Liquid cooling plate, liquid cooling plate group and data center

Abstract

The utility model provides a liquid cooling plate, a liquid cooling plate group and a data center, and relates to the technical field of data centers. The liquid cooling plate comprises a substrate which is provided with a heat conduction surface used for being in contact with a heating device; the cover plate is connected with the substrate and located on the side, away from the heat conduction face, of the substrate, a sealing cavity used for containing a liquid cooling medium is formed between the substrate and the cover plate, and an opening communicated with the sealing cavity is formed in the cover plate; the liquid cooling pipeline is communicated with the opening; and the plastic package part seals the joint of the liquid cooling pipeline and the cover plate. According to the technical scheme provided by the embodiment of the invention, the injection-molded plastic package part is adopted to seal the assembly joint of the liquid cooling plate, the connection area can be sealed, and the liquid cooling plate has the characteristics of high temperature resistance and corrosion resistance, so that the liquid leakage risk of the liquid cooling plate can be greatly reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of data centers, in particular to a liquid cooling plate, a liquid cooling plate group and a data center. BACKGROUND

[0002] The server of a data center is highly integrated, and its power consumption is also increasingly high. The traditional air cooling technology has unavoidable noise and energy consumption problems, therefore, the liquid cooling technology is gradually adopted for the server heat dissipation of a data center, that is, a liquid cooling plate is arranged at a heat generating device of the server. However, the liquid cooling plate often has a liquid leakage phenomenon, and the liquid leakage of the liquid cooling plate will cause a server failure, therefore, it is necessary to reduce the liquid leakage risk of the liquid cooling plate. CONTENT OF THE UTILITY MODEL

[0003] The embodiments of the present application provide a liquid cooling plate, a liquid cooling plate group and a data center to reduce the liquid leakage risk of the liquid cooling plate.

[0004] In a first aspect, the embodiments of the present application provide a liquid cooling plate, comprising: a substrate, the substrate having a heat conduction surface for contacting a heat generating device; a cover plate, the cover plate being connected with the substrate and located on a side of the substrate away from the heat conduction surface, a sealed cavity for accommodating a liquid cooling medium being formed between the substrate and the cover plate, and an opening being provided on the cover plate and communicating with the sealed cavity; a liquid cooling pipeline, the liquid cooling pipeline communicating with the opening; and a plastic sealing piece, the plastic sealing piece sealing a connection between the liquid cooling pipeline and the cover plate.

[0005] In an implementation, the opening comprises an inlet and an outlet, the liquid cooling pipeline comprises an inlet liquid cooling pipeline communicating with the inlet and an outlet liquid cooling pipeline communicating with the outlet, and the plastic sealing piece comprises an inlet plastic sealing piece and an outlet plastic sealing piece, the inlet plastic sealing piece covering a connection between the inlet liquid cooling pipeline and the cover plate, and the outlet plastic sealing piece covering a connection between the outlet liquid cooling pipeline and the cover plate.

[0006] In an implementation, the inlet plastic sealing piece and the outlet plastic sealing piece are integrally formed.

[0007] In an implementation, the liquid cooling plate further comprises: an adapter, a first end portion of the liquid cooling pipeline and the cover plate are both connected to the adapter, the liquid cooling pipeline and the opening both communicate with an inner cavity of the adapter, and the plastic sealing piece is sleeved on the first end portion and covers the adapter.

[0008] In an implementation, the plastic sealing piece further covers a space between the first end portion and the cover plate.

[0009] In an embodiment, the liquid cooling plate further comprises a first enclosure, which is arranged around the periphery of the plastic package to define the boundary shape of the plastic package.

[0010] In an embodiment, the liquid cooling plate further comprises a connecting piece, which is connected to the second end of the liquid cooling pipeline away from the opening, and the inner cavity of the connecting piece is in communication with the liquid cooling pipeline; a protection piece, which is plasticly encapsulated at the connection between the second end and the connecting piece; and a second enclosure, which is arranged around the periphery of the protection piece to define the boundary shape of the protection piece.

[0011] In an embodiment, the liquid cooling plate further comprises a welding port sealing piece, which is plasticly encapsulated around the welding port of the liquid cooling plate.

[0012] In a second aspect, the embodiments of the present application provide a liquid cooling plate set, which comprises a plurality of liquid cooling plates provided by any of the embodiments of the present application.

