Heat dissipation module of beauty instrument
By employing a heat dissipation design that combines a heat spreader and copper pipes in the beauty device, the problem of low heat dissipation efficiency in traditional beauty devices has been solved, achieving efficient heat dissipation and miniaturization of the device.
Patent Information
- Application Number
- CN202422527373.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-18
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-10-18
AI Technical Summary
Traditional beauty devices suffer from limited heat dissipation area, low heat transfer efficiency, complex structure, and large space occupation, making it difficult to meet the heat dissipation requirements of high-power beauty devices.
Using a heat spreader and copper pipes as heat conduction ends, the heat generated by the semiconductor cooling chip is efficiently transferred through the heat dissipation fins to form an integrated heat dissipation path. Combined with a thermistor sensor and a smart skin recognition module, the heat dissipation performance is optimized.
It improves heat transfer efficiency, shortens the heat transfer path, reduces thermal resistance, enhances overall heat dissipation performance, and enables the miniaturization and portability of the beauty device.
Smart Images

Figure CN223567937U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a beauty instrument, specifically relates to a heat dissipation module of beauty instrument. BACKGROUND
[0002] In the current beauty instrument design, the heat dissipation problem has been the key factor influencing the equipment performance and life. The semiconductor refrigerating sheet is widely used in the beauty instrument because it can realize the effect of one side refrigeration and one side heating under the action of electric current. However, the high efficient heat dissipation of semiconductor refrigerating sheet has been a technical problem.
[0003] The traditional heat dissipation design often uses simple heat dissipation fin or fan to carry out heat management, but this method often cannot satisfy the heat dissipation demand of high power beauty instrument. There are mainly following problems:
[0004] The traditional heat dissipation fin is difficult to quickly transfer the heat generated by the semiconductor refrigerating sheet effectively due to the limited heat dissipation area, leading to temperature rise, influencing the equipment performance.
[0005] Although the fan can assist heat dissipation, due to the unreasonable overall heat dissipation path design, the heat transfer efficiency is low, and the root problem still cannot be solved.
[0006] The traditional heat dissipation solution often needs multiple components to cooperate, leading to the complex overall structure, large space occupation, high cost, and inconvenience for the miniaturization and portability of beauty instrument. UTILITY MODEL CONTENT
[0007] The utility model solves the technical problem that a heat dissipation module of beauty instrument is provided to solve the problems in the background art.
[0008] The heat dissipation module of the utility model is realized through the following technical scheme, comprising:
[0009] The fixed seat is fixed with the heat dissipation module, one end of the heat dissipation module is the heat conduction end of the heat plate, the other end is the heat conduction end of the copper pipe, and the heat generated by the semiconductor refrigerating sheet is transmitted to the heat dissipation end of the heat dissipation module through the heat plate and the copper pipe.
[0010] As a preferred technical scheme, the heat dissipation module comprises heat dissipation fins and semiconductor refrigerating sheets.
[0011] The heat dissipation fins are installed below the fixed seat, and the heat plate and the copper pipe are directly connected with the heat dissipation fins without transitional transmission body, the semiconductor refrigerating sheets are provided with two and are installed on the heat plate and the copper pipe respectively, and the heat generation end of the semiconductor refrigerating sheet contacts with the heat plate and the copper pipe.
[0012] The lamp tube power supply position is formed between the heat plate and the copper pipe, and the lamp tube structure is arranged at the lamp tube power supply position.
[0013] As a preferred technical solution, the lamp tube structure comprises a reflector cup body, a lamp tube body, an electrode sheet and a reflector cup holder.
[0014] The reflector cup body is arranged on the reflector cup holder, and the reflector cup holder is arranged between the heat plate and the copper pipe, and the electrode sheet is arranged at two ends of the reflector cup body.
[0015] The electrode sheet is connected with the copper column on the fixing seat, so as to realize power supply for the lamp tube body.
[0016] As a preferred technical solution, a thermistor sensor is arranged at the semiconductor refrigeration sheet of the heat plate, and a thermistor sensor is also arranged at the semiconductor refrigeration sheet of the copper pipe, and the temperature of the skin contact surface is detected through the thermistor sensor.
