Evaporation condensation and atomization injection type liquid cooling combined system

Abstract

The utility model discloses an evaporative condensation and atomization injection type liquid cooling combined system, which is characterized by comprising an evaporative condenser, a cooling capacity distribution unit (CDU) and a chip cooling unit which are connected in sequence, the system further comprises a first pipeline and a second pipeline. The evaporative condenser is communicated with the cooling capacity distribution unit CDU through the first pipeline and the second pipeline. The system further comprises a liquid return pipe and a third pipeline, and the chip cooling unit is communicated with the cooling capacity distribution unit CDU through the liquid return pipe and the third pipeline. The system aims to reduce energy consumption and improve heat exchange efficiency by combining the advantages of the two technologies, and efficient and reliable heat dissipation of the electronic equipment is achieved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to data center heat dissipation cooling technical field, concretely relates to the system of evaporation condensation and atomization injection type liquid cooling combination. BACKGROUND

[0002] Evaporation condensation technology as a kind of efficient heat exchange mode, in refrigeration, air conditioning and other fields has been widely used.The technology realizes heat transfer and release through evaporation and condensation two processes, has the advantages such as high heat dissipation efficiency, low energy consumption etc.However, in the field of electronic equipment heat dissipation, the application of evaporation condensation technology is still relatively small, the main problem is how to combine evaporation condensation technology with the heat dissipation demand of electronic equipment, realizes efficient, reliable heat dissipation.

[0003] On the other hand, atomization injection type liquid cooling technology is a new heat dissipation mode, it sprays liquid to the surface of heat source after atomization, utilizes the principle that liquid absorbs a large amount of heat when evaporating, realizes efficient heat dissipation of heat source.The technology has the advantages such as high heat dissipation efficiency, fast heat dissipation speed etc., especially suitable for high heat flux density heat dissipation scene.

[0004] However, at present, the system that evaporation condensation technology and atomization injection type liquid cooling technology are combined and applied in electronic equipment heat dissipation is still relatively small.This is mainly due to the difference between the working principle, operating condition etc.of two kinds of technology, how to effectively combine and exert the respective advantages of them is a problem to be solved. INVENTION CONTENTS

[0005] The utility model aims at providing the system of evaporation condensation and atomization injection type liquid cooling combination, aims at being able to reduce the overall energy consumption of data center and improve heat exchange efficiency by combining the advantages of two kinds of technology, realizes efficient and reliable heat dissipation of electronic equipment.

[0006] The technical scheme adopted by the utility model is the system of evaporation condensation and atomization injection type liquid cooling combination, including the evaporation type condenser, cold distribution unit CDU and chip cooling unit that are connected in turn;

[0007] Still include first pipeline and second pipeline, and the evaporation type condenser is communicated with the cold distribution unit CDU by the first pipeline and the second pipeline;

[0008] Still include liquid return pipe and third pipeline, and the chip cooling unit is communicated with the cold distribution unit CDU by the liquid return pipe and the third pipeline.

[0009] The utility model is characterized in that:

[0010] The liquid accumulator, fluorine pump and throttle valve are sequentially arranged on the second pipeline, the liquid accumulator is arranged close to the evaporation type condenser, and the throttle valve is arranged close to the cold distribution unit CDU.

[0011] The evaporative condenser comprises an organic unit shell, a draught fan, a water baffle, a water distribution device, a heat exchange coil and a water collecting tank are sequentially arranged in the unit shell from top to bottom; the water distribution device is communicated with the water collecting tank through a water supply pipe;

[0012] A draught outlet is arranged at the top of the unit shell corresponding to the draught fan;

[0013] Air inlets are arranged on the two opposite side walls of the unit shell corresponding to the heat exchange coil and the water collecting tank;

[0014] The liquid inlet of the heat exchange coil is communicated with the cold energy distribution unit CDU through a first pipeline;

[0015] The liquid outlet of the heat exchange coil is communicated with the cold energy distribution unit CDU through a second pipeline.

[0016] The water distribution device comprises a water distribution pipe, and a plurality of nozzles are arranged on the water distribution pipe; the water distribution pipe is communicated with the water collecting tank through a water supply pipe.