[0013] In an embodiment, the plurality of liquid cooling plates comprises a first liquid cooling plate, a second liquid cooling plate, and a third liquid cooling plate; the liquid cooling pipeline of the first liquid cooling plate comprises a first liquid inlet pipeline and a first liquid outlet pipeline, the opening of the first liquid cooling plate comprises a first liquid inlet port and a first liquid outlet port, the first liquid inlet pipeline is in communication with the first liquid inlet port, and the first liquid outlet pipeline is in communication with the first liquid outlet port; the sealing piece of the first liquid cooling plate comprises a first liquid inlet port sealing piece and a first liquid outlet port sealing piece, the first liquid inlet port sealing piece encapsulates the connection between the first liquid inlet pipeline and the cover plate of the first liquid cooling plate, and the first liquid outlet port sealing piece encapsulates the connection between the first liquid outlet pipeline and the cover plate of the first liquid cooling plate; the liquid cooling pipeline of the second liquid cooling plate comprises a second liquid inlet pipeline and a second liquid outlet pipeline, the opening of the second liquid cooling plate comprises a second liquid inlet port and a second liquid outlet port, the second liquid inlet pipeline is in communication with the second liquid inlet port, and the second liquid outlet pipeline is in communication with the second liquid outlet port; the sealing piece of the second liquid cooling plate comprises a second liquid inlet port sealing piece and a second liquid outlet port sealing piece, the second liquid inlet port sealing piece encapsulates the connection between the second liquid inlet pipeline and the cover plate of the second liquid cooling plate, and the second liquid outlet port sealing piece encapsulates the connection between the second liquid outlet pipeline and the cover plate of the second liquid cooling plate; and the liquid cooling pipeline of the third liquid cooling plate comprises a third liquid inlet pipeline and a third liquid outlet pipeline, the opening of the third liquid cooling plate comprises a third liquid inlet port and a third liquid outlet port, the third liquid inlet pipeline is in communication with the third liquid inlet port, and the third liquid outlet pipeline is in communication with the third liquid outlet port; the sealing piece of the third liquid cooling plate comprises a third liquid inlet port sealing piece and a third liquid outlet port sealing piece, the third liquid inlet port sealing piece encapsulates the connection between the third liquid inlet pipeline and the cover plate of the third liquid cooling plate, and the third liquid outlet port sealing piece encapsulates the connection between the third liquid outlet pipeline and the cover plate of the third liquid cooling plate; wherein the first liquid outlet pipeline is in communication with the second liquid inlet pipeline and integrally formed.

[0014] In an embodiment, the first liquid cooling plate comprises a first connecting piece and a first protective piece, the first connecting piece is connected with an end of the first liquid inlet liquid cooling pipeline away from the first liquid inlet, an inner cavity of the first connecting piece is communicated with the first liquid inlet liquid cooling pipeline, and the first protective piece is provided in a plastic sealing sleeve at a connection between the first liquid inlet liquid cooling pipeline and the first connecting piece; the second liquid cooling plate comprises a second connecting piece and a second protective piece, an end of the second liquid outlet liquid cooling pipeline away from the second liquid outlet is connected with the second connecting piece, the second liquid outlet liquid cooling pipeline is communicated with an inner cavity of the second connecting piece, and the second protective piece is provided in a plastic sealing sleeve at a connection between the second liquid outlet liquid cooling pipeline and the second connecting piece; wherein a second enclosure of the first liquid cooling plate is used to define a boundary shape of the first protective piece, a second enclosure of the second liquid cooling plate is used to define a boundary shape of the second protective piece, and the second enclosure of the first liquid cooling plate and the second enclosure of the second liquid cooling plate are integrally formed.

[0015] In a third aspect, an embodiment of the present application provides a data center, comprising: a server, the server comprising at least one heat generating device; a liquid cooling plate, the liquid cooling plate being provided by any of the embodiments of the present application, and the liquid cooling plate being used for heat dissipation of the at least one heat generating device.

[0016] In a fourth aspect, an embodiment of the present application provides a data center, comprising: a server, the server comprising a plurality of heat generating devices; and a liquid cooling plate group, the liquid cooling plate group being provided by any of the embodiments of the present application, and the liquid cooling plate group being used for heat dissipation of the plurality of heat generating devices.

[0017] According to the technical scheme of the embodiment of the present application, the plastic sealing piece formed by injection molding is used to seal the assembly connection of the liquid cooling plate, to realize reliable sealing of the assembly connection area of the liquid cooling plate (including but not limited to the connection between the liquid cooling pipeline and the opening, the connection between the liquid cooling pipeline and the connecting piece, the welding port, etc.), and has the characteristics of high temperature resistance and corrosion resistance, so that the risk of liquid leakage of the liquid cooling plate can be greatly reduced.

[0018] The above summary is intended to illustrate the present application and is not intended to be limiting thereof. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features will become apparent to those skilled in the art upon examination of the drawings and the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0019] In the drawings, like reference numerals refer to same or similar functionalities throughout the several views. The drawings are not necessarily to scale. It is to be understood that the drawings only depict several embodiments of the disclosure and are not to be considered as limiting its scope.

[0020] Figure 1A A structural schematic diagram of a liquid cooling plate according to an embodiment of the present application is shown.

[0021] Figure 1B An exploded view of a liquid cooling plate according to an embodiment of the present application is shown.

[0022] Figure 2A A structural schematic diagram of a liquid cooling plate according to an embodiment of the present application is shown.

[0023] Figure 2B An exploded view of a liquid cooling plate according to an embodiment of the present application is shown.

[0024] Figure 2C A structural schematic diagram of a connecting piece 600 and a protection piece 700 is shown.

[0025] Figure 2D An exploded view of a connecting piece 600 and a protection piece 700 is shown.

[0026] Figure 3 A structural schematic diagram of a liquid cooling plate group according to an embodiment of the present application is shown.

