Cooling structure and laser

Abstract

The utility model discloses a cooling structure and a laser, and relates to the technical field of lasers, the cooling structure is used for a power supply module, and the cooling structure comprises a plurality of substrates and cooling pipes; each substrate is provided with at least one heat conduction area, and the heat conduction areas can receive heat generated by a power module. According to the technical scheme, the multiple substrates are arranged, at least one heat conduction area is arranged on each substrate, the purpose of dispersing the whole substrate into the multiple heat conduction areas is achieved, the heat conduction areas absorb heat generated by the power module, compared with a traditional whole-block arrangement mode, the heat conduction efficiency is improved, and the heat conduction efficiency is improved. According to the cooling structure, the plurality of substrates can be selectively arranged on the power supply module needing heat dissipation, so that unnecessary space occupation is reduced, the size and the weight are further reduced to a certain extent, and the cooling structure has a light-weight use effect.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a cooling structure and a laser. Background Technology

[0002] Lasers have a wide range of needs and applications in various fields such as manufacturing. As the output power continues to increase, the weight and size are also getting bigger and bigger, which has become one of the key issues restricting the application and development of lasers. How to reduce the size and weight of lasers while ensuring the output power and beam quality is becoming another important development direction. As a system that integrates optics, mechanics and electronics, lasers contain many components. Optimized design of components and use of lightweight materials are all ways to achieve miniaturization and weight reduction of lasers.

[0003] In view of this, we propose a cooling structure and a laser to solve the above problems. Utility Model Content

[0004] The main objective of this invention is to provide a cooling structure and a laser, with the aim of providing a cooling structure that can be used in a lightweight manner.

[0005] To achieve the above objectives, the present invention proposes a cooling structure for a power module, comprising:

[0006] Multiple substrates, each substrate having at least one heat-conducting region capable of receiving heat generated by the power module; and

[0007] A cooling pipe has an inlet, an outlet, and an intermediate pipe connecting the inlet and the outlet. The intermediate pipe allows a condensing medium to flow from the inlet to the outlet. A heat-conducting area is attached to the intermediate pipe so that the heat generated by the power module can be discharged through the condensing medium.

[0008] In one embodiment, a plurality of the substrates are spaced apart on the intermediate conduit.

[0009] In one embodiment, a heat-conducting plate is provided in the heat-conducting area, and the heat-conducting plate is attached to the intermediate pipe.

[0010] In one embodiment, the heat-conducting plate is integrally disposed with the substrate.

[0011] In one embodiment, a heat-spreading plate is provided within the heat-conducting area, and the heat-spreading plate is attached to the intermediate pipe.

[0012] In one embodiment, a mounting groove is formed on the upper surface of the substrate for mounting the heat-conducting plate or the heat-spreading plate to form the heat-conducting area.

[0013] In one embodiment, the mounting groove is disposed through the substrate along its upper and lower sides.

[0014] In one embodiment, the intermediate conduit includes multiple connecting channels that connect two adjacent heat-conducting regions. The connecting channels are bendable, and the bends are arc-shaped; and / or,

[0015] The cross-section of the intermediate pipe is set to rectangular.

[0016] This utility model also proposes a laser, which includes a cooling structure, the cooling structure comprising:

[0017] Multiple substrates, each substrate having at least one heat-conducting region capable of receiving heat generated by the power module; and

[0018] A cooling pipe has an inlet, an outlet, and an intermediate pipe connecting the inlet and the outlet. The intermediate pipe allows a condensing medium to flow from the inlet to the outlet. A heat-conducting area is attached to the intermediate pipe so that the heat generated by the power module can be discharged through the condensing medium.

[0019] The technical solution of this utility model employs a configuration of multiple substrates, with at least one heat-conducting area on each substrate. This disperses the entire substrate into multiple heat-conducting areas, which absorb the heat generated by the power module. Compared to the traditional single-piece configuration, multiple substrates allow for selective placement on power modules requiring heat dissipation, reducing unnecessary space occupation and thus minimizing size and weight. This results in a lightweight cooling structure. Furthermore, the presence of a cooling pipe, through which a condensing medium flows from the inlet to the outlet and adheres to the heat-conducting areas, effectively absorbs and transfers the heat generated by these areas. This reduces the usable area while maintaining efficient heat dissipation. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 A schematic diagram of an embodiment of the cooling structure provided by this utility model;

[0022] Figure 2 for Figure 1 A side view of the mounting slot in the cooling structure.

[0023] Explanation of icon numbers:

[0024] 100. Cooling structure; 1. Base plate; 11. Heat conduction area; 12. Mounting groove; 2. Cold pipe; 21. Inlet; 22. Outlet; 23. Intermediate pipe; 231. Connecting channel; 3. Heat conduction plate; 4. Heat spreader.

