Protective device and chemical mechanical polishing system

Abstract

The utility model discloses a protective device and a chemical mechanical polishing system, the protective device is used for protecting a polishing disk in the chemical mechanical polishing system, and the protective device comprises an annular main body piece and is positioned on the peripheral side of the polishing disk; the main body part comprises an accommodating cavity which is arranged in the main body part and is used for storing liquid; the liquid outlet is formed in the inner side of the main body piece and communicates with the containing cavity; and liquid in the accommodating cavity flows to the inner side wall of the main body piece through the liquid outlet, so that the inner side wall of the main body piece is moisturized.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of semiconductor manufacturing, and in particular, to a protection device and a chemical mechanical polishing system. BACKGROUND

[0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digitalization and intelligence. Chips are the carriers of integrated circuits, and chip manufacturing involves integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, cutting and packaging, and testing processes. Among them, chemical mechanical polishing is one of the five core processes in the wafer manufacturing process.

[0003] Chemical mechanical polishing (CMP) is a global planarization ultra-precision surface processing technology. Chemical mechanical polishing usually attracts the wafer to the bottom surface of the carrier head, the side of the wafer with the deposited layer abuts against the upper surface of the polishing pad, and the carrier head rotates with the polishing pad under the actuation of the drive assembly and gives the wafer a downward load; the polishing liquid is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, so that the wafer completes the chemical mechanical polishing of the wafer under the joint action of chemical and mechanical.

[0004] During the polishing process, the polishing disc rotates at a certain speed, and the polishing waste liquid and cleaning water on the surface of the polishing pad will be thrown outward under the action of centrifugal force. In order to control the influence of the polishing waste liquid on the polishing unit, an annular retaining ring is usually arranged on the outer periphery of the polishing disc to block the thrown liquid to some extent.

[0005] Although most of the waste liquid splashed towards the retaining ring is discharged with the cleaning water, a small part of the polishing waste liquid remains on the inner side wall of the retaining ring; this small part of the polishing waste liquid will adhere to the inner side wall of the retaining ring to form crystals, and these crystals will fall on the surface of the polishing pad during the up and down movement of the retaining ring due to external vibration. The crystals falling on the surface of the polishing pad will bring the risk of wafer scratches, thereby affecting the yield of wafer manufacturing.

[0006] In order to ensure the reliable operation of the chemical mechanical polishing system, the inner side wall of the retaining ring needs to be cleaned regularly by manual operation. However, due to the limited operation space inside the polishing unit, this will affect the efficiency of cleaning the retaining ring, and thus affect the operation time of the CMP system. UTILITY MODEL CONTENT

[0007] Therefore, embodiments of the present application provide a protection device and a chemical mechanical polishing system to at least partially solve the above problems.

[0008] According to a first aspect of the embodiments of the present application, a protective device is provided for protecting a polishing disc in a chemical mechanical polishing system, which comprises a ring-shaped main body located at the outer periphery of the polishing disc, wherein the main body comprises:

[0009] a receiving cavity arranged inside the main body for buffering liquid;

[0010] a liquid outlet arranged on the inner side of the main body and in communication with the receiving cavity;

[0011] The liquid in the receiving cavity flows to the inner sidewall of the main body through the liquid outlet, so as to realize the moisturizing of the inner sidewall of the main body.

[0012] In some embodiments, the liquid outlet is arranged on the top and / or the upper edge of the inner side of the main body, so that the liquid flowing out of the liquid outlet covers the splash area of the polishing waste liquid thrown out by the polishing disc.

[0013] In some embodiments, the number of liquid outlets is multiple, which are arranged at intervals along the circumference of the main body.

[0014] In some embodiments, the top surface of the main body is arranged to be inclined towards the inner side.

[0015] In some embodiments, the upper edge of the inner side of the main body is transitioned by a circular arc, so that the liquid flowing out of the liquid outlet flows to the inner sidewall of the main body through the upper edge of the inner side.

[0016] In some embodiments, the top surface of the main body is configured with a ring-shaped opening towards the inner side, and the liquid flowing out of the liquid outlet flows to the inner sidewall of the main body through the ring-shaped opening.

[0017] In some embodiments, the liquid outlet on the top of the main body is arranged to be inclined upwards and inwards.

[0018] In some embodiments, the liquid outlet on the top of the main body is arranged vertically upwards, and the liquid outlet is located at the corner of the ring-shaped opening.

