Heat dissipation shell and domain controller
The heat dissipation housing with multi-level ring structure and air guide structure solves the problem of low heat dissipation efficiency of domain controllers, realizes uniform heat dissipation and temperature reduction of circuit boards, and improves the performance and reliability of the equipment.
Patent Information
- Application Number
- CN202423153830.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-12-19
AI Technical Summary
Domain controllers may experience low heat dissipation efficiency due to heat accumulation during operation, which could lead to internal circuit board failure or reduced efficiency, affecting overall performance and reliability.
The heat dissipation shell adopts a multi-stage annular structure and air guiding structure, including an air guiding section and an air gathering section. It is designed as a flat plate. The air gathering section gathers gas for heat exchange, and the multi-stage blades accelerate the airflow. Combined with heat dissipation fins and air outlet pipes, it forms a swirling flow to improve heat dissipation efficiency.
This improves the heat dissipation efficiency of the domain controller, ensures uniform heat dissipation on the circuit board, reduces temperature, extends the service life of the circuit board, and reduces the overall cost of the equipment.
Smart Images
Figure CN223567977U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of heat dissipation, in particular to a heat dissipation shell and a domain controller. BACKGROUND
[0002] With the continuous progress of intelligent technology, the integration of the domain controller is becoming higher and higher, and the integrated functions and circuits are becoming more and more complex. This causes the domain controller to generate significant heat accumulation during operation, which rapidly increases the internal temperature of the device. If the heat cannot be dissipated in time and effectively, the controller will continue to heat up, which may cause the internal circuit board to fail or reduce the efficiency, thereby affecting the overall performance and reliability. Therefore, effective heat dissipation of the domain controller is particularly important. The domain controller contains various functional components and other heat generating elements, and the current technology has the problem of low heat dissipation efficiency of the circuit board elements in the domain controller due to design defects. CONTENT OF THE UTILITY MODEL
[0003] The application embodiment provides a heat dissipation shell for improving the heat dissipation performance of the domain controller.
[0004] The application embodiment provides a heat dissipation shell, which comprises a wind guide structure and at least two levels of annular structures arranged outside the periphery of the wind guide structure. The diameters of the annular structures of each level gradually increase, and blades extending in a radial state are respectively fixedly arranged on each level of the annular structures. The wind guide structure comprises a wind guide part and a wind gathering part. The wind guide part is in the form of a flat plate. The wind gathering part is formed in the form of a ring-shaped protrusion extending from one side of the wind guide part. The wind gathering part can gather flowing gas to exchange heat with a heat dissipation component. The wind guide part and the blades can guide the flow of gas to carry away heat.
[0005] In some embodiments, the wind guide part is sequentially provided with a first ring part, a second ring part and a third ring part along the radial direction thereof. The blades comprise first-level blades, second-level blades and third-level blades. The first-level blades are fixedly installed between the wind guide part and the first ring part. The second-level blades are fixedly installed between the first ring part and the second ring part. The third-level blades are fixedly installed between the second ring part and the third ring part. The first ring part, the second ring part and the wind guide part are located in the same plane.
[0006] In some embodiments, the third ring part is provided with a plurality of heat dissipation fins. The heat dissipation fins are located on the side of the wind guide part away from the wind gathering part for active heat dissipation.
[0007] In some embodiments, a plurality of air outlet pipes are arranged on the second ring part. The air outlet pipes and the wind gathering part are arranged on the same side of the wind guide part. The plurality of air outlet pipes are used to guide the flowing gas to blow to a designated position.
[0008] In some embodiments, the air outlet pipe comprises a first end and a second end, the distance from the first end to the plane of the air guide part is less than the distance from the second end to the plane of the air guide part, and the diameter of the air outlet pipe at the first end is less than the diameter of the air outlet pipe at the second end.
[0009] In some embodiments, the third stage of blades is inclined to the plane of the air guide part.
[0010] In some embodiments, a plurality of heat dissipation holes are formed on the air guide part, and the heat dissipation holes are located in the closed area enclosed by the annular air gathering part.
[0011] In some embodiments, the side of the air guide part facing the air gathering part is further provided with a boss, the boss is located in the closed area enclosed by the annular air gathering part, the center of the boss is provided with a through hole, and the heat dissipation hole is located between the boss and the air gathering part.
