness of the carrier is 1.2 mm, and the side length of the rectangular opening is 43.5 mm.

10. The carrier for semiconductor package products as recited in claim 1, wherein, The lower part of the carrier is also provided with a two-dimensional code, and the side length of the two-dimensional code is 4.5 mm.

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