[0017] A circulating water pump is arranged on the water supply pipe.

[0018] The chip cooling unit comprises a liquid inlet tank and a plurality of chip cooling assemblies; the liquid inlet tank is communicated with the cold energy distribution unit CDU through a third pipeline; each chip cooling assembly is communicated with the liquid inlet tank through a liquid inlet pipe; each chip cooling assembly is communicated with the cold energy distribution unit CDU through a liquid return pipe; the liquid inlet tank is installed above the plurality of chip cooling assemblies in the cabinet.

[0019] The chip cooling assembly comprises a liquid distribution device and a liquid collecting disc, and the liquid collecting disc is communicated with the liquid return pipe through a liquid discharge pipe; the liquid distribution device is located above the heating surface of the chip, and the liquid collecting disc is located below the chip.

[0020] The liquid distribution device comprises a liquid distribution pipe, and a plurality of atomizing nozzles are arranged on the liquid distribution pipe; the liquid distribution pipe is communicated with the liquid inlet pipe.

[0021] The cold energy distribution unit CDU comprises a plate heat exchanger and a cooling liquid pump; the cooling liquid pump is arranged on the liquid return pipe;

[0022] The cold end liquid outlet of the plate heat exchanger is communicated with the liquid inlet of the heat exchange coil through a first pipeline;

[0023] The cold end liquid inlet of the plate heat exchanger is communicated with the liquid outlet of the heat exchange coil through a second pipeline;

[0024] The hot end liquid outlet of the plate heat exchanger is communicated with the liquid inlet tank through a third pipeline;

[0025] Each liquid discharge pipe is communicated with the hot end liquid inlet of the plate heat exchanger through the liquid return pipe.

[0026] The chip cooling unit comprises a liquid inlet tank and a plurality of chip cooling assemblies; the liquid inlet tank is communicated with the cold energy distribution unit CDU through a third pipeline; each chip cooling assembly is communicated with the liquid inlet tank through a liquid inlet pipe; each chip cooling assembly is communicated with the cold energy distribution unit CDU through a liquid return pipe; the liquid inlet tank is installed above the plurality of chip cooling assemblies in the cabinet.

[0027] 1. The system of the present application, compared with the existing liquid cooling technology, the atomization spray liquid cooling is a more efficient CPU cooling technology, and the principle is to rely on the pressure of the liquid itself (pressure spray) to atomize the liquid, and forcibly spray it to the surface of the heating object, so as to realize the effective cooling of the object. This cooling method has strong heat exchange, has a very high critical heat flux value (CHF), and is uniform in cooling, and is suitable for some fields with very strict temperature requirements (such as microelectronics, laser technology, national defense, aerospace technology, etc.), and has unique advantages and importance.

[0028] 2. The system of the present application, the evaporative condenser only needs to provide power for the fan and the circulating water pump during operation, compared with the traditional mechanical ventilation refrigeration, the evaporative condenser is more energy-saving and environment-friendly, has higher efficiency, and is suitable for winter and summer. By reducing energy consumption and heat emission, the environmental friendliness of the data center can be improved, and the requirements of sustainable development can be met.

[0029] 3. The system of the present application, the heat pipe system and the fluorine pump device are used, the working medium in the heat pipe absorbs heat and evaporates into gas, and is condensed into liquid by the evaporative condenser and flows back to the heat pipe to complete the cycle, the evaporative condenser and the fluorine pump heat pipe system are used in combination, which can reduce energy consumption, improve heat exchange efficiency and reduce land occupation. By using the evaporative condensation fluorine pump heat pipe technology, the energy efficiency ratio of the data center can be effectively improved, and the energy consumption cost can be reduced.

[0030] 4. The system of the present application, each component adopts mature and reliable technology, so that use and maintenance are relatively simple and convenient. At the same time, due to the high efficiency and stability of the system, the frequency and cost of maintenance can also be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0031] Fig. 1 is a structure diagram of the system of the present application evaporative condensation and atomization spray liquid cooling combination.

[0032] Fig. 2 is a state diagram of the system of the present application evaporative condensation and atomization spray liquid cooling combination when the atomization spray head sprays the chip.