[0019] In some embodiments, the liquid outlet on the upper edge of the inner side of the main body is arranged to be inclined upwards and inwards.

[0020] In some embodiments, the protective device further comprises an outer cover plate arranged in matching with the main body to form the receiving cavity, and the outer cover plate is configured with a liquid inlet in communication with an external liquid source to deliver liquid to the receiving cavity.

[0021] In some embodiments, the main body is configured with a ring-shaped groove, and the outer cover plate is arranged outside the ring-shaped groove to form the receiving cavity.

[0022] In some embodiments, the setting height of the liquid inlet is less than or equal to the height of the liquid outlet.

[0023] In some embodiments, the main body is made of homopolypropylene, polyphenylene sulfide or polyether ether ketone.

[0024] In some embodiments, the surface roughness Ra value of the inner side wall of the main body is greater than or equal to 6.3 microns.

[0025] According to the second aspect of the embodiments of the present application, a chemical mechanical polishing system is provided, characterized in that it comprises a polishing disc, a carrier head, a liquid supply device and a dressing device, the carrier head presses the wafer to be polished against the polishing pad above the polishing disc, the liquid supply device supplies the polishing liquid towards the polishing pad and the wafer, and the dressing device is used to dress the surface of the polishing pad; it further comprises the protective device described above to realize the moisturizing of the inner side wall of the main body and prevent the formation of crystals on the inner side wall of the main body.

[0026] The beneficial effects of the present application include:

[0027] a. The protective device provided is configured with a main body having a containing cavity, and the liquid in the containing cavity flows to the inner side wall of the main body through the overflow of the liquid outlet. This moisturizing method is relatively gentle to avoid the movement of pollutants on the inner side wall of the main body towards the direction of the polishing disc, thereby preventing the back-and-forth movement of pollutants between the polishing disc and the main body and increasing the cleaning cost;

[0028] b. The protective device is configured with an outer cover plate, which is detachably arranged on the outer circumferential side of the main body, and the outer cover plate is configured with a liquid inlet to temporarily store liquid in the containing cavity. The setting height of the liquid inlet is less than or equal to the height of the liquid outlet, so that the liquid stored in the containing cavity flows out of the inner side wall of the main body through the overflow of the liquid outlet, thereby forming a relatively complete water film on the inner side wall of the main body, thereby achieving good moisturizing effect;

[0029] c. The number of liquid outlets is multiple, which are arranged at intervals along the circumference of the main body, so that the liquid overflowing from the liquid outlet can cover the entire area of the main body, thereby avoiding the formation of crystals by the residual polishing pollutants on the inner side wall of the main body;

[0030] d. The liquid outlet is arranged on the inner side upper edge of the main body, and the liquid outlet is arranged upward and inward at an inclination. The liquid in the containing cavity is discharged outward through the inclined liquid outlet, and the liquid needs to overcome a certain resistance to be discharged from the liquid outlet. This reduces the speed of the liquid to some extent, avoids the reverse spraying of the liquid flowing out of the liquid outlet towards the polishing disc, and is conducive to the formation of a water film on the inner side wall of the main body to achieve good moisturizing;

[0031] e. The liquid outlet is arranged at the top of the main body, and the liquid in the containing cavity flows out through the liquid outlet, thereby covering the splash area of the polishing waste liquid centrifugally thrown by the polishing disc, so as to prevent the inside wall of the main body from forming crystals;

[0032] f. The upper edge of the inside wall of the main body is circularly arc-shaped, so that the liquid flowing out of the liquid outlet flows to the inside wall of the main body through the upper edge of the inside wall, so as to control the influence of the edge structure of the main body on the movement of the fluid and prevent the newly-inflowing liquid from damaging the formed liquid film;

[0033] g. The liquid outlet is a long-hole, which is arranged along the circumference of the main body; the liquid in the containing cavity slowly overflows through the liquid outlet, so as to form a complete water film on the inside wall of the main body;

[0034] h. The top surface of the main body is provided with an annular opening facing the inside wall, and the liquid outlet is arranged at the corner of the annular opening; the liquid flowing out of the liquid outlet flows to the inside wall of the main body through the annular opening, and at the same time, the overflowing liquid can moisturize the side wall of the annular opening, thereby preventing polishing contaminants from forming crystals at the area. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments described in the embodiments of the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0036] Figure 1 is a longitudinal sectional view of a protective device provided by an embodiment of the present application;

