Polishing tool for end face of suction nozzle glue dipping head

Abstract

A suction nozzle glue dipping head end face polishing tool comprises a mounting base, a guide piece and a polishing piece, a positioning hole used for positioning a suction nozzle is formed in the mounting base, and a positioning rod of the suction nozzle can be inserted into the positioning hole; the polishing piece covers the positioning hole and is in contact with the glue dipping head of the suction nozzle, and the polishing piece reciprocates along the mounting seat so as to polish the end face of the glue dipping head of the suction nozzle; and the guide piece is arranged on the mounting seat, is arranged beside the positioning hole, and is used for guiding the polishing piece, so that the polishing piece does reciprocating motion along a straight line. According to the glue dipping head polishing device, by arranging the mounting base and the multiple corresponding positioning holes, multiple suction nozzles of different glue dipping heads can be fixed at a time, one-time polishing is carried out, the structure is simple, operation is convenient, and therefore the polishing efficiency is greatly improved, and the polishing precision is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip manufacturing, and in particular to a polishing tool for the end face of a suction nozzle. BACKGROUND

[0002] The die-bonding suction nozzle is a tool used in a die bonder, mainly used for sucking and fixing LED wafers and IC dies to improve the yield of semiconductor packaging. The die-bonding suction nozzle has high mechanical strength, good insulation, heat resistance and corrosion resistance, and is widely used in the suction nozzle of the chip in the die-bonding operation. There are various models suitable for various chips, which plays a crucial role in the process of semiconductor packaging and can significantly improve the chip dark bouncing and IR problems, and is suitable for hot pressing and gluing operation of various chips.

[0003] The die-bonding suction nozzle currently used includes a positioning rod and a glue-dipping head arranged at the front end of the positioning rod. Under the premise of consistent positioning rod, the glue-dipping head is generally set to different structures according to different chips, and the end away from the positioning rod is provided with a suction head and used for direct contact with high-precision materials such as chips. Therefore, the end face often needs to be mirror polished. The traditional polishing method adopts manual polishing and mechanical polishing.

[0004] When manually polishing, the operator needs to have super high experience, but it will also cause the irregularity of the periphery of the suction nozzle glue-dipping head, affecting the lens catch contour. When mechanically polishing, the end face is flattened by a mechanical platform, and then polished by a lifting platform. The lifting platform polishing needs to push the table, which wastes a lot of time in actual processing. At the same time, the precision level of the suction nozzle is very high, and the end face is easily abnormal in each link, such as inspection, lettering, process turnover, etc., which will damage the polished surface. Reusing the platform for polishing greatly wastes the processing time. CONTENT OF THE INVENTION

[0005] The present application provides a polishing tool for the end face of a suction nozzle glue-dipping head, which can improve the polishing efficiency and ensure the polishing precision.

[0006] According to the present application, a polishing tool for the end face of a suction nozzle glue-dipping head is provided in one embodiment, which is used for a polishing tool clamp, comprising:

[0007] A mounting seat is provided with a positioning hole for positioning the suction nozzle, and the positioning hole is used for inserting the positioning rod of the suction nozzle;

[0008] A polishing piece covers the positioning hole and contacts the glue-dipping head of the suction nozzle, and the polishing piece reciprocates along the mounting seat to polish the end face of the glue-dipping head of the suction nozzle; and

[0009] A guide piece is arranged beside the positioning hole on the mounting seat, and the guide piece is used for guiding the polishing piece to make the polishing piece reciprocate along a straight line.

[0010] In another embodiment, the guide comprises two guide surfaces, and the two guide surfaces are distributed on both sides of the positioning hole, and the polishing piece is arranged between the two guide surfaces and slides.

[0011] In another embodiment, the mounting seat is provided with a transverse guide groove, and the positioning hole is arranged at the bottom wall of the guide groove, and the two side walls of the guide groove form the guide surfaces.

[0012] In another embodiment, the polishing piece comprises a polishing stone, and the polishing stone is arranged in a four-prism strip structure.

[0013] In another embodiment, the mounting seat is provided with a hole-avoiding hole coaxially arranged with the positioning hole, the hole-avoiding hole and the positioning hole are arranged in a stepped hole, and the hole-avoiding hole has a larger diameter than the positioning hole to adapt to different glue-dipping heads of the suction nozzle.

