Circuit acquisition board

Abstract

The utility model relates to a circuit acquisition board. The circuit acquisition board comprises a printed circuit board; the printed circuit board comprises a first voltage region, a second voltage region and a third voltage region; the second voltage region is located between the first voltage region and the third voltage region; the first voltage region, the second voltage region and the third voltage region are all provided with components; the distance between the first voltage region and the second voltage region is a first distance; the distance between the second voltage region and the third voltage region is a second distance; the first distance is greater than the second distance; wherein the first voltage region is a low-voltage region; the second voltage region and the third voltage region are high-voltage regions, and the working voltage of a component in the second voltage region is smaller than that of a component in the third voltage region. According to the invention, the electrical gap and the creepage distance between different voltage areas are enhanced through the appropriate distance, the isolation effect between different voltage areas is improved, and the safety requirement of the internal voltage of the circuit acquisition board is met.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of circuit, and particularly relates to a circuit acquisition board. BACKGROUND

[0002] The high-voltage circuit acquisition board of the battery system is used for acquiring the total voltage, current, temperature and insulation information of the battery, analyzing and processing the acquired various information, identifying the battery state, and then predicting and processing the potential risks and faults in the application process of the battery. And the battery information can be transmitted to other controller units through the communication bus.

[0003] The components on the circuit acquisition board are increasing and becoming more and more complex. The circuit is divided into high-voltage area and low-voltage area, and isolation is needed between different voltage areas to avoid the problem that the signal quality acquired by the circuit acquisition board is interfered and the components are broken down. Therefore, improving the isolation effect of the circuit acquisition board is the current problem to be solved. CONTENT OF THE INVENTION

[0004] In order to solve the above technical problems, the present disclosure provides a circuit acquisition board.

[0005] The present disclosure provides a circuit acquisition board, comprising: a printed circuit board;

[0006] The printed circuit board comprises a first voltage area, a second voltage area and a third voltage area;

[0007] The second voltage area is located between the first voltage area and the third voltage area;

[0008] The first voltage area, the second voltage area and the third voltage area are all provided with components; the distance between the first voltage area and the second voltage area is a first distance; the distance between the second voltage area and the third voltage area is a second distance; the first distance is greater than the second distance;

[0009] The first voltage area is a low-voltage area; the second voltage area and the third voltage area are high-voltage areas, and the working voltage of the components in the second voltage area is less than the working voltage of the components in the third voltage area.

[0010] In some embodiments, the region between the first voltage area and the second voltage area less than or equal to a first preset distance is provided with a creepage slot.

[0011] In some embodiments, the region between the second voltage area and the third voltage area less than or equal to a second preset distance is provided with a creepage slot.

[0012] In some embodiments, the creepage slot penetrates through the printed circuit board.

[0013] In some embodiments, the creepage slot has a width greater than 1mm.

[0014] In some embodiments, further comprising: an isolation device;

[0015] The isolation device is disposed between the first voltage region and the second voltage region, and / or between the second voltage region and the third voltage region.

[0016] In some embodiments, the printed circuit board region where the isolation device is disposed is provided with a creepage slot.

[0017] In some embodiments, the third voltage region comprises at least two sub-high voltage regions;

[0018] The distance between adjacent sub-high voltage regions is greater than a third distance;

[0019] Wherein the components in different sub-high voltage regions have different functions; the third distance is greater than the second distance.

[0020] In some embodiments, further comprising: a plug-in component;

[0021] The plug-in component is located in the third voltage region;

[0022] The plug-in component comprises an insulating barrier and a metal pin; adjacent metal pins are isolated by the insulating barrier.

[0023] In some embodiments, further comprising: a first insulating housing and a second insulating housing;

[0024] The first insulating housing and the second insulating housing form a cavity; the printed circuit board is located inside the cavity.