[0012] In some embodiments, the third ring part faces the positioning part of the air gathering part, and the positioning part is used for connecting and positioning the circuit board.
[0013] In some embodiments, a domain controller is provided, comprising a connecting shell, a circuit board and the heat dissipation shell described above, the circuit board is arranged between the connecting shell and the heat dissipation shell, and the air gathering part of the heat dissipation shell faces the circuit board.
[0014] The heat dissipation shell provided by the embodiments of the present application can reduce the probability of diffusion of the gas sucked from the air guide part to the surrounding, gather the air flow to the area enclosed by the annular boss as much as possible and form a rotational flow, thereby improving the air flow in the area enclosed by the annular boss, the air guide part facing the circuit board when applied to the domain controller can improve the heat exchange efficiency of the gas and the circuit board, the air flow flows from the center of the heat dissipation shell to the surrounding and is blown out from the edge of the heat dissipation shell, thereby delivering heat, the multi-stage annular structure and the multi-stage blades can accelerate the flow rate of the air flow to some extent and make the heat dissipation more uniform, thereby effectively improving the heat dissipation efficiency of the domain controller. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0016] Figure 1 is a structural schematic diagram of a domain controller in some embodiments of the present application;
[0017] Figure 2 is Figure 1 A schematic diagram of the profile of the domain controller in the embodiment;
[0018] Figure 3 is Figure 1 A schematic diagram of the structure of the heat dissipation housing in the embodiment;
[0019] Figure 4 is Figure 3 A schematic diagram of the structure of the heat dissipation housing in the embodiment from another perspective.
[0020] In the above figures:
[0021] 10, heat dissipation housing; 11, air guide structure; 111, air guide part; 112, air gathering part; 113, heat dissipation hole; 114, boss; 115, through hole; 12, first ring part; 13, second ring part; 131, air outlet pipe; 14, third ring part; 141, positioning part; 142, mounting part; 143, stiffening rib; 144, heat dissipation fin; 15, first stage blade; 16, second stage blade; 17, third stage blade;
[0022] 20, connecting housing; 21, connector;
[0023] 30, circuit board; 40, mounting cavity. DETAILED DESCRIPTION
[0024] The present application will be further described below in conjunction with the drawings and embodiments. It is particularly pointed out that the following embodiments are only for illustrating the present application, but not for limiting the scope of the present application. Similarly, the following embodiments are only part of the embodiments of the present application, but not all the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art without making creative efforts are within the scope of protection of the present application.
[0025] The terms "first", "second", "third", etc. in the embodiments of the present application are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", "third" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly and specifically limited. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are used only for explaining the relative position relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly. The terms "include" and "have" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or components inherent to the process, method, product or device.
[0026] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of the application. The appearances of the phrase that the phrase in various places in the specification are not necessarily all referring to the same embodiment, or are necessarily referring to different or alternative embodiments. It is explicitly and implicitly understood that the embodiments described herein can be combined with other embodiments.
[0027] Please refer to Figure 1 and Figure 2 , Figure 1 is a structural schematic diagram of a domain controller in some embodiments of the present application, Figure 2 is Figure 1 a cross-sectional schematic diagram of the domain controller in the embodiments. The embodiments of the present application provide a domain controller, which includes a connecting shell 20, a circuit board 30 and a heat dissipation shell 10, the connecting shell 20 and the heat dissipation shell 10 enclose to form a mounting cavity 40, and the circuit board 30 is arranged between the connecting shell 20 and the heat dissipation shell 10.
[0028] Please refer to Figure 3 and Figure 4 , Figure 3 is Figure 1 a structural schematic diagram of the heat dissipation shell in the embodiments, Figure 4 is Figure 3Structure diagram of the heat dissipation shell from another perspective in the embodiment. Wherein, the heat dissipation shell 10 comprises a wind guide structure 11 and at least two levels of annular structures arranged on the outer periphery of the wind guide structure 11, the diameter of each level of annular structures gradually increases, and each level of annular structures is respectively fixedly provided with blades extending in a radial state, the wind guide structure 11 comprises a wind guide part 111 and a wind gathering part 112, the wind guide part 111 is in a planar plate shape, and the wind gathering part 112 is formed as an annular protrusion extending from one side of the wind guide part 111, the wind gathering part 112 can gather the flowing gas to exchange heat with the heat dissipation object, and the wind guide part 111 and the blades can guide the gas flow and take away the heat.
