Management module of communication equipment and communication equipment

Abstract

The utility model relates to the technical field of communication equipment, in particular to a management module of communication equipment and the communication equipment. The management module comprises a tray and a management board card unit arranged on the tray, wherein the management board card unit comprises a substrate, a core processing unit board and a substrate management control board; the tray is used for being in sliding connection with a case of the communication equipment, so that the tray can enter and exit the case through an opening of the case; the core processing unit and the substrate management control board are electrically connected with the substrate. When the management module needs to be operated and maintained, only the tray needs to slide out of the case, the operation space is large, maintenance is convenient, after operation and maintenance are completed, the tray drives the management module to slide into the case, other parts of the communication equipment do not need to be disassembled and assembled, and other parts or connecting wires are prevented from being damaged. Therefore, the management module of the communication equipment is convenient to operate and maintain, and the operation and maintenance cost is remarkably reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication equipment, and particularly relates to a management module of communication equipment and the communication equipment. BACKGROUND

[0002] In the communication equipment, the management board card refers to a special circuit board for monitoring, configuring and managing servers or other network equipment. The management board card includes a central processing unit board (CPU board) and a baseboard management controller board (BMC board), and the management card usually contains a processor, a memory, a storage and an interface for device monitoring, configuration, fault diagnosis and management. Among them, the management board card is usually installed on the mainboard of the communication equipment or fixed on the case of the communication equipment. When the management board card needs to be maintained, the maintenance personnel need to first remove the communication equipment from the rack, then open the top cover of the case, and may need to disassemble multiple components to access the management board card. In addition, during the disassembly process, other components or connection lines near the management board card may be damaged. Therefore, the maintenance steps of the related management board card of the communication equipment are complicated and the cost is high. CONTENT OF THE UTILITY MODEL

[0003] The present application discloses a management module of communication equipment and the communication equipment to solve the problem of complicated maintenance steps and high cost of the related management board card of the communication equipment.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0005] In a first aspect, the present application provides a management module of communication equipment, which comprises a tray and a management board card unit arranged on the tray, the management board card unit comprising a substrate, a central processing unit board and a baseboard management controller board; the tray is used for being slidably connected with a case of the communication equipment, so that the tray can enter and exit the case through an opening of the case; the central processing unit board and the baseboard management controller board are electrically connected with the substrate.

[0006] Among them, the management module is arranged on the tray, and the tray can enter and exit the case through the opening of the case. When the management module needs to be maintained, only the tray needs to be slid out of the case, the operation space is large, and the maintenance is convenient. After the maintenance is completed, the tray drives the management module to slide into the case, without the need to disassemble other components of the communication equipment, so as to avoid damaging other components or connection lines. Therefore, the management module of the communication equipment in the present application is convenient to maintain and operate, and the maintenance cost is significantly reduced.

[0007] Further, the management board card unit further comprises a storage component selected from at least one of a solid state disk and a random access memory.

[0008] Further, the management module comprises a first connector arranged on the substrate, and the first connector is configured to be connected with a mainboard of the communication device.

[0009] Further, the management module further comprises a connector pressing strip arranged on the tray, and the connector pressing strip comprises a pressing structure arranged on a side of the first connector away from the tray, and the pressing structure is in abutment with the first connector.

[0010] Further, the management module further comprises a first guide arranged on the tray, and the first guide is configured to cooperate with a second guide in the cabinet; wherein the first guide is a guide slot, and the second guide is a guide pin; or the first guide is a guide pin, and the second guide is a guide slot.

[0011] Further, the management module further comprises a fixing member arranged on the tray, and the fixing member is configured to make the tray and the cabinet in a locked state or an unlocked state.

[0012] Further, the tray comprises a limiting part, and the limiting part comprises a limiting slot extending along a sliding direction of the tray, and the limiting slot is configured to cooperate with a limiting protrusion on the cabinet to limit a limit distance of the tray extending into the cabinet.

[0013] Further, a surface of the limiting part facing the substrate is provided with a boss, and the boss is configured to be in abutment with a brim of the limiting protrusion penetrating through the limiting slot in a direction perpendicular to the tray.