[0025] The technical solutions provided by the present disclosure have the following advantages compared with the prior art:

[0026] The circuit acquisition board provided by the present disclosure comprises a printed circuit board, the printed circuit board comprises a first voltage area, a second voltage area and a third voltage area, and each voltage area is provided with components. Among them, the first voltage area is a low voltage area, the second voltage area and the third voltage area are high voltage areas, and the working voltage of the components in the second voltage area is less than the working voltage of the components in the third voltage area. The working voltage ranges of the components in the three voltage areas are different, there is a voltage difference between different voltage areas, and the high voltage signal is easy to break through the components in the low voltage area, so the high voltage area and the low voltage area should be isolated from each other. And the high voltage area also includes the second voltage area with relatively low voltage and the third voltage area with relatively high voltage, and the components in the second voltage area are also easy to be broken by the high voltage in the third voltage area, so the mutual influence between the second voltage area and the third voltage area should also be avoided. Therefore, the distance between the first voltage area and the second voltage area is a first distance, the distance between the second voltage area and the third voltage area is a second distance, and the first distance is greater than the second distance. The present disclosure strengthens the electrical gap and the creepage distance between different voltage areas by appropriate distance, improves the isolation effect between the high voltage area and the low voltage area, and between the relatively low voltage area and the relatively high voltage area in the high voltage area, and meets the safety requirements of the internal voltage of the circuit acquisition board. BRIEF DESCRIPTION OF DRAWINGS

[0027] The drawings incorporated into the specification and constituting a part of the specification show embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure.

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0029] Figure 1 A structural schematic diagram of a circuit acquisition board provided by an embodiment of the present disclosure is shown in the figure.

[0030] Figure 2 A structural schematic diagram of another circuit acquisition board provided by an embodiment of the present disclosure is shown in the figure.

[0031] Figure 3 A structural schematic diagram of another circuit acquisition board provided by an embodiment of the present disclosure is shown in the figure.

[0032] Figure 4 A structural schematic diagram of another circuit acquisition board provided by an embodiment of the present disclosure is shown in the figure.

[0033] Figure 5 A structural schematic diagram of a plug-in component provided by an embodiment of the present disclosure is shown in the figure.

[0034] Figure 6A structural schematic diagram of the circuit collection board provided by the embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0035] In order to enable one skilled in the art to more clearly understand the above-mentioned purposes, features and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0036] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the present disclosure, but the present disclosure can also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, not all the embodiments.

[0037] The embodiment of the present disclosure provides a circuit collection board, Figure 1 A structural schematic diagram of the circuit collection board provided by the embodiment of the present disclosure is shown. Figure 1 The circuit collection board comprises a printed circuit board.

[0038] The printed circuit board comprises a first voltage area 10, a second voltage area 20 and a third voltage area 30.

[0039] The second voltage area 20 is located between the first voltage area 10 and the third voltage area 30.

[0040] The first voltage area 10, the second voltage area 20 and the third voltage area 30 are all provided with components; the distance between the first voltage area 10 and the second voltage area 20 is a first distance; the distance between the second voltage area 20 and the third voltage area 30 is a second distance; the first distance is greater than the second distance.

[0041] Among them, the first voltage area 10 is a low-voltage area; the second voltage area 20 and the third voltage area 30 are high-voltage areas, and the working voltage of the components in the second voltage area 20 is less than that of the components in the third voltage area 30.

[0042] Exemplarily, the circuit collection board comprises a printed circuit board, and various components are arranged on the printed circuit board. The printed circuit board comprises a first voltage area 10, a second voltage area 20 and a third voltage area 30, and the second voltage area 20 is located between the first voltage area 10 and the third voltage area 30. Each voltage area is provided with components, and the working voltages of the components in different voltage areas are different.

[0043] The first voltage area 10 is a low voltage area, and the working voltage of the components in the first voltage area 10 is low. The first voltage area 10 is electrically connected with other control boards outside to transmit battery information to other controller units. For example, the working voltage of the components in the first voltage area 10 is 0-24V. The second voltage area 20 and the third voltage area 30 are high voltage areas. The working voltage of the components in the second voltage area 20 is lower than that of the components in the third voltage area 30. For example, the second voltage area 20 is electrically connected with the negative electrode of the battery and serves as the reference ground of the high voltage area of the circuit acquisition board. The working voltage of the components in the second voltage area is 0-24V. The third voltage area 30 is electrically connected with the high voltage output end of the battery, such as the positive electrode of the battery, and the working voltage is 24-1500V.

[0044] The low voltage area and the high voltage area mentioned in the embodiments of the present disclosure are relative concepts. The voltage of the high voltage area is higher than that of the low voltage area, and there is a voltage difference between the conductive areas of the two. There is also a relatively low voltage area in the high voltage area as the reference ground of the high voltage area, for example, the second voltage area 20. However, the second voltage area 20 and the third voltage area 30 both belong to the high voltage area range. Even if the working voltage of the components in the second voltage area 20 is similar to that in the first voltage area 10, they are still in different voltage areas and need to be isolated to avoid mutual leakage or breakdown. The second voltage area 20 and the third voltage area 30 in the high voltage area range should also be isolated to avoid mutual leakage or breakdown to ensure the normal work of the components.

[0045] Therefore, the distance between the first voltage area 10 and the second voltage area 20 is a first distance, and the distance between the second voltage area 20 and the third voltage area 30 is a second distance. By setting a safe distance between different voltage areas, the creepage distance and electrical clearance are strengthened, and the isolation effect between different voltage areas is improved. Considering the effective isolation between the low voltage area and the high voltage area, the basis of the high voltage circuit system, and the limited size of the printed circuit board, the first distance is greater than the second distance to ensure that the first voltage area 10 and the second voltage area 20 can achieve the optimal isolation effect and avoid mutual leakage or breakdown. At the same time, the isolation between the second voltage area 20 and the third voltage area 30 in the high voltage area is also strengthened to avoid damage to the components.

[0046] It should be noted that, Figure 1 The dashed line is used to represent the edge profile of different voltage areas. It can be understood that the voltage areas on both sides of the dashed line are different, and there is a certain distance between the voltage areas on both sides of the dashed line. However, the dashed line is only used to represent the edge profile of different voltage areas. Figure 1 Not shown, just an example.

[0047] The circuit acquisition board provided by the present disclosure comprises a printed circuit board, the printed circuit board comprises a first voltage area, a second voltage area and a third voltage area, and each voltage area is provided with components. Among them, the first voltage area is a low voltage area, the second voltage area and the third voltage area are high voltage areas, and the working voltage of the components in the second voltage area is less than that of the components in the third voltage area. The working voltage ranges of the components in the three voltage areas are different, there is a voltage difference between different voltage areas, and the high voltage signal is easy to break through the components in the low voltage area, so the high voltage area and the low voltage area should be isolated from each other. And the high voltage area also includes the second voltage area with relatively low voltage and the third voltage area with relatively high voltage, and the components in the second voltage area are also easy to be broken by the high voltage in the third voltage area, so the mutual influence between the second voltage area and the third voltage area should also be avoided. Therefore, the distance between the first voltage area and the second voltage area is a first distance, and the distance between the second voltage area and the third voltage area is a second distance, and the first distance is greater than the second distance. The present disclosure strengthens the electrical clearance and creepage distance between different voltage areas by appropriate distance, improves the isolation effect between the high voltage area and the low voltage area, and the relatively low voltage area in the high voltage area and the relatively high voltage area, and meets the safety requirements of the internal voltage of the circuit acquisition board.

[0048] In some embodiments, Figure 2 The structure schematic diagram of another circuit acquisition board provided by the present disclosure is provided with reference to Figure 2 The region between the first voltage area 10 and the second voltage area 20 less than or equal to the first preset distance is provided with a creepage slot 40.

[0049] Exemplarily, the first voltage area 10 is a low voltage area, the second voltage area 20 is a high voltage area, and the first voltage area 10 and the second voltage area 20 should be isolated. For example, by strengthening the distance between the two voltage areas, the electrical clearance and creepage distance between the components in different voltage areas are improved. However, the size of the printed circuit board is limited, and the region between the first voltage area 10 and the second voltage area 20 is also limited by the size of the components and the overall arrangement, so it is impossible to realize the isolation of larger distance. Therefore, the region between the first voltage area 10 and the second voltage area 20 less than or equal to the first preset distance is provided with a creepage slot 40, and the creepage slot 40 is a structure for prolonging the creepage distance. Therefore, the creepage distance between the first voltage area 10 and the second voltage area 20 is improved, the safety and stability of the printed circuit board are improved, and the printed circuit board and each component are prevented from being broken.

[0050] For example, the first preset distance is 15mm, and the region between the first voltage area 10 and the second voltage area 20 less than or equal to 15mm is provided with a creepage slot 40 (for reference Figure 2Creepage slot 41 is provided to increase the creepage distance and improve the isolation effect. Considering the structural stability of the printed circuit board, if the distance between the first voltage zone 10 and the second voltage zone 20 is greater than 15mm, the creepage slot 40 may not be provided.

[0051] In other embodiments, creepage slots can also be provided in the area between the first voltage region and the second voltage region that is greater than the first preset distance to improve the isolation effect. The embodiments disclosed herein are only illustrative examples, and can be set according to actual needs.

