Semiconductor chip sealing device

By using a combination of limit blocks and clamping components in the chip sealing device, the problem of damage caused by chip shaking is solved, and stable fixation and protection of chips of different sizes are achieved.

CN223575025UActive Publication Date: 2025-11-21WUXI SIPENG SEMICON TESTING CO LTD
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Patent Information

Application Number
CN202423311233.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2025-11-21
Estimated Expiration
2034-12-31

AI Technical Summary

Technical Problem

Existing chip storage boxes, when clamped or without a fixing mechanism, cause chips to shake and bounce, leading to breakage or wear, and are not compatible with chips of various sizes.

Method used

The chip is separated by a first plate inside the storage box, and a second plate is set on both sides to form an operating area. The second plate has a slidingly connected limit block and a clamping component. The limit block has a rubber component. Through the cooperation of the moving component and the locking component, the chip is stably fixed.

Benefits of technology

It effectively prevents damage to the chip sidewalls and is compatible with chips of different sizes, improving the stability and applicability of chip packaging.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a semiconductor chip sealing device, which comprises a storage box, a first plate for separating the storage box, a second plate for supporting a chip, a third plate arranged on the second plate, a limiting block for limiting the position of the chip, a moving piece for driving the limiting block to move, and a locking piece for preventing the limiting block from damaging the chip, the first plate is arranged in the storage box; the second plates are arranged on the two sides of the first plate, and operation areas are reserved between the second plates and the bottom of the storage box. The third plate separates the second plate; a first groove is formed in the second plate; the limiting block slides along the first groove; the moving part is arranged in the operation area; the acting end of the moving part is connected with the limiting block; the locking piece is arranged on the moving piece. The chip sealing and storing box solves the problems that the chip sealing and storing box usually clamps the chip or is not provided with a fixing mechanism, so that the chip sealing and storing box shakes and jolts, the clamped chip is broken or abraded, and the chip sealing and storing box cannot adapt to chips of various sizes.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor, especially a kind of semiconductor chip storage device. BACKGROUND

[0002] In prior art, chip, also called microcircuit, microchip, integrated circuit, refers to the silicon chip containing integrated circuit, very small, often indispensable part in computer or other electronic equipment;If central processing unit CPU is compared to the heart of entire computer system, then chip set on mainboard is the torso of entire body, for mainboard, chip set almost determines the function of this mainboard, and then influence the exertion of entire computer system performance;Therefore, the mode of chip storage has essential influence on the pros and cons of electronic product, the existing chip storage box usually clamps chip or does not set fixed mechanism, therefore, it can appear that clamping chip collapses or wears out due to shaking and jolting, and it cannot adapt to chips of multiple sizes. SUMMARY

[0003] The semiconductor chip storage device provided by the embodiment of the present application solves the problem that the chip storage box in the prior art usually clamps the chip or does not set a fixed mechanism, and thus shaking and jolting can cause the clamped chip to collapse or wear out, and the chip storage box cannot adapt to chips of multiple sizes.

[0004] The technical scheme adopted by the embodiment of the present application is as follows.

[0005] A semiconductor chip storage device includes a storage box, a first plate separating the storage box, a second plate supporting a chip, a third plate provided on the second plate, a limiting block limiting the position of the chip, a moving piece driving the limiting block to move, and a locking piece preventing the limiting block from damaging the chip.

[0006] As a further improvement of the above technical scheme, the operating area is provided with a pressing piece, one end of the pressing piece abuts against the second plate, and the other end of the pressing piece abuts against the operating area.

[0007] As a further improvement of the above technical scheme, a first inclined surface is formed on the side wall of the limiting block, a rubber piece is arranged on the first inclined surface, and the rubber piece presses down the chip until the chip contacts the third plate when the rubber piece contacts the chip.

[0008] As a further improvement of the above technical solution: the locking member comprises a first rod, a second rod arranged on the first rod, a first clamping member sliding on the second rod, a fourth plate preventing the first clamping member from being separated, and an elastic member abutting against the first clamping member; the first rod rotates on the side wall of the storage box and the other end of the first rod is located in the operation area; the fourth plate is arranged on the end face of the second rod; the elastic member is sleeved on the second rod; the moving member is threadedly arranged in the limiting block; a second clamping member is arranged on the end face of the moving member; and the second clamping member cooperates with the first clamping member.

[0009] As a further improvement of the above technical solution: a plurality of groups of second clamping blocks are arranged on the first clamping member; the second clamping blocks are triangular; a plurality of groups of third clamping blocks are arranged on the second clamping member; the third clamping blocks are triangular; and the gaps between the third clamping blocks and two groups of the second clamping blocks correspond.

