Printing roller and grid line printing device
By setting grooves on the surface of the printing roller and using a slurry injection machine and drive components to print the slurry, the problems of high material consumption and short service life of screen printing equipment are solved, achieving the effects of reducing costs and extending service life.
Patent Information
- Application Number
- CN202520006938.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2035-01-02
AI Technical Summary
In existing screen printing equipment, the squeegee and screen are consumed in large quantities during use, resulting in high production costs and short service life.
The printing roller is made by creating grooves on its surface, filling it with paste using a paste injection machine, and driving the roller to move and rotate on the silicon wafer surface. This process simplifies the printing structure and extends the service life of the printing roller.
It reduces production costs, extends the lifespan of printing rollers, reduces consumables, and avoids frequent replacements of doctor blades and screens.
Smart Images
Figure CN223574009U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to photovoltaic cell preparation technical field, specifically, relate to a printing roller and grid line printing device. BACKGROUND
[0002] In the photovoltaic industry, most of the way is to print the grid line on the surface of the silicon wafer by silk screen to form the electrode, the silk screen printing method in the prior art is to print the electrode paste by using the local opening of the screen plate, and a certain pressure is applied to the printing area of the screen plate by a squeegee, and the squeegee moves towards the other end of the screen plate; with the movement of the squeegee, the paste in the hole of the screen plate is extruded onto the to-be-printed cell, so as to print the grid line on the surface of the silicon wafer.
[0003] The squeegee and the screen plate are consumed greatly in the use of the silk screen printing device in the prior art, and frequent replacement leads to high production cost. UTILITY MODEL CONTENTS
[0004] The utility model provides a printing roller and grid line printing device, it can reduce production cost, improve the service life.
[0005] The embodiment of the utility model can be realized as follows:
[0006] The embodiment of the utility model provides a printing roller, the surface of the printing roller is equipped with the recess for forming the printing pattern, the surface of the printing roller is used for contacting the surface of the silicon wafer, and the paste in the recess is used for printing on the surface of the silicon wafer.
[0007] Optionally, the recess is multiple, and the multiple recesses are sequentially arranged along the circumferential direction of the printing roller.
[0008] Optionally, the printing roller is of a flexible structure, and the surface of the printing roller is used to deform in the case of contacting the surface of the silicon wafer, so that the paste in the recess is printed on the surface of the silicon wafer.
[0009] Optionally, the surface of the printing roller is of an arc surface structure, and the arc surface structure is convex towards the direction away from the axis of the printing roller.
[0010] The embodiment of the utility model further provides a grid line printing device, which comprises a paste injection machine, a driving member and a printing roller, the paste injection machine is communicated with the recess and is used for injecting paste into the recess, the driving member is connected with the printing roller and is used for driving the printing roller to move and rotate on the surface of the silicon wafer.
[0011] Optionally, the paste injection machine comprises a machine body and a paste injection pipe, the machine body is communicated with the paste injection pipe, and the outlet of the paste injection pipe is communicated with the recess.
[0012] Optionally, the surface of the outlet of the grouting pipe and the surface of the printing cylinder are in contact, so that the paste flowing out of the outlet of the grouting pipe enters the groove completely.
[0013] Optionally, the number of the grouting pipes and the number of the grooves are one-to-one corresponding, in the case of printing in one of the grooves, the grouting machine grouts the next groove for printing, so that the paste fills into the groove.
[0014] Optionally, the driving member comprises a driver and a transmission shaft, the transmission shaft is connected with the driver, the transmission shaft is connected with the printing cylinder, the driver is used to drive the transmission shaft to reciprocate relative to the silicon wafer, so that the printing cylinder moves on the surface of the silicon wafer, and the driver drives the printing cylinder to rotate through the transmission shaft.
[0015] Optionally, the grid line printing device further comprises a printing table, and the printing table is used to carry the silicon wafer.
[0016] The printing cylinder and the grid line printing device have the following advantages, for example:
[0017] The surface of the printing cylinder is provided with a groove for forming a printing pattern, the surface of the printing cylinder is used to contact the surface of the silicon wafer, and the paste in the groove is used to print on the surface of the silicon wafer. In use, the printing cylinder can be manually driven to rotate on the surface of the silicon wafer, or an automatic driving device can be used to drive the printing cylinder to rotate on the surface of the silicon wafer, so that the paste in the groove is printed on the surface of the silicon wafer, and the printing work is completed. Compared with the silk screen printing method in the prior art, the printing cylinder directly sets the groove for forming the printing pattern on the surface of the printing cylinder, simplifies the printing structure, and the printing cylinder can continuously perform the printing work, has a long service life, and reduces the consumption cost.
[0018] The grid line printing device comprises a grouting machine, a driving member and a printing cylinder, the grouting machine is communicated with the groove and is used to grout towards the groove, the driving member is connected with the printing cylinder and is used to drive the printing cylinder to move and rotate on the surface of the silicon wafer. In use, the grouting machine grouts towards the groove of the printing cylinder, so that the groove is filled with the paste, then the driving member drives the printing cylinder to move on the silicon wafer, and the printing cylinder rotates in the moving process, so that the paste in the groove is printed on the surface of the silicon wafer to form the grid line. Compared with the silk screen printing method in the prior art, the grid line printing device directly sets the groove on the printing cylinder, simplifies the printing structure, and the printing cylinder can continuously perform the printing work under the driving of the driving member, has a long service life, and reduces the consumption cost. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.
[0020] Figure 1 The structure schematic diagram of the grid line printing device provided in the present embodiment.
[0021] Icon: 10-printing roller; 101-groove; 20-grouting pipe; 30-transmission shaft; 40-printing table; 102-silicon wafer. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical scheme in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.
[0023] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of the present application.
[0024] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0025] In the description of the present application, it should be noted that if the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship of the present application product when it is usually placed, which is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0026] In addition, if the terms "first", "second" and the like appear, they are only used for distinction in description, and cannot be understood as indicating or implying relative importance.
[0027] It should be noted that the features in the embodiments of the utility model can be combined with each other without conflict.
[0028] In the photovoltaic industry, most of the electrodes are formed by printing grid lines on the surface of silicon wafers through silk screen printing. The silk screen printing method in the prior art is to print electrode paste by using partial opening of the screen plate, and a certain pressure is applied to the printing area of the screen plate by a squeegee, while the squeegee moves towards the other end of the screen plate. With the movement of the squeegee, the paste in the holes on the screen plate is extruded onto the printed cell, thereby printing grid lines on the surface of the silicon wafer.
[0029] In the related art, the consumption of the squeegee and the screen plate is large during use, and frequent replacement is required, resulting in high production cost.
[0030] Please refer to Figure 1 The embodiment provides a grid line printing device, which comprises a paste injection machine, a driving member and a printing roller 10. The paste injection machine and the printing roller 10 are connected, and the paste injection machine is used to fill the slurry in the groove 101. The driving member and the printing roller 10 are connected, and the driving member is used to drive the printing roller 10 to move and rotate on the surface of the silicon wafer 102, thereby completing the printing work on the surface of the silicon wafer 102. The grid line printing device can effectively improve the above-mentioned technical problems, reduce the production cost, and prolong the service life.
[0031] The surface of the printing roller 10 is provided with a groove 101 for forming a printing pattern, the surface of the printing roller 10 is used to contact the surface of the silicon wafer 102, and the slurry in the groove 101 is used to print on the surface of the silicon wafer 102.
[0032] In the prior art, the silk screen printing device generally comprises a screen plate and a squeegee. Since the screen plate is mainly made by pressing the screen cloth and the PI adhesive film, and is made by opening holes according to the printing pattern by laser, the cost of the screen plate is relatively high. Moreover, the thickness of the screen plate is only 10-30 microns, and there are many hollows, which will cause the service life of the screen plate to be short and need to be frequently replaced. In addition, the squeegee is a consumable for extruding the slurry onto the printed silicon wafer 102. During the silk screen printing process, the squeegee needs to be pressed on the screen plate to make reciprocating motion, and therefore the squeegee is prone to wear and deformation. As can be seen from the above, the silk screen printing device in the prior art has the technical problem of large amount of consumables and frequent replacement, resulting in high production cost. In order to solve this technical problem, the grid line printing device provided in the embodiment directly slots the surface of the printing roller 10 to form the groove 101, fills the groove 101 with the slurry by the paste injection machine, and rotates the printing roller 10 during the movement of the driving member, so that the slurry in the groove 101 is printed on the surface of the silicon wafer 102 to form grid lines, thereby completing the printing. The printing roller 10 can be recycled, and the generation of consumables is reduced.