[0029] The wind gathering part 112 can reduce the probability of the gas inhaled from the wind guide part 111 diffusing to the surroundings, gather the airflow as much as possible into the area enclosed by the annular protrusion and form a rotational flow, improve the airflow in the area enclosed by the annular protrusion, and further improve the heat exchange efficiency with the circuit board 30. The heat dissipation shell 10 can be made of a heat conductive material, and the heat conductive material can be aluminum alloy, alumina ceramic and other materials with high heat transfer coefficient.
[0030] Please refer to Figure 2 Optionally, the connection shell 20 and the heat dissipation shell 10 are detachably fixedly connected by screws, and the circuit board 30 is located in the mounting cavity 40 and clamped between the connection shell 20 and the heat dissipation shell 10. Since the components of the domain controller are detachable, only the corresponding component needs to be replaced when a single component is damaged, avoiding the scrapping of the entire domain controller and reducing the cost. The connection shell 20 is provided with a connector 21, the connector 21 is used for connecting the controlled load of the domain controller, signal acquisition or electrical component control of the load, and the connection shell 20 and the connector 21 are made of an integral injection molding process.
[0031] Optionally, the wind gathering part 112 of the heat dissipation shell 10 faces the circuit board 30, and a plurality of electronic components are integrated on the circuit board 30, ensuring that the control functions of the domain controller can be smoothly realized. At the same time, the circuit board 30 is arranged close to the heat dissipation shell 10, so that the heat dissipation efficiency of the heat dissipation shell 10 can fully cover the circuit board 30, thereby providing better heat dissipation protection for the key components on the circuit board 30.
[0032] In addition, in the embodiment, a waterproof coating is specially applied to the surface of the circuit board 30, which can be selected from liquid materials such as polyurethane, epoxy resin and acrylic, or can be selected by using a paralyne coating film technology and other types of waterproof treatment methods, and the specific selection is not limited. This design not only enhances the waterproof ability of the circuit board 30, effectively avoids the short circuit problem caused by condensation water droplets, but also greatly prolongs the working life of the circuit board 30.
[0033] The domain controller provided in the present application can be arranged at a position where air flows, for example, on an air conditioner assembly air duct. Through the air flowing on the air conditioner assembly air duct, in combination with the air guide structure 11 on the heat dissipation shell 10, the heat dissipation shell 10 can introduce the flowing air into the domain controller to dissipate heat for the circuit board 30. Of course, the arrangement position of the domain controller is not limited to the air conditioner assembly air duct, but can be at a position where air flows and away from a high-temperature heat source.
[0034] In other embodiments, an electronic fan can be directly arranged on the heat dissipation shell 10, which corresponds to the air guide structure 11 of the heat dissipation shell 10. The electronic fan is rotated to make the air flow to the air guide structure 11. Through the cooperation of the air gathering part 112 and the air guide part 111, the swirling effect can be enhanced, the air flow can be accelerated, the heat dissipation efficiency in the domain controller mounting cavity 40 can be enhanced, and the temperature of the circuit board 30 can be reduced.
[0035] Please refer to Figure 3 and Figure 4 In some embodiments, the air guide part 111 is sequentially provided with a first ring part 12, a second ring part 13 and a third ring part 14 along the radial direction thereof, and the blades include first-stage blades 15, second-stage blades 16 and third-stage blades 17. The first-stage blades 15 are fixedly installed between the air guide part 111 and the first ring part 12, the second-stage blades 16 are fixedly installed between the first ring part 12 and the second ring part 13, and the third-stage blades 17 are fixedly installed between the second ring part 13 and the third ring part 14. The first ring part 12, the second ring part 13 and the air guide part 111 are located in the same plane.
[0036] The first ring part 12, the second ring part 13 and the air guide part 111 are located in the same plane to facilitate the air gathering part 112 to gather the air entering the domain controller mounting cavity 40, so that the external air is gathered in the central region of the heat dissipation shell 10, thereby forming a central swirling flow to facilitate sufficient heat exchange with the circuit board 30 in the domain controller. The area enclosed by the second ring part 13 forms an air inlet area, and the area between the second ring part 13 and the third ring part 14 forms an air outlet area. The air is sucked through the air inlet area, and the swirling effect of the air inlet area is strong, which can enhance the heat exchange efficiency. The air flow in the mounting cavity is guided to the outside through the air outlet area for heat dissipation. In the present embodiment, the air sucked into the mounting cavity 40 flows from the central air inlet area to the periphery after exchanging heat, and is blown out from the edge of the heat dissipation shell 10 to deliver heat. The multi-stage ring structure and the multi-stage blades can accelerate the air flow speed to some extent, make the heat dissipation more uniform, and effectively improve the heat dissipation efficiency of the domain controller.
[0037] It can be understood that the first ring part 12, the second ring part 13 and the third ring part 14 can be circular, rectangular or other special-shaped rings, which are specifically limited here. For example, in the embodiment, the air guide part 111 is a flat disc-shaped panel, the first ring part 12 and the second ring part 13 are coaxial with the air guide part 111, and the third ring part 14 is rectangular.
[0038] Please refer to Figure 3 The third ring part 14 is provided with a plurality of heat dissipation fins 144, which are located on the side of the air guide part 111 away from the air collecting part 112 and used for active heat dissipation. The heat dissipation fins 144 are located on the outermost layer of the heat dissipation shell 10 and can preferentially contact air to naturally dissipate heat into the air.
[0039] In some embodiments, the third-stage blades 17 are inclined to the plane of the air guide part 111. For example, the angle between the third-stage blades 17 and the plane of the air guide part 111 can be 30 degrees, 60 degrees, 90 degrees, 120 degrees, etc., which are not limited in the embodiment.
[0040] It can be understood that the plurality of heat dissipation fins 144 are protruded from the third ring part 14, the adjacent heat dissipation fins 144 form an air duct, the third-stage blades 17 are inclined to the plane of the air guide part 111 and connected between the second ring part 13 and the third ring part 14, and the gas in the mounting cavity 40 can flow from the second ring part 13 to the third ring part 14 through the third-stage blades 17 and carry away the heat on the heat dissipation fins 144 through the air duct between the heat dissipation fins 144.
[0041] Please refer to Figure 2 and Figure 4 In some embodiments, the second ring part 13 is provided with a plurality of air outlet pipes 131, which are located on the same side of the air guide part 111 as the air collecting part 112, and the plurality of air outlet pipes 131 are used to guide the flowing gas to a designated position. The designated position can be a position where the local heat of the heat dissipation object is larger, for example, in the embodiment, the designated position can be the position where the electronic device is arranged on the circuit board 30, so as to avoid local high temperature of the circuit board 30 and damage caused by excessively high temperature of the internal elements of the domain control.
[0042] Optionally, the air outlet pipe 131 includes a first end and a second end, the distance from the first end to the plane of the air guide part 111 is smaller than the distance from the second end to the plane of the air guide part 111, and the pipe diameter of the air outlet pipe 131 at the first end is smaller than the pipe diameter of the air outlet pipe 131 at the second end. That is, in the embodiment, the air outlet end of the air outlet pipe 131 is in the shape of a circular truncated cone with the pipe diameter gradually increasing along the direction of the airflow, and the flared design of the air outlet pipe 131 can further accelerate the flow rate of the airflow and improve the heat dissipation efficiency of the local larger heat position of the circuit board 30.
[0043] Please refer to Figure 4In some embodiments, the air guide part 111 is provided with a plurality of heat dissipation holes 113, which are located in the closed area enclosed by the air gathering part 112. The heat dissipation holes 113 can be circular, triangular or other polygonal shapes. The design of the heat dissipation holes 113 can facilitate the entry of gas from outside the mounting cavity 40 into the mounting cavity 40 and form a rotational flow in the area enclosed by the air gathering part 112, and also facilitate the dissipation of heat in the mounting cavity 40.
[0044] Further, the side of the air guide part 111 facing the air gathering part 112 is also provided with a boss 114, which is located in the closed area enclosed by the air gathering part 112. The boss 114 is provided with a through hole 115 in the center, and the heat dissipation holes 113 are located between the boss 114 and the air gathering part 112.