[0014] In another embodiment, a plurality of positioning holes are arranged, and the plurality of positioning holes are distributed along the movement track of the polishing piece.

[0015] In another embodiment, the positioning hole is arranged as a blind hole, and the height of the positioning hole is smaller than the height of the glue-dipping end surface of the suction nozzle, so that the polishing piece contacts the glue-dipping end surface of the suction nozzle for polishing.

[0016] In another embodiment, the positioning hole is arranged as a through hole, and the end of the suction nozzle away from the polishing piece is manually supported and adjusted by an operator, so that the glue-dipping head of the suction nozzle is in contact with the polishing piece.

[0017] In another embodiment, the lower end of the positioning hole is provided with an elastic member, and the elastic member is used to support the suction nozzle, so that the glue-dipping end surface is in contact with the polishing piece.

[0018] In another embodiment, the polishing piece comprises a driving part connected to the mounting seat, the polishing piece is connected to the output end of the driving part, and the driving part is used to drive the polishing piece to make reciprocating motion along a straight line.

[0019] The nozzle glue-dipping head end face polishing tool according to the above embodiment can be used for polishing nozzle glue-dipping heads of different structures by directly positioning the nozzle through the positioning hole when the positioning rod outer diameter tolerance is similar, thereby greatly saving the polishing process time and scrap rate, solving the operation of guaranteeing the flatness of the product extremely small end face by the traditional polishing platform, avoiding the mechanical clamping and fixing of the vise tool, effectively protecting the edge of the product, preventing edge collapse, and being simple in structure and operation, highly practical, and capable of reducing unnecessary repair waste caused by the slight damage of the nozzle end face due to lettering, inspection, and turnover. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 FIG. 1 is a structural schematic diagram of an existing nozzle;

[0021] Figure 2 FIG. 2 is a sectional view of the existing nozzle;

[0022] Figure 3 FIG. 3 is a structural schematic diagram of a nozzle glue-dipping head end face polishing tool according to an embodiment of the present application;

[0023] Figure 4 FIG. 4 is a sectional view of the mounting seat in one embodiment;

[0024] Figure 5 FIG. 5 is a sectional view of the mounting seat in another embodiment;

[0025] Figure 6 FIG. 6 is a sectional view of the mounting seat in another embodiment;

[0026] Figure 7 FIG. 7 is a structural schematic diagram of a nozzle glue-dipping head end face polishing tool according to another embodiment of the present application.

[0027] FIG. 1 is a structural schematic diagram of an existing nozzle; FIG. 2 is a sectional view of the existing nozzle; FIG. 3 is a structural schematic diagram of a nozzle glue-dipping head end face polishing tool according to an embodiment of the present application; FIG. 4 is a sectional view of the mounting seat in one embodiment; FIG. 5 is a sectional view of the mounting seat in another embodiment; FIG. 6 is a sectional view of the mounting seat in another embodiment; FIG. 7 is a structural schematic diagram of a nozzle glue-dipping head end face polishing tool according to another embodiment of the present application; and FIG. 8 is a structural schematic diagram of a nozzle glue-dipping head end face polishing tool according to another embodiment of the present application. DETAILED DESCRIPTION

[0028] The application will be described in further detail below with specific reference being made to the drawings. Like elements in different embodiments are denoted by like reference numerals. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, it will be apparent to one skilled in the art that the application can be practiced without some or all of these details. In other instances, well known process steps have not been described in detail in order not to unnecessarily obscure the application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description is for describing particular embodiments only and is not intended to be limiting of the application. As used in this application, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", or "includes" and / or "including" when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and / or groups thereof.

[0029] In addition, the features, operations or steps described in the specification can be combined in any suitable manner in various embodiments, and the order of the steps involved in each embodiment can be adjusted as long as it is obvious to those skilled in the art. Therefore, the specification and drawings are only intended to clearly describe one embodiment, and do not mean that the components and / or order are necessary.

[0030] The serial numbers of components in this paper, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any order or technical meaning. The "connection" and "coupling" in this application include direct and indirect connection (coupling) unless otherwise specified.