[0037] Figure 2 is a partial schematic view of a protective device provided by an embodiment of the present application;

[0038] Figure 3 is a schematic view of the upper edge of the inside wall of the main body being provided with an inclined liquid outlet provided by an embodiment of the present application;

[0039] Figure 4 is a schematic view of the top of the main body being provided with a vertical liquid outlet provided by an embodiment of the present application;

[0040] Figure 5 is a schematic view of the top of the main body being provided with an annular opening provided by an embodiment of the present application;

[0041] Figure 6 is a schematic view of the top of the main body being provided with an inclined and vertical liquid outlet provided by an embodiment of the present application;

[0042] Figure 7is a schematic view of the top of the main body piece provided by an embodiment of the utility model, which is provided with an inclined liquid outlet;

[0043] Figure 8 is a schematic view of the protective device provided by another embodiment of the utility model;

[0044] Figure 9 is a schematic view of the chemical mechanical polishing system provided by an embodiment of the utility model. DETAILED DESCRIPTION

[0045] In order to make the personnel in the art better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art should belong to the scope of protection of the embodiments of the present application.

[0046] The terms used in the present application are merely for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein means and includes any or all possible combinations of one or more associated listed items.

[0047] It should be understood that although the terms "first", "second", "third" and the like may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information without departing from the scope of the present application. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0048] Figure 1 is a longitudinal sectional view of the protective device 100 provided by an embodiment of the utility model, and the protective device 100 is used for Figure 9 The protective device 100 is shown in the chemical mechanical polishing system 1000. Specifically, the protective device 100 includes a main body piece 10, which is an annular structure and is arranged on the outer periphery of the polishing disc to block the polishing waste liquid centrifugally thrown from the upper side of the polishing disc 200 and inhibit the polishing waste liquid from spreading outward to pollute other areas.

[0049] Specifically, the polishing pad is arranged on the upper side of the polishing disc, the polishing liquid is supplied between the wafer and the polishing pad, and the wafer pressed against the surface of the polishing pad is subjected to chemical and mechanical polishing to remove the material on the surface of the wafer; after polishing, deionized water (DIW) is supplied to the surface of the polishing pad to clean the pollutants remaining on the surface of the polishing pad; the pollutants and the deionized water will be thrown to the inner side wall of the main body 10 under the action of centrifugal force and guided to the waste liquid discharge port under the action of gravity.

[0050] Generally, the deionized water will flush the inner side wall of the main body 10, thereby removing most of the polishing pollutants; however, a small part of the pollutants are not removed in time and form crystals. If the crystals formed on the inner side wall of the main body 10 fall on the surface of the polishing pad, the polished wafer may be scratched by the crystals, thereby reducing the yield of the wafer.

[0051] To solve the above problems, the protective device 100 provided by the utility model not only has the function of blocking the polishing waste liquid, but also has the function of moisturizing, so that the inner side wall of the main body 10 is always in a wet state, thereby preventing the pollutants from drying and crystallizing on the inner side wall of the main body 10.

[0052] Specifically, Figure 1 The main body 10 shown includes:

[0053] The accommodating cavity 11 is arranged in the interior of the main body 10 and is used for buffering the liquid;

[0054] The liquid outlet 12 is arranged on the inner side of the main body 10, and the liquid outlet 12 is in communication with the accommodating cavity 11; specifically, the liquid outlet 12 extends from the inner side wall of the accommodating cavity 11 to the inner side wall of the main body 10; the liquid in the accommodating cavity 11 flows to the inner side wall of the main body 10 through the liquid outlet 12, so as to realize the moisturizing of the inner side wall of the main body 10.

[0055] It should be noted that in the utility model, in the longitudinal section view of the main body 10, the "inner side" and the "outer side" are relative to the polishing disc; the side of the main body 10 close to the polishing disc is called the "inner side", and the side of the main body 10 away from the polishing disc is called the "outer side".

[0056] The moisturizing method of the inner side wall of the main body 10 provided by the utility model is relatively soft. Specifically, the liquid used for moisturizing is stored in the accommodating cavity 11, and the liquid is continuously supplied to the accommodating cavity 11; when the liquid level of the accommodating cavity 11 is higher than the liquid outlet 12, the liquid will overflow from the liquid outlet 12 under the action of gravity, so that the liquid wets the inner side wall of the main body 10, thereby realizing the moisturizing of the inner side wall of the main body 10.