[0052] In some embodiments, continue to refer to Figure 2 A creepage groove 40 is provided in the area between the second voltage zone 20 and the third voltage zone 30 that is less than or equal to the second preset distance.

[0053] For example, both the second voltage region 20 and the third voltage region 30 are high-voltage regions, but the second voltage region 20 serves as the reference ground for the high-voltage region. If the voltage difference between the two voltage regions is too large, a certain degree of isolation is necessary to prevent mutual leakage or breakdown. For instance, increasing the distance between the two voltage regions can improve the electrical clearance and creepage distance between components in different voltage regions. Similarly, the area between the second voltage region 20 and the third voltage region 30 is also limited by component size and overall layout, making it impossible to achieve greater isolation distance. Therefore, a creepage slot 40 is provided in the area between the second voltage region 20 and the third voltage region 30 that is less than or equal to a second preset distance to increase the creepage distance between the two voltage regions, improve the safety and stability of the printed circuit board, and prevent the printed circuit board and its components from being damaged.

[0054] For example, the second preset distance is 8mm, and a creepage slot 40 is provided in the area less than or equal to 8mm between the second voltage zone 20 and the third voltage zone 30 (see reference). Figure 2 Creepage slot 42 in the circuit increases the creepage distance and improves the isolation effect. Similarly, considering the structural stability of the printed circuit board, if the distance between the second voltage zone 20 and the third voltage zone 30 is greater than 8mm, creepage slot 40 may not be required.

[0055] In other embodiments, creepage slots can also be provided in the area between the second voltage region and the third voltage region that is larger than the second preset distance to improve the isolation effect. The embodiments disclosed herein are only illustrative examples, and can be set according to actual needs.

[0056] In some embodiments, the creepage slot extends through the printed circuit board.

[0057] Creepage slot is a structure for extending the creepage distance, which refers to the shortest path between two conductive objects measured along the surface of an insulating material. The smaller the creepage distance, the more likely it is to cause a leakage situation, and the larger the creepage distance, the better the isolation effect. In addition, the creepage slot can also increase the creepage distance on the printed circuit board. The creepage slot penetrates the printed circuit board, increases the overall creepage distance, and improves the isolation effect of the printed circuit board. In addition, the creepage slot penetrates the printed circuit board, which can maximize the increase of the creepage distance, and the operation process is relatively easy, which improves the preparation efficiency. In some optional embodiments, the creepage slot can also not completely penetrate the printed circuit board, which improves the reliability and stability of the printed circuit board structure.

[0058] In some embodiments, the width of the creepage slot is greater than 1 mm.

[0059] The purpose of setting the creepage slot is to increase the creepage distance and improve the insulation effect. Therefore, the width of the creepage slot should be greater than 1 mm, which can increase the creepage distance and be resistant to voltage enough to be suitable for high-voltage environment. If the width is small, it cannot effectively increase the creepage distance and cannot play a role in improving the isolation effect. The actual slotting position, size and shape of the creepage slot are not specifically limited in the embodiments of the present disclosure, and the above is only an example. It can be set according to actual needs.

[0060] In some embodiments, Figure 3 Another structure schematic diagram of the circuit collection plate provided by the embodiments of the present disclosure is provided, referring to Figure 3 The circuit collection plate further comprises an isolation device 50.

[0061] The isolation device 50 is arranged between the first voltage area 10 and the second voltage area 20, and / or arranged between the second voltage area 20 and the third voltage area 30.

[0062] As shown in the example Figure 3 The isolation device 50 is arranged at the dashed box, which can play a role in electrical isolation, protect the circuits and components of different voltage areas, and also play a role in signal transmission and anti-interference. Therefore, the isolation device 50 can be arranged between the first voltage area 10 and the second voltage area 20 to isolate the high-voltage area and the low-voltage area, avoid signal breakdown of the high-voltage area to the components of the low-voltage area, and cause loss. Similarly, the working voltage of the components of the second voltage area 20 is less than that of the components of the third voltage area 30, so the isolation device 50 can also be arranged to improve the anti-interference and avoid signal crosstalk.

[0063] Optionally, the isolation device 50 arranged between the first voltage area 10 and the second voltage area 20 can be an optoelectronic coupler or an isolation coil, both of which can achieve a strong isolation effect. However, the optoelectronic coupler and the isolation coil have different sizes, and can be selected according to the space on the printed circuit board. In addition, the optoelectronic coupler can transmit multiple signals and has strong compatibility, such as transmitting communication signals; the isolation coil can also transmit multiple signals, such as power signals. In actual application, the isolation device 50 can be selected according to requirements.