[0027] Explanation of reference numerals:

[0028] Substrate 100; cover plate 200, cover plate 200A of the first liquid cooling plate and cover plate 200B of the second liquid cooling plate; sealed cavity 201;

[0029] Opening 202; liquid inlet 2021; liquid outlet 2022;

[0030] Liquid cooling pipeline 300; liquid inlet liquid cooling pipeline 301; liquid outlet liquid cooling pipeline 302;

[0031] Plastic sealing piece 400; liquid inlet plastic sealing piece 401; liquid outlet plastic sealing piece 402;

[0032] Adapter 500; connecting piece 600; protection piece 700; support piece 30;

[0033] First liquid cooling plate 10A; first liquid inlet 2021A; first liquid outlet 2022A; first liquid inlet liquid cooling pipeline 301A; first liquid outlet liquid cooling pipeline 302A; first liquid inlet plastic sealing piece 401A; first liquid outlet plastic sealing piece 402A; first connecting piece 600A; first protection piece 700A;

[0034] Second liquid cooling plate 10B; second liquid inlet 2021B; second liquid outlet 2022B; second liquid inlet liquid cooling pipeline 301B; second liquid outlet liquid cooling pipeline 302B; second liquid inlet plastic sealing piece 401B; second liquid outlet plastic sealing piece 402B; second connecting piece 600B; second protection piece 700B;

[0035] A first enclosure 800; a second enclosure 900. DETAILED DESCRIPTION

[0036] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that the present application can be practiced without the specific details set forth in this description. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the present application.

[0037] Data centers include financial data centers, enterprise data centers, and Internet cloud data centers. With the rapid growth of cloud computing, big data, artificial intelligence (AI), video on demand, and other businesses, the scale of Internet cloud data centers is growing larger and larger, the number of users is surging, and the Internet data center has higher requirements for the stability, efficiency, flexibility, and security of servers.

[0038] A server refers to a computer with high computing power that can be provided to multiple users (including enterprises, organizations, and individuals) for use through a network. The server is composed of a processor, a hard disk, a memory, a system bus, etc. in hardware, similar to the architecture of a general-purpose computer. In a data center, a server provides computing resources, storage resources, and network forwarding resources to end users, and plays a crucial role in the total cost of ownership (TCO) of the entire data center.

[0039] Servers include air-cooled servers and liquid-cooled servers. Air-cooled servers use air conditioners in data centers to dissipate heat, thereby reducing the internal temperature of the server and avoiding server failures such as downtime due to high temperatures. A liquid-cooled server is a server that uses a liquid cooling medium to exchange heat with the server to remove the heat of the server. A liquid-cooled server includes a cold plate liquid-cooled server, in which the liquid cooling medium is stored in a cold plate and does not directly contact the heat-generating devices of the server, but the cold plate dissipates heat from the heat-generating devices of the server.

[0040] The liquid cooling plate is usually assembled by multiple components, and the assembly methods include welding, locking, sealing gasket, etc. Since these components are usually metal assemblies, the sealing effect of the welding and sealing gasket is not good, and liquid leakage accidents still occur from time to time. In the related art, one improvement method is to optimize the generation process, such as optimizing the assembly method of locking and sealing gasket to full welding, or wrapping the outside of the pipeline with a silicone hose to prevent scratches, or replacing the pipeline with a wear-resistant material, or reducing the liquid leakage probability in the production stage by nitrogen detection or factory pressure maintenance, but due to the process limitation and material limitation of the metal assembly, the liquid leakage risk is still high. Another improvement method is to optimize the liquid leakage detection technology, such as setting a liquid leakage detection rope in the liquid cooling plate, server or cabinet, and then giving a liquid leakage warning, but this improvement method is a post remedial measure, and the detection coverage is limited, and the liquid leakage risk is still high.

[0041] The embodiment of the present application aims to provide a liquid cooling plate or liquid cooling plate group, which uses a plastic sealing piece to seal the assembly connection of the liquid cooling plate, and uses a molding process for the plastic sealing piece, thereby improving the sealing effect and having the characteristics of high temperature resistance and corrosion resistance, so as to greatly reduce the liquid leakage risk of the liquid cooling plate.

[0042] Liquid cooling plate

[0043] Figure 1A A structural schematic diagram of a liquid cooling plate of an embodiment of the present application is shown. Figure 1B An exploded view of the liquid cooling plate of the embodiment of the present application is shown. As shown in Figure 1A , the liquid cooling plate can include a substrate 100, a cover plate 200, a liquid cooling pipeline 300 and a plastic sealing piece 400. It should be noted that the liquid cooling pipeline 300 and the plastic sealing piece 400 are not shown in Figure 1B .

[0044] Among them, the substrate 100 and the cover plate 200 are usually made of metal. Exemplarily, the substrate 100 is usually in contact with the heat generating device and has a heat conduction surface for contacting the heat generating device, so the material of the substrate 100 can be copper with high heat conduction performance. The cover plate 200 can be made of the same material as the substrate 100, or can be made of a different material, for example, the material of the cover plate 200 can be selected from aluminum alloy or copper alloy with higher mechanical strength and better corrosion resistance. The material of the substrate and the cover plate is not limited in the embodiment of the present application.

[0045] The cover plate 200 is connected with the substrate 100 and located on the side of the substrate 100 away from the heat conduction surface. The substrate 100 and the cover plate 200 can be connected by brazing technology, for example, the edges of the substrate 100 and the cover plate 200 are heated to the melting temperature of the filler metal to form a firm seal, thereby forming a high-strength and high-temperature-resistant sealing cavity 201 between the substrate 100 and the cover plate 200, as shown in Figure 1BAs shown. The substrate 100 and the cover plate 200 can also be connected by other processes, such as laser welding, which is not limited in this embodiment.

[0046] The sealed cavity 201 is used to contain the liquid cooling medium, which can be any one of water (such as deionized water), ethylene glycol water mixture (such as 20% ethylene glycol solution, 25% ethylene glycol solution, or 30% ethylene glycol solution), insulating cooling oil, or fluorinated liquid.

[0047] like Figure 1B As shown, the cover plate 200 has an opening 202 that communicates with the sealing cavity 201. The liquid cooling pipe 300 communicates with the opening 202, and thus with the sealing cavity 201. Therefore, the liquid cooling pipe 300 is used to transport the liquid cooling medium in the sealing cavity 200. The molding compound 400 seals the connection between the liquid cooling pipe 300 and the cover plate 200.

[0048] The molding compound 400 is manufactured using a molding process. For example, the injection molding process of the molding compound 400 includes: injecting molding material into an injection mold, and forming the molding compound 400 through pressure molding. The molding material includes, but is not limited to, silicone, fluororubber (Viton), or polyurethane, and possesses corrosion resistance, flexibility, and pressure resistance. The injection mold can be designed according to the area that needs to be sealed by the molding compound 400, such as based on the specific structural design of the liquid cooling pipe 300 and the cover plate 200, ensuring that the molding compound 400 can accurately cover the connection between the liquid cooling pipe 300 and the cover plate 200, avoiding gaps or voids.

[0049] The connection method between the cover plate 200 and the liquid cooling pipe 300 can be selected according to their materials, and this embodiment does not limit this. For example, the liquid cooling pipe 300 can be made of metal, and the liquid cooling pipe 300 is welded to the cover plate 200. The molding compound 400 directly covers the joint between the liquid cooling pipe 300 and the cover plate 200 through injection molding, forming a wrap-around seal. Alternatively, the liquid cooling pipe 300 and the cover plate 200 can be threaded together, and the molding compound 400 directly covers the threaded area between the liquid cooling pipe 300 and the cover plate 200 through injection molding, forming a filling wrap-around seal.

[0050] According to the technical solution of this application embodiment, injection-molded plastic sealant is used to seal the connection between the liquid cooling pipeline and the cover plate, thereby sealing the connection area. It also has the characteristics of high temperature resistance and corrosion resistance, which can improve the sealing reliability of the connection area of ​​the liquid cooling plate assembly and significantly reduce the risk of liquid leakage of the liquid cooling plate.

[0051] In one implementation, such as Figure 1A and Figure 1BAs shown, the liquid cooling plate of the embodiment of the present application can further include a first enclosure 800, which is arranged around the periphery of the plastic sealing member 400 to define the boundary shape of the plastic sealing member 400. For example, the first enclosure 800 is the injection mold of the plastic sealing member 400 in the injection molding process. That is, after the injection molding is completed, the injection mold can be directly retained on the liquid cooling plate, which can play a certain supporting role to protect the liquid cooling pipeline 300 and also simplify the process flow.

[0052] In an embodiment, the liquid cooling pipeline 300 can be made of elastic material, i.e., the liquid cooling pipeline 300 can be a hose. For example, Figure 1B As shown, the liquid cooling plate can further include an adapter 500, and the cover plate 200 and the liquid cooling pipeline 300 are connected through the adapter 500. Specifically, the first end of the liquid cooling pipeline 300 (the end close to the opening 202) and the cover plate 200 are both connected to the adapter 500, and the liquid cooling pipeline 300 and the opening 202 are both in communication with the inner cavity of the adapter 500. The adapter 500 includes but is not limited to a threaded adapter, a buckle adapter, a quick connector adapter, etc.

[0053] Further, the plastic sealing member 400 is sleeved on the first end and covers the adapter 500. Based on this, in the case that the liquid cooling pipeline is a hose and the cover plate and the liquid cooling pipeline are connected based on the adapter, the plastic sealing member can form reliable sealing at the connection, thereby reducing the risk of liquid leakage of the liquid cooling plate. It can be understood that, although in the Figure 1A embodiment, the plastic sealing member 400 not only covers the adapter 500 but also covers the space between the first end (the end of the liquid cooling pipeline 300 close to the opening 202) and the cover plate 200, the embodiment of the present application is not limited to this. For example, there can be a gap between the first end (the end of the liquid cooling pipeline 300 close to the opening 202) and the cover plate 200, as long as the connection between the first end and the adapter 500 is sealed by the plastic sealing member 400.

[0054] In an embodiment, as shown in Figure 1A The plastic sealing member 400 also covers the space between the first end (the end of the liquid cooling pipeline 300 close to the opening 202) and the cover plate 200. In this way, the design difficulty of the injection mold and the processing difficulty of the injection process can be reduced, and the space between the first end and the cover plate 200 can also enhance the support strength of the liquid cooling pipeline 300 and increase the sealing of the connection under the filling action of the plastic sealing member 400, thereby further reducing the risk of liquid leakage of the liquid cooling plate.

[0055] Figure 2A A structural schematic diagram of the liquid cooling plate of the embodiment of the present application is shown. Figure 2B An exploded view of the liquid cooling plate of the embodiment of the present application is shown. Compared with Figure 1A and Figure 1BThe difference between the shown liquid cooling plate is that, Figure 2A and Figure 2B In the shown liquid cooling plate, the opening is designed as two, namely the liquid inlet 2021 and the liquid outlet 2022, and the liquid cooling pipeline is designed as two, namely the liquid inlet liquid cooling pipeline 301 communicating with the liquid inlet 2021 and the liquid outlet liquid cooling pipeline 302 communicating with the liquid outlet 2022. That is, the liquid cooling medium flows into the sealed cavity 201 from the liquid inlet liquid cooling pipeline 301, and the liquid cooling medium in the sealed cavity 201 flows out of the liquid cooling plate from the liquid outlet liquid cooling pipeline 302, thereby dissipating heat through the flow of the liquid cooling medium.