[0031] The die bonding suction nozzle is a tool used in die bonder, mainly used for sucking and fixing LED wafer and IC die, improving the yield of semiconductor packaging, and is widely used in die bonder. Chip suction nozzle 1, there are various models suitable for various chips. The die bonding suction nozzle currently used, please refer to Figure 1 and Figure 2 , including a positioning rod 11 and a glue dipping head 12 arranged at the front end of the positioning rod 11. Generally, the outer diameter of the positioning rod 11 is basically similar, and the glue dipping head 12 can be set to different structures according to different chips, and the end of the glue dipping head 12 away from the positioning rod 11 is provided with a suction head and used for direct contact with high-precision materials such as chips, so the end face often needs to be mirror polished. The traditional polishing method adopts manual polishing and mechanical polishing.

[0032] When polishing manually, the operator needs to have super high experience, but it also causes the irregularity of the periphery of the glue head of the suction nozzle, affecting the lens grabbing contour; when polishing mechanically, the end face is flattened by pushing the table with a mechanical platform, and then polished with a lifting platform. The polishing with the lifting platform needs to push the table, which is relatively time-consuming in actual processing. At the same time, the precision degree of the suction nozzle is very high, and the end face is easily abnormal in each link, such as inspection, lettering, process turnover, etc., which can damage the polished surface. Re-polishing with the platform again greatly wastes the processing time.

[0033] The application provides a suction nozzle glue head end face polishing tool, which can fix a plurality of different glue heads 12 of the suction nozzle 1 at one time through the setting of a mounting seat 2 and a plurality of corresponding positioning holes 21, and perform one-time polishing. The structure is simple, the operation is convenient, and the polishing precision is ensured.

[0034] Please refer to Figure 3 and Figure 4 In an embodiment, a suction nozzle glue head end face polishing tool is provided, which includes a mounting seat 2, a guide 3 and a polishing piece 4. The mounting seat 2 is provided with a positioning hole 21 for positioning the suction nozzle 1, and the positioning hole 21 is used for inserting the positioning rod 11 of the suction nozzle 1. The polishing piece 4 covers the positioning hole 21 and is in contact with the glue head 12 of the suction nozzle 1. The polishing piece 4 reciprocates along the mounting seat 2 to polish the end face of the glue head 12 of the suction nozzle 1. The guide 3 is arranged beside the positioning hole 21 on the mounting seat 2, and the guide 3 is used for guiding the polishing piece 4 to reciprocate along a straight line.

[0035] Surface roughness refers to the unevenness of small pitch and tiny peaks and valleys on the machined surface. The distance between two wave peaks or two wave troughs (wave distance) is very small (below 1mm), which belongs to micro-geometric error. The smaller the surface roughness is, the smoother the surface is.

[0036] In this embodiment, when the outer diameter tolerance of the positioning rod 11 is similar, the suction nozzle 1 is directly positioned through the positioning hole 21, the glue head 12 of the suction nozzle 1 with different structures can be polished, the end face of the glue head 12 is polished to a surface roughness of 0.2mm or a mirror surface, the working hours of the polishing process and the scrap rate are greatly saved, the operation of pushing the table to ensure the flatness of the extremely small end face of the product in the traditional polishing platform is solved, the mechanical clamping and fixing tool is avoided, the edge of the product is effectively protected, the collapse is prevented, the structure and operation are simple, and the tool is equipped in the corresponding section where the suction nozzle 1 appears or the suction nozzle 1 is easy to scratch, which can reduce the unnecessary repair waste caused by the slight damage of the end face of the suction nozzle 1 due to lettering, inspection and turnover.

[0037] In the embodiment, the operation of covering the positioning hole 21 by the polishing piece 4 and contacting the glue-dipping head 12 of the suction nozzle 1 is that, in the field operation, the polishing piece 4 is attached to the plane where the positioning hole 21 is located, and the covering is that the projection of the polishing piece 4 on the corresponding plane can completely enclose the positioning hole 21, so as to polish the suction nozzle 1 at one time and reduce the error.

[0038] Further, referring to Figure 3 and Figure 4 , the positioning hole 21 is provided with a plurality of positioning holes 21, and the plurality of positioning holes 21 are distributed along the movement track of the polishing piece 4, so that a plurality of different types of suction nozzles 1 can be polished at the same time, the diameters of the plurality of positioning holes 21 are different, and different levels can also be set according to different suction nozzles 1, so as to adapt to the positioning of suction nozzles 1 of different sizes.

[0039] In the embodiment, due to the consistency of the fixation of the device, when the suction nozzle 1 with similar outer diameter tolerance of the positioning rod 11 is processed, various different sizes of suction nozzles 1 can be positioned through the plurality of positioning holes 21, the shaking of the suction nozzle 1 is reduced, and the working hours of the polishing process are greatly saved; in the section that is easy to cause the end face of the glue-dipping head 12 of the suction nozzle 1 to be scratched and damaged, for example, in the inspection of the characters, such a tooling can be provided, so as to reduce the unnecessary rework waste caused by the characters, the inspection, and the turnover.

[0040] Further, referring to Figure 3 , the guide piece 3 includes two guide surfaces 32, and the two guide surfaces 32 are distributed on both sides of the positioning hole 21, and the polishing piece 4 is arranged between the two guide surfaces 32 and slides; specifically, the mounting seat 2 is provided with a horizontal guide groove 31, the positioning hole 21 is arranged on the bottom wall of the guide groove 31, and the two side walls of the guide groove 31 form the above-mentioned guide surface 32.

[0041] In the embodiment, referring to Figure 1 , the polishing piece 4 adopts a polishing stone 41, and the polishing stone 41 is arranged in a strip structure of a quadrangular prism, the quadrangular prism-shaped polishing stone 41 is clamped into the concave guide groove 31, so as to limit the deviation of the polishing stone 41 and guide the linear motion of the polishing stone 41, and at the same time, the plurality of suction nozzles 1 on the same straight line are subjected to the same force, so as to form the same polishing effect and facilitate batch polishing.

[0042] Further, referring to Figure 3 and Figure 4The mounting base 2 is provided with an avoiding hole 22 coaxially arranged with the positioning hole 21. The avoiding hole 22 is arranged in a stepped hole with the positioning hole 21, and the axial diameter of the avoiding hole 22 is greater than that of the positioning hole 21, so as to adapt to different glue-dipping heads 12 of the suction nozzles 1. In the embodiment, the avoiding hole 22 is located at the upper end of the positioning hole 21, the lower end of the positioning rod 11 is inserted into the positioning hole 21, and the glue-dipping head 12 is located at the avoiding hole 22 and arranged to protrude from the bottom wall of the guide groove 31, so that the end surface of the glue-dipping head 12 is in contact with the polishing stone 41.

[0043] In one embodiment, referring to Figure 4 In particular, when polishing a single suction nozzle 1, the positioning hole 21 can be arranged as a through hole, and the end of the suction nozzle 1 away from the polishing piece 4 is manually supported and adjusted by an operator, so that the glue-dipping head 12 of the suction nozzle 1 is in contact with the polishing piece 4, the contact pressure between the end surface of the glue-dipping head 12 and the polishing stone 41 is controlled, and polishing is performed.

[0044] In another embodiment, referring to Figure 5 In particular, when polishing a plurality of suction nozzles 1 of the same type, the overall height of the suction nozzle 1 is constant, the depth of the positioning hole 21 can be arranged according to the height of the suction nozzle 1, and the positioning hole 21 is arranged as a blind hole. When the positioning rod 11 is supported by the bottom wall of the blind hole, the height of the positioning hole 21 is less than the height of the end surface of the glue-dipping head 12 of the suction nozzle 1, so that the end surface of the glue-dipping head 12 protrudes from the positioning hole 21 and can be in contact with the polishing stone 41.

[0045] Further, referring to Figure 6 In order to increase the applicability of the tool and control the contact pressure between the polishing stone 41 and the end surface of the glue-dipping head 12, an elastic member 5 is arranged at the lower end of the positioning hole 21. The elastic member 5 is used to support the suction nozzle 1, so that the end surface of the glue-dipping head 12 is in contact with the polishing piece 4. In the embodiment, the elastic member 5 is a spring rod, and other elastic structures can also be used. The elastic member 5 can be directly fixed in the positioning hole 21 to support the suction nozzle 1.

[0046] Further, referring to Figure 7 The polishing piece 4 comprises a driving part 42, which is fixed opposite to the mounting base 2. The driving part 42 is connected to one side of the mounting part or both can be mounted on the same operation platform. The polishing piece 4 is connected to the output end of the driving part 42, and the driving part 42 is used to drive the polishing piece 4 to make reciprocating motion along a straight line. In the embodiment, the driving part 42 is a telescopic pneumatic cylinder, which is mounted on the mounting base 2, and the telescopic rod of the telescopic pneumatic cylinder is parallel to the direction of the guide groove 31.