[0017] As a preferred technical solution, the fixing seat is installed in the replaceable head of the beauty instrument.
[0018] The beneficial effects of the utility model are as follows:
[0019] The utility model discloses a heat plate and copper pipe are used as the heat conduction end, and the heat generated by the semiconductor refrigeration sheet is efficiently transferred to the radiating fin through them;The radiating fin is installed below the fixing seat and is connected with the heat plate and the copper pipe, and forms an integrated radiating path;The combination of the heat plate and the copper pipe can effectively improve the heat transfer efficiency, shorten the heat transfer path, reduce the thermal resistance, and thus enhance the overall heat dissipation performance.
[0020] The utility model discloses a radiating fin, heat plate, copper pipe and semiconductor refrigeration sheet are integrated on a fixing seat, and form an integrated radiating system, and the structure is compact, and the occupied space is small. DRAWINGS
[0021] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the following will briefly introduce the drawing needed to be used in the embodiment or prior art description, and obviously, the drawing in the following description is only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without paying creative labor.
[0022] Figure 1 It is a single lamp tube three-dimensional structure schematic view of the utility model;
[0023] Figure 2 It is a single lamp tube explosion structure schematic view of the utility model
[0024] Figure 3A double lamp tube structure schematic diagram of the utility model;
[0025] Figure 4 A double lamp tube explosion structure schematic diagram of the utility model.
[0026] Mark explanation:
[0027] 1, fixed seat, 2, the heat plate, 3, copper pipe, 4, heat dissipation fin, 5, semiconductor refrigeration piece, 6, the main body of the reflector cup, 7, the main body of the lamp tube, 8, electrode piece, 9, copper column, 10, clamping groove, 11, thermistor, 12, reflector lamp holder. Specific implementation
[0028] All features disclosed in the specification, or steps in all methods or processes disclosed, can be combined in any manner, except where mutually exclusive.
[0029] As Figures 1-2 The utility model discloses a heat dissipation module of cosmetic instrument, including fixed seat 1, the fixed seat 1 is fixed with heat dissipation module, one end heat conduction end of heat dissipation module is heat plate 2, and the other end heat conduction end is copper pipe 3, and the heat that semiconductor refrigeration piece 5 sends is transmitted to the heat dissipation end at heat dissipation module through heat plate 2 and copper pipe 3.
[0030] Among them, heat dissipation module includes heat dissipation fin 4 and semiconductor refrigeration piece 5;
[0031] The heat dissipation fin 4 is installed below the fixed seat 1, and the heat plate 2 and copper pipe 3 are connected with the heat dissipation fin 4, the semiconductor refrigeration piece 5 is provided with two and is installed on the heat plate 2 and copper pipe 3 respectively, and the heating end of the semiconductor refrigeration piece 5 contacts the heat plate 2 and copper pipe 3.
[0032] The heat plate 2 and copper pipe 3 form lamp tube power supply potential between them, and the lamp tube structure is arranged at the lamp tube power supply potential.
[0033] Among them, the lamp tube structure includes reflector cup main body 6, lamp tube main body 7, electrode piece 8 and reflector cup holder 12;
[0034] The reflector cup main body 6 is arranged on the reflector cup holder 12, the reflector cup holder 12 is arranged between the heat plate 2 and copper pipe 3, and the electrode piece 8 is arranged at both ends of the reflector cup main body 6, a plurality of clamping grooves 10 are formed in the electrode piece 8, and one lamp tube main body 7 is installed in the clamping groove 10 (or as Figures 3-4 Two lamp tube main bodies 7 are installed in the clamping groove, and the double lamp tube function is further provided), the electrode piece 8 is connected with the copper column 9 on the fixed seat 1, and the power supply for the lamp tube main body 7 is realized.
[0035] In addition, a thermistor sensor 11 is arranged at the semiconductor refrigeration fin 5 of the heat plate 2, and a thermistor sensor 11 is also arranged at the semiconductor refrigeration fin 5 of the copper pipe 3, the thermistor sensor 11 is used for testing the temperature of the heating surface, and then controlling the temperature of the heating surface, so as to achieve the hot compress effect on the skin, open the pores, make the light more easily penetrate the skin and be better absorbed by the hair root, and then achieve better depilation effect.