[0057] Compared with the traditional spraying moisturizing mode, the above-mentioned moisturizing mode is relatively gentle to avoid the movement of the contaminants on the inner side wall of the main body 10 towards the direction where the polishing disc is located, thereby preventing the contaminants from moving back and forth between the polishing disc and the main body 10 to increase the cleaning cost.

[0058] It should be noted that the liquid stored in the accommodating cavity 11 can be deionized water (DIW) and / or cleaning liquid with cleaning effect, etc., so as to maintain the cleaning of the inner side wall of the main body 10 while moisturizing.

[0059] Figure 1 In the illustrated embodiment, the protection device 100 further comprises an outer cover plate 20 which is arranged in matching with the main body 10 to form the accommodating cavity 11.

[0060] Further, the outer cover plate 20 is configured with a liquid inlet 21 which is in communication with an external liquid source (not shown) to continuously deliver the liquid into the accommodating cavity 11 at a certain pressure and flow rate.

[0061] Further, the main body 10 is configured with Figure 2 The annular groove 11a is shown, and the outer cover plate 20 is covered on the outer side of the annular groove 11a to form the accommodating cavity 11.

[0062] In some embodiments, the setting height of the liquid inlet 21 is less than or equal to the height of the liquid outlet 12, so that the liquid stored in the accommodating cavity 11 flows out of the liquid outlet 21 to the inner side wall of the main body 10, thereby forming a relatively complete water film on the inner side wall of the main body 10, thereby achieving good moisturizing effect.

[0063] Figure 1 In the illustrated embodiment, if the height of the liquid outlet 12 is greater than the height of the liquid inlet 21, the liquid can directly flow from the liquid inlet 21 to the liquid outlet 12, so that the liquid flowing out of the liquid outlet 12 has a certain speed, which is not conducive to forming a water film on the inner side wall of the main body 10, and at the same time, the polishing contaminants on the inner side wall of the main body 10 can be pushed to the position where the polishing disc is located to form a secondary pollution problem.

[0064] Figure 2 It is a partial schematic view of the protection device 100 provided by an embodiment of the utility model, and the number of liquid outlets 12 is multiple, which are arranged at intervals along the circumference of the main body 10, so that the liquid overflowing from the liquid outlet 12 can cover the entire area of the main body 10, thereby avoiding the polishing contaminants remaining on the inner side wall of the main body 10 to form crystals.

[0065] It can be understood that the distance between adjacent liquid outlets 12 can be 3-10 mm, so that the overflowing liquid can cover the inner side wall of the main body 10.

[0066] Figure 1 andFigure 2 In the embodiment shown, the liquid outlet 12 is arranged on the inner upper edge of the main body 10, i.e. the liquid outlet 12 is located on the inner side of the main body 10 and close to the top of the main body 10, so that the liquid overflowing from the liquid outlet 12 covers the inner side wall of the main body 10 as much as possible, so that the liquid flowing out of the liquid outlet 12 covers the splash area of the polishing waste liquid centrifugally thrown out by the polishing disc.

[0067] It should be noted that the main body 10 of the protection device 100 can move vertically, as shown in Figure 9 As shown, the protection device 100 can move up and down in the vertical direction to cooperate with the interaction of the carrier head and the load cup, and to prevent the uncontrolled throwing out of the polishing waste liquid. The interaction process of the carrier head and the load cup can be referred to the description in patent CN113118965A.

[0068] Specifically, when the carrier head moves between the polishing disc and the loading table, the main body 10 needs to move towards the lower side to avoid interference with the movement of the carrier head; at this time, the CMP system does not perform polishing work and will not produce polishing waste liquid.

[0069] When the carrier head loads the wafer from the load cup and moves above the polishing disc, the main body 10 moves towards the upper side so that the main body 10 blocks the centrifugally thrown polishing waste liquid and prevents the polishing waste liquid from polluting other areas of the polishing unit. It should be noted that the top of the main body 10 moving to the upper side needs to be higher than the horizontal plane of the polishing pad on the upper side of the polishing disc, so that the polishing waste liquid is thrown to the upper middle area of the main body 10. Therefore, the liquid outlet 12 is arranged on the inner upper edge of the main body 10, so that the upper middle area of the main body 10 is always in a moisturizing state, thereby avoiding the formation of crystallization of the polishing waste liquid on the inner side wall of the main body 10 and causing wafer scratch defects.