[0056] Based on this design, as shown in Figure 2A and Figure 2B The plastic sealing piece 400 is designed to include a liquid inlet plastic sealing piece 401 and a liquid outlet plastic sealing piece 402, the liquid inlet plastic sealing piece 301 covers the connection between the liquid inlet liquid cooling pipeline 301 and the cover plate 200, and the liquid outlet plastic sealing piece 302 covers the connection between the liquid outlet liquid cooling pipeline 302 and the cover plate 200. By using the liquid inlet plastic sealing piece and the liquid outlet plastic sealing piece made by injection molding to seal the liquid inlet area (the connection between the liquid inlet liquid cooling pipeline 301 and the cover plate 200) and the liquid outlet area (the connection between the liquid outlet liquid cooling pipeline 302 and the cover plate 200) of the liquid cooling plate respectively, the risk of liquid leakage of the liquid cooling plate can be greatly reduced.

[0057] Correspondingly, the first enclosure is designed as two, namely the liquid inlet enclosure 801 and the liquid outlet enclosure 802. Among them, the liquid inlet enclosure 801 is arranged on the periphery of the liquid inlet plastic sealing piece 301, used to define the boundary shape of the liquid inlet plastic sealing piece 301, and the liquid inlet enclosure 801 is the injection mold during the injection molding process of the liquid inlet plastic sealing piece 301; the liquid outlet enclosure 802 is arranged on the periphery of the liquid outlet plastic sealing piece 302, used to define the boundary shape of the liquid outlet plastic sealing piece 302, and the liquid outlet enclosure 802 is the injection mold during the injection molding process of the liquid outlet plastic sealing piece 302.

[0058] Correspondingly, the adapter is designed as two, namely the liquid inlet adapter 501 connecting the cover plate 200 and the liquid inlet liquid cooling pipeline 301, and the liquid outlet adapter 502 connecting the cover plate 200 and the liquid outlet liquid cooling pipeline 302.

[0059] In an embodiment, the liquid inlet plastic sealing piece and the liquid outlet plastic sealing piece are integrally formed (not shown in the figure). That is, in the injection molding process, an injection mold can be designed which can not only surround the connection between the liquid inlet liquid cooling pipeline and the cover plate, but also surround the connection between the liquid outlet liquid cooling pipeline and the cover plate, so that the liquid inlet plastic sealing piece and the liquid outlet plastic sealing piece as an integrated structure can not only wrap the connection between the liquid inlet liquid cooling pipeline and the cover plate, but also wrap the connection between the liquid outlet liquid cooling pipeline and the cover plate. Based on this, the design difficulty of the injection mold and the processing difficulty of the injection molding process can be reduced, thereby reducing the cost.

[0060] It should be noted that the liquid inlet liquid cooling pipeline and the liquid outlet liquid cooling pipeline are used as the liquid cooling pipeline, the liquid inlet and the liquid outlet are used as the opening, and the liquid inlet plastic sealing piece and the liquid outlet plastic sealing piece are used as the plastic sealing piece, which can adopt the same implementation manner as the liquid cooling plate in Figure 1A and Figure 1B , including the connection manner, material, and injection molding process, and the like, which will not be described here.

[0061] In an embodiment, the liquid cooling plate can further include a connecting piece and a protective piece. The liquid cooling pipeline has a second end portion away from the liquid outlet, the second end portion is connected with the connecting piece, and the liquid cooling pipeline is in communication with the inner cavity of the connecting piece. The protective piece is sleeved on the connecting portion of the second end portion and the connecting piece.

[0062] Figure 2C The structure diagram of the connecting piece 600 and the protective piece 700 is shown; Figure 2D The exploded view of the connecting piece 600 and the protective piece 700 is shown. In Figure 2C and Figure 2D , the liquid cooling pipeline includes a liquid inlet liquid cooling pipeline 301 and a liquid outlet liquid cooling pipeline 302, and correspondingly, the connecting piece 600 is two, which are respectively used for connecting the liquid inlet liquid cooling pipeline 301 and the liquid outlet liquid cooling pipeline 302.

[0063] The connecting piece 600 can be designed as an adapter, including but not limited to a threaded adapter, a buckle adapter, a quick connector adapter, and the like. The connecting piece 600 can be connected with an external device of the liquid cooling plate, such as a pumping mechanism of the cooling medium. The protective piece 700 is formed by a plastic sealing process. Exemplarily, the plastic sealing material is injected into an injection mold, and then the protective piece 700 is formed by pressure forming. The injection mold can be designed according to the area that needs to be sealed by the protective piece 700, such as according to the specific structure of the liquid cooling pipeline 300 and the connecting piece 600, to ensure that the protective piece 700 can accurately cover the connecting portion between the liquid cooling pipeline 300 and the connecting piece 600, so as to avoid the occurrence of gaps or voids.

[0064] Based on the protective piece formed by the injection molding to seal the connecting portion between the liquid cooling pipeline and the connecting piece, the connecting area is sealed, and has the characteristics of high temperature resistance and corrosion resistance, so that the risk of liquid leakage of the liquid cooling plate can be greatly reduced.