[0036] In addition, one side of the heat dissipation fin is provided with an intelligent skin identification module 13 for identifying the skin state, and then controlling the lamp tube and the semiconductor refrigeration fin.
[0037] In addition, the fixed seat 1 is installed in the replaceable head of the beauty instrument, and the sapphire is installed on the replaceable head.
[0038] The beauty instrument is internally provided with a heat dissipation fan, and the air outlet end of the heat dissipation fan corresponds to the position of the heat dissipation fin, the heat is transmitted in a convection manner of the air in the channel of the beauty instrument through the fan, so as to reduce the temperature of the ice compress surface and achieve the refrigeration effect.
[0039] The working principle of the semiconductor refrigeration fin of the utility model is that one side is cold and the other side is hot when working, the cold side is attached to the sapphire, and the hot side is attached to the copper pipe or the heat plate, the heat plate and the copper pipe are respectively welded with the heat dissipation fin, the heat dissipation fin is a very thin aluminum sheet or copper sheet connected together, forms a block to increase the heat dissipation area, and the heat is transmitted from the semiconductor refrigeration fin hot surface copper pipe and heat plate to fin.
[0040] The above is only a specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any change or replacement without creative labor should be covered in the protection scope of the utility model. Therefore, the protection scope of the utility model should be limited to the protection scope defined in the claims.
Claims
1. A heat dissipation module of a cosmetic instrument, characterized in that, The utility model relates to a heat dissipation module of cosmetic instrument, including: The fixed seat (1) is fixed with heat dissipation module on one end of the heat dissipation module heat conduction end is the heat plate (2), and the other end heat conduction end is copper pipe (3), and the heat of semiconductor refrigeration piece (5) is transmitted to the heat dissipation end at heat dissipation module through heat plate (2) and copper pipe (3). The heat dissipation module includes heat dissipation fin (4) and semiconductor refrigeration piece (5); 2. The heat dissipation module of the cosmetic instrument according to claim 1, characterized in that: The heat dissipation fin (4) is installed below the fixed seat (1), and the heat plate (2) and copper pipe (3) are connected with heat dissipation fin (4); The heat plate (2) and copper pipe (3) form the lamp tube power supply position, and the lamp tube structure is arranged at the lamp tube power supply position. The semiconductor refrigeration piece (5) is provided with two and is installed on heat plate (2) and copper pipe (3) respectively;The heat generating end of semiconductor refrigeration piece (5) is in contact with heat plate (2) and copper pipe (3).
3. The heat dissipation module of the cosmetic instrument according to claim 2, characterized in that: The lamp tube structure includes reflector cup main part (6), lamp tube main part (7), electrode piece (8) and reflector cup support (12); 4. The heat dissipation module of the cosmetic instrument according to claim 3, characterized in that: The reflector cup main part (6) is arranged on reflector cup support (12), and reflector cup support (12) is placed between heat plate (2) and copper pipe (3), and electrode piece (8) is arranged at both ends of reflector cup main part (6); The electrode piece (8) is connected with the copper column (9) on the fixed seat (1), and the power supply of lamp tube main part (7) is realized. A plurality of clamping grooves (10) are arranged on the electrode piece (8), and the lamp tube main part (7) is installed in the clamping groove (10).
5. The heat dissipation module of the cosmetic instrument according to claim 4, characterized in that: The semiconductor refrigeration piece (5) at heat plate (2) is provided with thermistor sensor (11), and the semiconductor refrigeration piece (5) at copper pipe (3) is also provided with thermistor sensor (11), and the temperature of skin contact surface is detected through thermistor sensor (11).
6. The heat dissipation module of the cosmetic instrument according to claim 1, characterized in that: The fixed seat (1) is installed in the replaceable head of cosmetic instrument.
7. The heat dissipation module of the cosmetic instrument according to claim 1, characterized in that: