Multilayer shunting type micro-channel liquid cooling plate

Abstract

The utility model relates to the technical field of liquid cooling plates, in particular to a multilayer shunting type micro-channel liquid cooling plate, which comprises an inlet and outlet heat exchange seat, a heat exchange plate arranged at the bottom of the inlet and outlet heat exchange seat, and a shunting plate arranged between the inlet and outlet heat exchange seat and the heat exchange plate, a liquid inlet, a liquid outlet, a liquid inlet channel communicated with the liquid inlet and a liquid outlet channel communicated with the liquid outlet are formed in the inlet and outlet heat exchange seat, a liquid inlet hole and a liquid outlet hole are formed in the splitter plate, the heat exchange plate comprises a plate body and a plurality of heat exchange fins arranged side by side on the plate body, a heat exchange micro-channel is formed between every two adjacent heat exchange fins, and the heat exchange micro-channel is communicated with the liquid inlet channel. The heat exchange micro-channel is communicated with the liquid inlet channel through the liquid inlet hole, and the heat exchange micro-channel is communicated with the liquid outlet channel through the liquid outlet hole; according to the utility model, a traditional plane shunting structure can be changed into a space stacking shunting structure, so that the plane size can be effectively reduced, and the heat dissipation and cooling requirements of a high-heat-flux electronic device under the condition that the plane space is limited can be met.

Description

TECHNICAL FIELD

[0001] The utility model relates to liquid cooling plate technical field especially relates to a multilayer shunt formula microchannel liquid cooling plate. BACKGROUND

[0002] With the continuous improvement of electronic device integration, the heat power and heat flux density of various electronic devices also greatly improve, and higher requirements are put forward for the heat dissipation performance of liquid cooling plate. As a kind of heat dissipation device with high heat transfer performance, liquid cooling plate is suitable for high heat flux density heat dissipation field and has been widely used in high-power electronic device heat dissipation, power battery heat dissipation and the like. The flow guide device of traditional liquid cooling plate adopts plane structure layout, for example, in the patent CN102767983A, the main heat exchange flow channel and the inlet and outlet shunt flow channel are located on the same plane to form Z-shaped fluid channel, and the land area is relatively large, which is difficult to meet the heat dissipation demand of high heat flux electronic device under the condition of limited plane space. SUMMARY

[0003] The utility model discloses a multilayer shunt formula microchannel liquid cooling plate, changes the traditional plane shunt structure into spatial stacking shunt structure, can effectively reduce the plane size, to meet the heat dissipation cooling requirement of high heat flux density electronic device under the condition of limited plane space.

[0004] In order to realize the above-mentioned purpose, the utility model adopts the technical scheme of a multilayer shunt formula microchannel liquid cooling plate, including inlet and outlet heat exchange seat, the heat exchange plate of setting in the bottom of inlet and outlet heat exchange seat, the shunt plate of setting between inlet and outlet heat exchange seat and heat exchange plate, inlet and outlet heat exchange seat is formed with liquid inlet, liquid outlet, with liquid inlet communication's liquid inlet channel, with liquid outlet communication's liquid outlet channel, and the shunt plate is formed with liquid inlet hole, liquid outlet hole, and the heat exchange plate includes the plate body, sets up a plurality of heat exchange fins that are arranged side by side on the plate body, and the heat exchange microchannel is formed between each two adjacent heat exchange fins, and the heat exchange microchannel is communicated with liquid inlet channel through liquid inlet hole, and the heat exchange microchannel is communicated with liquid outlet channel through liquid outlet hole.

[0005] Further improvement of the above scheme is that the liquid inlet channel and the liquid outlet channel are arranged in the left-right direction respectively, the heat exchange microchannel is arranged in the left-right direction, the liquid inlet hole and the liquid outlet hole are strip-shaped holes, and the length direction of the liquid inlet hole and the length direction of the liquid outlet hole are arranged in the front-back direction respectively.

[0006] Further improvement of the above scheme is that the liquid outlet channel has two, the liquid inlet channel and the two liquid outlet channels are arranged side by side in the front-back direction, the liquid inlet channel is located at the middle position of the bottom of the inlet and outlet heat exchange seat, and the two liquid outlet channels are located at the front and rear ends of the bottom of the inlet and outlet heat exchange seat respectively.