[0014] Further, both ends of the tray along the sliding direction are provided with the limiting part, and a surface of the tray away from the substrate is provided with an avoiding slot, and the avoiding slot is configured to avoid the limiting protrusion.

[0015] Further, the management module further comprises a heat dissipation assembly and / or a power supply module arranged on the tray; the heat dissipation assembly is configured to dissipate heat of the management module, and the heat dissipation assembly is selected from at least one of a liquid cooling unit and an air cooling unit; and the power supply module is electrically connected with the management board card unit.

[0016] In a second aspect, the application provides a communication device, which comprises a cabinet and the management module of the first aspect, and the cabinet is provided with an opening, and the tray can enter or exit the cabinet through the opening. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can also be obtained by those skilled in the art without any creative effort.

[0018] Figure 1 FIG. 1 is a structural schematic diagram of the management module of an embodiment of the application;

[0019] Figure 2 An assembly view of a tray and a case according to an embodiment of the present application;

[0020] Figure 3 An enlarged view of A shown in FIG. 1B; Figure 2

[0021] An enlarged view of B shown in FIG. 1B; Figure 4

[0022] An enlarged view of C shown in FIG. 1B; Figure 5 Figure 4 A structure view of a management module according to another embodiment of the present application;

[0023] Figure 6 A structure view of a communication device according to an embodiment of the present application;

[0024] Figure 7 An enlarged view of C shown in FIG. 1B.

[0025] Figure 8 Figure 7 An enlarged view of C shown in FIG. 1B.

[0026] 100 - tray; 101 - bottom plate; 102 - side plate; 110 - first connector; 120 - connector pressing strip; 121 - pressing structure; 122 - connecting structure; 123 - arc-shaped structure; 130 - first guide; 140 - fixing member; 150 - limiting portion; 151 - boss; 160 - handle; 200 - management board card unit; 210 - base plate; 220 - core processing unit board; 230 - base plate management control board; 240 - storage assembly; 241 - solid state disk; 242 - double data rate random access memory; 500 - heat dissipation assembly; 510 - liquid cooling unit; 511 - water inlet pipeline; 512 - water outlet pipeline; 513 - water distributor; 514 - splash-proof device; 515 - liquid cooling plate; 600 - power supply module;

[0027] 10 - management module; 20 - case; 30 - main board; 40 - second guide; 50 - limiting boss; 51 - hat brim; 60 - second connector;

[0028] 01 - opening; 02 - limiting groove; 03 - avoiding groove; 05 - groove. DETAILED DESCRIPTION

[0029] ​​With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0030] The terms "first", "second" are only used for description purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0031] The height of the chassis of the related communication equipment can be 1U, 2U or 4U, etc., wherein "U" is the abbreviation of "Unit", indicating "unit". 1U usually refers to a standard height unit in computer hardware, used to describe the vertical size of rack-mounted devices such as servers, network devices, storage devices, etc. However, regardless of the height size specification of the communication equipment, the fixing method of the management board card inside the chassis is relatively fixed, usually the management board card is fixed with the chassis through screws, the management board card does not support quick disassembly, and cannot guarantee efficient operation and maintenance.

[0032] Therefore, in the embodiments of the present application, a management module of a communication equipment is provided, Figure 1 For the structure diagram of the management module of an embodiment of the present application, please refer to Figure 1 The management module 10 includes a tray 100 and a management board card unit 200 arranged on the tray 100, and the management board card unit 200 includes a substrate 210, a core processing unit board 220 and a substrate management control board 230. The tray 100 is used to be slidingly connected with the chassis of the communication equipment, so that the tray 100 can enter and exit the chassis through the opening of the chassis, thereby facilitating the management module 10 to enter and exit the chassis with the tray 100, and facilitating the operation and maintenance of the management module 10. Wherein, the core processing unit board 220 and the substrate management control board 230 are electrically connected with the substrate 210.

[0033] The core processing unit board 220 (CPU board) is buckled on the baseboard 210, which can provide rich interfaces such as Peripheral Component Interconnect Express (PCIE), Kilostream Receiver (KR), Inter-Integrated Circuit (I2C), Low Pin Count (LPC), Universal Asynchronous Transmitter / Transmitter (UART), Universal Serial Bus (USB), Joint Test Action Group (JTAG), Serial Peripheral Interface (SPI), etc., mainly bearing service traffic message processing, management and access to external PCIE / I2C devices.