[0033] In the figure, 1. air outlet, 2. exhaust fan, 3. fender, 4. nozzle, 5. circulating water pump, 6. air inlet, 7. water collecting tank, 8. heat exchange coil, 9. evaporative condenser, 10. liquid reservoir, 11. fluorine pump, 12. throttle valve, 13. cooling liquid pump, 14. plate heat exchanger, 15. cooling capacity distribution unit CDU, 16. firewall, 17. chip, 18. liquid inlet pipe, 19. liquid inlet tank, 20. atomizing nozzle, 21. liquid return pipe, 22. cabinet, 23. data center room, 24. fog, 25. liquid droplet, 26. liquid film, 27. first pipe, 28. second pipe, 29. third pipe, 30. liquid collecting tray, 31. water supply pipe, 32. water distribution pipe, 33. liquid discharge pipe, 34. unit shell, 35. liquid distribution pipe. DETAILED DESCRIPTION

[0034] The utility model will be described in detail below in combination with the drawings and specific embodiments.

[0035] The utility model provides evaporative condensation and atomizing injection type liquid cooling combined system, as shown in the figure, including evaporative condenser 9, cooling capacity distribution unit CDU 15 and chip cooling unit which are connected in proper order, Figs. 1-2

[0036] Evaporative condenser 9 provides cooling capacity for the whole system, cooling capacity distribution unit CDU 15 is arranged in data center room 23, and chip cooling unit is arranged in the inside of cabinet 22, and chip cooling unit and cabinet 22 form liquid cooling cabinet.

[0037] Cooling capacity distribution unit CDU 15 is separated from cabinet 22 by firewall 16, and evaporative condenser 9 is arranged outside data center room 23.

[0038] Still include first pipe 27 and second pipe 28, and evaporative condenser 9 is communicated with cooling capacity distribution unit CDU 15 through first pipe 27 and second pipe 28.

[0039] Still include liquid return pipe 21 and third pipe 29, and chip cooling unit is communicated with cooling capacity distribution unit CDU 15 through liquid return pipe 21 and third pipe 29.

[0040] Second pipe 28 is sequentially provided with liquid reservoir 10, fluorine pump 11 and throttle valve 12, liquid reservoir 10 is arranged close to evaporative condenser 9, and throttle valve 12 is arranged close to cooling capacity distribution unit CDU 15.

[0041] Evaporative condenser 9 includes unit shell 34, and exhaust fan 2, fender 3, water distribution device, heat exchange coil 8 and water collecting tank 7 are sequentially arranged from top to bottom in unit shell 34, water distribution device is communicated with water collecting tank 7 through water supply pipe 31, and the exhaust fan is axial flow fan.

[0042] ​An exhaust port 1 is arranged at the top of the corresponding unit shell 34 above the exhaust fan 2;

[0043] An air inlet 6 is arranged on each of the two opposite side walls of the corresponding unit shell 34 between the heat exchange coil 8 and the water collecting tank 7;

[0044] The liquid inlet of the heat exchange coil 8 is communicated with the cold energy distribution unit CDU 15 through a first pipeline 27;

[0045] The liquid outlet of the heat exchange coil 8 is communicated with the cold energy distribution unit CDU 15 through a second pipeline 28.

[0046] The water distribution device comprises a water distribution pipe 32, and a plurality of nozzles 4 are arranged on the water distribution pipe 32; the water distribution pipe 32 is communicated with the water collecting tank 7 through a water supply pipe 31.

[0047] The water supply pipe 31 is provided with a circulating water pump 5.

[0048] The chip cooling unit comprises a liquid inlet tank 19 and a plurality of groups of chip cooling assemblies; the liquid inlet tank 19 is communicated with the cold energy distribution unit CDU 15 through a third pipeline 29; each group of chip cooling assemblies is communicated with the liquid inlet tank 19 through a liquid inlet pipe 18; each group of chip cooling assemblies is communicated with the cold energy distribution unit CDU 15 through a liquid return pipe 21; the liquid inlet tank 19 is installed above the plurality of groups of chip cooling assemblies in the cabinet 22.