[0025] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0028] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0029] Lasers have a wide range of needs and applications in various fields such as manufacturing. As the output power continues to increase, the weight and size are also getting bigger and bigger, which has become one of the key issues restricting the application and development of lasers. How to reduce the size and weight of lasers while ensuring the output power and beam quality is becoming another important development direction. As a system that integrates optics, mechanics and electronics, lasers contain many components. Optimized design of components and use of lightweight materials are all ways to achieve miniaturization and weight reduction of lasers.

[0030] This invention proposes a cooling structure and a laser, aiming to provide a cooling structure that can be used in a lightweight manner.

[0031] Please see Figure 1 and Figure 2 In one embodiment of this utility model, the cooling structure 100 is used for a power module. The cooling structure 100 includes a plurality of substrates 1 and a cold pipe 2. Each substrate 1 is provided with at least one heat-conducting area 11, which can receive the heat generated by the power module. The cold pipe 2 has an inlet 21, an outlet 22, and an intermediate pipe 23 connecting the inlet 21 and the outlet 22. The intermediate pipe 23 allows a condensing medium to flow from the inlet 21 to the outlet 22. The heat-conducting area 11 is attached to the intermediate pipe 23 so that the heat generated by the power module can be discharged through the condensing medium.

[0032] The technical solution of this utility model adopts a configuration of multiple substrates 1, with at least one heat-conducting area 11 on each substrate 1. This serves to disperse the entire substrate 1 into multiple heat-conducting areas 11. The heat-conducting areas 11 absorb the heat generated by the power module. Compared with the traditional single-piece configuration, multiple substrates 1 can be selectively placed on the power module that needs heat dissipation, reducing unnecessary space occupation and thus reducing the volume and weight to a certain extent. This makes the cooling structure 100 lightweight. By providing the cold pipe 2, which carries a condensing medium in the intermediate pipe 23, the condensing medium flows from the inlet 21 to the outlet 22 and is attached to the heat-conducting areas 11, thereby absorbing and transferring the heat generated by the heat-conducting areas 11. This reduces the usable area while ensuring heat dissipation.

[0033] It should be explained that the thermally conductive area 11 refers to the surface area of ​​the substrate 1 that is in contact with the power module and undergoes heat exchange.

[0034] It is understood that there may be multiple heat-conducting regions 11, with each heat-conducting region 11 disposed on each substrate 1, thereby improving the heat dissipation effect.

[0035] It is understood that the intermediate pipe 23 and the heat-conducting area 11 can be attached in a specific way, such as by directly contacting the outer peripheral wall of the intermediate pipe 23 with the heat-conducting area 11; or by using thermal conductive paste, such as by applying the thermal conductive paste to the contact surface between the intermediate pipe 23 and the heat-conducting area 11; or by using thermal conductive adhesive to fix the contact surface between the intermediate pipe 23 and the heat-conducting area 11.

[0036] It should be noted that the condensing medium can be condensate.

[0037] In one embodiment, a plurality of the substrates 1 are arranged at intervals on the intermediate conduit 23.

[0038] This configuration improves space utilization. For power modules that do not require heat transfer, the position of the substrate 1 can be adjusted to make the device structure more compact and save space.

[0039] It should be added that the substrate 1 is mounted on the intermediate pipe 23 in a fixed manner, such as by welding.

[0040] It is understood that the specific form in which the multiple substrates 1 are spaced apart on the intermediate pipe 23 can be uniformly distributed, such as maintaining the same distance between the heat-conducting areas 11 to form a regular arrangement; or non-uniformly distributed, such as the distance between the heat-conducting areas 11 being inconsistent, which can be adjusted according to the actual heat generation of the power module.

[0041] In one embodiment, each of the substrates 1 is provided with a plurality of heat-conducting regions 11, and the plurality of heat-conducting regions 11 are arranged at intervals.

[0042] This configuration provides redundant paths through multiple independent heat-conducting areas 11, ensuring that even if one heat-conducting area 11 fails, other areas can continue to operate, reducing the risk of overall performance degradation due to single-point failure and enhancing reliability. Furthermore, the spaced arrangement allows for a rational layout of the power modules on the substrate 1, maximizing their utilization.

[0043] It is understood that the specific form of the spacing arrangement can be the same as the arrangement of the substrate 1 on the intermediate pipe 23.

[0044] In one embodiment, a heat-conducting plate 3 is provided in the heat-conducting area 11, and the heat-conducting plate 3 is attached to the intermediate pipe 23.

[0045] With this configuration, the heat-conducting plate 3 and the intermediate pipe 23 are attached together, so that the heat generated by the power module can be conducted through the heat-conducting plate 3, thereby achieving the purpose of heat dissipation.

[0046] It is understood that the heat-conducting plate 3 can be a flat heat-conducting plate 3, which is easy to process and install; or a foldable heat-conducting plate 3, which saves space; or a graphene heat-conducting plate 3, which has a high efficiency of heat conduction.

[0047] In one embodiment, the heat-conducting plate 3 is integrally disposed with the substrate 1.