[0034] The baseboard management control board 230 (BMC board) provides interfaces such as I2C, LPC, Serial Gigabit Media Independent Interface / Reduced Gigabit Media Independent Interface (SGMII / RGMII), UART, USB, etc., which can be used to monitor the X86 running state, online upgrade Basic Input / Output System / Complex Programmable Logic Device Firmware (BIOS / CPLD Firmware), Field Programmable Gate Array (FPGA), and management or access to external I2C devices.

[0035] It can be understood that the baseboard 210 is used to carry the interconnection of the CPU board and the BMC board, and the baseboard 210 can provide functions such as reset forwarding, serial port switching, external management port, etc. The baseboard 210 is locked and fixed with the tray 100. For example, the locking mode can be screw locking.

[0036] In some optional embodiments, rubber pads are arranged between the substrate 210 and the tray 100 to reduce the transmission of vibration.

[0037] In order to reduce the vibration of the substrate 210 and avoid the mutual influence between the CPU board, the BMC board and other boards arranged on the substrate 210, a plurality of damping holes penetrating through the substrate 210 are arranged on the substrate 210. The damping holes can be arranged between adjacent boards to reduce the transmission of vibration on the substrate 210 and avoid the mutual influence between adjacent boards.

[0038] In some optional embodiments, the management board unit 200 further comprises a storage component 240 selected from at least one of a solid state drive 241 (SSD), a double data rate random access memory 242 (DDR) and an embedded multi media card (EMMC).

[0039] In some preferred embodiments, the storage component 240 is selected from at least two of the solid state drive 241, the double data rate random access memory 242 and the embedded multi media card. For example, the storage component 240 comprises the solid state drive 241 and the double data rate random access memory 242.

[0040] In one possible implementation, the CPU board is electrically connected with the SSD, the CPU board is electrically connected with the DDR and the EMMC is electrically connected with the CPU board through PCB wires or cables.

[0041] In the above possible implementation, the SSD and the substrate 210 are detachably connected, for example, through snap connection. The snap connection can fix the SSD and avoid the shaking of the SSD. In addition, the snap connection is convenient for quickly assembling and disassembling the SSD, which is a vulnerable component.

[0042] In some optional embodiments, referring to Figure 1 The management module 10 comprises a first connector 110 arranged on the substrate 210. The first connector 110 is used to connect with the main board of the communication device, so as to realize the electrical connection between the main board and the substrate 210.

[0043] The management module 10 can be plugged in with electricity. In order to avoid the burning phenomenon caused by the sparking of the pins of the first connector 110 when being plugged in, the first connector 110 needs to be selected as a connector that can withstand high voltage and large current. In addition, the first connector 110 includes long needle pins and short needle pins. The long needle pins are used for the transmission of the in-place signal, and the short needle pins are used for power supply. The long needle pins can ensure that the signal line is in contact with the power line first when the first connector 110 is inserted, and is disconnected last when being pulled out, thereby reducing signal interference and potential electric spark risk, and further improving the stability and reliability of the management module 10.

[0044] In some optional embodiments, continuing to refer to Figure 1 The management module 10 further includes a connector pressing strip 120 arranged on the tray 100. The connector pressing strip 120 includes a pressing structure 121 arranged on the side of the first connector 110 away from the tray 100, and the pressing structure 121 is in abutment with the first connector 110, thereby pressing the first connector 110 to prevent it from being warped due to insufficient holding force. In addition, the connector pressing strip 120 can enhance the strength of the management module 10.

[0045] In some optional embodiments, the tray 100 includes a bottom plate 101 and two oppositely arranged side plates 102. Optionally, the connector pressing strip 120 further includes a connecting structure 122 connected with the pressing structure 121, and the end of the connecting structure 122 away from the pressing structure 121 is fixedly connected with the side plate 102. As shown in Figure 1 The connector pressing strip 120 can include two connecting structures 122. The pressing structure 121 is arranged between the two connecting structures 122, and each connecting structure 122 is fixedly connected with the side plate 102 close to the connecting structure 122. In this application, the fixed connection manner of the side plate 102 of the connecting structure 122 is not limited, for example, the two can be connected by screws or bolts.