[0049] The chip cooling assembly comprises a liquid distribution device and a liquid collecting disc 30, and the liquid collecting disc 30 is communicated with the liquid return pipe 21 through a liquid discharge pipe 33; the liquid distribution device is located above the heating surface of the chip 17, and the liquid collecting disc 30 is located below the chip 17.

[0050] The liquid distribution device comprises a liquid distribution pipe 35, and a plurality of atomizing nozzles 20 are arranged on the liquid distribution pipe 35; the liquid distribution pipe 35 is communicated with the liquid inlet pipe 18.

[0051] The cold energy distribution unit CDU 15 comprises a plate heat exchanger 14 and a cooling liquid pump 13; the cooling liquid pump 13 is arranged on the liquid return pipe 21;

[0052] The cold end liquid outlet of the plate heat exchanger 14 is communicated with the liquid inlet of the heat exchange coil 8 through the first pipeline 27;

[0053] The cold end liquid inlet of the plate heat exchanger 14 is communicated with the liquid outlet of the heat exchange coil 8 through the second pipeline 28;

[0054] The hot end liquid inlet of the plate heat exchanger 14 is communicated with the liquid inlet tank 19 through the third pipeline 29;

[0055] Each liquid discharge pipe 33 is communicated with the hot end liquid inlet of the plate heat exchanger 14 through the liquid return pipe 21.

[0056] The working medium of spray cooling is directly in contact with electronic devices, so the cooling liquid required for spray cooling of data centers must also be an insulating and low-corrosive medium, and the boiling point requirement is low, so a low-boiling fluorinated liquid is selected.

[0057] The process of producing low-temperature refrigerant working medium in the evaporative condenser 9 in the system, the refrigerant working medium flows into the heat exchange coil 8 of the evaporative condenser 9 after absorbing heat in the cold distribution unit CDU 15, the refrigerant enters the evaporative condenser 9 in the form of high-temperature and high-pressure gas, in the evaporative condenser 9, the gaseous refrigerant exchanges heat with water and air through the pipe wall of the heat exchange coil 8, in operation, the circulating water flows to the nozzle 4 from the water collecting tank 7 through the circulating water pump 5 and sprays on the surface of the heat exchange coil 8, the cooling water uniformly covers the surface of the heat exchange coil 8 under the strong wind force, exchanges heat with the high-temperature gaseous refrigerant, and condenses into liquid state. At the same time, part of the cooling water vaporizes to form water vapor, and the evaporation carries away a large amount of heat, which is sucked away by the exhaust fan 2 and discharged into the atmosphere. The condensed liquid refrigerant flows out from the bottom of the heat exchange coil 8, ready to enter the next component.

[0058] After the liquid refrigerant flows out of the evaporative condenser 9, it enters the liquid accumulator 10. The main function of the liquid accumulator 10 is to store liquid refrigerant and provide stable liquid refrigerant supply for the system. It can also play the role of liquid seal to prevent the phenomenon of liquid gas mixture entering the throttling valve 12 due to poor condensation. In the liquid accumulator 10, the refrigerant may undergo a certain degree of separation and sedimentation to remove impurities and bubbles therein.

[0059] After the liquid refrigerant flows out of the liquid accumulator 10, it enters the fluorine pump 11. The fluorine pump 11 uses mechanical action to pressurize and deliver the low-temperature liquid refrigerant to the cold distribution unit CDU 15. This process ensures that the refrigerant can overcome the resistance loss in the system and realize long-distance liquid supply.

[0060] Under the action of the fluorine pump 11, the liquid refrigerant enters the cold distribution unit CDU 15 through the throttling valve 12. The main function of the throttling valve 12 is to throttle and reduce the pressure, and convert the high-pressure liquid refrigerant into low-pressure liquid refrigerant. At the same time, it also controls and regulates the flow of refrigerant into the cold distribution unit CDU 15. After passing through the throttling valve 12, the pressure and temperature of the refrigerant will be reduced, preparing for the evaporation process.