[0065] In an embodiment, as shown in Figure 2C and Figure 2D , the liquid cooling plate can further include a second fence 900, which is arranged on the periphery of the protective piece 700 and is used for defining the boundary shape of the protective piece 700. That is, after the injection molding is completed, the second fence 900 as the injection mold can be directly retained, which can play a certain supporting role on the one hand to protect the liquid cooling pipeline, and on the other hand, also simplifies the process flow.

[0066] For example, such as Figure 2C and Figure 2D As shown, the liquid cooling plate may further include a support member 30, which is sleeved on the liquid cooling pipeline (e.g., on the inlet liquid cooling pipeline 301 and the outlet liquid cooling pipeline 302), and abuts against the second enclosure 900 in the axial direction of the liquid cooling pipeline. "Abutting" can be understood as meaning that there is no gap between the support member 30 and the second enclosure 900 in the axial direction of the liquid cooling pipeline. Exemplarily, the support member 30 and the second enclosure 900 have the same contour shape on the plane containing the cross-section of the liquid cooling pipeline, and the support member 30 and the second enclosure 900 are in surface contact in the axial direction of the liquid cooling pipeline.

[0067] In one embodiment, during the assembly of the liquid cooling plate, there may be some weld joints. Weld joint sealants can be used to encapsulate the weld joints, that is, injection-molded weld joint sealants can be used to seal the weld joints that may leak, thereby sealing these areas and further reducing the risk of liquid leakage of the liquid cooling plate.

[0068] For example, the assembly process of the liquid cooling plate may include: selecting a suitable molding compound, and performing potting (injection molding) on ​​the joints of each liquid cooling plate (including but not limited to the joints between the liquid cooling pipes and the openings, the joints between the liquid cooling pipes and the connectors, the weld joints, etc.) in batches according to the assembly sequence. For example, first assemble the substrate and the cover plate, weld the substrate and the cover plate, and then injection mold a weld joint seal at the weld joint; assemble the liquid cooling pipes and the cover plate, and injection mold a molding compound around the connector used to connect the liquid cooling pipes and the cover plate; and injection mold a protective component at the connection between the liquid cooling pipes and the external equipment of the liquid cooling plate.

[0069] Liquid cooling plate group

[0070] This application also provides a liquid cooling plate assembly, including a plurality of liquid cooling plates as described above.

[0071] Figure 3 A schematic diagram of the structure of a liquid-cooled plate assembly according to an embodiment of this application is shown. In one embodiment, such as Figure 3 As shown, the liquid cooling plate assembly includes a first liquid cooling plate 10A and a second liquid cooling plate 10B, wherein the first liquid cooling plate 10A and the second liquid cooling plate 10B can both be liquid cooling plates of any of the above embodiments.

[0072] Specifically, the liquid cooling pipeline of the first liquid cooling plate 10A includes a first liquid inlet liquid cooling pipeline 301A and a first liquid outlet liquid cooling pipeline 302A; the opening of the first liquid cooling plate 10A includes a first liquid inlet ( Figure 3 Not shown in the image, please refer to the following: Figure 2B The inlet (2021) and the first outlet ( Figure 3 Not shown in the image, please refer to the following: Figure 2Bthe first liquid outlet 2022 of the first liquid cooling plate 10A); the sealing member of the first liquid cooling plate 10A includes a first liquid inlet plastic sealing member 401A and a first liquid outlet plastic sealing member 402A. The first liquid inlet liquid cooling pipeline 301A is in communication with the first liquid inlet, and the first liquid outlet liquid cooling pipeline 302A is in communication with the first liquid outlet; the first liquid inlet plastic sealing member 401A covers the connection between the first liquid inlet liquid cooling pipeline 301A and the cover plate 200A of the first liquid cooling plate 10A, and the first liquid outlet plastic sealing member 402A covers the connection between the first liquid outlet liquid cooling pipeline 302A and the cover plate 200A of the first liquid cooling plate 10A.

[0073] The liquid cooling pipeline of the second liquid cooling plate 10B includes a second liquid inlet liquid cooling pipeline 301B and a second liquid outlet liquid cooling pipeline 302B, and the opening of the second liquid cooling plate 10B includes a second liquid inlet Figure 3 (not shown in the figures, which can be referred to Figure 2B the liquid inlet 2021) and a second liquid outlet Figure 3 (not shown in the figures, which can be referred to Figure 2B the liquid outlet 2022); the second liquid inlet liquid cooling pipeline 301B is in communication with the second liquid inlet, and the second liquid outlet liquid cooling pipeline 302B is in communication with the second liquid outlet; the sealing member of the second liquid cooling plate 10B includes a second liquid inlet plastic sealing member 401B and a second liquid outlet plastic sealing member 402B, the second liquid inlet plastic sealing member 401B covers the connection between the second liquid inlet liquid cooling pipeline 301B and the cover plate 200B of the second liquid cooling plate 10B, and the second liquid outlet plastic sealing member 402B covers the connection between the second liquid outlet liquid cooling pipeline 302B and the cover plate 200B of the second liquid cooling plate 10B.

[0074] That is, the first liquid cooling plate 10A and the second liquid cooling plate 10B can both use the liquid cooling plate structure shown in Figure 2A and Figure 2B . The first liquid outlet liquid cooling pipeline 302A is in communication with and integrally formed with the second liquid inlet liquid cooling pipeline 301B, that is, the first liquid outlet liquid cooling pipeline 302A and the second liquid inlet liquid cooling pipeline 301B are integrally designed, that is, they are the same liquid cooling pipeline.