[0046] In some optional embodiments, the connector pressing strip 120 further includes an arc-shaped structure 123. The vertical distance between the pressing structure 121 and the bottom plate 101 is greater than the vertical distance between the connecting structure 122 and the bottom plate 101. The pressing structure 121 and the connecting structure 122 are connected through the arc-shaped structure 123, and the arc-shaped structure 123 can limit the first connector 110 along the length direction of the connector pressing strip 120.

[0047] The preparation material of the connector pressing strip 120 can be metal or alloy, etc. The pressing structure 121, the connecting structure 122 and the arc-shaped structure 123 can be an integrally formed structure, or can be connected by welding or bonding, etc.

[0048] In some optional embodiments, continuing to refer to Figure 1The management module 10 also includes a first guide 130 disposed on the tray 100, which cooperates with a second guide inside the chassis. The first guide 130 is a guide groove, and the second guide is a guide pin; or, the first guide 130 is a guide pin, and the second guide is a guide groove. The guide pin is inserted into the guide groove to allow the tray 100 to slide into a preset position within the chassis 20, thereby aligning the first connector 110 with the corresponding interface on the motherboard, thus ensuring the electrical connection between the substrate 210 and the motherboard.

[0049] In some optional embodiments, the management module 10 further includes a fixing member 140 disposed on the tray 100, the fixing member 140 being used to lock or unlock the tray 100 and the chassis. When maintenance is required on the management module 10, the fixing member 140 is unlocked, and the tray 100 can slide out from the chassis; after maintenance is completed, the tray 100 is slid back into the chassis, and the fixing member 140 is locked to prevent the tray 100 from falling out of the chassis.

[0050] The fastener 140 can be a captive screw, a clip, a wrench, etc. When the fastener 140 is a captive screw, the chassis has a corresponding screw hole, and the captive screw can be inserted into the screw hole. When the fastener 140 is a wrench, when the tray 100 is inside the chassis, the wrench blocks the exit of the chassis, restricting the tray 100 from sliding out of the chassis; when it is necessary to slide the tray 100 out of the chassis, the wrench limit is released, so that the tray 100 can slide out of the chassis.

[0051] In some alternative embodiments, the tray 100 is provided with a handle 160. When it is necessary to slide the tray 100 out of the chassis, the operator can pull the handle 160 to pull the tray 100 out, which is convenient.

[0052] Figure 2 This is a schematic diagram of the assembly of the tray and chassis according to one embodiment of this application. Figure 3 for Figure 2 A magnified view of a portion at point A shown in the image. Figure 4 This is a bottom view of a tray according to one embodiment of this application. Figure 5 for Figure 4 A magnified view of point B shown in the image, refer to... Figures 2 to 5 The tray 100 includes a limiting part 150, which includes a limiting groove 02 extending along the sliding direction D of the tray 100. The limiting groove 02 is used to cooperate with the limiting protrusion 50 on the chassis 20 to limit the maximum distance that the tray 100 can extend into the chassis 20. When the limiting protrusion 50 abuts against the inner wall of the limiting groove 02, the tray 100 stops moving, and the distance between the tray 100 and the motherboard 30 is the minimum distance, thereby avoiding excessive force when pushing the tray 100 into the chassis 20, which could cause the first connector 110 to over-insert and damage the first connector 110.

[0053] In order to make the tray 100 more smoothly in and out of the cabinet 20, the bottom of the tray 100 and the cabinet can have a gap to reduce the friction between them. However, the gap between the bottom of the tray 100 and the cabinet 20 can cause the tray 100 to easily shake violently under vibration conditions.

[0054] Therefore, referring to Figures 2 to 5 , the surface of the limiting portion 150 of the tray 100 facing the base plate 210 is provided with a boss 151, which is used to abut with the brim 51 of the limiting protrusion 50 penetrating the limiting slot 02 in a direction perpendicular to the tray 100, so that the tray 100 is clamped between the limiting protrusion 50 and the brim 51, thereby effectively reducing the vibration of the tray 100.