[0007] Further improvement of the above scheme is that the flow distribution plate is formed with a liquid inlet groove arranged in the left-right direction, two liquid outlet grooves arranged in the left-right direction, the liquid inlet groove is located below the liquid inlet channel, and the two liquid outlet grooves are respectively located below the two liquid outlet channels.

[0008] Further improvement of the above scheme is that the liquid outlet hole has four, the liquid inlet hole is located at the middle position of the liquid inlet groove and is in communication with the liquid inlet groove, two liquid outlet holes are located in front of the liquid inlet groove and are respectively located on both sides of the liquid inlet hole, the two liquid outlet holes located in front of the liquid inlet groove are respectively in communication with the liquid outlet groove located at the front end, and the other two liquid outlet holes are located behind the liquid inlet groove and are respectively located on both sides of the liquid inlet hole, the two liquid outlet holes located behind the liquid inlet groove are respectively in communication with the liquid outlet groove located at the rear end.

[0009] Further improvement of the above scheme is that the two sides of the flow distribution plate are respectively formed with a liquid inlet side groove arranged in the front-rear direction, the two liquid inlet side grooves are respectively in communication with the liquid inlet groove, and the heat exchange microchannel is in communication with the liquid inlet channel through the liquid inlet side groove.

[0010] Further improvement of the above scheme is that the plate body of the heat exchange plate and each heat exchange fin are integrally formed.

[0011] The utility model has the advantages that the utility model discloses a multilayer flow distribution type microchannel liquid cooling plate, which comprises an inlet and outlet heat exchange seat, a heat exchange plate arranged at the bottom of the inlet and outlet heat exchange seat and a flow distribution plate arranged between the inlet and outlet heat exchange seat and the heat exchange plate.

[0012] The plate body of the heat exchange plate is attached to the electronic equipment to be cooled, the cooling liquid is passed into the liquid inlet channel from the liquid inlet, the cooling liquid in the liquid inlet channel flows into the heat exchange microchannel formed by the heat exchange fins through the liquid inlet hole of the flow distribution plate, the high surface area to volume ratio of the heat exchange microchannel can realize efficient heat exchange, and the cooling liquid in the heat exchange microchannel flows to the liquid outlet channel from the liquid outlet hole of the flow distribution plate after completing heat exchange and flows out from the liquid outlet, so that the electronic equipment is cooled efficiently. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1The utility model discloses a structure schematic drawing.

[0014] Figure 2 The utility model discloses a decomposition structure schematic drawing.

[0015] Figure 3 For Figure 2 Another structure schematic drawing of angle.

[0016] Figure 4 For Figure 2 The enlarged view of A in the middle.

[0017] Mark explanation: import and export heat exchange seat 1, liquid inlet 11, liquid outlet 12, liquid inlet channel 13, liquid outlet channel 14, shunt plate 2, liquid inlet hole 21, liquid outlet hole 22, liquid inlet groove 23, liquid outlet groove 24, liquid inlet side groove 25, heat exchange plate 3, plate body 31, heat exchange fin 32, heat exchange microchannel 4. Specific implementation:

[0018] The utility model will be further explained below in conjunction with the drawings, such as Figures 1-4 As shown in the utility model discloses an import and export heat exchange seat 1, the heat exchange plate 3 of setting in the bottom of import and export heat exchange seat 1, the shunt plate 2 of setting between import and export heat exchange seat 1 and heat exchange plate 3, the import and export heat exchange seat 1 is shaped with liquid inlet 11, liquid outlet 12, with liquid inlet 11 intercommunication's liquid inlet channel 13, with liquid outlet 12 intercommunication's liquid outlet channel 14, shunt plate 2 is shaped with liquid inlet hole 21, liquid outlet hole 22, and heat exchange plate 3 includes plate body 31, sets up multiple heat exchange fins 32 of parallel arrangement of plate body 31, forms heat exchange microchannel 4 between each adjacent two heat exchange fins 32, and heat exchange microchannel 4 is communicated with liquid inlet channel 13 through liquid inlet hole 21, and heat exchange microchannel 4 is communicated with liquid outlet channel 14 through liquid outlet hole 22;The plate body 31 of heat exchange plate 3 is attached to the electronic equipment of required heat dissipation, and cooling liquid is passed into liquid inlet channel 13 from liquid inlet 11, and the cooling liquid in liquid inlet channel 13 flows into the heat exchange microchannel 4 formed by each heat exchange fin 32 through liquid inlet hole 21 on shunt plate 2, and through the high surface area volume ratio of heat exchange microchannel 4, high -efficient heat exchange can be realized, and the cooling liquid in heat exchange microchannel 4 flows to liquid outlet channel 14 from liquid outlet hole 22 of shunt plate 2 after completing heat exchange and flows out from liquid outlet 12, and this circulation is carried out to the electronic equipment and completes high -efficient heat dissipation;Compared with the prior art liquid cooling plate, the utility model can change the traditional plane shunt structure into spatial stacking shunt structure, can effectively reduce the plane size, to meet the heat dissipation cooling requirement of high heat flux density electronic device under the condition of limited plane space.