[0061] After the low-pressure liquid refrigerant enters the plate heat exchanger 14 in the cold distribution unit CDU 15, the evaporation process begins. In the evaporation process, the refrigerant absorbs heat and vaporizes, exchanging heat with the cooling liquid in the cooling liquid circuit. The gaseous refrigerant enters the evaporative condenser 9 again through the refrigerant circuit, and the cycle continues.

[0062] The cooling fluid cooled by the cold distribution unit CDU 15 is delivered by the cooling fluid pump 13 to the chip cooling unit inside the cabinet 22 through the cooling fluid circuit; the cooling fluid enters the cabinet 22 and will be delivered to the liquid inlet tank 19 to provide a fixed size of gravitational potential to drive the cooling fluid to be sprayed through the atomizing nozzle 20; then, the cooling fluid will be atomized and sprayed to the heat generating surface of the chip 17 through the atomizing nozzle 20, the cooling fluid is atomized into tiny droplets 25 to form a mist 24, the mist 24 forms a liquid film 26 on the heat generating surface of the chip 17, absorbs and carries away the heat generated by the chip 17, as shown in Fig. 2 The heated cooling fluid will be collected through the liquid return pipe 21 and delivered to the cold distribution unit CDU 15 through the cooling fluid pump 13 for the next cooling cycle.

[0063] Embodiment 1

[0064] The system combining evaporation condensation and atomizing spray liquid cooling, as shown in Figs. 1-2 includes the evaporative condenser 9, the cold distribution unit CDU 15 and the chip cooling unit connected in sequence;

[0065] The evaporative condenser 9 provides cold energy for the whole system; the cold distribution unit CDU 15 is arranged in the data center room 23, the chip cooling unit is arranged inside the cabinet 22, and the chip cooling unit and the cabinet 22 form a liquid cooling cabinet;

[0066] The cold distribution unit CDU 15 is separated from the cabinet 22 by the firewall 16; the evaporative condenser 9 is arranged outside the data center room 23;

[0067] It also includes the first pipe 27 and the second pipe 28, and the evaporative condenser 9 is communicated with the cold distribution unit CDU 15 through the first pipe 27 and the second pipe 28;

[0068] It also includes the liquid return pipe 21 and the third pipe 29, and the chip cooling unit is communicated with the cold distribution unit CDU 15 through the liquid return pipe 21 and the third pipe 29.

[0069] Embodiment 2

[0070] The system combining evaporation condensation and atomizing spray liquid cooling, as shown in Figs. 1-2 includes the evaporative condenser 9, the cold distribution unit CDU 15 and the chip cooling unit connected in sequence;

[0071] The evaporative condenser 9 provides cold energy for the whole system; the cold distribution unit CDU 15 is arranged in the data center room 23, the chip cooling unit is arranged inside the cabinet 22, and the chip cooling unit and the cabinet 22 form a liquid cooling cabinet;

[0072] The cold distribution unit CDU 15 is separated from the cabinet 22 by the firewall 16; the evaporative condenser 9 is arranged outside the data center room 23;

[0073] The first pipe 27 and the second pipe 28 are further included, and the evaporative condenser 9 communicates with the cold distribution unit CDU 15 through the first pipe 27 and the second pipe 28.

[0074] The return pipe 21 and the third pipe 29 are further included, and the chip cooling unit communicates with the cold distribution unit CDU 15 through the return pipe 21 and the third pipe 29.

[0075] The second pipe 28 is sequentially provided with the liquid accumulator 10, the fluorine pump 11 and the throttle valve 12, the liquid accumulator 10 is arranged close to the evaporative condenser 9, and the throttle valve 12 is arranged close to the cold distribution unit CDU 15.

[0076] Embodiment 3

[0077] The system combining the evaporative condensation and the atomization injection type liquid cooling, as shown in the figure, includes the evaporative condenser 9, the cold distribution unit CDU 15 and the chip cooling unit which are sequentially connected. Figs. 1-2

[0078] The evaporative condenser 9 provides cold for the whole system; the cold distribution unit CDU 15 is arranged in the data center room 23, the chip cooling unit is arranged inside the cabinet 22, and the chip cooling unit and the cabinet 22 form a liquid cooling cabinet.