[0047] In the embodiment, when the mass production nozzle 1 is processed, the single operation of the tool can be changed into a batch production mode, a plurality of nozzles 1 are positioned through a plurality of positioning holes 21, the lower end of the nozzle 1 is pushed against by a spring, the polishing stone 41 is arranged in the guide groove 31 and can be driven by a telescopic cylinder to complete the automatic polishing of the glue head 12 of the nozzle 1 in mass production, thereby improving the efficiency and quality.

[0048] The above describes the utility model by using specific examples, which is only used for helping to understand the utility model and does not limit the utility model. According to the idea of the utility model, a plurality of simple deductions, deformations or substitutions can be made for the technical personnel in the technical field of the utility model.

Claims

1. A nozzle dip head end face polishing tool for polishing a tool holder, characterized by, The utility model relates to a kind of polishing device for suction nozzle, comprising: Mounting seat (2), the positioning hole (21) for positioning suction nozzle (1) is opened on the mounting seat (2), the positioning hole (21) is used for the positioning rod (11) of the suction nozzle (1) insertion; Polishing piece (4), the polishing piece (4) covers the positioning hole (21) and is in contact with the glue-dipping head (12) of the suction nozzle (1), and the polishing piece (4) reciprocating motion along mounting seat (2), to the glue-dipping head (12) end surface of the suction nozzle (1) polishing; And Guide piece (3), the guide piece (3) is arranged in the positioning hole (21) side of the mounting seat (2), and the guide piece (3) is used to guide the polishing piece (4), so that the polishing piece (4) reciprocating motion along straight line.

2. The mouthpiece dip tip end face polishing tool of claim 1, wherein, The guide piece (3) includes two guide surfaces (32), and two the guide surfaces (32) are distributed on both sides of the positioning hole (21), and the polishing piece (4) is arranged between two the guide surfaces (32) and slides.

3. The nozzle dip tip end face polishing tool of claim 2, wherein, The mounting seat (2) is provided with transverse guide groove (31), the positioning hole (21) is arranged on the bottom wall of the guide groove (31), and the two side walls of the guide groove (31) form the guide surface (32).

4. The mouthpiece dip tip end face polishing tool of claim 1, wherein, The polishing piece (4) includes polishing stone (41), and the polishing stone (41) is arranged as four-prism strip structure.

5. The mouthpiece dip tip end face polishing tool of claim 1, wherein, The mounting seat (2) is provided with the hole-avoiding (22) coaxially arranged with the positioning hole (21), the hole-avoiding (22) is arranged as a stepped hole with the positioning hole (21), and the hole-avoiding (22) is larger than the positioning hole (21) in diameter, to adapt to different glue-dipping head (12) of the suction nozzle (1).

6. The nozzle dip tip end face polishing tool of any one of claims 1-5, wherein, The positioning hole (21) is provided with a plurality of, and a plurality of the positioning hole (21) is distributed along the movement track of the polishing piece (4).

7. The nozzle dip tip end face polishing tool of claim 6, wherein, The positioning hole (21) is arranged as a blind hole, and the height of the positioning hole (21) is less than the height of the glue-dipping head (12) end surface of the suction nozzle (1), so that the polishing piece (4) contacts the glue-dipping head (12) end surface of the suction nozzle (1) and polishes.

8. The mouthpiece dip tip end face polishing tool of claim 6, wherein, The positioning hole (21) is arranged as a through hole, and one end of the suction nozzle (1) away from the polishing piece (4) is manually supported and adjusted by operating personnel, so that the glue-dipping head (12) of the suction nozzle (1) is in contact with the polishing piece (4).

9. The nozzle dip tip end face polishing tool of any one of claims 7 or 8, wherein, The lower end of the positioning hole (21) is provided with elastic element (5), and the elastic element (5) is used to support the suction nozzle (1), so that the glue-dipping head (12) end surface is in contact with the polishing piece (4).

10. The mouthpiece dip tip end face polishing tool of claim 6, wherein, The polishing piece (4) includes driving part (42), the driving part (42) is connected to the mounting seat (2), the output end of the polishing piece (4) is connected to the driving part (42), and the driving part (42) is used to drive the polishing piece (4) reciprocating motion along straight line.

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