[0033] In the embodiment, the printing roller 10 is in the structure of an arc three-prism, the grooves 101 are multiple, and each surface of the printing roller 10 is provided with the grooves 101. The printing roller 10 is used to print the slurry in the grooves 101 on the surface of the silicon wafer 102 in sequence under rotation.
[0034] It can be understood that the grooves 101 in the embodiment are in the structure of a long strip, and the width of the grooves 101 is adjusted according to the width of the gate line in the actual production process, which is not specifically limited here.
[0035] In the embodiment, the number of the grooves 101 is three. In other embodiments, the number of the grooves 101 can be increased or decreased, and the number of the grooves 101 is adjusted according to the spacing between two adjacent gate lines on the silicon wafer 102 in the actual production process, which is not specifically limited here.
[0036] In other embodiments, the printing roller 10 can also be in the structure of an arc four-prism, an arc five-prism, etc., which is not specifically limited here.
[0037] It needs to be noted that, since the thickness of the silicon wafer 102 is thin, the traditional silk-screen printing method needs to use a squeegee to press repeatedly on the surface of the silicon wafer 102, which causes the silicon wafer 102 to be easy to be broken after being stressed. In order to avoid the phenomenon of the silicon wafer 102 being broken in the printing process, the printing roller 10 in the embodiment is in a flexible structure, and the surface of the printing roller 10 is used to be deformed in the case of contacting the surface of the silicon wafer 102, so that the slurry in the groove 101 is printed on the surface of the silicon wafer 102. The printing roller 10 is driven to descend by the driving member until the surface of the printing roller 10 contacts the surface of the silicon wafer 102. Since the printing roller 10 is in a flexible structure, the surface of the printing roller 10 will be deformed in the direction away from the surface of the silicon wafer 102 after contacting the surface of the silicon wafer 102, so that the slurry in the groove 101 is extruded to the surface of the silicon wafer 102, thereby completing the printing work on the surface of the silicon wafer 102. The surface of the flexible structure of the printing roller 10 can reduce the stress on the surface of the silicon wafer 102 after contacting the surface of the silicon wafer 102, thereby avoiding the phenomenon of the silicon wafer 102 being broken. Moreover, the arc angle of the printing roller 10 is large, and compared with the squeegee repeatedly pressing on the surface of the silicon wafer 102 in the prior art, the stress when the printing roller 10 contacts the surface of the silicon wafer 102 is more dispersed, which can further reduce the probability of the silicon wafer 102 being broken.
[0038] In the embodiment, the printing roller 10 is composed of a composite material. Specifically, the printing roller 10 is composed of a mixture of epoxy resin and glass fiber.
[0039] It should be further noted that the surface of the printing roller 10 is arc-shaped, and the arc-shaped structure protrudes away from the axis of the printing roller 10. Specifically, during the rotation of the printing roller 10, the surface of the printing roller 10 can completely cover the surface of the silicon wafer 102, ensuring that the paste is printed on the surface of the silicon wafer 102, thereby completing the printing work.
[0040] Further, the diameter of the printing roller 10 is adjusted according to the size of the printing pattern in the actual production process, and the arc length of the surface of the printing roller 10 is adjusted according to the printing pattern in the actual production process, which is not specifically limited here.
[0041] In this embodiment, the paste injection machine includes a machine body and a paste injection pipe 20, the machine body and the paste injection pipe 20 are in communication, and the outlet of the paste injection pipe 20 is in communication with the groove 101. Among them, the machine body pumps the paste into the paste injection pipe 20 and provides a filling pressure, and the paste in the paste injection pipe 20 enters the groove 101 through the outlet.