[0064] The second voltage area 20 and the third voltage area 30 are high-voltage areas, the working voltage of the components in the second voltage area 20 is less than the working voltage of the components in the third voltage area 30, and an isolation device can also be arranged between the second voltage area 20 and the third voltage area 30 to strengthen the isolation between the reference ground in the high-voltage area and the high-voltage area and improve the insulation effect between the second voltage area 20 and the third voltage area 30.

[0065] Optionally, the specific type of the isolation device is not limited in the embodiments of the present disclosure, and the isolation device itself can achieve electrical insulation of signals through capacitive, electromagnetic, optical and other modes. Different implementation modes can meet different requirements of parameters and performance such as voltage, current, frequency and voltage resistance, and the specific implementation can be set according to the actual requirements of the circuit. The above is only an example for illustration.

[0066] In some embodiments, continuing to refer to Figure 3 The printed circuit board area where the isolation device 50 is arranged is provided with a creepage slot 40.

[0067] The input and output ports of the isolation device 50 need to be connected to different voltage areas, thereby playing a role in isolating and transmitting signals. When the distance between the voltage areas on both sides of the area where the isolation device 50 is arranged is small and the creepage distance is insufficient, the printed circuit board area at this position can be provided with a creepage slot 40 to increase the creepage distance and further strengthen the isolation effect and improve the voltage resistance performance. Exemplarily, referring to Figure 3 The printed circuit board area where the isolation device 50 is arranged is provided with a creepage slot 40 (which can refer to the position area of the creepage slot 43).

[0068] In some embodiments, Figure 4 Another structure schematic diagram of a circuit collection board provided by the embodiments of the present disclosure is provided, referring to Figure 4 The third voltage area 30 includes at least two sub-high-voltage areas 31.

[0069] The distance between adjacent sub-high-voltage areas 31 is greater than the third distance.

[0070] Among them, the components in different sub-high-voltage areas 31 have different functions; and the third distance is greater than the second distance.

[0071] Exemplarily, the third voltage area 30 is a high-voltage area, and components in the high-voltage area correspond to different voltage levels and different functions, so there is a large voltage difference among the components in the third voltage area 30. In order to improve the safety of the system, different high-voltage areas in the third voltage area 30 can be divided to realize insulation enhancement. The third voltage area 30 includes at least two sub-high-voltage areas 31, and the components in different sub-high-voltage areas 31 have different functions, and adjacent sub-high-voltage areas 31 are isolated by a spacing. The distance between adjacent sub-voltage 31 should be greater than the third distance. Since the second distance is the spacing between the second voltage area 20 and the third voltage area 30, in the high-voltage area, the second voltage area is the reference ground of the high-voltage area, so the isolation degree between the second voltage area 20 and the third voltage area 30 can be weak. The components in adjacent sub-high-voltage areas 31 have different functions, and the proportion ensures that the functions of each area are normal, and the isolation degree between adjacent sub-high-voltage areas 31 should be higher than that between the second voltage area 20 and the third voltage area 30, that is, the third distance is greater than the second distance.

[0072] Figure 4 Exemplarily, three sub-high-voltage areas 31 are provided, and there is no component in the dashed line position, which indicates that the edge profile of different voltage areas can be understood as the voltage areas on both sides of the dashed line being different, and the voltage areas on both sides of the dashed line have a certain spacing, which is an isolation area. Figure 4 The three sub-high-voltage areas 31 in the figure respectively represent different functional areas, such as a battery high-voltage area, a battery output high-voltage area, and a battery charging high-voltage area, and the area to be turned on is selected according to actual needs. By isolating the three sub-high-voltage areas 31, signal interference between different sub-high-voltage areas can be avoided, and electrical safety can be ensured.

[0073] Optionally, the extension area of the three sub-high-voltage areas 31 is below the dashed line separating the three sub-high-voltage areas 31. Since the spacing between different areas is insufficient, the creepage distance is increased by slotting.

[0074] In some embodiments, Figure 5 A plug structure schematic diagram is provided for the embodiments of the present disclosure, referring to Figure 5 and combining Figure 4 The circuit acquisition board further includes a plug 60.

[0075] The plug 60 is located in the third voltage area 30.

[0076] The plug 60 includes an insulating stopper 61 and a metal pin 62, and adjacent metal pins 62 are isolated by the insulating stopper 61.