[0070] Figure 3 is Figure 1 Variation of the embodiment shown, in which the liquid outlet 12 is located on the inner upper edge of the main body 10, and the liquid outlet 12 is arranged upwardly and inwardly inclined.

[0071] In this way, the liquid in the containing cavity 11 is discharged outwardly through the inclined liquid outlet 12; since the liquid outlet 12 is arranged inclinedly, the liquid needs to overcome a certain resistance to be discharged from the liquid outlet 12, which reduces the speed of the liquid to some extent, avoids the liquid flowing out of the liquid outlet 12 from being sprayed in the opposite direction towards the polishing disc, and thereby facilitates the formation of a water film on the inner side wall of the main body 10 to achieve good moisturizing.

[0072] In some embodiments, the angle between the liquid outlet 12 and the horizontal plane is 20-80°; preferably, the angle between the liquid outlet 12 and the horizontal plane is 45-60°, so as to form a complete water film on the inner side wall of the main body 10, preventing the crystallization of polishing contaminants on the inner side wall of the main body 10.

[0073] As an embodiment of the present application, the liquid outlet 12 can also be a long hole, which is arranged along the circumference of the main body 10. That is, the number of liquid outlets 12 is one, and the liquid in the containing cavity 11 slowly overflows through the liquid outlet 12, so as to form a complete water film on the inner side wall of the main body 10, thereby achieving the moisturizing of the inner side wall of the main body 10 and avoiding the crystallization of polishing contaminants. That is, one long strip-shaped liquid outlet 12 is arranged on the inner side upper edge of the main body 10, which can avoid the problem that adjacent liquid outlets 12 are not covered with liquid in the scheme of arranging multiple liquid outlets 12, thereby improving the moisturizing effect of the protection device.

[0074] It can be understood that the number of long hole liquid outlets 12 can be multiple, such as 2, 3, etc., and the liquid outlets 12 are arranged at intervals, or the liquid outlets 12 are arranged at intervals in the height direction of the main body 10, and the liquid outlets 12 have a certain intersection along the circumferential direction of the main body 10, thereby ensuring that the inner side wall of the main body 10 forms a complete water film.

[0075] Figure 4 is a longitudinal sectional view of the protection device 100 provided by an embodiment of the present application, in which the liquid outlet 12 is arranged on the top of the main body 10, and the liquid in the containing cavity 11 flows out through the liquid outlet 12, thereby covering the splashing area of the polishing waste liquid thrown out by the polishing disc, so as to prevent the crystallization of the inner side wall of the main body 10.

[0076] Figure 4 In the embodiment, the top surface of the main body 10 is arranged to be inclined towards the inner side, so that the liquid overflowing through the liquid outlet 12 can flow along the inclined top surface to the inner side wall of the main body 10, avoiding the accumulation of liquid on the top surface of the main body 10. If too much liquid accumulates on the top surface of the main body 10, it will quickly move towards the inner side wall of the main body 10, which will destroy the water film formed on the inner side wall, and is not conducive to achieving good moisturizing effect.

[0077] In some embodiments, the inclination angle between the top surface of the main body 10 and the horizontal plane is 10-40°, preferably, the inclination angle between the top surface of the main body 10 and the horizontal plane is 30°, so as to appropriately control the flow rate of the liquid on the top surface of the main body 10, so that the inner side wall of the main body 10 quickly forms a complete liquid film.

[0078] In the present application, the inner side upper edge of the main body 10 is transitioned by an arc, such as Figure 4As shown, the liquid flowing out of the liquid outlet 12 flows to the inner side wall of the main body 10 via the upper inner side edge, so as to control the influence of the corner structure of the main body 10 on the fluid movement, and avoid the destruction of the liquid film formed by the newly-inflowing liquid on the inner side wall of the main body 10.

[0079] Figure 5 The utility model discloses a longitudinal section view of the protection device 100, and in the embodiment, the top surface of the main body 10 is provided with an annular opening 13 facing the inner side, and the liquid flowing out of the liquid outlet 12 flows to the inner side wall of the main body 10 via the annular opening 13.

[0080] The annular opening 13 is arranged on the side of the main body 10 close to the inner side wall, and is arranged along the top surface of the main body 10 in a ring shape, so as to provide a place for the overflow of the liquid from the liquid outlet 12.

[0081] Further, the depth of the annular opening 13 is 0.5-3mm, and the depth of the annular opening 13 is the distance between the top surface of the main body 10 and the bottom surface of the annular opening 13.