[0042] Specifically, the surface of the outlet of the paste injection pipe 20 is attached to the surface of the printing roller 10, so that the paste flowing out of the outlet of the paste injection pipe 20 completely enters the groove 101. Among them, the outlet of the paste injection pipe 20 is circular arc-shaped, so that the outlet can be attached to the surface of the printing roller 10, ensuring that the paste flowing out of the outlet can completely enter the groove 101.
[0043] Specifically, the number of paste injection pipes 20 corresponds to the number of grooves 101 one by one. In the case where one of the grooves 101 contacts the silicon wafer 102 for printing, the paste injection machine injects paste into the paste injection pipe 20 corresponding to the next groove 101 for printing, so that the paste fills the groove 101.
[0044] When working, the driving member drives the printing roller 10 to descend to the surface of the silicon wafer 102, so that the printing roller 10 contacts the surface of the silicon wafer 102, and then the driving member drives the printing roller 10 to move and rotate on the surface of the silicon wafer 102. The surface where the groove 101 filled with paste is rotated to be attached to the surface of the silicon wafer 102, so that the paste in the groove 101 is printed on the surface of the silicon wafer 102; in the case where the groove 101 is printed, the surface where the next groove 101 for printing is located is in a position parallel to the surface of the silicon wafer 102, that is, the surface where the next groove 101 for printing is located is located on the top surface of the printing roller 10, and the machine body pumps the paste into the groove 101 located on the top surface through the paste injection pipe 20, so that the groove 101 is filled with the paste, to complete the preparation work before printing, and the preparation work is circularly performed in the rotation process of the printing roller 10.
[0045] In this embodiment, the radius of the outlet of the paste injection pipe 20 is consistent with the radius of the printing roller 10.
[0046] It should be further explained that the driving member comprises a driver and a transmission shaft 30, the transmission shaft 30 is connected with the driver, and the transmission shaft 30 is connected with the printing roller 10.
[0047] Specifically, the driver comprises a cylinder and a motor, wherein the transmission shaft 30 comprises a rotating shaft and a transmission rod, the rotating shaft penetrates through the printing roller 10, and both ends of the rotating shaft are located at both ends of the printing roller 10, both ends of the rotating shaft are connected with the transmission rod, the transmission rod is connected with the cylinder, the rotating shaft is connected with the motor, and the motor drives the rotating shaft to rotate, thereby driving the printing roller 10 to rotate.
[0048] In operation, the cylinder drives the transmission rod to drive the rotating shaft to descend, thereby driving the printing roller 10 to descend to the surface of the silicon wafer 102, and then the motor drives the rotating shaft to drive the printing roller 10 to rotate on the surface of the silicon wafer 102, thereby printing on the surface of the silicon wafer 102.
[0049] Further, the grid line printing device further comprises a printing table 40, and the printing table 40 is used for carrying the silicon wafer 102. The printing table 40 can adsorb the silicon wafer 102, thereby fixing the silicon wafer 102 on the printing table 40, and facilitating the printing work of the printing roller 10.
[0050] The printing roller 10 and the grid line printing device provided by the embodiment have at least the following advantages:
[0051] The screen printing device in the prior art generally comprises a screen and a squeegee. Since the screen is mainly made by pressing a screen cloth and a PI film, and is made by laser according to a printing pattern to form holes, the cost of the screen is relatively high. Moreover, the thickness of the screen is only 10-30 microns, and the screen has many hollows, which leads to a short service life of the screen and frequent replacement. In addition, the squeegee is a consumable for extruding paste onto the printing silicon wafer 102. In the screen printing process, the squeegee needs to be pressed on the screen to make reciprocating motion, and thus the squeegee is prone to wear and deformation. In summary, the screen printing device in the prior art has the technical problem of high production cost due to large amount of consumables and frequent replacement. In order to solve this technical problem, the grid line printing device provided by the embodiment directly forms grooves 101 on the surface of the printing roller 10 in use, fills the grooves 101 with paste by a paste injection machine, and the paste in the grooves 101 can be printed on the surface of the silicon wafer 102 in the process of rotation of the printing roller 10 following the driving member, thereby completing printing. The printing roller 10 can be recycled, and the generation of consumables is reduced.