[0077] Exemplarily, the connector 60 is mounted on the A area of the printed circuit board, and the high-voltage signal is connected through the connector 60. The connector 60 includes metal pins 62 connected with the interface of the A area of the printed circuit board. The connector 60 is a high-voltage resistant device, and has large pins. In order to improve the high-voltage resistant level, insulating baffles 61 are further arranged between the adjacent metal pins 62, and the metal pins 62 are spaced apart through the insulating baffles 61 to realize the insulation between the exposed metal pins 62.

[0078] Optionally, in actual application, in order to further improve the safety performance, insulating glue can be applied to each metal pin 62, the exposed metal pin 62 is wrapped by the insulating glue, the exposure is avoided, and the insulation of the high-impedance medium is formed. It should be noted that the above connector structure is only illustrative, and corresponding components can be selected according to actual needs.

[0079] In some embodiments, Figure 6 Another structure schematic diagram of the circuit collection board provided by the embodiment of the present disclosure is provided, referring to Figure 6 The circuit collection board further includes a first insulating shell 71 and a second insulating shell 72.

[0080] The first insulating shell 71 and the second insulating shell 72 form a cavity, and the printed circuit board is located inside the cavity.

[0081] Exemplarily, in order to improve the safety and reliability of the circuit collection board as a whole, the first insulating shell 71 and the second insulating shell 72 are further arranged to protect the printed circuit board. The first insulating shell 71 and the second insulating shell 72 are both formed of insulating materials, form a cavity, and the printed circuit board is located inside the cavity, so that the printed circuit board is surrounded and protected by the shells. Since a variety of components are arranged on the printed circuit board, such as high-voltage devices and low-voltage devices, the shells are made of non-metal insulating materials to avoid the risk of high-voltage breakdown between the high-voltage devices on the circuit board and the shells.

[0082] It should be noted that, in this document, relational terms such as“first” and“second”, and the like, are used solely to distinguish one entity or action from another entity or action, without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms“comprises”,“comprising”, or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, an element defined by the statement“comprising a……” does not exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0083] The foregoing detailed description has set forth various embodiments of the present disclosure via the use of specific terminology. However, embodiments thereof can be practiced without the specific details (e.g., quantities, values, etc.) set forth in the specification and drawings. The present disclosure can be practiced with or without the specific details set forth.

Claims

1. A circuit acquisition board, characterized by, Comprise: A printed circuit board; The printed circuit board comprises a first voltage area, a second voltage area and a third voltage area; The second voltage area is located between the first voltage area and the third voltage area; The first voltage area, the second voltage area and the third voltage area are all provided with components; the distance between the first voltage area and the second voltage area is a first distance; the distance between the second voltage area and the third voltage area is a second distance; the first distance is greater than the second distance; Among them, the first voltage area is a low-voltage area; the second voltage area and the third voltage area are high-voltage areas, and the working voltage of the components in the second voltage area is less than that in the third voltage area.

2. The circuit collection board of claim 1, wherein, The area between the first voltage area and the second voltage area less than or equal to the first preset distance is provided with a creepage slot.

3. The circuit collection board of claim 1, wherein, The area between the second voltage area and the third voltage area less than or equal to the second preset distance is provided with a creepage slot.

4. The circuit collection board according to claim 2 or 3, characterized in that, The creepage slot runs through the printed circuit board.

5. The circuit collection board according to claim 2 or 3, characterized by The width of the creepage slot is greater than 1mm.

6. The circuit collection board of claim 1, wherein, Also include: Isolation device; The isolation device is arranged between the first voltage area and the second voltage area, and / or arranged between the second voltage area and the third voltage area.

7. The circuit card of claim 6, wherein, The area of the printed circuit board provided with the isolation device is provided with a creepage slot.

8. The circuit collection board of claim 1, wherein, The third voltage area comprises at least two sub-high voltage areas; The distance between adjacent sub-high voltage areas is greater than a third distance; Among them, the functions of the components in different sub-high voltage areas are different; the third distance is greater than the second distance.

9. The circuit collection board of claim 1, wherein, Also include: Plug-in part; The plug-in part is located in the third voltage area; The plug-in part comprises an insulating stop sheet and a metal pin; adjacent metal pins are isolated by the insulating stop sheet.

10. The circuit collection board of claim 1, wherein, Also include: First insulating shell and second insulating shell; The first insulating shell and the second insulating shell form a cavity; The printed circuit board is located inside the cavity.

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