[0079] The cold distribution unit CDU 15 is separated from the cabinet 22 by the firewall 16; the evaporative condenser 9 is arranged outside the data center room 23;

[0080] The first pipe 27 and the second pipe 28 are further included, and the evaporative condenser 9 communicates with the cold distribution unit CDU 15 through the first pipe 27 and the second pipe 28.

[0081] The return pipe 21 and the third pipe 29 are further included, and the chip cooling unit communicates with the cold distribution unit CDU 15 through the return pipe 21 and the third pipe 29.

[0082] The second pipe 28 is sequentially provided with the liquid accumulator 10, the fluorine pump 11 and the throttle valve 12, the liquid accumulator 10 is arranged close to the evaporative condenser 9, and the throttle valve 12 is arranged close to the cold distribution unit CDU 15.

[0083] The evaporative condenser 9 includes the unit shell 34, and the unit shell 34 is sequentially provided with the exhaust fan 2, the water baffle 3, the water distribution device, the heat exchange coil 8 and the water collecting tank 7 from top to bottom; the water distribution device communicates with the water collecting tank 7 through the water supply pipe 31; the exhaust fan is an axial flow fan.

[0084] Embodiment 4​

[0085] The system combining evaporative condensation with atomized injection type liquid cooling, as shown in Figs. 1-2 includes evaporative condensers 9, cold distribution units CDU15 and chip cooling units connected in sequence.

[0086] The evaporative condensers 9 provide cold for the entire system; the cold distribution units CDU15 are arranged in the data center room 23, and the chip cooling units are arranged inside the cabinet 22, and the chip cooling units and the cabinet 22 form a liquid cooling cabinet.

[0087] The cold distribution units CDU15 and the cabinet 22 are separated by a firewall 16; the evaporative condensers 9 are arranged outside the data center room 23.

[0088] It also includes first pipes 27 and second pipes 28, and the evaporative condensers 9 are communicated with the cold distribution units CDU15 through the first pipes 27 and the second pipes 28.

[0089] It also includes liquid return pipes 21 and third pipes 29, and the chip cooling units are communicated with the cold distribution units CDU15 through the liquid return pipes 21 and the third pipes 29.

[0090] The second pipes 28 are sequentially provided with liquid reservoirs 10, fluorine pumps 11 and throttle valves 12, the liquid reservoirs 10 are arranged close to the evaporative condensers 9, and the throttle valves 12 are arranged close to the cold distribution units CDU15.

[0091] The evaporative condensers 9 include unit housings 34, and the unit housings 34 are sequentially provided with exhaust fans 2, water baffles 3, water distribution devices, heat exchange coils 8 and water collecting tanks 7 from top to bottom; the water distribution devices are communicated with the water collecting tanks 7 through water supply pipes 31; the exhaust fans are axial flow fans.

[0092] The exhaust fans 2 are provided with exhaust ports 1 corresponding to the top of the unit housings 34;

[0093] The unit housings 34 are provided with air inlets 6 on the two opposite side walls corresponding to the heat exchange coils 8 and the water collecting tanks 7;

[0094] The liquid inlets of the heat exchange coils 8 are communicated with the cold distribution units CDU15 through the first pipes 27;

[0095] The liquid outlets of the heat exchange coils 8 are communicated with the cold distribution units CDU15 through the second pipes 28.

[0096] Embodiment 5

[0097] The system combining evaporative condensation with atomized injection type liquid cooling, as shown in Figs. 1-2 includes evaporative condensers 9, cold distribution units CDU15 and chip cooling units connected in sequence.

[0098] The evaporative condenser 9 provides cold energy for the whole system; the cold energy distribution unit CDU 15 is arranged in the data center room 23, and the chip cooling unit is arranged inside the cabinet 22, and the chip cooling unit and the cabinet 22 form a liquid cooling cabinet;

[0099] The cold energy distribution unit CDU 15 is separated from the cabinet 22 by the firewall 16; the evaporative condenser 9 is arranged outside the data center room 23;

[0100] Further comprising a first pipe 27 and a second pipe 28, the evaporative condenser 9 communicates with the cold energy distribution unit CDU 15 through the first pipe 27 and the second pipe 28;

[0101] Further comprising a liquid return pipe 21 and a third pipe 29, the chip cooling unit communicates with the cold energy distribution unit CDU 15 through the liquid return pipe 21 and the third pipe 29.