[0019] The liquid inlet channel 13 and the liquid outlet channel 14 are arranged in the left-right direction respectively, the heat exchange micro channel 4 is arranged in the left-right direction, the liquid inlet hole 21 and the liquid outlet hole 22 are strip-shaped holes, the length direction of the liquid inlet hole 21 and the length direction of the liquid outlet hole 22 are arranged in the front-back direction respectively; the cooling liquid in the liquid inlet channel 13 can be better distributed to each heat exchange micro channel 4 through the liquid inlet hole 21, and the cooling liquid in each heat exchange micro channel 4 can flow to the liquid outlet channel 14 through the liquid outlet hole 22.

[0020] The liquid outlet channel 14 has two, the liquid inlet channel 13 and the two liquid outlet channels 14 are arranged side by side in the front-back direction, the liquid inlet channel 13 is located at the middle position of the bottom of the inlet and outlet heat exchange seat 1, and the two liquid outlet channels 14 are respectively located at the front and rear ends of the bottom of the inlet and outlet heat exchange seat 1; the distribution plate 2 is formed with a liquid inlet groove 23 arranged in the left-right direction and two liquid outlet grooves 24 arranged in the left-right direction, the liquid inlet groove 23 is located below the liquid inlet channel 13, and the two liquid outlet grooves 24 are respectively located below the two liquid outlet channels 14; the liquid outlet hole 22 has four, the liquid inlet hole 21 is located at the middle position of the liquid inlet groove 23 and communicates with the liquid inlet groove 23, two liquid outlet holes 22 are located in front of the liquid inlet groove 23 and are respectively located on both sides of the liquid inlet hole 21, the two liquid outlet holes 22 located in front of the liquid inlet groove 23 respectively communicate with the liquid outlet groove 24 located at the front end, and the other two liquid outlet holes 22 are located behind the liquid inlet groove 23 and are respectively located on both sides of the liquid inlet hole 21, the two liquid outlet holes 22 located behind the liquid inlet groove 23 respectively communicate with the liquid outlet groove 24 located at the rear end; the cooling liquid located in the liquid inlet channel 13 is introduced to the position of the liquid inlet hole 21 through the liquid inlet groove 23, and then is distributed to each heat exchange micro channel 4 through the liquid inlet hole 21, and the cooling liquid in the heat exchange micro channel 4 located at different positions is introduced to the two liquid outlet grooves 24 through the four liquid outlet holes 22 respectively, so that the flow of the cooling liquid can be realized more quickly, the overall flow resistance is smaller, and the heat exchange efficiency can be improved better.

[0021] The two sides of the distribution plate 2 are respectively formed with liquid inlet side grooves 25 arranged in the front-back direction, the two liquid inlet side grooves 25 respectively communicate with the liquid inlet groove 23, and the heat exchange micro channel 4 communicates with the liquid inlet channel 13 through the liquid inlet side groove 25; the cooling liquid in the liquid inlet channel 13 flows into each heat exchange micro channel 4 from the two sides through the two liquid inlet side grooves 25, and combines with the liquid inlet hole 21 to make the cooling liquid in the liquid inlet channel 13 flow into each heat exchange micro channel 4 from the middle, the cooling liquid flowing into each heat exchange micro channel 4 from the two sides flows to the middle, and the cooling liquid flowing into each heat exchange micro channel 4 from the middle flows to the two sides, which can further shorten the flow path of the cooling liquid, the overall flow resistance is smaller, and the heat exchange efficiency can be improved better.