[0010] As a further improvement of the above technical solution: a limiting strip is arranged on the second rod.

[0011] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0012] 1、Due to the first plate is arranged in the storage box, the first plate is arranged in the middle of the storage box, the first plate separates the storage box, the second plate is arranged on both sides of the first plate, the second plate forms an operation area with the inside of the storage box, a pressing piece is arranged in the operation area, one end of the pressing piece abuts against the second plate, so that the second plate always faces upward, a first groove is formed in the second plate, a limiting block is slidably connected to the second plate, a first inclined surface is formed in the limiting block, a rubber piece is arranged on the first inclined surface, the rubber piece contacts the chip, the limiting block contacts the top wall of the second plate, until the thickness of the chip exceeds the thickness of the first inclined surface, the pressing piece is compressed and a gap is generated between the limiting block and the second plate, a first rod is rotatable on the side wall of the storage box, a second rod is arranged on the first rod, the diameter of the second rod is smaller than that of the first rod, a limiting strip is arranged on the second rod, a first buckle piece is sleeved on the second rod, the first buckle piece rotates synchronously with the first rod through the limiting strip, a moving piece is rotatable in the working area, the moving piece is a screw rod, the moving piece is threadedly provided in the pressing piece, a second buckle piece is arranged on the end face of the moving piece, the second buckle piece corresponds to the first buckle piece, a plurality of second clamping blocks are arranged on the first buckle piece; the second clamping block is triangular; a plurality of third clamping blocks are arranged on the second buckle piece; the third clamping block is triangular; the gap between the third clamping block and the two groups of second clamping blocks corresponds, when the inclined surface between the second clamping block and the third clamping block is in contact, the moving piece is driven to rotate, when the inclined surface between the second clamping block and the third clamping block is in contact and the pressing piece abuts against the chip, the elastic piece is compressed until the third clamping block is clamped into the gap between the next two groups of second clamping blocks, when the straight surface between the second clamping block and the third clamping block is in contact, the moving piece rotates synchronously with the first rod, thereby preventing damage to the side wall of the chip and adapting to chips of different sizes. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a structure schematic view of the semiconductor chip storage device in the utility model.

[0014] Figure 2 It is a top view of the semiconductor chip storage device in the utility model.

[0015] Figure 3 It is a sectional view of the semiconductor chip storage device in the utility model.

[0016] Figure 4 It is Figure 2 It is a partial enlarged view of A in the utility model.

[0017] In the figure: 1, storage box; 2, first plate; 3, second plate; 31, first slot; 4, third plate; 5, limiting block; 51, first inclined surface; 52, rubber piece; 6, moving piece; 61, second buckle piece; 611, third clamping block; 7, locking piece; 71, first rod; 72, second rod; 721, limiting strip; 73, first buckle piece; 731, second clamping block; 74, fourth plate; 75, elastic piece; 8, operation area; 81, pressing piece. DETAILED DESCRIPTION

[0018] The semiconductor chip storage device provided by the embodiment of the present application solves the problem that the chip storage box in the prior art usually clamps the chip or does not set a fixing mechanism, so that the chip is shaken and jolted, the clamping position of the chip is damaged or worn out, and the chip storage box cannot adapt to chips of various sizes.

[0019] The technical solution in the embodiment of the present application is as follows to solve the above problem

[0020] In order to better understand the above technical solution, the above technical solution will be described in detail in combination with the drawings of the specification and specific embodiments.

[0021] A semiconductor chip storage device includes a storage box 1, a first plate 2 separating the storage box 1, a second plate 3 supporting the chip, a third plate 4 arranged on the second plate 3, a limiting block 5 limiting the position of the chip, a moving piece 6 driving the limiting block 5 to move, and a locking piece 7 preventing the limiting block 5 from damaging the chip; the first plate 2 is arranged in the storage box 1; the second plate 3 is arranged on both sides of the first plate 2, and the second plate 3 and the bottom of the storage box 1 leave an operation area 8; the third plate 4 separates the second plate 3; the first slot 31 is arranged on the second plate 3; the limiting block 5 slides along the first slot 31; the moving piece 6 is arranged in the operation area 8; the acting end of the moving piece 6 is connected to the limiting block 5; and the locking piece 7 is arranged on the moving piece 6.

[0022] The operation area 8 is provided with a pressing piece 81; one end of the pressing piece 81 abuts against the second plate 3, and the other end of the pressing piece 81 abuts against the operation area 8.