[0052] In summary, the printing roller 10 and the grid line printing device are provided in the embodiments of the present application, the surface of the printing roller 10 is provided with a groove 101 for forming a printing pattern, the surface of the printing roller 10 is used to contact the surface of a silicon wafer 102, and the slurry in the groove 101 is used to be printed on the surface of the silicon wafer 102. In use, the printing roller 10 can be manually driven to rotate on the surface of the silicon wafer 102, or an automatic driving device can be used to drive the printing roller 10 to rotate on the surface of the silicon wafer 102, so that the slurry in the groove 101 is printed on the surface of the silicon wafer 102, and the printing work is completed. Compared with the silk screen printing method in the prior art, the groove 101 for forming a printing pattern is directly arranged on the surface of the printing roller 10, the printing structure is simplified, the printing roller 10 can continuously perform the printing work, has a long service life, and the consumption cost is reduced.
[0053] The grid line printing device comprises a slurry injection machine, a driving member and the printing roller 10, the slurry injection machine is communicated with the groove 101 and is used for injecting slurry into the groove 101, and the driving member is connected with the printing roller 10 and is used for driving the printing roller 10 to move and rotate on the surface of the silicon wafer 102. In use, the slurry injection machine injects slurry into the groove 101 of the printing roller 10, so that the groove 101 is filled with slurry, then the driving member drives the printing roller 10 to move on the silicon wafer 102, and the printing roller 10 rotates during the movement, so that the slurry in the groove 101 is printed on the surface of the silicon wafer 102 to form a grid line. Compared with the silk screen printing method in the prior art, the groove 101 is directly arranged on the printing roller 10, the printing structure is simplified, the printing roller 10 can continuously perform the printing work under the driving of the driving member, has a long service life, and the consumption cost is reduced.
[0054] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A printing roller, characterized in that, The surface of the printing roller (10) is provided with a groove (101) for forming a printing pattern. The surface of the printing roller (10) is used to contact the surface of the silicon wafer (102). The paste in the groove (101) is used to print on the surface of the silicon wafer (102).
2. The printing roller according to claim 1, characterized in that, There are multiple grooves (101), and the multiple grooves (101) are arranged sequentially along the circumferential direction of the printing roller (10).
3. The printing roller according to claim 1, characterized in that, The printing roller (10) is a flexible structure, and the surface of the printing roller (10) is designed to deform when in contact with the surface of the silicon wafer (102), so that the paste in the groove (101) is printed on the surface of the silicon wafer (102).
4. The printing roller according to claim 1, characterized in that, The surface of the printing roller (10) is an arc-shaped structure, and the arc-shaped structure protrudes in a direction away from the axis of the printing roller (10).
5. A grid line printing apparatus, characterized in that, Includes a grouting machine, a drive unit, and a printing roller (10) as described in any one of claims 1-4, wherein the grouting machine is connected to the groove (101) for grouting into the groove (101), and the drive unit is connected to the printing roller (10) for driving the printing roller (10) to move and rotate on the surface of the silicon wafer (102).
6. The grid line printing apparatus according to claim 5, characterized in that, The grouting machine includes a body and a grouting pipe (20), the body and the grouting pipe (20) are connected, and the outlet of the grouting pipe (20) is connected to the groove (101).
7. The grid line printing apparatus according to claim 6, characterized in that, The surface of the outlet of the grouting pipe (20) is in contact with the surface of the printing roller (10), so that the grout flowing out of the outlet of the grouting pipe (20) completely enters the groove (101).
8. The grid line printing apparatus according to claim 6, characterized in that, The number of the grouting pipes (20) corresponds one-to-one with the number of the grooves (101). When one of the grooves (101) is being printed, the grouting machine injects grout into the next groove (101) being printed, so that the grout fills the groove (101).
9. The grid line printing apparatus according to claim 5, characterized in that, The driving component includes a driver and a transmission shaft (30). The transmission shaft (30) is connected to the driver and the printing roller (10). The driver is used to drive the transmission shaft (30) to reciprocate relative to the silicon wafer (102), so that the printing roller (10) moves on the surface of the silicon wafer (102), and the driver drives the printing roller (10) to rotate through the transmission shaft (30).
10. The grid line printing apparatus according to any one of claims 5-9, characterized in that, The grid line printing apparatus further includes a printing table (40) for holding a silicon wafer (102).