[0075] The servers of the data center are usually designed in an integrated manner, that is, a plurality of heat generating devices are arranged on the server, and therefore, when the servers of the data center are cooled by liquid cooling, a liquid cooling plate group is usually used for heat dissipation, that is, a plurality of liquid cooling plates can form a liquid cooling loop, so that the liquid cooling energy can be effectively utilized and the efficiency can be saved. In the embodiments of the present application, the plastic sealing members (the first liquid inlet plastic sealing member 401A, the first liquid outlet plastic sealing member 402A, the second liquid inlet plastic sealing member 401B, and the second liquid outlet plastic sealing member 402B) of each liquid cooling plate can respectively seal the corresponding connection areas, thereby reducing the risk of liquid leakage of the liquid cooling plate group and improving the reliability of the server.

[0076] In an embodiment, as shown in Figure 3As shown, the first liquid cooling plate 10A includes a first connecting piece 600A and a first protective piece 700A, the end of the first liquid inlet liquid cooling pipeline 301A away from the first liquid inlet is connected with the first connecting piece 600A, the first liquid inlet liquid cooling pipeline 301A is in communication with the inner cavity of the first connecting piece 600A, and the first protective piece 700A is plasticly encapsulated at the connection between the first liquid inlet liquid cooling pipeline 301A and the first connecting piece 600A; the second liquid cooling plate 10B includes a second connecting piece 600B and a second protective piece 700B, the end of the second liquid outlet liquid cooling pipeline 302B away from the second liquid outlet is connected with the second connecting piece 600B, the second liquid outlet liquid cooling pipeline 302B is in communication with the inner cavity of the second connecting piece 600B, and the second protective piece 700B is plasticly encapsulated at the connection between the second liquid outlet liquid cooling pipeline 302B and the second connecting piece 600B.

[0077] In the embodiment, the second enclosing piece 900 of the first liquid cooling plate 10A is used to define the boundary shape of the first protective piece 700A, the second enclosing piece 900 of the second liquid cooling plate 10B is used to define the boundary shape of the second protective piece 700B, and the second enclosing piece 900 of the first liquid cooling plate 10A is integrally formed with the second enclosing piece 900 of the second liquid cooling plate 10B. That is, in the injection molding process, an injection mold (the second enclosing piece 900) can be designed, and the injection cavity (used to accommodate the plastic encapsulation material to form the first protective piece and the second protective piece) of the injection mold can not only surround the connection between the first liquid inlet liquid cooling pipeline 301A and the first connecting piece 600A, but also surround the connection between the second liquid outlet liquid cooling pipeline 302B and the second connecting piece 600B. Based on this, the design difficulty of the injection mold and the processing difficulty of the injection molding process can be reduced, thereby reducing the cost.

[0078] It can be understood that the number of liquid cooling plates included in the liquid cooling plate group is not limited to one or two, but can also be three or more, and the structure of each liquid cooling plate can adopt the liquid cooling plate of any one of the embodiments of the present application, and the liquid cooling plates can adopt the same structure or different structures. For example, one liquid cooling plate is added between the first liquid cooling plate and the second liquid cooling plate, and only the number and form of the liquid cooling pipeline (including whether to share one liquid cooling pipeline) and the number and form of the connecting piece or the protective piece (including whether to be integrally formed) need to be adaptively adjusted, and the embodiments of the present application do not limit this.

[0079] Data center

[0080] The embodiments of the present application also provide a data center, which includes a server and the liquid cooling plate or the liquid cooling plate group of any one of the above embodiments. The data center can be a financial data center, an enterprise data center, an Internet cloud data center, etc.

[0081] The server can include one or more heat generating devices, such as a central processing unit (CPU), a graphics processing unit (GPU), a data processing unit (DPU), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), and the like. The heat generating device is arranged close to the heat conduction surface of the liquid cooling plate, for example, in surface contact, so as to dissipate heat from the heat generating device by the liquid cooling plate or the liquid cooling plate group.

[0082] In the data center of the embodiments of the present application, the assembly connection of the liquid cooling plate is sealed by the injection molded plastic sealing piece, which has the characteristics of high temperature resistance and corrosion resistance, thereby greatly reducing the risk of liquid leakage of the liquid cooling plate and improving the reliability of the server and the data center.

[0083] Other configurations of the liquid cooling plate, the liquid cooling plate group, the server and the data center of the above embodiments can be various technical solutions known to those skilled in the art now and in the future, which are not described in detail here.

[0084] In the description of the present application, it should be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0085] In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0086] In this application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixed", and similar terms should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection, and can also be communication; can be direct connection, or indirect connection through intermediate medium; can be internal communication of two elements, or interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0087] In this application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in indirect contact through another feature between them. Moreover, the first feature "on", "above" and "over" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0088] The above disclosure provides many different implementations or examples for implementing the different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various implementations and / or arrangements discussed.

[0089] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of various changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A liquid-cooled plate, characterized in that, The application relates to a liquid cooling plate, comprising: a substrate having a heat-conducting surface for contacting a heat-generating device; a cover plate connected to the substrate and located on a side of the substrate away from the heat-conducting surface, a sealed cavity for accommodating a liquid cooling medium being formed between the substrate and the cover plate, and an opening being provided on the cover plate and communicating with the sealed cavity; a liquid cooling pipeline communicating with the opening; and a plastic sealing member sealing a connection between the liquid cooling pipeline and the cover plate.