[0102] The second pipe 28 is sequentially provided with a liquid reservoir 10, a fluorine pump 11 and a throttle valve 12, the liquid reservoir 10 is arranged close to the evaporative condenser 9, and the throttle valve 12 is arranged close to the cold energy distribution unit CDU 15.

[0103] The evaporative condenser 9 comprises a unit shell 34, and the unit shell 34 is sequentially provided with an exhaust fan 2, a water baffle 3, a water distribution device, a heat exchange coil 8 and a water collecting tank 7 from top to bottom; the water distribution device communicates with the water collecting tank 7 through a water supply pipe 31; the exhaust fan is an axial flow fan.

[0104] The exhaust fan 2 is provided with an exhaust port 1 corresponding to the top of the unit shell 34;

[0105] The heat exchange coil 8 and the water collecting tank 7 are provided with an air inlet 6 on the two opposite side walls of the unit shell 34 corresponding thereto;

[0106] The inlet of the heat exchange coil 8 communicates with the cold energy distribution unit CDU 15 through the first pipe 27;

[0107] The outlet of the heat exchange coil 8 communicates with the cold energy distribution unit CDU 15 through the second pipe 28.

[0108] The water distribution device comprises a water distribution pipe 32, and a plurality of nozzles 4 are arranged on the water distribution pipe 32; the water distribution pipe 32 communicates with the water collecting tank 7 through the water supply pipe 31.

[0109] Embodiment 6

[0110] The system combining evaporative condensation and atomizing injection type liquid cooling, as shown in Figs. 1-2 includes an evaporative condenser 9, a cold energy distribution unit CDU 15 and a chip cooling unit connected in sequence;

[0111] The evaporative condenser 9 provides cold energy for the whole system; the cold energy distribution unit CDU 15 is arranged in the data center room 23, and the chip cooling unit is arranged inside the cabinet 22, and the chip cooling unit and the cabinet 22 form a liquid cooling cabinet;

[0112] The cold energy distribution unit CDU 15 is separated from the cabinet 22 by the firewall 16; the evaporative condenser 9 is arranged outside the data center room 23;

[0113] Further comprising a first pipe 27 and a second pipe 28, the evaporative condenser 9 is communicated with the cold energy distribution unit CDU 15 through the first pipe 27 and the second pipe 28;

[0114] Further comprising a liquid return pipe 21 and a third pipe 29, the chip cooling unit is communicated with the cold energy distribution unit CDU 15 through the liquid return pipe 21 and the third pipe 29.

[0115] The second pipe 28 is sequentially provided with a liquid accumulator 10, a fluorine pump 11 and a throttle valve 12, the liquid accumulator 10 is arranged close to the evaporative condenser 9, and the throttle valve 12 is arranged close to the cold energy distribution unit CDU 15.

[0116] The evaporative condenser 9 comprises a unit shell 34, and the unit shell 34 is sequentially provided with an exhaust fan 2, a water baffle 3, a water distribution device, a heat exchange coil 8 and a water collecting tank 7 from top to bottom; the water distribution device is communicated with the water collecting tank 7 through a water supply pipe 31; the exhaust fan is an axial flow fan.

[0117] The exhaust fan 2 is provided with an exhaust port 1 at the top of the corresponding unit shell 34;

[0118] The heat exchange coil 8 and the water collecting tank 7 are both provided with an air inlet 6 on the two opposite side walls of the corresponding unit shell 34;

[0119] The liquid inlet of the heat exchange coil 8 is communicated with the cold energy distribution unit CDU 15 through the first pipe 27;

[0120] The liquid outlet of the heat exchange coil 8 is communicated with the cold energy distribution unit CDU 15 through the second pipe 28.

[0121] The water distribution device comprises a water distribution pipe 32, and a plurality of nozzles 4 are arranged on the water distribution pipe 32; the water distribution pipe 32 is communicated with the water collecting tank 7 through the water supply pipe 31.