[0048] Thus, by integrating the heat-conducting plate 3 with the substrate 1, heat conduction efficiency is improved, and the absence of an intermediate layer with thermal resistance allows for rapid heat transfer to the heat dissipation area. Furthermore, the integrated design optimizes space utilization, making better use of limited space.

[0049] In one embodiment, a heat-spreading plate is provided in the heat-conducting area 11, and the heat-spreading plate is attached to the intermediate pipe 23.

[0050] With this configuration, the heat spreader is attached to the intermediate pipe 23, allowing the heat spreader to evenly diffuse heat over a large surface area, effectively reducing the temperature of local hot spots generated by the power module and improving heat transfer efficiency.

[0051] It is understood that the heat spreader can be an ultra-thin heat spreader (thickness less than 2mm), which has excellent thermal conductivity, a large heat transfer area, and good temperature uniformity, and can also achieve the effect of reducing the heat dissipation area without reducing the heat dissipation capacity. It can provide sufficient heat dissipation area while maintaining sufficient mechanical strength.

[0052] In one embodiment, a mounting groove 12 is formed on the upper surface of the substrate 1, the mounting groove 12 being used for mounting the heat-conducting plate 3 or the heat-spreading plate to form the heat-conducting area 11.

[0053] This configuration provides a mounting position for the heat-conducting plate 3 or the heat-spreading plate through the mounting slot 12, thereby facilitating the installation and use of the heat-conducting plate 3 and the heat-spreading plate.

[0054] In one embodiment, the mounting groove 12 is disposed through the substrate 1 along its upper and lower sides.

[0055] This configuration allows the heat-conducting plate 3 or the heat-spreading plate to directly contact the intermediate pipe 23, thereby improving heat conduction.

[0056] In one embodiment, the intermediate pipe 23 includes a plurality of connecting channels 231, the connecting channels 231 connecting two adjacent heat-conducting regions 11, the connecting channels 231 being bendable, and the bendable portion of the connecting channels 231 being arc-shaped.

[0057] This design, by making the connecting channel 231 bendable, improves the flexibility of the intermediate pipe 23, allowing it to adapt to different installation environments and space constraints, thus enhancing the adaptability and flexibility of the cooling structure 100. Furthermore, by making the bendable portion of the connecting channel 231 arc-shaped, the resistance and pressure loss of the condensing medium during bends are reduced, resulting in more uniform and stable heat transfer.

[0058] It should be explained that this application does not impose specific restrictions on the bendability setting; any setting method that enables bending is acceptable.

[0059] In one embodiment, the intermediate pipe 23 includes a plurality of connecting channels 231, the connecting channels 231 connecting two adjacent heat-conducting regions 11, the connecting channels 231 being bendable, and the bendable portion of the connecting channels 231 being arc-shaped; the flow channel cross-section of the intermediate pipe 23 is set to rectangular.

[0060] This configuration, by setting the cross-section of the intermediate pipe 23 to be rectangular, increases the contact area with the heat-conducting plate 3 or the heat-spreading plate compared to the traditional circular configuration, which can better transfer heat and improve the cooling effect.

[0061] This utility model also proposes a laser, which includes a cooling structure. The specific structure of the cooling structure is as described in the above embodiments. Since this laser adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0062] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A cooling structure for a power module, characterized in that, include: Multiple substrates, each of which has at least one heat-conducting area, the heat-conducting area being able to receive heat generated by the power module; as well as, A cooling pipe has an inlet, an outlet, and an intermediate pipe connecting the inlet and the outlet. The intermediate pipe allows a condensing medium to flow from the inlet to the outlet. A heat-conducting area is attached to the intermediate pipe so that the heat generated by the power module can be discharged through the condensing medium.

2. The cooling structure as described in claim 1, characterized in that, Multiple substrates are spaced apart on the intermediate pipe.

3. The cooling structure as described in claim 1, characterized in that, Each of the substrates is provided with a plurality of heat-conducting regions, which are arranged at intervals.

4. The cooling structure as described in claim 1, characterized in that, A heat-conducting plate is provided in the heat-conducting area, and the heat-conducting plate is attached to the intermediate pipe.

5. The cooling structure as described in claim 4, characterized in that, The heat-conducting plate is integrally formed with the substrate.

6. The cooling structure as described in claim 4, characterized in that, A heat-spreading plate is provided within the heat-conducting area, and the heat-spreading plate is attached to the intermediate pipe.

7. The cooling structure as described in claim 6, characterized in that, The upper surface of the substrate is provided with a mounting groove for mounting the heat-conducting plate or the heat-spreading plate to form the heat-conducting area.

8. The cooling structure as described in claim 7, characterized in that, The mounting groove is provided to penetrate the substrate from top to bottom.

9. The cooling structure as described in claim 1, characterized in that, The intermediate pipe includes multiple connecting channels that connect two adjacent heat-conducting areas. These connecting channels are bendable, and the bends are arc-shaped; and / or, The cross-section of the intermediate pipe is set to rectangular.

10. A laser, characterized in that, Includes the cooling structure as described in any one of claims 1 to 9.

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