[0055] In some optional embodiments, the surface of the limiting portion 150 away from the management module has a groove 05, which can act as a buffer when the limiting portion 150 is pressed by the management module, reducing the impact force directly on the cabinet 20.

[0056] In some optional embodiments, as shown in Figure 2 , both ends of the tray 100 can be provided with a limiting portion 150 along the sliding direction of the tray 100, thereby effectively reducing the vibration of the tray 100. Among them, the surface away from the base plate 210 is provided with an avoiding slot 03, which is used to avoid the limiting protrusion 50, and the limiting protrusion 50 can slide in the avoiding slot 03.

[0057] In some optional embodiments, the tray 100 and the cabinet 20 are connected through a sliding assembly to ensure that the tray 100 is smoothly in and out of the cabinet, reducing the jam. Among them, the sliding assembly can include a guide rail and a slider cooperating with the guide rail. When the guide rail is arranged on the surface of the tray 100, the slider is arranged on the cabinet 20. When the guide rail is arranged on the cabinet 20, the slider is arranged on the surface of the tray 100 facing the cabinet.

[0058] Figure 6 For another embodiment of the structure of the management module of the present application, referring to Figure 6 , the management module further comprises a heat dissipation assembly 500 arranged on the tray 100 and / or a power supply module 600. Among them, the heat dissipation assembly 500 is used to dissipate heat for the management module, and the heat dissipation assembly 500 is selected from at least one of a liquid cooling unit 510 and an air cooling unit. The power supply module 600 is electrically connected with the management board card unit 200. It can be understood that the power supply module 600 includes but is not limited to a button cell, a common redundant power supply (CRPS), etc., which is specifically set according to actual needs.

[0059] The heat dissipation assembly 500 can be arranged on the same tray 100 as the management board unit 200, or can be arranged on different trays 100, and the specific arrangement is based on the space size in the case 20 and actual needs. Similarly, the power supply module 600 can be arranged on the same tray 100 as the management board unit 200, or can be arranged on different trays 100, and the specific arrangement is based on the space size in the case 20 and actual needs. Of course, the power supply module 600 can also be arranged on the same tray 100 as the heat dissipation assembly 500.

[0060] As shown in FIG. 1, Figure 6 The heat dissipation assembly 500 can be arranged on a tray 100 alone, so as to facilitate the operation and maintenance of the heat dissipation assembly 500 alone, and increase the flexibility of the overall configuration of the management module. When the heat dissipation assembly 500 is a liquid cooling unit 510, the liquid cooling unit 510 includes a water inlet pipeline 511, a water outlet pipeline 512, a liquid cooling plate 515, a splash-proof device 514, a water distributor 513, and a liquid leakage collection tank (not shown in the figure). The liquid cooling plate 515 can be attached to the board in the management module to dissipate heat for the board. The splash-proof device 514 is used to prevent the cooling liquid from leaking at the connection and possibly splashing onto the substrate, thereby protecting the board from damage. The water distributor 513 is used to distribute the cooling liquid to multiple cooling plates. The water inlet pipeline 511 is used to transport the cooling liquid from an external liquid storage tank to the liquid cooling plate 515, and the water outlet pipeline 512 is used to send the cooling liquid that has absorbed heat back to the liquid storage tank. The liquid leakage collection tank is located on the tray 100 and can collect the liquid leakage from the water distributor. The working process of the liquid cooling unit 510 is described in detail as follows:

[0061] The cooling liquid in the liquid storage tank flows to the liquid cooling plate 515 through the water inlet pipeline 511, and the cooling liquid inside the cooling plate absorbs the heat of the board in thermal contact with the liquid cooling plate 515, thereby dissipating heat for the board. The water outlet pipeline 512 sends the cooling liquid that has absorbed heat back to the liquid storage tank to complete the circulation and continue the cooling process.

[0062] Based on the same technical concept, the embodiments of the present application also provide a communication device, Figure 7 a structural schematic diagram of the communication device of an embodiment of the present application, Figure 8 as shown in the enlarged view of part C in FIG. 1, Figure 7 as shown in FIG. 1, Figure 7 and Figure 8 The communication device includes a case 20 and a management module 10 in various possible embodiments of the present application, and the case 20 is provided with an opening 01 through which a tray 100 can enter and exit the case 20.

