Light-emitting diode lead frame with heat dissipation function
By designing a lead frame with heat dissipation function, the problems of insufficient heat dissipation efficiency and unstable bracket positioning of the piranha LED were solved, achieving efficient heat dissipation and stable potting of the LED, and extending the LED's service life.
Patent Information
- Application Number
- CN202422184830.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-09-06
AI Technical Summary
Piranha LEDs have high luminous intensity, but insufficient heat dissipation efficiency, which affects the LED's performance and lifespan. Heat dissipation is even more difficult when multiple LEDs are assembled into modules, and the bracket needs to be stably positioned during the production process to maintain the stability of the potting.
A light-emitting diode lead frame with heat dissipation function was designed, including components such as a thermally conductive positioning copper plate frame, a positioning bracket, a positioning connecting post, electrode pins, a chip bracket, an encapsulation block, and an ultra-thin heat pipe. Through the combination of these components, effective heat dissipation and stable positioning of the bracket are achieved.
It improves the heat dissipation performance of LEDs, extends their service life, and maintains the stability of the bracket during the production process, ensuring the stability of the potting.
Smart Images
Figure CN223568008U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a light emitting diode technical field, specifically relates to a light emitting diode lead frame with heat dissipation function. BACKGROUND
[0002] Light emitting diode (LED) has low operating voltage, small power consumption, high luminous efficiency, short reaction time, pure light color, firm structure, impact resistance, vibration resistance, stable and reliable performance, light weight, small size and low cost etc. With the progress of technology, the brightness level of LED can be exhibited higher and higher, and its application field is also more and more widely, such as: large area graphic display full color screen, state indication, sign lighting, signal display, backlight source of liquid crystal display or in-car lighting.
[0003] The piranha LED is a kind of packaged, square, transparent resin package, with four pins, a missing pin at the negative electrode, and the piranha LED belongs to a kind of light scattering LED, with a light emitting angle of more than 120 degrees and a high light intensity, and can withstand greater power. The piranha LED is often used in car brake lights and turn signals. During production, the piranha LED holder is first selected, the holder is cleaned, the LED wafer is fixed in the holder bowl, the shape, size and depth of the bowl in the holder are determined, and then the holder is dried. After drying, the two poles of the LED chip are welded, and then the corresponding mold is selected according to the number of chips and the size of the light emitting angle. The piranha holder with welded LED chip is inserted into the mold filled with glue. Put it into the oven to dry, demold, and then cut it off on the cutting film. Then test and sort it.
[0004] Due to the high light intensity of the piranha LED, when the heat dissipation efficiency of the LED structure is insufficient, the efficiency and service life of the LED are easily affected, especially when multiple LEDs are assembled into a light emitting diode module, it is more difficult to dissipate heat, and during the production of the piranha LED, the holder of the piranha LED needs to be positioned and fixed to maintain the stability of the holder during glue filling. Therefore, we propose a light emitting diode lead frame with heat dissipation function. CONTENT OF THE UTILITY MODEL
[0005] The utility model aims at: for solving because the piranha LED's lamp pearl light intensity is high, when the heat dissipation efficiency of the LED structure is insufficient, the efficiency and service life of the LED are easily affected, especially when multiple LEDs are assembled into a light emitting diode module, it is more difficult to dissipate heat, and during the production of the piranha LED, the holder of the piranha LED needs to be positioned and fixed to maintain the stability of the holder during glue filling. Therefore, we propose a light emitting diode lead frame with heat dissipation function.
[0006] The utility model discloses in order to realize above-mentioned purpose specifically adopts the following technical scheme:
[0007] The utility model provides a light emitting diode lead frame with heat dissipation function, including chip support, the bottom fixed connection of chip support has the heat conduction positioning copper plate frame, and the both sides front -back mirror symmetry fixed connection of heat conduction positioning copper plate frame has the positioning support, the outer interface of positioning support fixedly connected has the positioning connecting post, and the upper end of positioning connecting post is connected with a plurality of electrode pins, the chip support, chip fixed slot and heat conduction positioning copper plate frame outer moulding has the encapsulation rubber block, the both ends of heat conduction positioning copper plate frame are folded down, and the both sides bottom fixed connection of heat conduction positioning copper plate frame has the heat dissipation bottom plate, the bottom of heat dissipation bottom plate is flush with the bottom of encapsulation rubber block.
[0008] Further, the positioning connecting post is a transparent cylinder of acrylic material, and both ends of the positioning connecting post are provided with fixed plugs.
[0009] Further, the middle part of the chip support is stamped to form a chip fixing groove, and the upper end of the heat conduction positioning copper plate frame is provided with a corresponding butt joint hemispherical groove, and the inner wall of the butt joint hemispherical groove abuts against the bottom of the chip fixing groove.
[0010] Further, a plurality of fixed clamps are uniformly welded and fixed to the upper side of the heat conduction positioning copper plate frame corresponding to the edges of the chip support, and the upper ends of the fixed clamps are bent towards the center of the chip support.
[0011] Further, the bottom of the encapsulation rubber block is provided with an empty gap.