[0045] In some embodiments, the boss 114 can be in direct contact with the circuit board 30 to transfer heat from the circuit board 30 to the boss 114. The boss 114 is integrally formed with the heat dissipation shell 10 and is made of a heat conductive material and is in contact with the circuit board 30 to facilitate the transfer of heat from the circuit board 30 to the boss 114. The design of the boss 114 further increases the volume and surface area of the heat dissipation shell 10, improves the heat transfer rate of the circuit board 30 and the heat exchange rate with the gas, and enhances the rotational flow effect, thereby improving the heat dissipation efficiency of the circuit board 30.
[0046] Please refer to Figure 2 and Figure 4 In some embodiments, the positioning part 141 of the third ring part 14 facing the air gathering part 112 is used to connect and position the circuit board 30, ensuring the connection performance of the circuit board 30 with the connection shell 20 and the heat dissipation shell 10.
[0047] Please refer to Figure 3 Optionally, the outer periphery of the third ring part 14 is provided with a mounting part 142 for assembly and fixation with the connection shell 20. The third ring part 14 is provided with a stiffening rib 143 connecting the inner ring and the outer ring of the third ring part 14, which is used to enhance the structural strength of the third ring part 14 and ensure the connection strength of the assembly and connection position of the heat dissipation shell 10 with the connection shell 20.
[0048] The above only describes some embodiments of the present application, and does not limit the protection scope of the present application. Any equivalent device or equivalent process transformation using the contents of the present application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A heat dissipation housing, characterized in that, The device includes an air guiding structure and at least two annular structures disposed around the outer periphery of the air guiding structure. The diameter of each annular structure gradually increases, and each annular structure is fixedly provided with blades extending radially. The air guiding structure includes an air guiding part and an air concentrating part. The air guiding part is in the shape of a planar plate, and the air concentrating part extends from one side of the air guiding part to form an annular protrusion. The air concentrating part can gather the flowing gas and exchange heat with the heat-dissipating component. The air guiding part and the blades can guide the gas flow to carry away the heat.
2. The heat dissipation housing according to claim 1, characterized in that, The air guide section is provided with a first ring section, a second ring section and a third ring section in sequence along its own radial direction. The blade includes a first-stage blade, a second-stage blade and a third-stage blade. The first-stage blade is fixedly installed between the air guide section and the first ring section. The second-stage blade is fixedly installed between the first ring section and the second ring section. The third-stage blade is fixedly installed between the second ring section and the third ring section. The first ring section, the second ring section and the air guide section are located on the same plane.
3. The heat dissipation housing according to claim 2, characterized in that, The third ring protrudes and is provided with several heat dissipation fins, which are located on the side of the air guide section away from the air gathering section for active heat dissipation.
4. The heat dissipation housing according to claim 2 or 3, characterized in that, The second ring is provided with several air outlet pipes, which are located on the same side of the air guide section as the air gathering section. The several air outlet pipes are used to guide the flowing gas to a set position.
5. The heat dissipation housing according to claim 4, characterized in that, The air outlet duct includes a first end and a second end. The distance from the first end to the plane where the air guide is located is less than the distance from the second end to the plane where the air guide is located. The diameter of the air outlet duct at the first end is less than the diameter of the air outlet duct at the second end.
6. The heat dissipation housing according to claim 2 or 3, characterized in that, The third-stage blade is inclined to the plane of the air guide section.
7. The heat dissipation housing according to any one of claims 1 to 3, characterized in that, The air guide section has several heat dissipation holes, which are located within the closed area enclosed by the annular air gathering section.
8. The heat dissipation housing according to claim 7, characterized in that, The air guide section is also provided with a protrusion on the side facing the air gathering section. The protrusion is located in the closed area formed by the annular air gathering section. The center of the protrusion is provided with a through hole, and the heat dissipation hole is located between the protrusion and the air gathering section.
9. The heat dissipation housing according to claim 2, characterized in that, The third ring faces the positioning part of the air-gathering part, and the positioning part is used to connect the circuit board and position the circuit board.
10. A domain controller, characterized in that, It includes a connecting housing, a circuit board, and a heat dissipation housing as described in any one of claims 1 to 9, wherein the circuit board is disposed between the connecting housing and the heat dissipation housing, and the air-collecting portion of the heat dissipation housing faces the circuit board.