[0023] The sidewall of the limiting block 5 is provided with a first inclined surface 51; the first inclined surface 51 is provided with a rubber piece 52; when the rubber piece 52 contacts the chip, the chip is pressed down until the chip contacts the third plate 4.

[0024] The locking member 7 comprises a first rod 71, a second rod 72 arranged on the first rod 71, a first clamping member 73 sliding on the second rod 72, a fourth plate 74 preventing the first clamping member 73 from being separated, an elastic member 75 abutting against the first clamping member 73; the first rod 71 rotates on the side wall of the storage box 1 and the other end of the first rod 71 is located in the operation area 8; the fourth plate 74 is arranged on the end face of the second rod 72; the elastic member 75 is sleeved on the second rod 72; the moving member 6 is threadedly arranged in the limiting block 5; the end face of the moving member 6 is provided with a second clamping member 61; the second clamping member 61 cooperates with the first clamping member 73.

[0025] A plurality of groups of second clamping blocks 731 are arranged on the first clamping member 73; the second clamping blocks 731 are triangular; a plurality of groups of third clamping blocks 611 are arranged on the second clamping member 61; the third clamping blocks 611 are triangular; the third clamping blocks 611 correspond to the gaps between the two groups of second clamping blocks 731.

[0026] A limiting strip 721 is arranged on the second rod 72.

[0027] The storage box 1 is provided with a first plate 2, the first plate 2 is arranged at the middle of the storage box 1, the first plate 2 separates the storage box 1, both sides of the first plate 2 are provided with a second plate 3, the second plate 3 forms an operation area 8 with the inside of the storage box 1, the operation area 8 is provided with a pressing piece 81, one end of the pressing piece 81 abuts against the second plate 3, so that the second plate 3 always faces upwards, a first groove 31 is formed in the second plate 3, a limiting block 5 is slidably connected to the second plate 3, a first inclined surface 51 is formed in the limiting block 5, a rubber piece 52 is arranged on the first inclined surface 51, the rubber piece 52 contacts the chip, the limiting block 5 contacts the top wall of the second plate 3, until the thickness of the chip exceeds the thickness of the first inclined surface 51, so that the pressing piece 81 is compressed and a gap is generated between the limiting block 5 and the second plate 3, a first rod 71 is rotatable on the side wall of the storage box 1, a second rod 72 is arranged on the first rod 71, the diameter of the second rod 72 is smaller than the diameter of the first rod 71, a limiting strip 721 is arranged on the second rod 72, a first buckle piece 73 is sleeved on the second rod 72, the first buckle piece 73 rotates synchronously with the first rod 71 through the limiting strip 721, a moving piece 6 rotates in the working area, the moving piece 6 is a screw rod, the moving piece 6 is threadedly provided in the pressing piece 81, a second buckle piece 61 is arranged on the end face of the moving piece 6, the second buckle piece 61 corresponds to the first buckle piece 73, a plurality of groups of second clamping blocks 731 are arranged on the first buckle piece 73; the second clamping blocks 731 are triangular; a plurality of groups of third clamping blocks 611 are arranged on the second buckle piece 61; the third clamping blocks 611 are triangular; the gap between the third clamping blocks 611 and the two groups of second clamping blocks 731 corresponds, when the inclined surfaces between the second clamping blocks 731 and the third clamping blocks 611 contact, the moving piece 6 is driven to rotate, when the inclined surfaces between the second clamping blocks 731 and the third clamping blocks 611 contact and the pressing piece 81 abuts against the chip, an elastic piece 75 is compressed until the third clamping blocks 611 are clamped into the gap between the next two groups of second clamping blocks 731, when the straight surfaces between the second clamping blocks 731 and the third clamping blocks 611 contact, the moving piece 6 rotates synchronously with the first rod 71.