[0012] Further, the bottoms of the plurality of encapsulation rubber blocks are provided with aligned empty gaps, and a super-thin heat pipe is clamped in the aligned empty gaps, and the upper end of the super-thin heat pipe abuts against the bottom surface of the heat dissipation bottom plate.
[0013] The utility model discloses the beneficial effects are as follows:
[0014] 1. The utility model discloses a heat conduction positioning copper plate frame, which is fixedly connected with the chip support, and the chip support is positioned with the upper end center of the heat conduction positioning copper plate frame. A plurality of positioning supports and positioning connecting posts are arranged to position and fix the electrode pins on both sides. Then, the diode chip on the chip support is electrically connected with the plurality of electrode pins through gold wires, ensuring the stability of the position of the diode chip and the plurality of electrode pins during glue pouring. The heat conduction positioning copper plate frame can conduct the large amount of heat generated by the plurality of diode chips on the chip support through the heat dissipation bottom plate at the bottom, facilitating heat dissipation during the operation of the light emitting diode, improving the heat dissipation performance of the light emitting diode, and prolonging the service life of the light emitting diode.
[0015] 2. The utility model discloses a chip fixing groove is set up, and the light emitting diode is fixed in the chip fixing groove, and fills the fluorescent material, and the docking hemispherical groove can be pasted the chip support bottom chip fixing groove punch -out spherical surface, the heat on the chip support is exported fast, and when the chip support is connected with the heat conduction positioning copper plate frame docking, plays the effect of limiting and fixing.
[0016] 3. The utility model discloses an overhead gap is set up, and the overhead gap can overhead heat dissipation base plate, guarantees the air circulation of bottom after the installation of encapsulation rubber block, avoids the heat dissipation base plate heat dissipation of PCB board blocking, sets up the ultra -thin heat pipe, and the ultra -thin heat pipe can assist encapsulation rubber block heat dissipation, can press tightly fixed heat dissipation fin in the both ends of ultra -thin heat pipe, guarantees the quick heat dissipation of multiple encapsulation rubber blocks, improves the heat dissipation effect of multiple light emitting diodes parallel installation after greatly. DRAWINGS
[0017] Figure 1 It is the perspective drawing of the utility model;
[0018] Figure 2 It is the front cut -away view of the utility model;
[0019] Figure 3 It is the finished product light emitting diode after molding of the utility model fills glue stereo graph.
[0020] Signs: 1, chip support;2, electrode pin;3, chip fixing groove;4, heat conduction positioning copper plate frame;5, fixed clamping jaw;6, heat dissipation base plate;7, docking hemispherical groove;8, encapsulation rubber block;9, overhead gap;10, positioning support;11, positioning connecting column;12, ultra -thin heat pipe. SPECIFIC IMPLEMENTATION
[0021] In order to make the purpose, technical scheme and advantage of the utility model embodiment more clear, below will combine the drawing in the utility model embodiment, clear, complete technical scheme in the utility model embodiment is described.
[0022] Please refer to Figure 1 Figure 3 The utility model provides a kind of light emitting diode lead frame with heat dissipation function, including chip support 1, the bottom of chip support 1 is fixedly connected with heat conduction positioning copper plate frame 4, and heat conduction positioning copper plate frame 4 is fixedly connected with positioning support 10 on both sides front and back mirror image symmetry, positioning support 10 is inserted and fixed with positioning connecting column 11 outside, and the upper end of positioning connecting column 11 is sleeved and fixed with multiple electrode pins 2, chip support 1, chip fixing groove 3 and heat conduction positioning copper plate frame 4 are molded with encapsulation rubber block 8 outside, the both ends of heat conduction positioning copper plate frame 4 are bent downward, and heat conduction positioning copper plate frame 4 is fixedly connected with heat dissipation base plate 6 on both sides bottom, and the bottom of heat dissipation base plate 6 is flush with the bottom of encapsulation rubber block 8.
[0023] In the embodiment, preferably, the positioning connecting column 11 is a transparent cylinder made of acrylic material, and both ends of the positioning connecting column 11 are provided with fixed plugs; the transparent acrylic material is arranged to ensure the insulation between the electrode pin 2 and the heat-conducting positioning copper plate frame 4 while the positioning connecting column 11 connects the electrode pin 2, and the transparent acrylic material does not affect the propagation of light.
[0024] In the embodiment, preferably, the middle part of the chip support 1 is stamped and formed with a chip fixing groove 3, and the upper end of the heat-conducting positioning copper plate frame 4 is provided with a butt joint hemispherical groove 7 corresponding to the chip fixing groove 3, and the inner wall of the butt joint hemispherical groove 7 abuts against the bottom of the chip fixing groove 3; the chip fixing groove 3 is arranged to fix the light-emitting diode in the chip fixing groove 3 and fill the fluorescent material, and the butt joint hemispherical groove 7 is arranged to match the spherical surface stamped out by the chip fixing groove 3 at the bottom of the chip support 1, so as to quickly conduct heat away from the chip support 1 and play a limiting and fixing effect when the chip support 1 is connected to the heat-conducting positioning copper plate frame 4.