[0082] Figure 5 In the embodiment shown, the liquid outlet 12 is arranged vertically upward, and the liquid outlet 12 is located at the corner of the annular opening 13. In this way, the overflow of the liquid from the liquid outlet 12 can wash the side wall of the annular opening 13, thereby realizing the moisturizing of the side wall of the annular opening 13 and preventing crystallization of the side wall of the annular opening 13.

[0083] As a variant of the embodiment, the bottom surface of the annular opening 13 can also be arranged to extend downwardly and inwardly, as shown in Figure 6 so as to facilitate the overflow of the liquid to the inner side wall of the main body 10.

[0084] In the utility model, the liquid outlet 12 arranged on the top of the main body 10 can also be arranged to incline upwardly and inwardly, as shown in Figure 7 so that the liquid in the accommodating cavity 11 can smoothly flow to the inner side wall of the main body 10 via the inclined liquid outlet 12.

[0085] In the embodiment shown, Figures 4-7 the liquid outlet 12 is arranged on the top of the main body 10, and the overflow of the liquid from the liquid outlet 12 flows along the inner side wall of the main body 10 from top to bottom to form a liquid film. In order to facilitate the formation of the liquid film, the surface roughness Ra value of the inner side wall of the main body 10 is greater than or equal to 6.3μm, so that the stability of the liquid spreading is enhanced, the liquid droplets on the surface of the inner side wall show a certain hydrophilicity, and the wettability of the inner side wall of the main body 10 is improved, so as to facilitate the formation of a complete liquid film.

[0086] It should be noted that the liquid outlet 12 of the main body 10 can be combined in various ways, that is, the liquid outlet 12 is arranged on the top and / or the inner side upper edge of the main body 10, so that the liquid flowing out of the liquid outlet 12 covers the splash area of the polishing waste liquid centrifugally thrown by the polishing disc, thereby realizing the moisturizing of the inner side wall of the main body 10 and preventing the crystallization of the polishing pollutants on the inner side wall of the main body 10.

[0087] In the utility model, the main body 10 is made of polypropylene homopolymer (PPH, Polypropylene Homopolymer). Polypropylene is a high molecular compound which is polymerized from propylene monomer and has excellent physical and chemical properties. PPH is the product of β modification of polypropylene, which has a uniform and delicate Beta crystal structure and has more excellent chemical corrosion resistance, wear resistance, high temperature resistance, corrosion resistance, aging resistance and insulation, so that the liquid overflowing from the liquid outlet 12 forms a liquid film on the inner side wall of the main body 10, thereby realizing the moisturizing of the main body 10.

[0088] It can be understood that the main body 10 can also be made of polyphenylene sulfide or polyether ether ketone, so as to facilitate the moisturizing of the inner side wall of the main body 10.

[0089] Figure 8 is a schematic view of the protective device 100 provided by another embodiment of the utility model. In this embodiment, the liquid outlet 12 is arranged on the top of the main body 10, and the outer cover plate 20 is arranged on the outer circumferential side of the main body 10. At the same time, the upper part of the outer cover plate 20 is provided with a shielding part 22 to shield the top of the main body 10, so that the liquid overflowing through the liquid outlet 12 can flow in the space defined between the top of the main body 10 and the shielding part 22, and then infiltrate the inner side wall of the main body 10 under the action of gravity.

[0090] Specifically, the shielding part 22 extends to the inner side of the main body 10 along the horizontal direction and then extends vertically downward to form an L-shaped structure. The shielding part 22 can prevent the polishing waste liquid from falling on the top of the main body 10, and then the liquid overflowing along the containing cavity 11 flows to the inner side wall of the main body 10.

[0091] However, the shielding part 22 also has a disadvantage: the polishing waste liquid may be attached to the upper surface of the shielding part 22 to form crystallization. To solve this problem, the upper surface of the shielding part 22 is coated with a hydrophobic coating to inhibit the liquid from staying on the upper surface of the shielding part 22. It can be understood that the shielding part 22 can be made of a material with good hydrophobicity.

[0092] At the same time, the utility model also provides a chemical mechanical polishing system 1000, and a schematic view is shown in Figure 9 The chemical mechanical polishing system 1000 comprises a polishing disc 200, a carrier head 300, a liquid supply device 400 and a trimming device 500, and further comprisesFigure 1 The protective device 100 is shown.