2. The liquid cold plate of claim 1, wherein, The opening comprises an inlet and an outlet, the liquid cooling pipeline comprises an inlet liquid cooling pipeline communicating with the inlet and an outlet liquid cooling pipeline communicating with the outlet, and the plastic sealing member comprises an inlet plastic sealing member and an outlet plastic sealing member, the inlet plastic sealing member covering a connection between the inlet liquid cooling pipeline and the cover plate, and the outlet plastic sealing member covering a connection between the outlet liquid cooling pipeline and the cover plate.

3. The liquid cold plate of claim 2, wherein, The inlet plastic sealing member and the outlet plastic sealing member are integrally formed.

4. The liquid cold plate of claim 1, wherein, The application further relates to a liquid cooling plate, comprising: an adapter, a first end of the liquid cooling pipeline and the cover plate being connected to the adapter, the liquid cooling pipeline and the opening both communicating with an inner cavity of the adapter, and the plastic sealing member being sleeved on the first end and covering the adapter.

5. The liquid cold plate of claim 4, wherein, The plastic sealing member further covers a space between the first end and the cover plate.

6. The liquid cold plate of any of claims 1 to 5, wherein, The application further relates to a liquid cooling plate, comprising: a first enclosure surrounding a periphery of the plastic sealing member and defining a boundary shape of the plastic sealing member.

7. The liquid cold plate of any of claims 1 to 5, wherein, The application further relates to a liquid cooling plate, comprising: a connecting member connected to a second end of the liquid cooling pipeline away from the opening, an inner cavity of the connecting member communicating with the liquid cooling pipeline; a protective member being sleeved on a connection between the second end and the connecting member; a second enclosure surrounding a periphery of the protective member and defining a boundary shape of the protective member.

8. The liquid cold plate of any of claims 1 to 5, wherein, The application further relates to a liquid cooling plate, comprising: a welding port sealing member covering a welding port of the liquid cooling plate.

9. A liquid cooling plate set, comprising a plurality of liquid cooling plates according to any one of claims 1 to 8.

10. The liquid cold plate assembly of claim 9, wherein, The plurality of liquid cooling plates comprise: a first liquid cooling plate, a liquid cooling pipeline of the first liquid cooling plate comprising a first inlet liquid cooling pipeline and a first outlet liquid cooling pipeline, an opening of the first liquid cooling plate comprising a first inlet and a first outlet, the first inlet liquid cooling pipeline communicating with the first inlet, and the first outlet liquid cooling pipeline communicating with the first outlet; a sealing member of the first liquid cooling plate comprising a first inlet plastic sealing member and a first outlet plastic sealing member, the first inlet plastic sealing member covering a connection between the first inlet liquid cooling pipeline and a cover plate of the first liquid cooling plate, and the first outlet plastic sealing member covering a connection between the first outlet liquid cooling pipeline and the cover plate of the first liquid cooling plate. The second liquid cooling plate, a liquid cooling pipeline of the second liquid cooling plate includes a second liquid inlet pipeline and a second liquid outlet pipeline, an opening of the second liquid cooling plate includes a second liquid inlet and a second liquid outlet, the second liquid inlet pipeline is communicated with the second liquid inlet, and the second liquid outlet pipeline is communicated with the second liquid outlet; a sealing element of the second liquid cooling plate includes a second liquid inlet sealing element and a second liquid outlet sealing element, the second liquid inlet sealing element covers a connection position of the second liquid inlet pipeline and a cover plate of the second liquid cooling plate, and the second liquid outlet sealing element covers a connection position of the second liquid outlet pipeline and the cover plate of the second liquid cooling plate. The first liquid cooling plate is communicated with the second liquid inlet pipeline and is integrally formed.

11. The liquid cold plate manifold of claim 10, wherein, The first liquid cooling plate includes a first connecting element and a first protection element, the first connecting element is connected with an end of the first liquid inlet pipeline away from the first liquid inlet, an inner cavity of the first connecting element is communicated with the first liquid inlet pipeline, and the first protection element is arranged in a sealing mode at a connection position of the first liquid inlet pipeline and the first connecting element; the second liquid cooling plate includes a second connecting element and a second protection element, an end of the second liquid outlet pipeline away from the second liquid outlet is connected with the second connecting element, the second liquid outlet pipeline is communicated with an inner cavity of the second connecting element, and the second protection element is arranged in a sealing mode at a connection position of the second liquid outlet pipeline and the second connecting element. The second enclosure of the first liquid cooling plate is used for defining a boundary shape of the first protection element, the second enclosure of the second liquid cooling plate is used for defining a boundary shape of the second protection element, and the second enclosure of the first liquid cooling plate and the second enclosure of the second liquid cooling plate are integrally formed.

12. A data center, characterized by, Comprising: a server, the server comprising at least one heat generating device; a liquid cooling plate, as claimed in any one of claims 1 to 8, the liquid cooling plate being used for dissipating heat from the at least one heat generating device.

13. A data center, characterized by, Comprising: a server, the server comprising a plurality of heat generating devices; a liquid cooling plate group, as claimed in any one of claims 9 to 11, the liquid cooling plate group being used for dissipating heat from the plurality of heat generating devices.

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