[0025] In the embodiment, preferably, a plurality of fixed clamping jaws 5 are uniformly welded and fixed on the upper side of the heat-conducting positioning copper plate frame 4 corresponding to the edges of the chip support 1, and the upper ends of the plurality of fixed clamping jaws 5 are bent towards the center of the chip support 1; the plurality of fixed clamping jaws 5 are arranged to clamp and fix the edges of the chip support 1, so as to facilitate the connection and fixation of the chip support 1 and the heat-conducting positioning copper plate frame 4.
[0026] In the embodiment, preferably, the bottom of the packaging glue block 8 is provided with an empty gap 9; the empty gap 9 is arranged to empty the heat dissipation bottom plate 6, so as to ensure the air circulation at the bottom after the packaging glue block 8 is installed, and avoid the blocking of the heat dissipation bottom plate 6 by the PCB.
[0027] In the embodiment, preferably, the bottom empty gaps 9 of the plurality of packaging glue blocks 8 are arranged in alignment, and a super-thin heat pipe 12 is clamped in the aligned plurality of empty gaps 9, and the upper end of the super-thin heat pipe 12 abuts against the bottom surface of the heat dissipation bottom plate 6; the super-thin heat pipe 12 is arranged to assist the heat dissipation of the packaging glue block 8, and the heat dissipation fins are tightly fixed at both ends of the super-thin heat pipe 12, so as to ensure the rapid heat dissipation of the plurality of packaging glue blocks 8 and greatly improve the heat dissipation effect after the plurality of light-emitting diodes are installed in parallel.
[0028] The working principle and use flow of the utility model: when the device is used, through the heat conduction positioning copper plate frame 4 set, the heat conduction positioning copper plate frame 4 is fixed with the chip support 1, the position of the chip support 1 is positioned with the upper end center of the heat conduction positioning copper plate frame 4, through the multiple positioning supports 10 and the positioning connecting column 11 set, the electrode pin 2 on both sides is positioned and connected and fixed, then the diode chip on the chip support 1 is electrically connected with the multiple electrode pins 2 through the gold wire, the position stability of the diode chip and the multiple electrode pins 2 is guaranteed when pouring the glue, the heat conduction positioning copper plate frame 4 exports the large amount of heat of the multiple diode chips on the chip support 1 through the heat dissipation bottom plate 6 at the bottom, the heat dissipation of the light emitting diode when working is convenient, the heat dissipation performance of the light emitting diode is improved, and the service life of the light emitting diode is improved.
[0029] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments without departing from the spirit or scope of the utility model. Therefore, the utility model will not be limited to these embodiments shown herein, but will accord with the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A lead frame with heat dissipation function for light emitting diode, characterized in that: The utility model provides chip support (1), the bottom fixed connection of chip support (1) has heat conduction positioning copper plate frame (4), and both sides of heat conduction positioning copper plate frame (4) are fixedly connected with positioning support (10) and mirror symmetry, the outer interface of positioning support (10) fixedly connected with positioning connecting post (11), and the upper end of positioning connecting post (11) is sleeved with a plurality of electrode pins (2) and is fixed, chip support (1), chip fixed groove (3) and heat conduction positioning copper plate frame (4) are molded with encapsulation rubber block (8) outside, both ends of heat conduction positioning copper plate frame (4) are folded downward, and the bottom of both sides of heat conduction positioning copper plate frame (4) is fixedly connected with heat dissipation bottom plate (6), and the bottom of heat dissipation bottom plate (6) is flush with the bottom of encapsulation rubber block (8).
2. The LED leadframe with heat dissipation function according to claim 1, wherein: The positioning connecting post (11) is a transparent cylinder made of acrylic material, and both ends of the positioning connecting post (11) are provided with fixed plugs.
3. The LED leadframe with heat dissipation function according to claim 1, wherein: The middle part of the chip support (1) is punched to form a chip fixed groove (3), and the upper end of the heat conduction positioning copper plate frame (4) is provided with a corresponding butt joint hemispherical groove (7) corresponding to the chip fixed groove (3), and the inner wall of the butt joint hemispherical groove (7) is in abutment with the bottom of the chip fixed groove (3).
4. The LED leadframe with heat dissipation function according to claim 1, wherein: The upper side of the heat conduction positioning copper plate frame (4) is uniformly welded with a plurality of fixed clamping jaws (5) corresponding to the edges of the chip support (1), and the upper ends of the plurality of fixed clamping jaws (5) are bent towards the center of the chip support (1).
5. The LED leadframe with heat dissipation function according to claim 1, wherein: The bottom of the encapsulation rubber block (8) is provided with an overhead gap (9).
6. The LED leadframe with heat dissipation function according to claim 5, wherein: The bottoms of the plurality of encapsulation rubber blocks (8) are provided with overhead gaps (9) in alignment, and a super-thin heat pipe (12) is inserted into the aligned overhead gaps (9), and the upper end of the super-thin heat pipe (12) is in abutment with the bottom surface of the heat dissipation bottom plate (6).