[0022] The plate body 31 of the heat exchange plate 3 is integrally formed with each heat exchange fin 32, so that the number of components is small, assembly is facilitated, heat transfer from the plate body 31 to each heat exchange fin 32 is facilitated, and the heat exchange efficiency is improved.

[0023] Working principle:

[0024] The plate body 31 of the heat exchange plate 3 is integrally formed with each heat exchange fin 32, so that the number of components is small, assembly is facilitated, heat transfer from the plate body 31 to each heat exchange fin 32 is facilitated, and the heat exchange efficiency is improved.

[0025] Of course, the above only describes the preferred embodiments of the present application, and equivalent changes or modifications made in accordance with the structure, features and principles described in the patent application range of the present application are included in the patent application range of the present application.

Claims

1. A multi-layer shunt microchannel liquid cooling plate, characterized in that: The system includes an inlet / outlet heat exchange base (1), a heat exchange plate (3) disposed at the bottom of the inlet / outlet heat exchange base (1), and a flow divider (2) disposed between the inlet / outlet heat exchange base (1) and the heat exchange plate (3). The inlet / outlet heat exchange base (1) is formed with an inlet (11), an outlet (12), an inlet channel (13) connected to the inlet (11), and an outlet channel (14) connected to the outlet (12). The flow divider (2) is formed with an inlet hole (21) and an outlet hole (22). The heat exchange plate (3) includes a plate body (31) and multiple heat exchange fins (32) arranged side by side on the plate body (31). A heat exchange microchannel (4) is formed between each pair of adjacent heat exchange fins (32). The heat exchange microchannel (4) is connected to the inlet channel (13) through the inlet hole (21) and to the outlet channel (14) through the outlet hole (22).

2. The multi-layer shunt microchannel liquid cooling plate according to claim 1, characterized in that: The liquid inlet channel (13) and liquid outlet channel (14) are respectively arranged in the left and right directions, the heat exchange microchannel (4) is arranged in the left and right directions, the liquid inlet hole (21) and liquid outlet hole (22) are respectively strip holes, and the length direction of the liquid inlet hole (21) and the length direction of the liquid outlet hole (22) are respectively arranged in the front and back directions.

3. The multi-layer shunt microchannel liquid cooling plate according to claim 2, characterized in that: There are two liquid outlet channels (14). The liquid inlet channel (13) and the two liquid outlet channels (14) are arranged side by side in the front-to-back direction. The liquid inlet channel (13) is located at the middle of the bottom of the inlet and outlet heat exchange base (1), and the two liquid outlet channels (14) are located at the front and rear ends of the bottom of the inlet and outlet heat exchange base (1) respectively.

4. The multi-layer shunt microchannel liquid cooling plate according to claim 3, characterized in that: The diversion plate (2) is formed with an inlet groove (23) arranged in the left-right direction and two outlet grooves (24) arranged in the left-right direction. The inlet groove (23) is located below the inlet channel (13), and the two outlet grooves (24) are located below the two outlet channels (14) respectively.

5. A multi-layer shunt microchannel liquid cooling plate according to claim 4, characterized in that: There are four outlet holes (22). The inlet hole (21) is located in the middle of the inlet tank (23) and is connected to the inlet tank (23). Two outlet holes (22) are located in front of the inlet tank (23) and are located on both sides of the inlet hole (21). The two outlet holes (22) located in front of the inlet tank (23) are connected to the outlet tank (24) located at the front end. The other two outlet holes (22) are located behind the inlet tank (23) and are located on both sides of the inlet hole (21). The two outlet holes (22) located behind the inlet tank (23) are connected to the outlet tank (24) located at the rear end.

6. The multi-layer shunt microchannel liquid cooling plate according to claim 5, characterized in that: The flow divider (2) has liquid inlet side grooves (25) formed on both sides in a front-to-back direction. The two liquid inlet side grooves (25) are connected to the liquid inlet groove (23) respectively. The heat exchange microchannel (4) is connected to the liquid inlet channel (13) through the liquid inlet side grooves (25).

7. The multi-layer shunt microchannel liquid cooling plate according to claim 1, characterized in that: The heat exchange plate (3) is integrally formed with each heat exchange fin (32).

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