[0093] Specifically, a polishing pad is arranged on the upper surface of the polishing disc 200 and rotates along the axis together with the polishing disc 200; a horizontally movable carrier head 300 is arranged above the polishing pad, and the lower surface of the carrier head 300 is loaded with a wafer to be polished; a trimming device 500 includes a trimming arm and a trimming head, which are arranged on one side of the polishing disc 200, the trimming arm drives the rotating trimming head to swing to trim the surface of the polishing pad; a liquid supply device 400 is arranged on the upper side of the polishing pad to spread the polishing liquid on the surface of the polishing pad.

[0094] The protective device 100 is arranged on the outer periphery of the polishing disc 200, and the inner part of the main body 10 of the protective device 100 is configured with a containing cavity 11, the liquid in the containing cavity 11 can flow to the inner side wall of the main body 10 through the liquid outlet 12, thereby realizing the moisturizing of the inner side wall of the main body 10 and preventing the inner side wall of the main body 10 from forming crystals.

[0095] Those skilled in the art can realize that the units and method steps of each example described in combination with the embodiments disclosed herein can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. A person skilled in the art can use different methods to realize the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of the present application.

[0096] The above embodiments are only used to illustrate but not to limit the embodiments of the present application, and a person skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application, therefore all equivalent technical solutions also belong to the scope of the embodiments of the present application, and the patent protection scope of the embodiments of the present application should be defined by the claims.

Claims

1. A protective device for protecting a polishing disc in a chemical mechanical polishing system, characterized in that, It includes a ring-shaped main body component located on the outer periphery of the polishing disc; the main body component includes: A receiving cavity, located inside the main body, is used to buffer liquid; The liquid outlet is located on the inner side of the main body and communicates with the receiving cavity; The liquid in the receiving cavity flows through the liquid outlet to the inner wall of the main body to achieve moisture retention of the inner wall of the main body.

2. The protective device according to claim 1, characterized in that, The liquid outlet is located at the top and / or the upper inner edge of the main body, so that the liquid flowing out of the outlet covers the splash area of ​​the polishing waste liquid centrifugally ejected by the polishing disc.

3. The protective device according to claim 1, characterized in that, The number of liquid outlets is multiple, and they are spaced apart along the circumference of the main body.

4. The protective device according to claim 2, characterized in that, The top surface of the main body is inclined inward.

5. The protective device according to claim 2, characterized in that, The inner upper edge of the main body is rounded, so that the liquid flowing out of the outlet flows smoothly towards the inner wall of the main body through the inner upper edge.

6. The protective device according to claim 2, characterized in that, The top surface of the main body is provided with an annular opening facing inward, and the liquid flowing out of the outlet flows through the annular opening to the inner wall of the main body.

7. The protective device according to claim 2, characterized in that, The liquid outlet located at the top of the main body is tilted upwards and inwards.

8. The protective device according to claim 6, characterized in that, The liquid outlet located at the top of the main body is vertically upward, and the liquid outlet is located at the corner of the annular opening.

9. The protective device according to claim 2, characterized in that, The liquid outlet located on the upper inner edge of the main body is tilted upwards and inwards.

10. The protective device according to claim 1, characterized in that, It also includes an outer cover plate, which is matched with the main body to form the receiving cavity; the outer cover plate is provided with a liquid inlet, which is connected to an external liquid source to deliver liquid to the receiving cavity.

11. The protective device according to claim 10, characterized in that, The main body is provided with an annular groove, and the outer cover plate is placed on the outside of the annular groove to form the receiving cavity.

12. The protective device according to claim 10, characterized in that, The height of the liquid inlet is less than or equal to the height of the liquid outlet.

13. The protective device according to claim 1, characterized in that, The main body is made of homopolymer polypropylene, polyphenylene sulfide, or polyetheretherketone.

14. The protective device according to claim 1, characterized in that, The liquid outlet is located at the top of the main body, and the surface roughness Ra value of the inner sidewall of the main body is ≥6.3μm.

15. A chemical mechanical polishing system, characterized in that, The device includes a polishing pad, a support head, a liquid supply device, and a trimming device. The support head presses the wafer to be polished against a polishing pad above the polishing pad. The liquid supply device supplies polishing liquid between the polishing pad and the wafer. The trimming device is used to trim the surface of the polishing pad. The device also includes a protective device as described in any one of claims 1 to 14 to achieve moisture retention on the inner wall of the main body and prevent crystal formation on the inner wall of the main body.

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