[0028] Due to the first plate 2 is arranged in the storage box 1, the first plate 2 is arranged at the middle of the storage box 1, the first plate 2 separates the storage box 1, the second plate 3 is arranged on both sides of the first plate 2, the second plate 3 forms the operation area 8 with the inside of the storage box 1, the pressing piece 81 is arranged in the operation area 8, one end of the pressing piece 81 abuts against the second plate 3, so that the second plate 3 always faces upward, the first groove 31 is formed in the second plate 3, the limiting block 5 is slidably connected to the second plate 3, the first inclined surface 51 is formed in the limiting block 5, the rubber piece 52 is arranged on the first inclined surface 51, the rubber piece 52 contacts the chip, the limiting block 5 contacts the top wall of the second plate 3, until the thickness of the chip exceeds the thickness of the first inclined surface 51, so that the pressing piece 81 is compressed and the gap is generated between the limiting block 5 and the second plate 3, the first rod 71 is rotatably arranged on the side wall of the storage box 1, the second rod 72 is arranged on the first rod 71, the diameter of the second rod 72 is smaller than that of the first rod 71, the limiting strip 721 is arranged on the second rod 72, the first buckle piece 73 is sleeved on the second rod 72, the first buckle piece 73 rotates synchronously with the first rod 71 through the limiting strip 721, the moving piece 6 rotates in the working area, the moving piece 6 is a screw rod, the moving piece 6 is threadedly arranged in the pressing piece 81, the second buckle piece 61 is arranged on the end surface of the moving piece 6, the second buckle piece 61 corresponds to the first buckle piece 73, a plurality of groups of second clamping blocks 731 are arranged on the first buckle piece 73, the second clamping blocks 731 are triangular, a plurality of groups of third clamping blocks 611 are arranged on the second buckle piece 61, the third clamping blocks 611 are triangular, the gap between the third clamping blocks 611 and the two groups of second clamping blocks 731 corresponds, when the inclined surfaces between the second clamping blocks 731 and the third clamping blocks 611 contact, the moving piece 6 is driven to rotate, when the inclined surfaces between the second clamping blocks 731 and the third clamping blocks 611 contact and the pressing piece 81 abuts against the chip, the elastic piece 75 is compressed until the third clamping blocks 611 are clamped into the gap between the next two groups of second clamping blocks 731, when the straight surfaces between the second clamping blocks 731 and the third clamping blocks 611 contact, the moving piece 6 rotates synchronously with the first rod 71, thereby preventing the chip side wall from being damaged and adapting to chips of different sizes.

[0029] Although the preferred embodiments of the present application have been described, those skilled in the art who understand the basic inventive concept can make further changes and modifications to the embodiments. Therefore, the appended claims are intended to include the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0030] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application also intends to include these modifications and variations.

Claims

1. A semiconductor chip packaging device, characterized in that, The device includes a storage box (1), a first plate (2) separating the storage box (1), a second plate (3) supporting the chip, a third plate (4) disposed on the second plate (3), a limiting block (5) restricting the chip position, a moving part (6) driving the limiting block (5) to move, and a locking part (7) preventing the limiting block (5) from damaging the chip; the first plate (2) is disposed inside the storage box (1); the second plate (3) is disposed on both sides of the first plate (2) and the second plate (3) and the bottom of the storage box (1) have an operating area (8); the third plate (4) separates the second plate (3); a first groove (31) is provided on the second plate (3); the limiting block (5) slides along the first groove (31); the moving part (6) is disposed in the operating area (8); the working end of the moving part (6) is connected to the limiting block (5); and the locking part (7) is disposed on the moving part (6).

2. The semiconductor chip packaging device as described in claim 1, characterized in that, A clamping member (81) is provided in the operating area (8); one end of the clamping member (81) abuts against the second plate (3), and the other end of the clamping member (81) abuts against the operating area (8).

3. The semiconductor chip packaging device as described in claim 1, characterized in that, The limiting block (5) has a first inclined surface (51) on its side wall; a rubber part (52) is provided on the first inclined surface (51); when the rubber part (52) contacts the chip, it presses down on the chip until the chip contacts the third plate (4).

4. The semiconductor chip packaging device as described in claim 1, characterized in that, The locking member (7) includes a first rod (71), a second rod (72) disposed on the first rod (71), a first latching member (73) sliding on the second rod (72), a fourth plate (74) preventing the first latching member (73) from disengaging, and an elastic member (75) abutting against the first latching member (73); the first rod (71) rotates on the side wall of the storage box (1) and the other end of the first rod (71) is located in the operating area (8); the fourth plate (74) is disposed on the end face of the second rod (72); the elastic member (75) is sleeved on the second rod (72); the moving member (6) is threaded through the limiting block (5); a second latching member (61) is disposed on the end face of the moving member (6); the second latching member (61) cooperates with the first latching member (73).

5. The semiconductor chip packaging apparatus as described in claim 4, characterized in that, The first buckle (73) is provided with several sets of second buckle blocks (731); the second buckle blocks (731) are triangular; the second buckle (61) is provided with several sets of third buckle blocks (611); the third buckle blocks (611) are triangular; the gap between the third buckle blocks (611) and the two sets of second buckle blocks (731) corresponds.

6. The semiconductor chip packaging apparatus as described in claim 4, characterized in that, A limit bar (721) is provided on the second rod (72).