[0063] The case 20 includes a top surface, a bottom surface, and side surfaces. It can be understood that the opening 01 can be arranged on at least one side surface of the case 20, and the specific arrangement is based on actual needs.

[0064] It can be understood that the communication device includes but is not limited to a data center switch, a router, a server, a firewall and the like. Because it includes the communication device in the present application, the above-mentioned communication device also has the advantage that the management module 10 is convenient to repair. When the board card in the management module 10 of the communication device, such as SSD or DDR, fails, the above-mentioned board card can be repaired or replaced on the customer site, avoiding the whole communication device returning to operation and maintenance, improving the operation and maintenance efficiency, thereby effectively improving the user experience, and significantly reducing the operation and maintenance cost.

[0065] In some optional embodiments, as shown in Figure 7 The second connector 60 is electrically connected with the mainboard 30, and is used to be connected with the first connector 110, so as to electrically connect the mainboard 30 and the substrate 210. The second connector 60 needs to be a connector resistant to high voltage and large current. In addition, the second connector 60 also includes long needle pins and short needle pins. For specific descriptions of the long needle pins and the short needle pins, reference can be made to the descriptions of the selection of the first connector 110, which will not be described here again.

[0066] In some optional embodiments, the case 20 is also provided with a second guide 40, which is used to cooperate with the first guide 130. The first guide 130 is a guide groove, and the second guide 40 is a guide pin; or the first guide 130 is a guide pin, and the second guide 40 is a guide groove.

[0067] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the claims of the present application and the equivalent technology thereof, the present application also intends to include these modifications and variations.

Claims

1. A management module for a communication device, characterized in that, The management module comprises a tray and a management board card unit arranged on the tray, the management board card unit comprises a base plate, a core processing unit plate and a base plate management control plate; The tray is used for sliding connection with a chassis of a communication device, so that the tray can enter and exit the chassis through an opening of the chassis; The core processing unit plate and the base plate management control plate are electrically connected with the base plate.

2. The management module of claim 1, wherein, The management board card unit further comprises a storage assembly selected from at least one of a solid state disk and a random access memory.

3. The management module of claim 1, wherein, The management module comprises a first connector arranged on the base plate, and the first connector is used for connection with a mainboard of the communication device.

4. The management module of claim 3, wherein, The management module further comprises a connector pressing strip arranged on the tray, the connector pressing strip comprises a pressing structure arranged on a side of the first connector away from the tray, and the pressing structure is in abutment with the first connector.

5. The management module of claim 3, wherein, The management module further comprises a first guide arranged on the tray, and the first guide is used for cooperation with a second guide in the chassis; The first guide is a guide groove, and the second guide is a guide pin; or the first guide is a guide pin, and the second guide is a guide groove.

6. The management module of claim 1, wherein, The management module further comprises a fixing member arranged on the tray, and the fixing member is used for locking or unlocking the tray and the chassis.

7. The management module according to any of claims 1-6, characterized by The tray comprises a limiting portion, the limiting portion comprises a limiting groove extending along a sliding direction of the tray, and the limiting groove is used for cooperation with a limiting protrusion on the chassis to limit the limit distance of the tray extending into the chassis.

8. The management module of claim 7, wherein, A surface of the limiting portion facing the base plate is provided with a boss, and the boss is used for abutment with a brim of the limiting protrusion penetrating through the limiting groove in a direction perpendicular to the tray.

9. The management module of claim 8, wherein, Along the sliding direction of the tray, both ends of the tray are provided with the limiting portion, and a surface of the tray away from the base plate is provided with an avoiding groove for avoiding the limiting protrusion.

10. The management module of claim 7, wherein, The management module further comprises a heat dissipation assembly and / or a power supply module arranged on the tray; The heat dissipation assembly is used for heat dissipation of the management module, and the heat dissipation assembly is selected from at least one of a liquid cooling unit and an air cooling unit; The power supply module is electrically connected with the management board card unit.

11. A communication device, characterized by The management module comprises a chassis and a management module according to any one of claims 1-10, and the chassis is provided with an opening, and the tray can enter and exit the chassis through the opening.

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