[0122] The water supply pipe 31 is provided with a circulating water pump 5.

Claims

1. A system combining evaporation condensation with atomized spray liquid cooling, characterized in that, It comprises an evaporative condenser (9), a cold distribution unit (CDU) (15) and a chip cooling unit connected in sequence. It further comprises a first pipeline (27) and a second pipeline (28), the evaporative condenser (9) is communicated with the cold distribution unit (CDU) (15) through the first pipeline (27) and the second pipeline (28). It further comprises a liquid return pipe (21) and a third pipeline (29), the chip cooling unit is communicated with the cold distribution unit (CDU) (15) through the liquid return pipe (21) and the third pipeline (29).

2. The system of claim 1, wherein, The second pipeline (28) is sequentially provided with a liquid accumulator (10), a fluorine pump (11) and a throttle valve (12), the liquid accumulator (10) is arranged close to the evaporative condenser (9), and the throttle valve (12) is arranged close to the cold distribution unit (CDU) (15).

3. The system of claim 2, wherein, The evaporative condenser (9) comprises a unit shell (34), the unit shell (34) is sequentially provided with an exhaust fan (2), a water baffle (3), a water distribution device, a heat exchange coil (8) and a water collecting tank (7) from top to bottom; the water distribution device is communicated with the water collecting tank (7) through a water supply pipe (31); An exhaust port (1) is arranged at the top of the unit shell (34) corresponding to the exhaust fan (2); Air inlets (6) are arranged on two opposite side walls of the unit shell (34) corresponding to the heat exchange coil (8) and the water collecting tank (7); The liquid inlet of the heat exchange coil (8) is communicated with the cold distribution unit (CDU) (15) through the first pipeline (27); The liquid outlet of the heat exchange coil (8) is communicated with the cold distribution unit (CDU) (15) through the second pipeline (28).

4. The system of claim 3, wherein, The water distribution device comprises a water distribution pipe (32), a plurality of nozzles (4) are arranged on the water distribution pipe (32); the water distribution pipe (32) is communicated with the water collecting tank (7) through the water supply pipe (31).

5. The system of claim 3, wherein, A circulating water pump (5) is arranged on the water supply pipe (31).

6. The system of claim 3, wherein, The chip cooling unit comprises a liquid inlet tank (19) and a plurality of chip cooling assemblies; the liquid inlet tank (19) is communicated with the cold distribution unit (CDU) (15) through the third pipeline (29), each chip cooling assembly is communicated with the liquid inlet tank (19) through a liquid inlet pipe (18); each chip cooling assembly is communicated with the cold distribution unit (CDU) (15) through the liquid return pipe (21); the liquid inlet tank (19) is installed above the plurality of chip cooling assemblies in a cabinet (22).

7. The system of claim 6, wherein, The chip cooling assembly comprises a liquid distribution device and a liquid collecting disc (30), the liquid collecting disc (30) is communicated with the liquid return pipe (21) through a liquid discharge pipe (33); the liquid distribution device is located above a heating surface of a chip (17), and the liquid collecting disc (30) is located below the chip (17).

8. The system of claim 7, wherein, The liquid distribution device comprises a liquid distribution pipe (35), a plurality of atomizing nozzles (20) are arranged on the liquid distribution pipe (35), and the liquid distribution pipe (35) is communicated with the liquid inlet pipe (18).

9. The system of claim 8, wherein, The cold distribution unit (CDU) (15) comprises a plate heat exchanger (14) and a cooling liquid pump (13); the cooling liquid pump (13) is arranged on the liquid return pipe (21); The cold end liquid outlet of the plate heat exchanger (14) is communicated with the liquid inlet of the heat exchange coil (8) through the first pipeline (27); The cold end liquid inlet of the plate heat exchanger (14) is communicated with the liquid outlet of the heat exchange coil (8) through the second pipeline (28); The hot end liquid outlet of the plate heat exchanger (14) is communicated with the liquid inlet tank (19) through the third pipeline (29); Each liquid discharge pipe (33) is communicated with the hot end liquid inlet of the plate heat exchanger (14) through the liquid return pipe (21).

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